CN220488945U - LED light source module - Google Patents

Abstract

The application belongs to the technical field of light emitting diodes, and provides an LED light source module, which comprises a circuit board; the base is electrically connected with the circuit board; the light-emitting piece is arranged on one side of the base, which is away from the circuit board, and is electrically connected with the base; the fluorescent layer is stuck on the luminous surface of the luminous piece; the reflecting piece is arranged between the circuit board and the luminous piece, the reflecting piece is provided with a reflecting surface, the reflecting surface and the luminous piece are arranged at intervals, and the reflecting surface faces the luminous piece. The LED light source module provided by the application is arranged towards the light emitting part through the reflecting surface in the reflecting part, and the reflecting surface and the light emitting part are arranged at intervals, so that the light efficiency of the whole LED light source module is effectively improved.

Description

LED light source module

Technical Field

The application belongs to the technical field of light emitting diodes, and particularly relates to an LED light source module.

Background

With the birth of the LED light source module, the LED light source module has the advantages of environmental protection, long service life, high light efficiency, strong reliability, no stroboscopic effect, no starting delay, high designability and the like, so that the LED light source module rapidly occupies various lighting markets. Along with the increasing maturity of the product manufacturing process, the market has higher and higher requirements on the designable factors of the LED light source module, and the LED light source module has small volume, ultrahigh light efficiency and stable performance, so that the high-power high-light efficiency patch type LED light source module is applied.

At present, the patch type LED light source modules on the market are rich and various, and each LED light source module mainly provides a main light source by an internal LED light emitting part, but most of the LED light source modules on the market cause a large amount of loss in the process of refracting light rays emitted by the internal LED light emitting part, so that the light efficiency of the whole LED light source module is low.

Disclosure of Invention

An object of the embodiment of the application is to provide an LED light source module, so as to solve the technical problem that the light efficiency of the whole LED light source module is low due to a large amount of loss caused by the process of refracting the light emitted by an LED light emitting part in the LED light source module in the prior art.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is an LED light source module, including: a circuit board; the base is electrically connected with the circuit board; the light-emitting piece is arranged on one side, away from the base, of the base, and is electrically connected with the base; the fluorescent layer is attached to the light emitting surface of the light emitting piece; the reflecting piece is arranged between the circuit board and the luminous piece, a reflecting surface is arranged on the reflecting piece, the reflecting surface is arranged at intervals with the luminous piece, and the reflecting surface faces the luminous piece.

The beneficial effect that this application provided LED light source module lies in: compared with the prior art, the LED light source module has the advantages that the reflecting piece is arranged between the circuit board and the light emitting piece, the reflecting surface in the reflecting piece faces the light emitting piece, part of light rays emitted from the light emitting piece can be reflected by the reflecting surface, the reflecting surface and the light emitting piece are arranged at intervals, the light rays emitted from one side, close to the reflecting piece, of the light emitting piece can be emitted to the reflecting surface by utilizing the interval space between the reflecting surface and the light emitting piece, so that the part of light rays are reflected, all the light rays emitted from the light emitting piece are reflected fully, and therefore the light efficiency of the whole LED light source module is improved; meanwhile, the fluorescent layer is attached to the luminous surface of the luminous piece, so that the light emitted by the luminous piece can be effectively enhanced, and the light efficiency of the whole LED light source module is further improved.

In one embodiment, the reflecting surface includes a first reflecting surface and a second reflecting surface with different refractive angles, the first reflecting surface and the second reflecting surface are spliced with each other, and the first reflecting surface is located at the outer peripheral side of the second reflecting surface.

In one embodiment, the first reflecting surface is of a horizontal plane structure, and the second reflecting surface is of a cambered surface structure, and the center of the second reflecting surface is concave.

In one embodiment, the fluorescent layer is attached to a side of the light emitting element, which is away from the circuit board.

In one embodiment, the light-emitting device further comprises a light-transmitting body, and the light-transmitting body is covered on the light-emitting piece and the reflecting surface.

In one embodiment, the light emitting device further comprises a connecting layer, wherein the connecting layer is arranged between the light emitting piece and the base, and the connecting layer is used for connecting the light emitting piece and the base.

In one embodiment, the base is disposed in the reflector, and opposite sides of the base are respectively connected to the connection layer and the circuit board.

In one embodiment, the circuit board includes a first conductive layer, a second conductive layer, and a substrate, where the substrate is disposed between the first conductive layer and the second conductive layer, and conductive holes are formed in the substrate, and the first conductive layer and the second conductive layer are electrically connected through the conductive holes.

In one embodiment, the diameter of the conductive aperture is greater than or equal to 0.05mm and less than or equal to 0.5mm.

In one embodiment, the substrate is aluminum nitride, aluminum oxide, sapphire, or graphene.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a cross-sectional structure diagram of an LED light source module provided in an embodiment of the present application;

fig. 2 is a top view of the LED light source module shown in fig. 1.

Wherein, each reference sign in the figure:

10. a circuit board; 11. a first conductive layer; 12. a second conductive layer; 13. a substrate; 131. a conductive hole;

20. a base;

30. a light emitting member;

40. a fluorescent layer;

50. a reflecting member; 51. a reflecting surface; 511. a first reflecting surface; 512. a second reflecting surface;

60. a light transmitting body;

70. and a connection layer.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

Referring to fig. 1, an LED light source module provided in an embodiment of the present application will be described. The LED light source module comprises a circuit board 10, a base 20, a light emitting member 30, a fluorescent layer 40 and a reflecting member 50.

The base 20 is electrically connected with the circuit board 10; the light emitting piece 30 is arranged on one side of the base 20 away from the circuit board 10, and the light emitting piece 30 is electrically connected with the base 20; the fluorescent layer 40 is attached to the outer side surface of the light emitting member 30; the reflecting member 50 is disposed between the circuit board 10 and the light emitting member 30, the reflecting member 50 is provided with a reflecting surface 51, the reflecting surface 51 is spaced apart from the light emitting member 30, and the reflecting surface 51 faces the light emitting member 30.

For example, as shown in fig. 1, the base 20 and the reflecting member 50 are disposed on the same side of the circuit board 10, wherein the reflecting member 50 is used for reflecting the light of the light emitting member 30 near the reflecting member 50 toward the light emitting member 30, so that the light of the whole light emitting member 30 can be converted into the target area. The base 20 is mainly used for enabling the light emitting element 30 and the circuit board 10 to be arranged at intervals, so that the light emitting element 30 and the reflecting surface 51 on the reflecting element 50 are arranged at intervals, and light rays emitted by one side, close to the reflecting element 50, of the light emitting element 30 can be effectively refracted through the reflecting surface 51. Part of the light emitted from the light emitting element 30 needs to pass through the fluorescent layer 40 to be emitted to the outside, and the fluorescent layer 40 can effectively absorb the light emitted from the light emitting element 30 and then emit stronger light, so that the brightness of the light emitted from the light emitting element 30 is improved.

The reflector 50 is made of a material with a reflectivity of more than 92% such as silica gel or SMC composite material or EMC or PCT (polycaprolactam fibers) or nano glass beads or titanium pigment or ceramic powder.

The number of the light emitting members 30 may be plural, and the more the number of the light emitting members 30 is, the higher the brightness of the whole LED light source module.

Specifically, the fluorescent layer 40 is made of one or more of high-brightness red powder, yellow powder, green powder, orange powder, blue-green powder, and the like.

Further, the distance between the light emitting element 30 and the circuit board 10 can be adjusted by changing the thickness of the base 20, so that the position between the light emitting element 30 and the reflecting surface 51 in the reflecting element 50 can be adjusted.

Compared with the prior art, the LED light source module provided by the application has the advantages that the reflecting piece 50 is arranged on the circuit board 10, the reflecting surface 51 in the reflecting piece 50 faces the light emitting piece 30, part of light rays emitted from the light emitting piece 30 can be reflected out by the reflecting surface 51, the reflecting surface 51 and the light emitting piece 30 are arranged at intervals, the light rays emitted from one side, close to the reflecting piece 50, of the light emitting piece 30 can be emitted to the reflecting surface 51 by utilizing the interval space between the reflecting surface 51 and the light emitting piece 30, so that the part of light rays are reflected out, the light rays emitted from the light emitting piece 30 are reflected fully, the conversion efficiency of the light rays emitted from the light emitting piece 30 is improved, and the light efficiency of the whole LED light source module is improved; meanwhile, the fluorescent layer 40 is attached to the outer side surface of the light emitting member 30, so that light emitted by the light emitting member 30 can be effectively enhanced, and the light efficiency of the whole LED light source module is further improved.

In one embodiment of the present application, referring to fig. 1 and 2, the reflecting surface 51 includes a first reflecting surface 511 and a second reflecting surface 512 with different reflecting angles, and the first reflecting surface 511 and the second reflecting surface 512 are spliced with each other.

Specifically, the first reflecting surface 511 is spliced on the outer peripheral side of the second reflecting surface 512, where the first reflecting surface 511 is a horizontal plane structure. The second reflecting surface 512 is concave towards the center and is in an arc surface structure, and the second reflecting surface 512 is arranged to be in a concave structure, so that light rays emitted from the light emitting part 30 can be effectively reflected and converged. By arranging the reflecting surface 51 as the structure of splicing the first reflecting surface 511 and the second reflecting surface 512, the reflecting surface 51 in the reflecting member 50 can reflect the light emitted from the light emitting member 30 from different angles, so that the brightness of the whole LED light source module is improved, and the overall light efficiency is further improved.

In one embodiment of the present application, referring to fig. 1 and 2, the fluorescent layer 40 is attached to a side of the light emitting element 30 facing away from the circuit board 10.

Specifically, due to the direction problem, the light emitted by the side, away from the circuit board 10, of the light emitting member 30 cannot be irradiated onto the reflecting member 50, the light on the side can be irradiated towards the direction right ahead, the fluorescent layer 40 is attached to the side, away from the circuit board 10, of the light emitting member 30, the light passing through the fluorescent layer 40 can be absorbed, stronger light is emitted, and accordingly the light on the side, away from the circuit board 10, of the light emitting member 30 is enhanced, and the overall light efficiency of the whole LED light source module is improved.

In an embodiment of the present application, referring to fig. 1 and 2 together, the led light source module further includes a transparent body 60, the transparent body 60 is disposed on the reflecting surface 51, and the light emitting element 30 is located inside the transparent body 60.

Specifically, the light-transmitting body 60 is an integrally formed structure, and the light-emitting angle, shape, height and other shapes of the light-transmitting body 60 can be adjusted at will, and the process is a molding process such as die top or dispensing or 3D molding or UV curing; the light-transmitting body 60 is made of a high light-transmitting material such as silica gel, glass, or acryl. The side of the transparent body 60, which is close to the circuit board 10, and the reflecting surface 51 in the reflecting piece 50 are mutually attached together, and the transparent body 60 is attached to the reflecting surface 51, so that the light reflected on the reflecting surface 51 can directly irradiate into the transparent body 60, and the light is transmitted by the transparent body 60 with higher light transmittance, so that the overall light efficiency of the whole LED light source module is further improved.

Further, an accommodating space is formed in the transparent body 60, the light emitting element 30 and the fluorescent layer 40 are both arranged in the accommodating space, the positions of the light emitting element 30 except for the position connected with the base 20 are all in the wrapping range of the transparent body 60, and the light emitting element 30 is arranged in the transparent body 60, so that light emitted by the light emitting element 30 can directly enter the transparent body 60, and can be transmitted in a material with higher light transmittance in the transparent body 60, the loss of the light in the irradiation process is reduced, and the overall light efficiency of the whole LED light source module is further improved.

In an embodiment of the present application, referring to fig. 1, the led light source module further includes a connection layer 70, the connection layer 70 is disposed between the light emitting element 30 and the base 20, and the connection layer 70 is used for connecting the light emitting element 30 and the base 20.

Specifically, the connection layer 70 mainly serves to fix the light emitting member 30 to the base 20. Since the light emitting member 30 is disposed in the light transmitting body 60 and the base 20 is disposed outside the light transmitting body 60, it is difficult to perform a limited connection between the base 20 and the light emitting member 30 by a structure, and an additional connecting material is required to connect the two. By providing the connection layer 70 between the light emitting element 30 and the base 20, the light emitting element 30 inside the light transmitting body 60 can be effectively connected to the base 20 outside the light transmitting body 60.

In one embodiment of the present application, referring to fig. 1, the connection layer 70 is solder paste, silver paste, solder resist or silicone.

Specifically, since the accommodating space is a sealed space, and the light emitting member 30 itself generates a large amount of heat during operation, it is difficult to effectively dissipate heat in the accommodating space. Meanwhile, the solder paste, the silver paste, the solder resist or the silica gel are all high heat-conducting materials, and by adopting one of the solder paste, the silver paste, the solder resist or the silica gel as the connecting layer 70, heat generated in the light emitting part 30 can be effectively transferred to the outside of the light transmitting body 60 through the connecting layer 70, so that the excessive temperature in the accommodating space is effectively avoided.

In one embodiment of the present application, referring to fig. 1, the base 20 is disposed in the reflector 50, and opposite sides of the base 20 are respectively connected to the connection layer 70 and the circuit board 10.

Specifically, since the light emitting element 30 is an electrical element and needs to be electrically connected with the circuit board 10, light can be emitted after power is supplied, and meanwhile, the light emitting element 30 needs to be disposed on a side of the reflecting element 50 close to the reflecting surface 51, so that light generated in the light emitting element 30 can be irradiated onto the reflecting surface 51, but the base 20 connected with the light emitting element 30 cannot be disposed on a side of the reflecting element 50 close to the reflecting surface 51, so that light reflected in a part of the reflecting surface 51 is blocked, and the overall light efficiency of the whole LED light source module is seriously reduced. It is necessary to provide the light emitting member 30 and the circuit board 10 on opposite sides of the base 20, respectively.

In an embodiment of the present application, referring to fig. 1, a circuit board 10 includes a first conductive layer 11, a second conductive layer 12 and a substrate 13, the substrate 13 is disposed between the first conductive layer 11 and the second conductive layer 12, a conductive hole 131 is formed on the substrate 13, and the first conductive layer 11 and the second conductive layer 12 are electrically connected through the conductive hole 131.

Specifically, the primary functions of the first conductive layer 11 and the second conductive layer 12 are similar to the conductive wires for realizing electrical connection, while the substrate 13 has insulation property for preventing short circuit between the first conductive layer 11 and the second conductive layer 12, and the conductive holes 131 are formed on the substrate 13, so that the first conductive layer 11 and the second conductive layer 12 can be electrically connected to form a complete circuit. Meanwhile, the first conductive layer 11 and the second conductive layer 12 are both brushed with solder resist ink, the effect of the solder resist ink is similar to that of a rubber sheath outside a wire, short circuits inside the first conductive layer 11 and inside the second conductive layer 12 can be effectively prevented, and therefore complicated circuits inside the whole LED light source module can be subjected to high-density treatment, and the light emitting area of the light emitting piece 30 is optimized to the greatest extent.

Further, the base 20 and the first conductive layer 11 may be an integral structure formed by etching, or may be a split structure electrically connected to each other, and the two structures may be electrically connected to each other.

The heat transfer circuit in the whole LED light source module is that the light emitting element 30 generates heat after long-time operation, then the heat is transferred to the connection layer 70, then transferred to the base 20 and the first conductive layer 11, then transferred to the substrate 13, and finally transferred to the second conductive layer 12, and the whole heat is conducted from top to bottom.

In one embodiment of the present application, referring to fig. 1, the diameter of the conductive hole 131 is greater than or equal to 0.05mm and less than or equal to 0.5mm.

Specifically, the conductive holes 131 are mainly used for providing wires that can electrically connect the first conductive layer 11 and the second conductive layer 12. By setting the diameter of the conductive hole 131 to be greater than or equal to 0.05mm and less than or equal to 0.5mm, electrical connection between the first conductive layer 11 and the second conductive layer 12 can be achieved without affecting the overall performance of the circuit board 10.

In one embodiment of the present application, referring to fig. 1, the substrate 13 is aluminum nitride, aluminum oxide, sapphire or graphene.

Specifically, the first conductive layer 11 and the second conductive layer 12 generate a large amount of heat during operation, and the heat in the first conductive layer 11 and the second conductive layer 12 needs to be conducted immediately. Meanwhile, aluminum nitride, aluminum oxide, sapphire or graphene are all high-heat-conductivity insulating materials and have certain rigidity strength, and by adopting one of aluminum nitride, aluminum oxide, sapphire or graphene as the connecting layer 70, heat generated in the first conductive layer 11 and the second conductive layer 12 can be effectively absorbed, so that local overhigh temperature in the circuit board 10 can be effectively avoided.

The foregoing description of the preferred embodiments of the present utility model has been provided for the purpose of illustrating the general principles of the present utility model and is not to be construed as limiting the scope of the utility model in any way. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model, and other embodiments of the present utility model as will occur to those skilled in the art without the exercise of inventive faculty, are intended to be included within the scope of the present utility model.

Claims (10)

1. An LED light source module, comprising:

a circuit board;

the base is electrically connected with the circuit board;

the luminous piece is arranged on the side surface, away from the circuit board, of the base and is electrically connected with the base;

the fluorescent layer is attached to the light emitting surface of the light emitting piece;

the reflecting piece is arranged between the circuit board and the luminous piece, a reflecting surface is arranged on the reflecting piece, the reflecting surface is arranged at intervals with the luminous piece, and the reflecting surface faces the luminous piece.

2. The LED light source module of claim 1, wherein the reflective surface comprises a first reflective surface and a second reflective surface having different reflective angles, the first reflective surface and the second reflective surface are spliced with each other, and the first reflective surface is located at an outer peripheral side of the second reflective surface.

3. The LED light source module of claim 2, wherein the first reflective surface is of a horizontal plane structure and the second reflective surface is of a curved surface structure with a concave center.

4. The LED light source module of claim 1, wherein the phosphor layer is attached to a side of the light-emitting member facing away from the circuit board.

5. The LED light source module of claim 1, further comprising a light transmissive body covering the light emitting member and the reflective surface.

6. The LED light source module of claim 1, further comprising a connection layer disposed between the light emitting member and the base, the connection layer being configured to connect the light emitting member and the base.

7. The LED light source module of claim 6, wherein the base is disposed in the reflector, and opposite sides of the base are connected to the connection layer and the circuit board, respectively.

8. The LED light source module of claim 1, wherein the circuit board comprises a first conductive layer, a second conductive layer, and a substrate, the substrate is disposed between the first conductive layer and the second conductive layer, conductive holes are formed in the substrate, and the first conductive layer and the second conductive layer are electrically connected through the conductive holes.

9. The LED light source module of claim 8, wherein the diameter of the conductive aperture is greater than or equal to 0.05mm and less than or equal to 0.5mm.

10. The LED light source module of claim 8, wherein the substrate is aluminum nitride, aluminum oxide, sapphire, or graphene.