CN220490985U - Chip aging testing device - Google Patents
Chip aging testing device Download PDFInfo
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- CN220490985U CN220490985U CN202322075002.4U CN202322075002U CN220490985U CN 220490985 U CN220490985 U CN 220490985U CN 202322075002 U CN202322075002 U CN 202322075002U CN 220490985 U CN220490985 U CN 220490985U
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- 238000012360 testing method Methods 0.000 title claims abstract description 51
- 230000032683 aging Effects 0.000 title abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 239000000523 sample Substances 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 5
- 230000001174 ascending effect Effects 0.000 claims description 2
- 230000003750 conditioning effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The application relates to the technical field of chip production, in particular to a chip aging test device; aiming at the problem of low testing efficiency, the adopted scheme comprises the following steps: a base and a test chamber; the test chamber comprises a main chamber body and a movable bottom plate; the main chamber body is fixed with the base; the inner space of the main chamber body consists of a plurality of groups of subspaces; a plurality of groups of circuit boards are fixedly arranged on the movable bottom plate; the chip to be tested is arranged on the circuit board; each group of subspaces is provided with a temperature adjusting component and a temperature measuring component; the movable bottom plate is connected with the base in a sliding way and slides along the longitudinal direction; the movable bottom plate comprises a test position, and when the movable bottom plate is positioned at the test position, the movable bottom plate covers the opening of the main chamber body; the chip aging test device also comprises a reset component which is arranged on the base and/or the movable bottom plate; the reset component is used for driving the movable bottom plate to return to the test position along the longitudinal direction. Through the scheme, a plurality of test areas with different temperatures can be provided, and the position of the movable bottom plate can be adjusted to facilitate the loading of chips by operators.
Description
Technical Field
The application relates to the technical field of chip production, in particular to a chip aging testing device.
Background
The chip can produce a large amount of heat when the work, and the chip ageing can be caused to the high temperature, therefore in the in-process of chip production, need carry out high temperature ageing test to the chip. Most of the existing burn-in test devices only provide a test area, namely, the chips to be tested can only be tested in the same temperature range, and the test efficiency of the chips is low; meanwhile, the bottom plate provided with the circuit board is fixed, and when the chip is loaded, an operator is required to adjust the posture of the bottom plate so as to adapt to the height of the bottom plate, so that the bottom plate is inconvenient to load, and the detection efficiency is not improved.
Therefore, an improvement on the existing burn-in test device is still needed to solve the problem of low test efficiency in the prior art.
Disclosure of Invention
The embodiment provides a chip burn-in test device to solve the problem of test inefficiency among the prior art.
In order to achieve the above objective, the present embodiment provides a chip burn-in test device, including a base and a test chamber; the test chamber comprises a main chamber body with an opening at the lower end only and a movable bottom plate covering the opening of the main chamber body; the main chamber body is fixed with the base; the inner space of the main chamber body consists of a plurality of groups of subspaces which are not communicated with each other; the movable bottom plate is fixedly provided with a plurality of groups of circuit boards which are in one-to-one correspondence with a plurality of groups of subspaces; the chip to be tested is arranged on the circuit board; each group of subspaces is provided with a temperature adjusting component and a temperature measuring component; the temperature regulating component is used for regulating the temperature of the subspace; the temperature measuring component is used for detecting the temperature of the chip to be detected; the movable bottom plate is connected with the base in a sliding manner and slides along the longitudinal direction; the movable bottom plate comprises a test position, and when the movable bottom plate is positioned at the test position, the movable bottom plate covers the opening of the main chamber body; the chip burn-in test device also comprises a reset component arranged on the base and/or the movable bottom plate; the reset component is used for driving the movable bottom plate to return to the test position along the longitudinal direction.
Optionally, the chip burn-in test device further comprises an insulation layer; each group of subspaces is fixedly provided with the heat insulation layer on the inner side wall and the inner top wall.
Optionally, each group of temperature measuring assemblies comprises a longitudinal movable rod, a longitudinal mounting cylinder sleeved at the upper end of the longitudinal movable rod, a temperature measuring probe fixed with the lower end of the longitudinal movable rod, and a first longitudinal spring positioned in the longitudinal mounting cylinder; the longitudinal mounting cylinder is fixed with the main chamber body; the inner diameter of the longitudinal mounting cylinder is matched with the outer diameter of the first longitudinal spring; the temperature measuring probe corresponds to the chip to be measured; the upper end of the first longitudinal spring is fixed with the longitudinal mounting cylinder, and the lower end of the first longitudinal spring is fixed with the upper end of the longitudinal movable rod.
Optionally, the longitudinal mounting cylinder is mounted in the center of the inner top of the main chamber body; each group of temperature adjusting components comprises refrigerating and heating plates which are transversely arranged; the refrigerating and heating sheet is fixed with the center of the inner side wall of the main chamber body.
Optionally, each group of the temperature adjusting components comprises two groups of transverse fins; and the middle part of one of the two groups of transverse fins is fixed with the refrigerating surface of the refrigerating and heating sheet, and the other middle part of the two groups of transverse fins is fixed with the heating surface of the refrigerating and heating sheet.
Optionally, the chip burn-in device further includes a connection assembly connecting the movable bottom plate and the base; the connecting assembly comprises two groups of sub-assemblies which respectively correspond to two sides of the movable bottom plate; each group of subassemblies comprises a longitudinal guide rod, a transverse connecting plate, a matched dovetail groove and a dovetail tenon; the lower end of the longitudinal guide rod is fixed with the base; one side of the transverse connecting plate is provided with a guide through groove corresponding to the longitudinal guide rod, and the other side of the transverse connecting plate is fixed with the dovetail; the dovetail groove is arranged on the lower surface of the movable bottom plate; the length direction of the dovetail groove is perpendicular to the sliding direction of the movable bottom plate.
Optionally, the reset assembly includes two sets of second longitudinal springs corresponding to the two sets of subassemblies one to one; and each group of second longitudinal springs is respectively pressed against the lower surface of the transverse connecting plate and the base at two ends.
Optionally, the chip burn-in test device further includes two sets of limit blocks corresponding to the two sets of subassemblies one by one; the limiting block is fixed with the end part of the dovetail, and is used for limiting the sliding-in depth of the movable bottom plate on the dovetail; when the limiting block limits the movable bottom plate, each group of circuit boards on the movable bottom plate are opposite to each group of subspaces of the main chamber body one by one.
Optionally, the longitudinal guide rod is square; each group of subassemblies comprises a limiting ring; the limiting ring is fixed with the longitudinal guide rod and used for limiting the ascending height of the transverse connecting plate; when the limiting ring limits the transverse connecting plate, the movable bottom plate is located at the test position.
The device provided by the utility model has the advantages that on one hand, the temperature adjustment speed of the chip to be tested is high, a plurality of test areas with different temperatures can be provided, and the test efficiency is high; on the other hand, the movable bottom plate can slide up and down, and when loading chips, the position of the movable bottom plate can be adjusted to facilitate the loading of the chips by operators, and the detection efficiency is also facilitated to be improved. Specifically, the movable bottom plate is pulled down along the longitudinal direction, and a chip to be tested is loaded on the circuit board on the movable bottom plate; after loading is completed, the pulling force on the movable bottom plate is released, the reset assembly drives the movable bottom plate to return to the test position along the longitudinal direction, and the movable bottom plate covers the opening of the main chamber body to form a closed space; the temperature of each group of chips to be detected is detected through each group of temperature measuring components, and the temperature of each group of subspaces is regulated through each group of temperature regulating components.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front view of a chip burn-in apparatus according to the present embodiment;
fig. 2 is a bottom view of a main chamber of the device for burn-in testing a chip according to the present embodiment;
fig. 3 is a front view of the chip burn-in apparatus according to the present embodiment after the main chamber is cut;
fig. 4 is a sectional view of a temperature measuring component in a chip burn-in apparatus according to the present embodiment.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.
It is also to be understood that the terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
The embodiment provides a chip burn-in test device, as shown in fig. 1-4, which comprises a base 100 and a test chamber 101; the test chamber 101 comprises a main chamber body 102 with only the lower end being opened, and a movable bottom plate 103 covering the opening of the main chamber body 102; the main chamber 102 is fixed with the base 100; the inner space of the main chamber 102 is composed of a plurality of groups of subspaces 180 which are not communicated with each other; the movable bottom plate 103 is fixedly provided with a plurality of groups of circuit boards 104 which are in one-to-one correspondence with the plurality of groups of subspaces 180; the chip 2 to be tested is mounted on the circuit board 104; each group of subspaces 180 is provided with a temperature adjusting component 105 and a temperature measuring component 106; the temperature regulating assembly 105 is used to regulate the temperature of the subspace 180; the temperature measuring component 106 is used for detecting the temperature of the chip 2 to be measured; the movable bottom plate 103 is slidably connected with the base 100 and slides in the longitudinal direction; the movable bottom plate 103 comprises a test position 181, and when the movable bottom plate 103 is positioned at the test position 181, the movable bottom plate 103 covers the opening of the main chamber 102; the chip burn-in apparatus further includes a reset assembly mounted on the base 100 and/or the movable floor 103; the reset component is used for driving the movable bottom plate 103 to return to the test position 181 along the longitudinal direction.
The device provided by the above-mentioned, on the one hand, the temperature adjustment speed of the chip 2 to be tested is fast to can provide a plurality of test areas that the temperature is different, efficiency of software testing is high, on the other hand, movable bottom plate 103 can slide from top to bottom, when loading the chip, can adjust the position of movable bottom plate 103 in order to make things convenient for the operator to load the chip, also be convenient for improve detection efficiency. Specifically, the movable bottom plate 103 is pulled down along the longitudinal direction, and the chip 2 to be tested is loaded on the circuit board 104 on the movable bottom plate 103; after loading is completed, the pulling force on the movable bottom plate 103 is released, the reset assembly drives the movable bottom plate 103 to return to the test position 181 along the longitudinal direction, and the movable bottom plate 103 covers the opening of the main chamber 102 to form a closed space; the temperature of each group of chips 2 to be tested is detected by each group of temperature measuring components 106, and the temperature of each group of subspaces is regulated by each group of temperature regulating components 105.
Optionally, the chip burn-in device further includes a heat insulation layer 107; each group of subspaces 180 is fixedly provided with a heat insulation layer 107 on the inner side wall and the inner top wall, so that the temperature in the subspaces 180 is stable, and excessive heat exchange with the outside is avoided.
Optionally, each group of temperature measuring assemblies 106 comprises a longitudinal movable rod 108, a longitudinal mounting cylinder 109 sleeved on the upper end of the longitudinal movable rod 108, a temperature measuring probe 110 fixed with the lower end of the longitudinal movable rod 108, and a first longitudinal spring 111 positioned inside the longitudinal mounting cylinder 109; the longitudinal mounting cylinder 109 is fixed with the main chamber body 102; the inner diameter of the longitudinal mounting cylinder 109 is adapted to the outer diameter of the first longitudinal spring 111; the temperature probe 110 corresponds to the chip 2 to be measured; the upper end of the first longitudinal spring 111 is fixed to the longitudinal mounting cylinder 109, and the lower end is fixed to the upper end of the longitudinal movable rod 108. By the temperature measuring component 106, the temperature measuring result is more accurate. Specifically, when the movable bottom plate 103 moves upwards along the longitudinal direction, the chip 2 to be measured pushes the temperature measuring probe 110, so that the longitudinal movable rod 108 extends into the longitudinal mounting cylinder 109, and the first longitudinal spring 111 is pressed to have a tendency of restoring the original shape, so that the temperature measuring probe 110 and the chip 2 to be measured can be closely attached, and the temperature of the chip 2 to be measured can be better sensed.
Optionally, a longitudinal mounting cylinder 109 is mounted in the center of the inner top of the main chamber body 102; each group of temperature regulating components 105 comprises a refrigerating and heating plate 112 which is transversely arranged; the cooling and heating plate 112 is fixed to the center of the inner sidewall of the main chamber 102, and the temperature of both sides of the subspace 180 is more uniform.
Optionally, each set of temperature conditioning assemblies 105 includes two sets of transverse fins 113; two groups of transverse fins 113, one of which is fixed with the refrigerating surface of the refrigerating and heating plate 112 and the other of which is fixed with the heating surface of the refrigerating and heating plate 112, quickens the heat exchange, and makes the temperatures of two sides of the subspace 180 more quickly tend to be the same.
Optionally, the chip burn-in apparatus further includes a connection assembly connecting the movable bottom plate 103 and the base 100; the connecting assembly comprises two groups of subassemblies 114 corresponding to two sides of the movable bottom plate 103 respectively; each set of subassemblies 114 includes a longitudinal guide bar 115, a transverse web 116, mating dovetail slots 182, and dovetails 117; the lower end of the longitudinal guide bar 115 is fixed to the base 100; one side of the transverse connection plate 116 is provided with a guide through slot (not shown) corresponding to the longitudinal guide bar 115, and the other side is fixed to the dovetail 117; the dovetail groove 182 is arranged on the lower surface of the movable bottom plate 103; the length direction of the dovetail groove 182 is perpendicular to the sliding direction of the movable bottom plate 103; adopt aforementioned coupling assembling, connect the effect stable, and simple structure pulls out movable bottom plate 103, is convenient for load chip 2 that awaits measuring, pushes in again after loading is accomplished.
Optionally, the reset assembly includes two sets of second longitudinal springs 118 in one-to-one correspondence with the two sets of subassemblies 114; and both ends of each group of second longitudinal springs 118 respectively press the lower surface of the transverse connecting plate 116 and the base 100, and a reset function is realized by adopting the springs, so that the cost is low.
Optionally, the chip burn-in apparatus further includes two sets of limit blocks (not shown) corresponding to the two sets of subassemblies 114 one to one; the limiting block is fixed with the end part of the dovetail 117, and is used for limiting the sliding depth of the movable bottom plate 103 on the dovetail 117, so that the use by a user is facilitated; when the limiting block limits the movable bottom plate 103, each group of circuit boards 104 on the movable bottom plate 103 are opposite to each group of subspaces 180 of the main chamber body 102 one by one.
Alternatively, the longitudinal guide bar 115 is square; each set of subassemblies 114 includes a stop collar 120; the limiting ring 120 is fixed to the longitudinal guide bar 115 and is used for limiting the upward height of the transverse connection plate 116; when the limiting ring 120 limits the transverse connection plate 116, the movable bottom plate 103 is located at the test position 181.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A chip burn-in test device comprises a base and a test chamber; the testing chamber is characterized by comprising a main chamber body with an opening at the lower end only and a movable bottom plate covering the opening of the main chamber body; the main chamber body is fixed with the base; the inner space of the main chamber body consists of a plurality of groups of subspaces which are not communicated with each other; the movable bottom plate is fixedly provided with a plurality of groups of circuit boards which are in one-to-one correspondence with a plurality of groups of subspaces; the chip to be tested is arranged on the circuit board; each group of subspaces is provided with a temperature adjusting component and a temperature measuring component; the temperature regulating component is used for regulating the temperature of the subspace; the temperature measuring component is used for detecting the temperature of the chip to be detected; the movable bottom plate is connected with the base in a sliding manner and slides along the longitudinal direction; the movable bottom plate comprises a test position, and when the movable bottom plate is positioned at the test position, the movable bottom plate covers the opening of the main chamber body; the chip burn-in test device also comprises a reset component arranged on the base and/or the movable bottom plate; the reset component is used for driving the movable bottom plate to return to the test position along the longitudinal direction.
2. The device for burn-in of chips of claim 1, further comprising a thermal insulation layer; each group of subspaces is fixedly provided with the heat insulation layer on the inner side wall and the inner top wall.
3. The chip burn-in apparatus according to claim 1, wherein each of said temperature measuring assemblies comprises a longitudinally movable rod, a longitudinally mounted cylinder fitted over an upper end of said longitudinally movable rod, a temperature measuring probe fixed to a lower end of said longitudinally movable rod, and a first longitudinal spring disposed inside said longitudinally mounted cylinder; the longitudinal mounting cylinder is fixed with the main chamber body; the inner diameter of the longitudinal mounting cylinder is matched with the outer diameter of the first longitudinal spring; the temperature measuring probe corresponds to the chip to be measured; the upper end of the first longitudinal spring is fixed with the longitudinal mounting cylinder, and the lower end of the first longitudinal spring is fixed with the upper end of the longitudinal movable rod.
4. A die burn-in apparatus according to claim 3, wherein said longitudinal mounting cylinder is installed at a center of an inner top portion of said main chamber body; each group of temperature adjusting components comprises refrigerating and heating plates which are transversely arranged; the refrigerating and heating sheet is fixed with the center of the inner side wall of the main chamber body.
5. The die burn-in apparatus of claim 4 wherein each of said temperature conditioning assemblies comprises two sets of transverse fins; and the middle part of one of the two groups of transverse fins is fixed with the refrigerating surface of the refrigerating and heating sheet, and the other middle part of the two groups of transverse fins is fixed with the heating surface of the refrigerating and heating sheet.
6. The device of claim 1, further comprising a connection assembly connecting the movable floor and the base; the connecting assembly comprises two groups of sub-assemblies which respectively correspond to two sides of the movable bottom plate; each group of subassemblies comprises a longitudinal guide rod, a transverse connecting plate, a matched dovetail groove and a dovetail tenon; the lower end of the longitudinal guide rod is fixed with the base; one side of the transverse connecting plate is provided with a guide through groove corresponding to the longitudinal guide rod, and the other side of the transverse connecting plate is fixed with the dovetail; the dovetail groove is arranged on the lower surface of the movable bottom plate; the length direction of the dovetail groove is perpendicular to the sliding direction of the movable bottom plate.
7. The device of claim 6, wherein the reset assembly comprises two sets of second longitudinal springs in one-to-one correspondence with two sets of the subassemblies; and each group of second longitudinal springs is respectively pressed against the lower surface of the transverse connecting plate and the base at two ends.
8. The device according to claim 6, further comprising two sets of limit blocks corresponding to two sets of the subassemblies one to one; the limiting block is fixed with the end part of the dovetail, and is used for limiting the sliding-in depth of the movable bottom plate on the dovetail; when the limiting block limits the movable bottom plate, each group of circuit boards on the movable bottom plate are opposite to each group of subspaces of the main chamber body one by one.
9. The device of claim 6, wherein the longitudinal guide bar is square; each group of subassemblies comprises a limiting ring; the limiting ring is fixed with the longitudinal guide rod and used for limiting the ascending height of the transverse connecting plate; when the limiting ring limits the transverse connecting plate, the movable bottom plate is located at the test position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322075002.4U CN220490985U (en) | 2023-08-03 | 2023-08-03 | Chip aging testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322075002.4U CN220490985U (en) | 2023-08-03 | 2023-08-03 | Chip aging testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220490985U true CN220490985U (en) | 2024-02-13 |
Family
ID=89837723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322075002.4U Active CN220490985U (en) | 2023-08-03 | 2023-08-03 | Chip aging testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220490985U (en) |
-
2023
- 2023-08-03 CN CN202322075002.4U patent/CN220490985U/en active Active
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