CN220491221U - A control circuit that automatically adjusts test temperature - Google Patents

Abstract

The utility model discloses a control circuit that automatically adjusts the test temperature. The control circuit includes a plurality of control units, each of which is individually controlled to connect multiple objects to be measured; a plurality of diodes, and each of the diodes is connected to a plurality of objects. The control unit is electrically connected; a first triode and a second triode, a plurality of the diodes are also electrically connected to the base of the second triode, and the collector of the second triode It is electrically connected to the base of the first triode; a host computer is electrically connected to the collector of the first triode, and the host computer is also electrically connected to the temperature control box. Multiple corresponding diodes are controlled by multiple control units to enter the cut-off state. After the Vbe voltage of the second transistor is greater than the turn-on voltage, the second transistor enters the conductive state, and the first transistor enters the cut-off state. The machine adjusts the temperature value in the temperature control box, thereby automatically testing the operating conditions of multiple objects under test in different temperature environments.

Description

A control circuit that automatically adjusts test temperature

Technical field

The utility model relates to the technical field of control circuits, and in particular to a control circuit that automatically adjusts test temperature.

Background technique

In some aging test projects, the product under test needs to operate cyclically in high and low temperature environments, so as to test the operating conditions of the product under test at different temperatures.

In some related technologies, the test process needs to be completed with the help of a host computer on the product under test located in the temperature box, but the tester needs to manually control the test temperature in the temperature box, which makes the process more time-consuming and laborious.

Utility model content

In order to overcome the shortcomings of the existing technical solutions, embodiments of the present invention provide a control circuit that automatically adjusts the test temperature.

The technical solution adopted by this utility model to solve its technical problems is:

A control circuit that automatically adjusts test temperature, the control circuit includes:

Multiple control units, each of which individually controls and connects multiple objects under test;

A plurality of diodes, each of which is electrically connected to a plurality of control units;

A first triode and a second triode, a plurality of diodes are also electrically connected to the base of the second triode, and the collector of the second triode is connected to the first triode. The base of the tube is electrically connected;

The upper computer is electrically connected to the collector of the first transistor, and the upper computer is also electrically connected to the temperature control box.

As a preferred technical solution of the present invention, the control circuit further includes a first resistor, and the first resistor is provided at the connection point between the power supply device and the collector of the first transistor.

As a preferred technical solution of the present invention, the control circuit further includes a second resistor, and the second resistor is provided at a connection point between a plurality of diodes and the base of the second transistor.

As a preferred technical solution of the present invention, the control circuit further includes a third resistor, and the third resistor is provided at the connection point between the second resistor and the first ground terminal.

As a preferred technical solution of the present invention, the control circuit further includes a fourth resistor and a fifth resistor. The fourth resistor is disposed between the first power supply terminal and the collector of the second transistor. Connection point; the fifth resistor is provided at the connection point between the base of the first transistor and the fourth resistor.

As a preferred technical solution of the present invention, the control circuit further includes a sixth resistor, and the sixth resistor is provided at the connection point between the collector of the first transistor and the second power supply terminal.

As a preferred technical solution of the present invention, the control circuit further includes a seventh resistor, and the seventh resistor is provided at a connection point between each of the diodes and the third power supply terminal.

As a preferred technical solution of the present invention, the control circuit includes a module end, and the module end is provided at the connection point between the collector of the first transistor and the host computer.

As a preferred technical solution of the present invention, the control circuit further includes a second ground terminal, and the emitter junction of the first transistor is electrically connected to the second ground terminal.

As a preferred technical solution of the present invention, the control circuit further includes a third ground terminal, and the emitter junction of the second transistor is electrically connected to the third ground terminal.

Compared with the existing technology, the beneficial effects of this utility model are:

Through multiple control units, multiple corresponding diodes are controlled to enter the cut-off state. After the Vbe voltage of the second transistor is greater than the turn-on voltage, the second transistor enters the conductive state, and the first transistor enters the cut-off state. The machine adjusts the temperature value in the temperature control box, thereby automatically testing the operating conditions of multiple objects under test in different temperature environments.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present utility model more clearly, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the utility model. Those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.

Figure 1 is a control circuit diagram of an embodiment of the present utility model.

FIG. 2 is an enlarged partial circuit diagram of FIG. 1 .

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clear, this application will be further described in detail below in conjunction with the accompanying drawings and embodiments.

It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element.

When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be understood that the terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top" The orientations or positional relationships indicated by , "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply what is meant. Devices or elements must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limiting.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features.

In the description of this application, "plurality" means two or more than two, unless otherwise explicitly and specifically limited.

In order to solve the technical problem in the prior art that testers manually control the test temperature in the temperature box, which makes the process more time-consuming and laborious, embodiments of the present invention provide a control circuit that automatically adjusts the test temperature.

The specific solution of the control circuit for automatically adjusting the test temperature provided by the embodiment of the present invention is explained in detail below. As shown in Figure 1 and Figure 2, the specific solution of the control circuit for automatically adjusting the test temperature includes multiple MCUs, multiple A diode D, the first transistor Q1, the second transistor Q3 and the host computer 2.

Each MCU individually controls multiple connected objects 1 under test. Specifically, each MCU independently communicates with multiple objects under test 1 at the same time, thereby being able to monitor the operating status of each object under test 1 in the test environment at all times.

It should be noted that IO0 of each MCU is preset to a low level state. A logic AND gate circuit is formed through multiple diodes D in the control circuit, and a two-pole logic AND gate is formed through multiple transistors in the control circuit. circuit.

It should also be noted that MCUMUC is MCU (Microcontroller Unit), which is a single-chip microcomputer.

Further, each diode D is electrically connected to multiple MCUs respectively. Specifically, multiple diodes D are used to convert the lower-voltage alternating current output by the AC step-down circuit into unidirectional pulsating direct current, which is the rectification process of alternating current. The rectifier circuit is mainly composed of rectifier diodes D. The voltage after the rectifier circuit is not an AC voltage, but a mixed voltage containing DC voltage and AC voltage.

Furthermore, the plurality of diodes D are also electrically connected to the base of the second transistor Q3, and the collector of the second transistor Q3 is electrically connected to the base of the first transistor Q1. Specifically, during the test process, only the cathode of one of the multiple diodes D is set to a low level by the MCU. Under the action of the clamping characteristics of the diode D, the Vbe voltage value of the triode is is always lower than the voltage value when it is turned on, the second transistor Q3 at this time enters the cut-off state; conversely, if the Vbe voltage value of the first transistor Q1 is greater than the voltage value when it is turned on, the first transistor Q3 at this time Q1 goes into conduction state.

Further, the host computer 2 is electrically connected to the collector of the first transistor Q1 , and the host computer 2 is also electrically connected to the temperature control box 3 . Specifically, if the first transistor Q1 enters the conductive state, since the level obtained by the host computer 2 is a low level, the host computer 2 cannot adjust the temperature of the test environment of the temperature control box 3 .

It should be noted that the host computer 2 is electrically connected to the temperature control box 3 through a wire bus.

Specifically, after the object under test 1 completes the aging test, one of the objects under test 1 sends a signal to complete the aging test to its corresponding MCU. At this time, the MCU receives the signal from the object under test by controlling the GPIO pin IO1. 1. After the aging signal is sent, the aging signal is recorded in the preset software until the remaining objects 1 under test send signals to complete the aging test to the corresponding MCU, so that each object 1 under test enters the aging test state. .

It should be noted that if one of the objects 1 under test has not completed the aging test, the IO0 pin of the MCU remains low; conversely, if all the objects 1 under test have completed the aging test, the MCU controls the GPIO pin. After receiving the aging test completion signals sent by all the objects under test 1, the MCU at this time changes the low level to the high level by controlling IO0.

For example, there are 25 objects under test 1 in total. When the object under test 11 completes the aging test, the object under test 11 sends an aging completion signal to the corresponding MCU 1 . After MCU1 receives the aging signal sent by the object under test 1 by controlling the GPIO pin IO1, it passes the preset software mark; then waits for the remaining objects under test 12 to 124 to send aging completion signals to the corresponding MCU2 to MCU25 respectively. . If the object under test 13 fails to complete aging, the IO0 pin of MCU3 remains in a low level state.

If all the objects under test 1 complete the test and send signals to the corresponding MCU, the MCU will change the low level to a high level by controlling IO0, and the cathode of one of the diodes D is adjusted to a high level, and the diode D The anode is adjusted to a high level through the action of the corresponding resistor.

In a specific embodiment, the control circuit includes a module terminal 4 , which is disposed at the connection point between the collector of the first transistor Q1 and the host computer 2 . Specifically, when the first transistor Q1 enters the conductive state, the DINO pin of the module terminal 4 that supports the CAN bus is adjusted to a low level; conversely, when the first transistor Q1 enters the cut-off state, the Adjust the DINO pin of module terminal 4 that supports CAN bus to high level; that is, the level read by host computer 2 on IO module ding through CAN bus is low level or high level, thereby controlling and adjusting the temperature of the test environment .

When each MCU receives the signal of completing the aging test of the corresponding object 1, the IO0 pin of each MCU adjusts from low level to high level, and each diode D enters the cut-off state, causing the second The Vbe voltage of transistor Q3 is higher than the voltage when it is turned on. At this time, the second transistor Q3 is adjusted from the off state to the on state; if the Vbe voltage of the first transistor Q1 is lower than the voltage when it is turned on, At this time, the first three-stage tube is adjusted from the conductive state to the cut-off state.

In a specific embodiment, the control circuit further includes a first resistor R1. The first resistor R1 is provided at the connection point between the power supply device and the collector of the first transistor Q1. Specifically, if only the first transistor Q1 enters the cut-off state, the low level of the 4DIN0 pin of the module that supports the CAN bus will be pulled to the high level of the voltage of the power supply device through the first resistor R1.

It can be understood that the module terminal 4 in the embodiment of the present invention is an IO module.

Further, the control circuit also includes a second resistor R2, a third resistor R3, a fourth resistor R10, a fifth resistor R9, a sixth resistor R5 and a seventh resistor R4. The second resistor R2 is disposed between the plurality of diodes D and The connection point between the base of the second transistor Q3. Wherein, the third resistor R3 is disposed at the connection point between the second resistor R2 and the first ground terminal. The fourth resistor R10 is disposed at the connection point between the first power supply terminal and the collector of the second transistor Q3; the fifth resistor R9 is disposed at the base of the first transistor Q1 and the fourth resistor R10 connection points between. The sixth resistor R5 is disposed at the connection point between the collector of the first transistor Q1 and the second power supply terminal. The seventh resistor R4 is disposed at the connection point between each diode D and the third power supply terminal. Through multiple resistors, the current output to the circuit does not exceed the rated value or the specified value required for actual work, so as to ensure the normal operation of the whole device. A variable resistor can be connected in series in the circuit, and when it is required to be on the trunk line of the circuit at the same time When connecting several electrical appliances with different rated currents, a resistor can be connected in parallel at both ends of the electrical appliance with a smaller rated current.

Further, the control circuit also includes a second ground terminal and a third ground terminal, the emitter junction of the first transistor Q1 is electrically connected to the second ground terminal, and the emitter junction of the second transistor Q3 is electrically connected to the third ground terminal. , so that the current in the circuit can flow back to the ground, thereby protecting personnel and equipment from dangers such as electric shock.

The above are only specific implementations of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person familiar with the technical field can easily think of various implementations within the technical scope disclosed by the present utility model. Equivalent modifications or substitutions shall be included in the protection scope of the present invention. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims (10)

1. A control circuit for automatically adjusting a test temperature, the control circuit comprising:

a plurality of control units, each of which is individually controlled and connected with a plurality of tested bodies;

a plurality of diodes, each of which is electrically connected with a plurality of the control units, respectively;

the first triode and the second triode, a plurality of diodes are also electrically connected with the base electrode of the second triode, and the collector electrode of the second triode is electrically connected with the base electrode of the first triode;

the upper computer is electrically connected with the collector electrode of the first triode and is also electrically connected with the temperature control box.

2. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a first resistor disposed at a connection point between a power supply device and a collector of the first transistor.

3. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a second resistor disposed at a connection point between the plurality of diodes and the base of the second transistor.

4. The control circuit for automatically adjusting a test temperature according to claim 3, further comprising a third resistor disposed at a connection point between the second resistor and the first ground.

5. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a fourth resistor and a fifth resistor, wherein the fourth resistor is disposed at a connection point between a first power supply terminal and a collector of the second triode; the fifth resistor is arranged at a connection point between the base electrode of the first triode and the fourth resistor.

6. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a sixth resistor disposed at a connection point between a collector of the first transistor and a second power supply terminal.

7. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a seventh resistor disposed at a connection point between each of the diodes and a third power supply terminal.

8. The control circuit for automatically adjusting a test temperature according to claim 1, wherein the control circuit comprises a module terminal, the module terminal being disposed at a connection point between a collector of the first triode and the host.

9. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a second ground, wherein the emitter junction of the first transistor is electrically connected to the second ground.

10. The control circuit for automatically adjusting a test temperature according to claim 1, further comprising a third ground, wherein the emitter junction of the second transistor is electrically connected to the third ground.