CN220473894U - Humidity adjusting module and cabinet - Google Patents

Humidity adjusting module and cabinet Download PDF

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Publication number
CN220473894U
CN220473894U CN202322022289.4U CN202322022289U CN220473894U CN 220473894 U CN220473894 U CN 220473894U CN 202322022289 U CN202322022289 U CN 202322022289U CN 220473894 U CN220473894 U CN 220473894U
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China
Prior art keywords
compartment
solution
solution box
heat exchanger
environment
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CN202322022289.4U
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Chinese (zh)
Inventor
葛睿彤
王秀萍
王定远
杨少强
李标
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Qingdao Guochuang Intelligent Home Appliance Research Institute Co ltd
Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
Original Assignee
Qingdao Guochuang Intelligent Home Appliance Research Institute Co ltd
Qingdao Haier Smart Technology R&D Co Ltd
Haier Smart Home Co Ltd
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Priority to CN202322022289.4U priority Critical patent/CN220473894U/en
Application granted granted Critical
Publication of CN220473894U publication Critical patent/CN220473894U/en
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Abstract

The application relates to the technical field of humidity control and discloses a humidity control module, which comprises a shell and a humidity control component. The humidifying component is arranged in the shell and comprises a first solution box, a second solution box and a semiconductor refrigerating component; the first solution box is arranged in the first compartment and is provided with a first dehumidifying film; the second solution box is arranged in the second compartment and is provided with a second dehumidifying film; the first solution box and the second solution box are communicated with each other through a circulating pipeline to form a dehumidification loop; the semiconductor refrigeration assembly comprises a first heat exchanger and a second heat exchanger; the first heat exchanger is positioned in the first room, one side of the first heat exchanger is provided with a first fan, and the first fan blows air from the first heat exchanger to the first solution box; the second heat exchanger is positioned in the second compartment for exchanging heat with the desiccant flowing from the first solution cartridge to the second solution cartridge. The application also discloses a cabinet.

Description

Humidity adjusting module and cabinet
Technical Field
The application relates to the technical field of humidity adjustment, for example, to a humidity adjustment module and a cabinet.
Background
Cabinets are often used to house various items such as clothing, food or books, which are subject to severe humidity requirements in the storage environment and which, if left in an excessively humid or excessively dry environment for a long period of time, can easily cause damage, deterioration or corrosion. Therefore, a humidity adjusting module is required to be arranged in the cabinet, so that the requirement of a user on humidity adjustment is met.
The related art discloses a humidifying module, including first membrane solution subassembly, second membrane solution subassembly, condenser and heating portion, first membrane solution subassembly, second membrane solution subassembly, condenser and heating portion pass through the closed passageway and connect, wherein: a first membrane solution module for treating air passing through the first membrane solution module with a solution passing through the first membrane solution module; a second membrane solution assembly positioned in the closed path lower than the first membrane solution assembly; the heating part is connected between the bottom end of the first membrane solution component and the bottom end of the second membrane solution component; and the condenser is connected between the top end of the first membrane solution assembly and the top end of the second membrane solution assembly and is used for condensing the prefilled solution in the closed passage.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
the humidity adjusting module is complex in structure, and in order to ensure the operation stability of the humidity adjusting module, each component is required to have a height difference in arrangement, and the limited space for installing the humidity adjusting module in the cabinet leads to larger dehumidification limitation in the cabinet.
It should be noted that the information disclosed in the foregoing background section is only for enhancing understanding of the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a humidifying module and a cabinet, which solve the problems that the humidifying module has a complex structure and is not suitable for cabinet dehumidification.
In some embodiments, the humidity conditioning module includes:
a housing including a first compartment and a second compartment; the first compartment is provided with a first communication component for communicating the first compartment with a first environment; the second compartment is provided with a second communication component for communicating the second compartment with a second environment, and the second environment is separated from the first environment;
the humidifying component is arranged in the shell and comprises a first solution box, a second solution box and a semiconductor refrigerating component; the first solution box is arranged in the first compartment and is provided with a first dehumidifying film; the second solution box is arranged in the second compartment and is provided with a second dehumidifying film; the first solution box and the second solution box are communicated with each other through a circulating pipeline to form a dehumidification loop;
the semiconductor refrigeration assembly comprises a first heat exchanger and a second heat exchanger; the first heat exchanger is positioned in the first compartment, one side of the first heat exchanger is provided with a first fan, and the first fan blows air from the first heat exchanger to the first solution box; the second heat exchanger is positioned in the second compartment for exchanging heat with the desiccant flowing from the first solution cartridge to the second solution cartridge.
In some embodiments, the cabinet includes the humidity conditioning module.
The humidifying module and the cabinet provided by the embodiment of the disclosure can realize the following technical effects:
the humidifying module is simple in structure, low in cost and suitable for being applied to a cabinet, and can humidify or dehumidify the inside of the cabinet only by taking the outside of the cabinet as a first environment and taking the inside of the cabinet as a second environment.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
fig. 1 is a schematic structural diagram of a humidity conditioning module according to an embodiment of the disclosure;
FIG. 2 is a schematic illustration of air flow during dehumidification of a second environment provided by an embodiment of the disclosure;
FIG. 3 is a schematic view of the structures of a first dehumidification film and a second dehumidification film provided by an embodiment of the disclosure;
FIG. 4 is a schematic diagram of the structure of a first solution cartridge and a second solution cartridge provided by embodiments of the present disclosure;
FIG. 5 is a schematic diagram of the circulation of a desiccant within a dehumidification loop provided by an embodiment of the disclosure;
FIG. 6 is a schematic structural view of a housing provided by an embodiment of the present disclosure;
FIG. 7 is a schematic structural view of a cabinet provided by an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a method for controlling a humidity conditioning module provided by an embodiment of the present disclosure;
FIG. 9 is a schematic diagram of another method for controlling a humidity conditioning module provided by an embodiment of the present disclosure;
fig. 10 is a schematic diagram of another method for controlling a humidity conditioning module provided in an embodiment of the present disclosure.
Reference numerals:
100: a housing; 101: a first compartment; 102: a second compartment; 110: a first communication assembly; 111: a first air inlet; 112: a first air outlet; 113: a first fan; 120: a second communication assembly; 121: a second air inlet; 122: a second air outlet; 123: a second fan; 130: a heat insulating plate;
200: a circulation pump; 210: a first solution cartridge; 211: a first dehumidifying film; 220: a second solution cartridge; 221: a second dehumidifying film; 230: a first pipe section; 231: a second pipe section;
300: a heating module; 310: a semiconductor refrigeration assembly; 311: a first heat exchanger; 312: a second heat exchanger;
400: a cabinet body; 401: a placement space; 402: the article space.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged where appropriate in order to describe the presently disclosed embodiments. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.
In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.
Referring to fig. 1-7, embodiments of the present disclosure provide a humidity conditioning module including a housing 100 and a humidity conditioning assembly. As shown in fig. 1, the housing 100 includes a first compartment 101 and a second compartment 102; wherein, the first chamber 101 is provided with a first communication component 110 for communicating the first chamber 101 with a first environment; the second chamber 102 is provided with a second communication component 120 for communicating the second chamber 102 with a second environment, and the second environment is separated from the first environment; the humidity conditioning assembly is disposed in the housing 100 and includes a first solution box 210, a second solution box 220, and a semiconductor refrigeration assembly 310; wherein, the first solution box 210 is disposed in the first chamber 101 and is provided with a first dehumidifying film 211; the second solution box 220 is disposed in the second chamber 102, and is provided with a second dehumidifying film 221; the first solution box 210 and the second solution box 220 are communicated with each other through a circulation pipeline to form a dehumidification loop; the semiconductor refrigeration assembly 310 includes a first heat exchanger 311 and a second heat exchanger 312; the first heat exchanger 311 is located in the first compartment 101, one side of the first heat exchanger is provided with a first fan 113, and the first fan 113 blows air from the first heat exchanger 311 to the first solution box 210; a second heat exchanger 312 is located within the second compartment 102 for exchanging heat with the desiccant flowing from the first solution cartridge 210 to the second solution cartridge 220.
In this embodiment, the working principle of semiconductor refrigeration is that the peltier effect of semiconductor materials is utilized, and when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively. Here, both ends of the semiconductor refrigeration assembly 310 are provided with a first heat exchanger 311 and a second heat exchanger 312, respectively. And by changing the polarity of the direct current, the state of the two heat exchangers can be changed. For example, in the initial state, the first heat exchanger 311 heats and the second heat exchanger 312 cools, and when the electrode of the direct current is reversed, the state of the first heat exchanger 311 changes to cool and the state of the second heat exchanger 312 changes to heat.
In the present embodiment, the second environment is dehumidified or humidified by means of solution dehumidification, and the first dehumidification film 211 and the second dehumidification film 221 are selectively permeable films, allowing only water vapor to pass through. When dehumidification is performed, the first heat exchanger 311 heats, the second heat exchanger 312 cools, and the dehumidification loop begins to circulate. First, the first fan 113 blows the heat of the first heat exchanger 311 to the first solution box 210, the temperature of the desiccant in the first solution box 210 increases, the concentration of the moisture contained in the desiccant increases, the moisture passes through the first dehumidifying film 211 and enters the first compartment 101, and finally the moisture enters the first environment through the first communication assembly 110. Then, the concentrated solution enters the second solution tank 220 along the circulation line, and the second heat exchanger 312 reduces the temperature of the desiccant before it enters the second solution tank 220, which is advantageous for improving the moisture absorption efficiency of the desiccant. Meanwhile, air of the second environment enters the second compartment 102 through the second communication assembly 120, and water vapor contained in the air is absorbed by the concentrated solution through the second dehumidifying film 221, thereby having a dehumidifying effect, and the dehumidifying agent is diluted by the water vapor, and its concentration is reduced. Then, the diluted solution returns to the first solution box 210 along the circulation pipeline, and the dehumidifier in the first solution box 210 is continuously heated by the hot air and evaporated, so that the second environment is continuously dehumidified by circulation. The flow path of the water vapor is shown in fig. 2, and the change in the concentration of the dehumidifier is shown in fig. 5.
When humidified, the first heat exchanger 311 is cooled, the second heat exchanger 312 is heated, and the dehumidification loop begins to circulate. First, the second heat exchanger 312 heats the desiccant before it enters the second solution tank 220, the temperature of the desiccant in the second solution tank 220 increases, the concentration of the desiccant increases, and the moisture vapor enters the second compartment 102 through the second desiccant film 221, and finally the moisture vapor enters the second environment through the second communication assembly 120, thereby achieving humidification. The concentrated solution then enters the first solution cartridge 210 along a circulation line. The desiccant in the first solution box 210 is cooled by the cold air, which is beneficial to improving the moisture absorption efficiency of the desiccant. Meanwhile, air of the first environment enters the first compartment 101 through the first communication assembly 110, and water vapor contained in the air is absorbed by the concentrated solution through the first dehumidifying film 211, and the dehumidifying agent is diluted by the water vapor, and its concentration is reduced. The dilute solution then returns to the second solution tank 220 along the circulation line, and the desiccant entering the second solution tank 220 continues to be heated and vaporized by the second heat exchanger 312, such that the circulation continuously humidifies the second environment.
Thus, the humidity adjusting module is simple in structure and low in cost, and is suitable for being applied to a cabinet, and the interior of the cabinet body 400 can be dehumidified or humidified only by communicating the exterior of the cabinet body 400 as a first environment with the first compartment 101 and communicating the interior of the cabinet body 400 as a second environment with the second compartment 102.
In this embodiment, the box body of the first solution box 210 is made of a heat conducting material, which is beneficial for heat exchange between cold air/hot air and the dehumidifier. The first and second dehumidifying films 211 and 221 may employ hydrophilic high molecular polymers such as polydisiloxane, polyvinyl alcohol, etc. The dehumidifier can be solution with good hygroscopicity, such as LiCl, liBr, caCl.
It should be understood that other types of dehumidification membranes capable of selectively transmitting water vapor, other types of solutions capable of absorbing moisture, and the like, of the related art may also be applied to the technical solutions of the present application and are included in the protection scope of the present application.
Optionally, as shown in fig. 1, the first communication assembly 110 includes a first air inlet 111 and a first air outlet 112, and the second communication assembly 120 includes a second air inlet 121 and a second air outlet 122. When dehumidification is performed, the first fan 113 is started, so that air in the first environment is promoted to enter the first compartment 101 from the first air inlet 111, and water vapor evaporated by the dehumidifying agent is carried to return to the first environment from the first air outlet 112. The second fan 123 is arranged in the second compartment 102, the second fan 123 is started during dehumidification, air in the second environment is promoted to enter the second compartment 102 from the second air inlet 121, and the air is absorbed by the concentrated solution and then returns to the second environment from the second air outlet 122.
In the present embodiment, the direction of the air flow in the first compartment 101 is the same as or opposite to the direction of the liquid flow in the first solution cartridge 210, and the direction of the air flow in the second compartment 102 is the same as or opposite to the direction of the liquid flow in the second solution cartridge 220. Preferably, the direction of the gas flow is opposite to the direction of the liquid flow, which facilitates the adequate contact of air with the desiccant through the desiccant film.
Optionally, the housing 100 is provided with a damper assembly. The first air inlet 111 is provided with a first air inlet door, the first air outlet 112 is provided with a first air outlet door, the second air inlet 121 is provided with a second air inlet door, and the second air outlet 122 is provided with a second air outlet door. Thus, the first compartment 101 is controllably communicated with the first environment by controlling the on-off states of the first air inlet damper and the first air outlet damper; the second compartment 102 is controllably connected to a second environment by controlling the on-off state of the second inlet damper and the second outlet damper.
Alternatively, the first solution cartridge 210 has a plurality of sides, and at least one side is provided with a first dehumidifying film 211. In this way, in the case of having a plurality of first dehumidifying films 211, the contact area between the air in the first compartment 101 and the dehumidifying agent in the first solution cartridge 210 can be increased.
Alternatively, the second solution cartridge 220 has a plurality of sides, and at least one side is provided with a second dehumidifying film 221. In this way, in the case of having a plurality of second dehumidifying films 221, the contact area of the air in the second compartment 102 with the dehumidifying agent in the second solution cartridge 220 can be increased.
Alternatively, as shown in FIG. 4, the circulation line includes a first pipe segment 230 and a second pipe segment 231. Wherein one end of the first pipe section 230 is connected to the first solution box 210, the other end is connected to the second solution box 220, and the liquid in the first solution box 210 flows to the second solution box 220 through the first pipe section 230; one end of the second pipe section 231 is connected to the first solution box 210, the other end is connected to the second solution box 220, and the liquid of the second solution box 220 flows to the first solution box 210 through the second pipe section 231. And, the second heat exchanger 312 is disposed against the first tube segment 230 so as to exchange heat with the solution in the first tube segment 230.
Optionally, the first pipe section 230 and/or the second pipe section 231 are provided with a circulation pump 200, and the dehumidification circuit starts to circulate when the circulation pump 200 is started. Also, the circulation pump 200 may be located in the first compartment 101 or in the second compartment 102.
Optionally, the housing 100 is divided into adjacent first and second compartments 101 and 102 by a heat shield 130.
In this embodiment, the heat exchange between the first compartment 101 and the second compartment 102 is advantageously reduced by the heat shield 130. Preferably, the first solution box 210 is disposed on the plate surface of the heat insulation plate 130 located in the first compartment 101, and the second solution box 220 is disposed on the plate surface of the heat insulation plate 130 located in the second compartment 102.
Optionally, the humidity conditioning apparatus further includes a heating module 300 for assisting in heating the solution of the first solution cartridge 210. The heating module 300 is disposed in the first chamber 101 and disposed on the plate surface of the heat insulation plate 130 located in the first chamber 101. Preferably, as shown in fig. 3, the heating module 300 is disposed against the bottom surface of the first solution cartridge 210 and is located between the first solution cartridge 210 and the heat insulation plate 130.
Alternatively, the heating module 300 may be a graphene heating film or a heating wire. It should be understood that other types of heating elements that can be used to directly or indirectly heat the solution in the first solution cartridge 210 in the related art may also be used in the solution application and are included in the scope of the present application.
The embodiment of the disclosure also provides a cabinet, which comprises the humidity adjusting module described in any embodiment.
Optionally, the cabinet further comprises a cabinet body 400. The humidity control module is arranged outside the cabinet body 400, inside the cabinet body 400 or inside the side wall; the outside of the cabinet 400 serves as a first environment, and the inside of the cabinet 400 serves as a second environment.
In this embodiment, as shown in fig. 7, in the case where the humidity conditioning module is placed in the cabinet 400, the cabinet 400 includes a placement space 401 and an article space 402 therein. Wherein the placement space 401 is used for placing the housing 100, the article space 402 is used for storing articles, and the second chamber 102 is communicated with the article space 402 through the second communication component 120.
Illustratively, the interior of the cabinet 400 is partitioned into a placement space 401 and an article space 402 by a cabinet partition, the placement space 401 is located at the top of the interior of the cabinet 400, the article space 402 is located below the placement space 401, and the cabinet partition is provided with two vents. As shown in fig. 6, a housing 100 of the humidity conditioning module is configured in a rectangular parallelepiped shape, and is a first compartment 101 and a second compartment 102 from top to bottom. The humidity-adjusting module is supported by the cabinet partition after being placed in the placement space 401, and a first air inlet 111 and a first air outlet 112 are arranged on the side wall of the first compartment 101 facing the outside of the cabinet body 400 and are used for communicating with the outside of the cabinet body 400; the side wall of the second chamber 102 facing the article space 402 is provided with a second air inlet 121 and a second air outlet 122, and the second air inlet 121 and the second air outlet 122 are respectively communicated with the two air vents, so as to be further communicated with the article space 402, thereby facilitating dehumidification of the article space 402.
In this embodiment, in the case that the humidity conditioning module is disposed outside the cabinet 400, the second compartment 102 is in communication with the second environment through the ventilation pipeline.
Illustratively, the second air inlet 121 is connected to the cabinet 400 via an air inlet pipe, and the second air outlet 122 is connected to the cabinet 400 via an air outlet pipe. When the second fan 123 is started, air in the cabinet 400 enters the second compartment 102 through the air inlet pipeline to dehumidify, and the dehumidified air returns to the cabinet 400 through the air outlet pipeline.
In this embodiment, in the case that the humidity conditioning module is disposed in the side wall of the cabinet 400, the housing 100 is communicated with the inside of the cabinet 400 and the outside of the cabinet 400 through the air vent on the side wall.
Illustratively, an interlayer is disposed in the side wall of the cabinet 400, two cabinet external vents are disposed on one side of the interlayer facing the outside of the cabinet 400, and two cabinet internal vents are disposed on one side of the interlayer facing the inside of the cabinet 400. The humidity-adjusting module is arranged in the interlayer, and the first air inlet 111 and the first air outlet 112 are communicated with two cabinet external air vents and are used for being communicated with the outside of the cabinet body 400; and the second air inlet 121 and the second air outlet 122 are communicated with two intra-cabinet air vents for communicating with the inside of the cabinet 400.
In some embodiments, the heating module 300, the semiconductor refrigeration assembly 310, the circulation pump 200, the first fan 113, and the second fan 123 are electrically connected to a humidity controller, and the humidity controller is used to control the states of the above components.
As shown in fig. 8, an embodiment of the present disclosure further provides a method for controlling the humidity conditioning module, including:
s10: the humidity controller obtains the measured humidity of the second environment;
s11: and under the condition that the measured humidity is larger than the upper limit value of the proper humidity range, the humidity control controller controls the first heat exchanger to heat and the circulating pump to start.
In this embodiment, the second environment is dehumidified in step S11, and the air circulation rate can be increased when the first fan is controlled to be started and the second fan is controlled to be started at the same time. After the first heat exchanger heats, the dehumidifying agent in the first solution box is heated by hot air, the water vapor contained in the dehumidifying agent evaporates, the concentration of the water vapor is increased, and the water vapor enters the first compartment through the first dehumidifying film. Under the effect of the first fan, air in the first environment enters the first compartment from the first air inlet, and carries water vapor to quickly return to the first environment from the first air outlet. Under the action of the circulating pump, the concentrated solution enters the second solution box along the first pipe section. Under the effect of the second fan, air in the second environment quickly enters the second room through the second air inlet, and water vapor contained in the air is absorbed by the concentrated solution through the second dehumidifying film, so that a dehumidifying effect is achieved, and the dehumidified air quickly returns to the second environment through the second air outlet. The dehumidifying agent is diluted by the water vapor and the concentration thereof is reduced, the diluted solution returns to the first solution box along the second pipe section, and the dehumidifying agent in the first solution box is continuously heated by hot air and evaporated. The circulation is carried out continuously to convey the water vapor in the second environment to the first environment until the humidity of the second environment is reduced to a proper humidity range.
Optionally, in step S11, the heating module may be controlled to be started at the same time to assist in heating the solution in the first solution box, so as to improve the evaporation efficiency of the evaporation dehumidifier.
As shown in fig. 9, another method for controlling the humidity conditioning module is provided in an embodiment of the present disclosure, including:
s10: the humidity controller obtains the measured humidity of the second environment;
s12: and under the condition that the measured humidity is smaller than the lower limit value of the proper humidity range, the humidity control controller controls the second heat exchanger to heat and the circulating pump to start.
In this embodiment, the second environment is humidified by step S12, and the air circulation rate can be increased when the first fan and the second fan are simultaneously controlled to be started. When the second heat exchanger heats, the temperature of the desiccant flowing into the second solution box rises, the concentration of the water vapor contained in the desiccant increases due to evaporation, and the water vapor enters the second compartment through the second dehumidification film. Under the effect of the second fan, air in the second environment enters the second compartment from the second air inlet, and carries water vapor to quickly return to the second environment from the second air outlet. Under the action of the circulating pump, the concentrated solution enters the first solution box along the second pipe section. Under the action of the first fan, air in the first environment quickly enters the first room through the first air inlet, water vapor contained in the air is absorbed by the concentrated solution through the first dehumidifying film, the concentration of the dehumidifying agent is reduced, the dilute solution returns to the second solution box along the first pipe section, and the dehumidifying agent flowing into the second solution box is continuously heated and evaporated by the second heat exchanger. And (3) circulating in this way, continuously carrying the water vapor in the first environment to the second environment until the humidity in the second environment is increased to a proper humidity range.
As shown in fig. 10, an embodiment of the present disclosure further provides another method for controlling the humidity conditioning module, including:
s10: the humidity controller obtains the measured humidity of the second environment;
s13: and under the condition that the actually measured humidity is in a proper humidity range, the humidity control controller controls the first communication assembly and the second communication assembly to be blocked, and controls the semiconductor refrigeration assembly to stop.
In this embodiment, the blocking of the first communicating component is advantageous for preventing dust in the first environment from entering the first compartment, the blocking of the second communicating component is advantageous for maintaining the humidity in the second environment, and the timely stopping of the semiconductor refrigeration component is advantageous for saving energy.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A humidity conditioning module, comprising:
a housing (100) comprising a first compartment (101) and a second compartment (102); wherein the first compartment (101) is provided with a first communication assembly (110) for communicating the first compartment (101) with a first environment; the second chamber (102) is provided with a second communication component (120) for communicating the second chamber (102) with a second environment, and the second environment is separated from the first environment;
the humidifying component is arranged in the shell (100) and comprises a first solution box (210), a second solution box (220) and a semiconductor refrigerating component (310); wherein the first solution box (210) is arranged in the first compartment (101) and is provided with a first dehumidifying film (211); the second solution box (220) is arranged in the second compartment (102) and is provided with a second dehumidifying film (221); the first solution box (210) and the second solution box (220) are communicated with each other through a circulating pipeline to form a dehumidification loop;
the semiconductor refrigeration assembly (310) comprises a first heat exchanger (311) and a second heat exchanger (312); the first heat exchanger (311) is positioned in the first compartment (101), one side of the first heat exchanger is provided with a first fan (113), and the first fan (113) blows air from the first heat exchanger (311) to the first solution box (210); a second heat exchanger (312) is located within the second compartment (102) for exchanging heat with the desiccant flowing from the first solution cartridge (210) to the second solution cartridge (220).
2. The humidity conditioning module of claim 1 wherein the circulation line comprises:
a first pipe section (230) one end of which is communicated with the first solution box (210) and the other end of which is communicated with the second solution box (220), and the liquid of the first solution box (210) flows to the second solution box (220) through the first pipe section (230);
a second pipe section (231) one end of which is communicated with the first solution box (210) and the other end of which is communicated with the second solution box (220), and the liquid of the second solution box (220) flows to the first solution box (210) through the second pipe section (231);
the second heat exchanger (312) is for exchanging heat with the solution in the first tube section (230).
3. The humidity control module of claim 2 wherein,
the first pipe section (230) and/or the second pipe section (231) are/is provided with a circulating pump (200).
4. The humidity control module of claim 3 wherein,
the circulation pump (200) is located in the first compartment (101) or in the second compartment (102).
5. The humidity control module of any one of claims 1 to 4 wherein,
the first compartment (101) and the second compartment (102) are arranged adjacently.
6. The humidity control module of any one of claims 1 to 4 wherein the humidity control assembly further comprises:
and a heating module (300) for assisting in heating the solution of the first solution cartridge (210).
7. The humidity control module of any one of claims 1 to 4 wherein,
the second compartment (102) is provided with a second fan (123).
8. A cabinet comprising a humidity conditioning module according to any one of claims 1 to 7.
9. The cabinet of claim 8, further comprising:
the cabinet body (400) and the dehumidifying film group are arranged outside the cabinet body (400), in the cabinet body (400) or in the side wall; the outside of the cabinet body (400) is used as a first environment, and the inside of the cabinet body (400) is used as a second environment.
10. The cabinet according to claim 9, wherein in case the dehumidifying film set is placed in the cabinet body (400), the cabinet body (400) comprises:
a placement space (401) for placing the housing (100);
the article space (402), and the fourth compartment is communicated with the article space (402) through the second communication component (120).
CN202322022289.4U 2023-07-28 2023-07-28 Humidity adjusting module and cabinet Active CN220473894U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322022289.4U CN220473894U (en) 2023-07-28 2023-07-28 Humidity adjusting module and cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322022289.4U CN220473894U (en) 2023-07-28 2023-07-28 Humidity adjusting module and cabinet

Publications (1)

Publication Number Publication Date
CN220473894U true CN220473894U (en) 2024-02-09

Family

ID=89806265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322022289.4U Active CN220473894U (en) 2023-07-28 2023-07-28 Humidity adjusting module and cabinet

Country Status (1)

Country Link
CN (1) CN220473894U (en)

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