Disclosure of Invention
The purpose of the present application is: to solve the above-mentioned problems in the background art, the present application provides a temperature-adjustable hospital monitoring bed.
The application specifically adopts the following technical scheme for realizing the purposes:
a temperature-adjustable hospital monitoring bed comprising:
the water bed body is detachably provided with a water mattress;
the cooling box is arranged at the outer side of the bed body, a plurality of heat conducting frames are arranged in the cooling box in an array manner along the height direction of the cooling box, the heat conducting frames are arranged in an up-down staggered manner, the top of the cooling box is fixedly connected with a water outlet pipe communicated with one end of the water mattress, a water suction pump is fixedly arranged at the bottom of the cooling box, and a water inlet pipe is communicated between the water suction pump and the other end of the water mattress;
the cold-hot switching assembly comprises a semiconductor refrigerating sheet which is detachably inserted at the bottom of a heat conducting frame, wherein the bottom of the heat conducting frame is fixedly connected with a mounting frame for wrapping the semiconductor refrigerating sheet, and the mounting frame is internally fixedly connected with a fan communicated with the outside.
Further, the water mattress comprises a soft silica gel sleeve, positioning columns inserted on the bed body are fixedly connected at four corners of the soft silica gel sleeve, a plurality of supporting rings are arranged in the soft silica gel sleeve in an array mode, a plurality of vertical plates are arranged in the soft silica gel sleeve in an array mode, the vertical plates are oppositely arranged in a staggered mode to form a serpentine channel, and the water outlet pipe and the water inlet pipe are respectively communicated with the two ends of the serpentine channel.
Further, an air hole penetrating through the silica gel soft sleeve is formed in the supporting ring, and an arc angle is formed at the edge of the upper end of the air hole.
Further, the upper surface array of the silica gel soft sleeve is provided with a plurality of round protrusions.
Further, one end of the water outlet pipe positioned in the cooling box is fixedly connected with a spray header.
Further, the heat conduction frame comprises a bearing plate horizontally connected to the inner wall of the cooling box, one end of the bearing plate is fixedly connected with a ventilation pipe which obliquely upwards penetrates through the side wall of the cooling box, and a gap is formed between the other end of the bearing plate and the inner wall of the cooling box.
Further, the bottom of the receiving plate positioned at one side of the cooling box is provided with an inserting groove, the semiconductor refrigerating sheet is horizontally and slidably inserted in the inserting groove, and the other end of the ventilation pipe is detachably inserted with a ventilation block or a sealing block.
Further, the tray bottoms are each configured with a plurality of perforations.
The beneficial effects of this application are as follows:
1. this application is through setting up the water bed on guardianship bed, under patient's high temperature state, can utilize the suction pump with water between water bed and cooler bin quick-witted incasement circulation to this reduces the temperature of water bed, conveniently carries out body temperature regulation to personnel, and utilizes water as temperature transmission medium, and is comparatively mild, improves patient's comfort level.
2. This application is through setting up cold and hot switching assembly, can be in low temperature environment with the reverse interpolation of semiconductor refrigeration piece establish to make its heating surface and heat conduction frame contact, and then heat the water that circulates to the cooler bin in, with this temperature that improves the water bed, guarantee patient's recovery.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
As shown in fig. 1-5, one embodiment of the present application provides a temperature-adjustable hospital monitoring bed comprising:
the water bed comprises a bed body 1, wherein a water mattress 2 is detachably arranged on the bed body 1, and the water mattress 2 is paved on the upper side of a bed plate of the bed body 1;
the cooling box 3 is arranged at the outer side of the bed body 1, a plurality of heat conducting frames 4 are arranged in the cooling box 3 along the height direction array, the heat conducting frames 4 are arranged up and down in a staggered manner, the top of the cooling box 3 is fixedly connected with a water outlet pipe 301 communicated with one end of the water mattress 2, a water suction pump 302 is fixedly arranged in the cooling box 3, a water inlet pipe 303 is communicated between the water suction pump 302 and the other end of the water mattress 2, control valves are arranged on the water outlet pipe 301 and the water inlet pipe 303, not shown in the drawing, water flow can form circulation flow between the cooling box 3 and the water mattress 2 through the communication between the water outlet pipe 301 and the water inlet pipe 303, when the body of a patient needs to be cooled, half of control valves of the water outlet pipe 301 need to be opened, the control valves of the water inlet pipe 303 are all opened, the water mattress 2 is pressurized and filled with water by the water suction pump 302, the internal pressure of the water mattress 2 is kept, the water source is always filled in the cooling box, the water outlet pipe 301 can fall on the heat conducting frames 4, the water temperature of the water outlet pipe 301 can be effectively reduced, the water temperature of the water source can be reduced, and the water source can be cooled conveniently, and the temperature of the water mattress 2 is reduced;
the cold-hot switching component 5 comprises a semiconductor refrigerating sheet 501 which is detachably inserted at the bottom of a heat conducting frame 4, a mounting frame 502 which is used for wrapping the semiconductor refrigerating sheet 501 is fixedly connected at the bottom of the heat conducting frame 4, a fan 503 which is communicated with the outside is fixedly connected in the mounting frame 502, when a patient needs to be cooled, the refrigerating surface of the semiconductor refrigerating sheet 501 is arranged towards the heat conducting frame 4, so that the effect of further refrigerating a water source is achieved, the cooling effect is improved, the fan 503 is used for radiating the other surface of the semiconductor refrigerating sheet 501, the normal operation of the device is ensured, and when the water mattress 2 needs to be heated, the semiconductor refrigerating sheet 501 can be overturned and mounted at the bottom of the heat conducting frame 4, so that the temperature of the heating surface is increased towards the heat conducting frame 4 after the water mattress 2 is heated for many times, the temperature of the water mattress 2 is improved, the blood circulation and self-recovery effects of personnel are guaranteed, and the functionality and the practicability of the device are improved.
As shown in fig. 2, in some embodiments, the water-filled mattress 2 includes a silica gel soft sleeve 201, positioning columns 202 inserted on the mattress body 1 are fixedly connected at four corners of the silica gel soft sleeve 201, a plurality of support rings 203 are configured in the silica gel soft sleeve 201 in an array manner, a plurality of vertical plates 204 are configured in the silica gel soft sleeve 201 in an array manner, the vertical plates 204 are oppositely and alternately arranged to form a serpentine channel 205, a water outlet pipe 301 and a water inlet pipe 303 are respectively communicated with two ends of the serpentine channel 205, the positioning columns 202 are arranged at the bottom of the water-filled mattress 2 to facilitate positioning connection with the mattress body 1, sliding of the positioning columns is avoided, stability is increased, and the support rings 203 and the vertical plates 204 are arranged in the water-filled mattress 2 to play a role in internal support, so that the support force of the water-filled mattress 2 to the patient body is increased, and comfort of personnel is ensured.
As shown in fig. 2, in some embodiments, the air holes 2031 penetrating through the silica gel soft sleeve 201 are configured in the supporting ring 203, the arc angles are configured at the edges of the upper ends of the air holes 2031, the air holes 2031 are arranged to avoid the complete fit between the body of the patient and the mattress, the air permeability is ensured, the body ulcer caused by sweating of the person is avoided, the safety is increased, and the comfort of the patient in contact with the mattress is increased due to the arrangement of the arc angles.
As shown in fig. 1, in some embodiments, the upper surface array of the silica gel soft sleeve 201 is configured with a plurality of round protrusions 2011, and the round protrusions 2011 are used for increasing friction between a patient and the water mattress 2, guaranteeing stability of the patient when lying on the silica gel soft sleeve, and increasing safety of the device.
As shown in fig. 4, in some embodiments, one end of the water outlet pipe 301 located in the cooling tank 3 is fixedly connected with a spray header 3011, and the water outlet area of the water outlet pipe 301 can be increased by using the spray header 3011, so that the contact area between water and air is increased, and the cooling efficiency of water flow is further improved.
As shown in fig. 4, in some embodiments, the heat conducting frame 4 includes a receiving tray 401 horizontally connected to the inner wall of the cooling box 3, one end of the receiving tray 401 is fixedly connected with a ventilation pipe 402 extending obliquely upwards through the side wall of the cooling box 3, a gap is provided between the other end of the receiving tray 401 and the inner wall of the cooling box 3, the receiving tray 401 is used for receiving and scattering water flow, conducting a part of heat in water to the receiving tray 401, and increasing air circulation by using the contact between the ventilation pipe 402 and the outside, so that the water flow can be cooled by the air and the receiving tray 401 for multiple times, and the heat dissipation efficiency is improved.
As shown in fig. 4-5, in some embodiments, an inserting groove 4011 is configured at the bottom of a receiving tray 401 at one side of a cooling box 3, a semiconductor refrigeration piece 501 is horizontally slidably inserted into the inserting groove 4011, a ventilation block 4021 or a sealing block 4022 is detachably inserted at the other end of a ventilation pipe 402, the inserting groove 4011 is provided to facilitate the detachable installation of the semiconductor refrigeration piece 501, a heating surface is attached to the bottom of the receiving tray 401 when heating is needed, a refrigeration surface is attached to the bottom of the receiving tray 401 when cooling is needed, flexibility and functionality of the device are improved, the sealing block 4022 is inserted into the ventilation pipe 402 when heating is needed, so as to realize a heat preservation effect, and the ventilation block 4021 is inserted into the ventilation pipe 402 when cooling is needed, so as to realize a heat dissipation effect.
As shown in fig. 4, in some embodiments, the bottom of the receiving tray 401 is configured with a plurality of perforations 4012, and the perforations 4012 may enable the water flow to directly contact the cooling surface or the heating surface of the semiconductor cooling sheet 501, so as to reduce blocking and improve cooling or heating efficiency.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.