CN220484674U - Electrolytic water chip grabbing equipment - Google Patents

Electrolytic water chip grabbing equipment Download PDF

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Publication number
CN220484674U
CN220484674U CN202322065260.4U CN202322065260U CN220484674U CN 220484674 U CN220484674 U CN 220484674U CN 202322065260 U CN202322065260 U CN 202322065260U CN 220484674 U CN220484674 U CN 220484674U
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panel
recess
3ccm
groove
assembly
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CN202322065260.4U
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Chinese (zh)
Inventor
高育晨
曾黎
唐天赐
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Hydrogen Energy Shenzhen Co ltd
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Hydrogen Energy Shenzhen Co ltd
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Abstract

The utility model discloses an electrolyzed water chip grabbing device, which comprises: remove subassembly, vacuum adsorption subassembly, base and layer board, the layer board sets up in the mounting groove, the cross sectional shape and the size of first recess, the cross sectional shape and the size of layer board and the cross sectional shape and the size of 3CCM are all unanimous, the layer board is used for bearing 3CCM, remove the subassembly and be used for driving vacuum adsorption subassembly and remove, with vacuum adsorption subassembly's first recess remove to the layer board directly over, the layer board can follow the direction of height reciprocating slip for the mounting groove, so that the layer board is close to gradually and inlay and locate in the first recess or keep away from first recess, thereby realize the absorption and the location of first recess to 3 CCM. The utility model provides an electrolytic water chip snatchs equipment can accurately snatch and adsorb 3CCM, again because first recess is to the spacing effect of 3CCM, can avoid 3CCM to appear position deviation in snatching the transportation in-process to when reducing pre-installation 5CCM, the counterpoint error of 3CCM improves the 5CCM product performance of preparation.

Description

Electrolytic water chip grabbing equipment
Technical Field
The utility model relates to the technical field of fuel cells, in particular to an electrolyzed water chip grabbing device.
Background
The PEM (polyelectrolyte membrane) electrolyzed water chip (3 CCM) consists of CCM (proton exchange membrane) and cathode and anode catalysts coated on the front side and the back side of the proton exchange membrane, wherein one side coated with the cathode catalyst is called a cathode side, and the other side coated with the anode catalyst is called an anode side. The membrane electrode assembly (5 CCM) comprises 3CCM and sealing frames hot-pressed on the upper surface and the lower surface of the CCM. In the process of grabbing the 3CCM, as the flat plate type adsorption panel is adopted in the prior art, shaking easily occurs in carrying the 3CCM, so that the position of the 3CCM relative to the adsorption panel is deviated during grabbing, and the 3CCM with the position deviation is easily misaligned with the sealing frames of the upper layer and the lower layer during subsequent assembly of the membrane electrode assembly, so that the active area is reduced, the sealing performance is poor, and the performance of a prepared 5CCM product is poor.
Disclosure of Invention
Based on the above, it is necessary to provide an electrolyzed water chip grabbing device capable of accurately grabbing 3CCM and avoiding position deviation in the moving process of grabbing 3 CCM.
An electrolyzed water chip grabbing device comprising:
a moving assembly;
the vacuum adsorption assembly is arranged in the moving assembly, a first groove is formed in the bottom end of the vacuum adsorption assembly, and the vacuum adsorption assembly is used for adsorbing the 3CCM in the first groove;
a base, wherein an installation groove is formed in the base;
the support plate, the support plate set up in the mounting groove, the cross sectional shape and the size of first recess, the cross sectional shape and the size of support plate with the cross sectional shape and the size of 3CCM are all unanimous, the support plate is used for bearing 3CCM, remove the subassembly and be used for driving vacuum adsorption subassembly removes, with vacuum adsorption subassembly first recess removes to directly over the support plate, the support plate can for the mounting groove is followed the reciprocal slip of altitude direction, so that the support plate is close to gradually and inlays and locate in the first recess or keep away from first recess, thereby realize first recess pair absorption and the location of 3 CCM.
Optionally, the vacuum adsorption subassembly includes first panel, second panel and evacuation interface, first panel set up in the bottom of second panel, first panel's bottom has been seted up first recess, a plurality of absorption holes that link up the setting have been seted up in the first recess, the top of second panel with remove the subassembly and be connected, the second recess has been seted up to the bottom of second panel, first panel's top with the second recess surrounds and constitutes the cavity, the evacuation interface set up in the second panel, and with the cavity intercommunication, a plurality of absorption holes with the cavity is linked together, the evacuation interface is used for being connected with vacuum generator, so that the cavity forms negative pressure, thereby makes a plurality of absorption holes produce the adsorption affinity, with 3 adsorb in the first recess.
Optionally, the vacuum adsorption assembly further includes a sealing ring, where the sealing ring is disposed between the first panel and the second panel, so as to seal between the first panel and the second panel.
Optionally, the vacuum adsorption assembly further includes a fixing member, where the fixing member is configured to penetrate through the first panel and the second panel, so as to fix the first panel relative to the second panel.
Optionally, the locating hole has been seted up to first panel, the top of base is provided with the locating pin, the locating pin is used for inserting to locate in the locating hole, in order to realize first panel for the alignment of base.
Optionally, the number of the positioning holes is multiple, the positioning holes are uniformly distributed around the first panel, the number of the positioning pins is multiple, the positioning pins are uniformly distributed around the base, and the positioning pins are in one-to-one correspondence with the positioning holes.
Optionally, the electrolytic water chip grabbing device further comprises a lifting assembly, wherein the lifting assembly is arranged in the mounting groove, and the lifting assembly is used for driving the supporting plate to slide back and forth along the height direction relative to the mounting groove.
Optionally, the lifting assembly includes guide rail and actuating mechanism, the guide rail set up in the lateral wall of mounting groove, just the extending direction of guide rail with the direction of height of mounting groove is unanimous, actuating mechanism's one end set up in the bottom of mounting groove, actuating mechanism's the other end with the layer board is connected, the layer board still with guide rail sliding connection, actuating mechanism can stretch out and draw back for oneself, so as to drive the layer board is followed the reciprocal slip of guide rail.
Optionally, the lifting assembly further comprises a connecting assembly, the connecting assembly comprises a sliding part and a fixing part, the bottom end of the sliding part is connected with the guide rail, the fixing part is fixedly arranged at the top end of the sliding part, the supporting plate is connected with the top end of the fixing part, and the driving mechanism drives the supporting plate to slide along the guide rail, so that the fixing part drives the sliding part to slide along the guide rail.
Optionally, the electrolyzed water chip grabbing device further comprises a pressure sensor, the pressure sensor is arranged at the bottom of the supporting plate, and the pressure sensor is further electrically connected with the driving mechanism.
The application provides an electrolytic water chip snatchs equipment, through being provided with first recess at vacuum adsorption subassembly, just cross sectional shape and the size of first recess, cross sectional shape and the size of layer board with cross sectional shape and the size of 3CCM are all unanimous, and the layer board drives 3CCM and imbeds to first recess in, then first recess is accurate carries out vacuum adsorption to 3CCM, can accurately snatch and adsorb 3CCM, again because first recess is to the spacing effect of 3CCM, can avoid 3CCM to appear position deviation in snatching the transportation process to when reducing pre-installation 5CCM, 3 CCM's counterpoint error improves the 5CCM product performance that the preparation obtained.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an electrolytic water chip grabbing device according to an embodiment;
FIG. 2 is a schematic diagram showing a split structure of a vacuum adsorption module according to an embodiment;
FIG. 3 is a bottom view of the first panel in one embodiment;
FIG. 4 is a top view of a first panel according to one embodiment;
FIG. 5 is a schematic structural view of a second panel according to an embodiment;
FIG. 6 is a schematic view of a part of the structure of an electrolytic water chip grabbing device according to an embodiment;
FIG. 7 is a schematic view of a guide rail according to an embodiment;
fig. 8 is a schematic view of a part of the structure of the electrolytic water chip grabbing device in an operating state in an embodiment.
1. A moving assembly; 2. a vacuum adsorption assembly; 21. a first groove; 22. a first panel; 221. positioning holes; 23. a second panel; 24. a vacuumizing interface; 25. adsorption holes; 26. a second groove; 27. a seal ring; 28. a third groove; 29. a fixing member; 3. a base; 31. a mounting groove; 32. a positioning pin; 4. a supporting plate; 5. a lifting assembly; 51. a guide rail; 52. a driving mechanism; 53. a connection assembly; 531. a sliding part; 532. a fixing part; 6. a pressure sensor;
the achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, "and/or" throughout this document includes three schemes, taking a and/or B as an example, including a technical scheme, a technical scheme B, and a technical scheme that both a and B satisfy; in addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
Referring to fig. 1 to 3, the present application provides an electrolyzed water chip grabbing device, which includes a moving component 1, a vacuum adsorption component 2, a base 3 and a supporting plate 4, wherein the vacuum adsorption component 2 is arranged on the moving component 1, a first groove 21 is formed at the bottom end of the vacuum adsorption component 2, and the vacuum adsorption component 2 is used for adsorbing 3CCM in the first groove 21; the inside of the base 3 is provided with a mounting groove 31; the layer board 4 sets up in mounting groove 31, and the cross sectional shape and the size of first recess 21, the cross sectional shape and the size of layer board 4 and the cross sectional shape and the size of 3CCM are all unanimous, and layer board 4 is used for bearing 3CCM, and remove subassembly 1 is used for driving vacuum adsorption subassembly 2 and removes to directly over with the first recess 21 of vacuum adsorption subassembly 2 to layer board 4, layer board 4 can follow the reciprocal slip of altitude direction for mounting groove 31, so that layer board 4 is close gradually and inlay and locate in the first recess 21 or keep away from first recess 21, thereby realizes that first recess 21 adsorbs and the location to 3 CCM.
The application provides an electrolytic water chip snatchs equipment, through being provided with first recess 21 at vacuum adsorption subassembly 2, and the cross sectional shape and the size of first recess 21, the cross sectional shape and the size of layer board 4 and the cross sectional shape and the size of 3CCM are all unanimous, layer board 4 drives 3CCM and imbeds to first recess 21 in, then first recess 21 is accurate carries out vacuum adsorption to 3CCM, can accurately snatch and adsorb 3CCM, again because first recess 21 is to the spacing effect of 3CCM, can avoid 3CCM to appear position deviation in snatching the transportation process, thereby when reducing pre-installation 5CCM, the counterpoint error of 3CCM improves the 5CCM product performance that the preparation obtained.
In this example, the moving component 1 may be a manipulator, and the manipulator is used to grasp 3CCM, so that the reliability is high, and errors caused by manual grasping can be avoided.
Specifically, the cross-sectional shape of the support plate 4 may be rectangular and circular, and the cross-sectional dimensions of the first groove 21, the support plate 4 and the 3CCM are all uniform, meaning that the lengths and the widths of the three are all uniform.
Referring to fig. 2 to 5, the vacuum adsorption assembly 2 includes a first panel 22, a second panel 23 and a vacuum-pumping interface 24, the first panel 22 is disposed at the bottom of the second panel 23, a first groove 21 is formed at the bottom end of the first panel 22, a plurality of adsorption holes 25 are formed in the first groove 21, the top end of the second panel 23 is connected with the moving assembly 1, a second groove 26 is formed at the bottom end of the second panel 23, the top end of the first panel 22 and the second groove 26 surround to form a cavity, the vacuum-pumping interface 24 is disposed on the side wall of the second panel 23 and communicated with the cavity, the plurality of adsorption holes 25 are communicated with the cavity, and the vacuum-pumping interface 24 is connected with a vacuum generator to form negative pressure in the cavity, so that the plurality of adsorption holes 25 generate adsorption force to adsorb 3 CCMs in the first groove 21.
Specifically, the plurality of adsorption holes 25 are uniformly distributed in the first groove 21.
Referring to fig. 2, the vacuum adsorption assembly 2 further includes a sealing ring 27, and the sealing ring 27 is disposed between the first panel 22 and the second panel 23 to achieve sealing between the first panel 22 and the second panel 23.
Specifically, the top of first panel 22 has seted up third recess 28, and third recess 28 encircles around setting up in first recess 21, and sealing washer 27 inlays in third recess 28, so can make first panel 22 and second panel 23 form airtight space, and the pressure in the cavity can be made to reduce through vacuum generator draws out a certain amount of gas for the inside and outside of first panel 22 forms pressure differential, just can adsorb 3CCM under the effect of this pressure differential.
Referring to fig. 2, the vacuum adsorption assembly 2 further includes a fixing member 29, where the fixing member 29 is configured to be disposed through the first panel 22 and the second panel 23, so as to fix the first panel 22 relative to the second panel 23.
Specifically, the number of the fixing members 29 is plural, and the plurality of fixing members 29 are uniformly disposed around the first panel 22 and the second panel 23.
In this embodiment, the fixing member 29 is a screw.
Referring to fig. 4 and 6, the first panel 22 is provided with a positioning hole 221, and the top end of the base 3 is provided with a positioning pin 32, and the positioning pin 32 is used for being inserted into the positioning hole 221 so as to align the first panel 22 relative to the base 3. Through being provided with locating hole 221 and locating pin 32 that match each other, can make first panel 22 and base 3 accurate positioning to make vacuum adsorption subassembly 2's first recess 21 and layer board 4 accurate positioning, make vacuum adsorption subassembly 2 can adsorb the 3CCM on the layer board 4 in first recess 21 accurately, further realize 3 CCM's accurate snatch.
Specifically, the positioning hole 221 may be provided with a linear sliding bearing, and the positioning pin 32 is inserted into the linear sliding bearing, so that flexibility and matching accuracy are high.
Referring to fig. 4 and 6, the number of the positioning holes 221 is plural, the plurality of positioning holes 221 are uniformly distributed around the first panel 22, the number of the positioning pins 32 is plural, the plurality of positioning pins 32 are uniformly distributed around the base 3, and the plurality of positioning pins 32 are in one-to-one correspondence with the plurality of positioning holes 221.
In the present embodiment, the number of the positioning holes 221 is four, and the four positioning holes 221 are distributed at four corners of the first panel 22. The number of the positioning pins 32 is four, and the four positioning pins 32 are distributed at four corners of the top end of the substrate.
Referring to fig. 1, the electrolytic water chip grabbing apparatus further includes a lifting assembly 5, where the lifting assembly 5 is disposed in the mounting groove 31, and the lifting assembly 5 is used to drive the supporting plate 4 to slide back and forth in the height direction relative to the mounting groove 31.
Referring to fig. 6 and 7, the lifting assembly 5 includes a guide rail 51 and a driving mechanism 52, the guide rail 51 is disposed on a side wall of the installation groove 31, and an extending direction of the guide rail 51 is consistent with a height direction of the installation groove 31, one end of the driving mechanism 52 is disposed at a bottom end of the installation groove 31, the other end of the driving mechanism 52 is connected with the supporting plate 4, the supporting plate 4 is further slidably connected with the guide rail 51, and the driving mechanism 52 can stretch and retract relative to itself to drive the supporting plate 4 to slide reciprocally along the guide rail 51.
Specifically, the number of the guide rails 51 is plural, and the plural guide rails 51 are uniformly distributed around the side wall of the mounting groove 31. Wherein the guide rail 51 is a linear guide rail.
In the present embodiment, the number of the guide rails 51 is four, the four guide rails 51 are distributed at four corners of the mounting groove 31, and the four guide rails 51 are slidably connected with four corners of the rectangular pallet 4, respectively.
Specifically, the drive mechanism 52 may be a servo cylinder.
Referring to fig. 7, the lifting assembly 5 further includes a connection assembly 53, the connection assembly 53 includes a sliding portion 531 and a fixing portion 532, the bottom end of the sliding portion 531 is connected with the guide rail 51, the fixing portion 532 is fixedly disposed at the top end of the sliding portion 531, the supporting plate 4 is connected with the top end of the fixing portion 532, and the driving mechanism 52 drives the supporting plate 4 to slide along the guide rail 51, so that the fixing portion 532 drives the sliding portion 531 to slide along the guide rail 51.
Specifically, the fixing portion 532 is disposed at the bottom of the supporting plate 4, so as to avoid the influence of the fixing portion 532 on the embedding of the supporting plate 4 into the first groove 21.
Referring to fig. 6, the electrolyzed water chip grabbing apparatus further comprises a pressure sensor 6, the pressure sensor 6 is disposed at the bottom of the supporting plate 4, the pressure sensor 6 is further electrically connected with the driving mechanism 52, and the pressure sensor 6 is used for controlling the driving mechanism 52 to stop running. When the driving mechanism 52 starts to push the 3CCM on the supporting plate 4 into the first groove 21 of the first panel 22, the pressure sensor 6 senses the pressure transmitted to the supporting plate 4 by the first groove 21, and the pressure sensor 6 sends a signal to the driving mechanism 52 to control the driving mechanism 52 to stop running.
The working principle of the application is as follows:
the 3CCM is placed on the pallet 4, the pallet 4 is fixed to the sliding portion 531 by the fixing portion 532, and the sliding portion 531 can move the pallet 4 up and down along the rail 51 by the driving mechanism 52. The moving assembly 1 moves the vacuum suction assembly 2 to just above the pallet 4, and the positioning holes 221 in the vacuum suction assembly 2 are aligned with the positioning pins 32 of the base 3, by which the first panel 22 precisely falls onto the pallet 4 (refer to fig. 8). The driving mechanism 52 starts to push the 3CCM on the supporting plate 4 into the first groove 21 of the first panel 22, the pressure sensor 6 senses force and sends out a signal to stop the driving mechanism 52, and meanwhile, the vacuum generator enables vacuum to be generated in the cavity, and the 3CCM is flatly adsorbed in the first groove 21 of the first panel 22, so that accurate grabbing is realized.
The foregoing description of the preferred embodiments of the present utility model should not be construed as limiting the scope of the utility model, but rather should be understood to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model as defined by the following description and drawings or any application directly or indirectly to other relevant art(s).

Claims (10)

1. An electrolyzed water chip grabbing device, comprising:
a moving assembly;
the vacuum adsorption assembly is arranged in the moving assembly, a first groove is formed in the bottom end of the vacuum adsorption assembly, and the vacuum adsorption assembly is used for adsorbing the 3CCM in the first groove;
a base, wherein an installation groove is formed in the base;
the support plate, the support plate set up in the mounting groove, the cross sectional shape and the size of first recess, the cross sectional shape and the size of support plate with the cross sectional shape and the size of 3CCM are all unanimous, the support plate is used for bearing 3CCM, remove the subassembly and be used for driving vacuum adsorption subassembly removes, with vacuum adsorption subassembly first recess removes to directly over the support plate, the support plate can for the mounting groove is followed the reciprocal slip of altitude direction, so that the support plate is close to gradually and inlays and locate in the first recess or keep away from first recess, thereby realize first recess pair absorption and the location of 3 CCM.
2. The electrolyzed water chip grabbing device according to claim 1, wherein the vacuum adsorption assembly comprises a first panel, a second panel and a vacuumizing interface, the first panel is arranged at the bottom of the second panel, the bottom end of the first panel is provided with a first groove, a plurality of adsorption holes which are arranged in a penetrating manner are formed in the first groove, the top end of the second panel is connected with the moving assembly, the bottom end of the second panel is provided with a second groove, the top end of the first panel and the second groove are surrounded to form a cavity, the vacuumizing interface is arranged on the second panel and is communicated with the cavity, a plurality of adsorption holes are communicated with the cavity, the vacuumizing interface is used for being connected with a vacuum generator so that negative pressure is formed in the cavity, and therefore a plurality of adsorption holes generate adsorption force so as to adsorb 3CCM in the first groove.
3. The electrolyzed water chip gripping apparatus according to claim 2, wherein the vacuum suction assembly further comprises a sealing ring disposed between the first panel and the second panel to achieve a seal between the first panel and the second panel.
4. The electrolyzed water chip gripping apparatus according to claim 2, wherein the vacuum suction assembly further comprises a fixing member for penetrating the first panel and the second panel to fix the first panel relative to the second panel.
5. The electrolyzed water chip grabbing apparatus according to claim 2, wherein the first panel is provided with a positioning hole, and the top end of the base is provided with a positioning pin, and the positioning pin is used for being inserted into the positioning hole, so as to align the first panel relative to the base.
6. The electrolyzed water chip grabbing device according to claim 5, wherein the number of the positioning holes is a plurality, the plurality of the positioning holes are uniformly distributed around the first panel, the number of the positioning pins is a plurality, the plurality of the positioning pins are uniformly distributed around the base, and the plurality of the positioning pins are in one-to-one correspondence with the plurality of the positioning holes.
7. The electrolyzed water chip grabbing apparatus according to claim 1, further comprising a lifting assembly disposed in the mounting groove, wherein the lifting assembly is configured to drive the pallet to slide back and forth in a height direction relative to the mounting groove.
8. The electrolyzed water chip grabbing apparatus according to claim 7, wherein the lifting assembly comprises a guide rail and a driving mechanism, the guide rail is arranged on the side wall of the installation groove, the extending direction of the guide rail is consistent with the height direction of the installation groove, one end of the driving mechanism is arranged at the bottom end of the installation groove, the other end of the driving mechanism is connected with the supporting plate, the supporting plate is further connected with the guide rail in a sliding manner, and the driving mechanism can stretch relative to the driving mechanism to drive the supporting plate to slide back and forth along the guide rail.
9. The electrolyzed water chip grabbing apparatus according to claim 8, wherein the lifting assembly further comprises a connecting assembly, the connecting assembly comprises a sliding portion and a fixing portion, the bottom end of the sliding portion is connected with the guide rail, the fixing portion is fixedly arranged at the top end of the sliding portion, the supporting plate is connected with the top end of the fixing portion, and the driving mechanism drives the supporting plate to slide along the guide rail, so that the fixing portion drives the sliding portion to slide along the guide rail.
10. The electrolyzed water chip gripping apparatus according to claim 8, further comprising a pressure sensor disposed at a bottom of the carrier, the pressure sensor further being electrically connected to the driving mechanism.
CN202322065260.4U 2023-08-01 2023-08-01 Electrolytic water chip grabbing equipment Active CN220484674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322065260.4U CN220484674U (en) 2023-08-01 2023-08-01 Electrolytic water chip grabbing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322065260.4U CN220484674U (en) 2023-08-01 2023-08-01 Electrolytic water chip grabbing equipment

Publications (1)

Publication Number Publication Date
CN220484674U true CN220484674U (en) 2024-02-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322065260.4U Active CN220484674U (en) 2023-08-01 2023-08-01 Electrolytic water chip grabbing equipment

Country Status (1)

Country Link
CN (1) CN220484674U (en)

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