CN220463737U - Installation fixture - Google Patents

Abstract

The application relates to the technical field of semiconductors, especially, relate to an installation frock for install the heating plate on semiconductor equipment, installation frock includes main body frame, slide rail and fixed establishment, fixed establishment be used for fixed heating plate, the slide rail set up in main body frame, fixed establishment slides and sets up on the slide rail, and main body frame includes the installation department, and main body frame passes through installation department and semiconductor equipment fixed mounting, drives the heating plate through fixed establishment and slides on the slide rail in order to send into the preset mounted position of semiconductor equipment with the heating plate. According to the installation frock of this application to among the prior art, when upwards installing ceramic heating dish through the manual work, not only lead to the installation inconvenient because of the restriction of installation space, and ceramic heating dish has the problem of risk that drops in the installation.

Description

Installation fixture

Technical Field

The application relates to the technical field of semiconductors, in particular to an installation tool.

Background

A ceramic heating plate is required to be mounted on a semiconductor device to heat-treat a semiconductor component, and an existing ceramic heating plate includes a disk-shaped structure and a columnar structure provided on a center of the disk-shaped structure, one end of the columnar structure being provided with a connection member such as a screw. When the ceramic heating plate is mounted, it is necessary to manually grasp the edge of the plate-like structure and lift-mount the columnar structure into the mounting hole of the semiconductor device.

However, during manual installation, the arm is in a bent-up state and the ceramic heating plate weighs about 10kg, with the risk of dropping the ceramic heating plate. Moreover, as shown in fig. 1, a circular installation space exists near the installation hole of the conventional semiconductor device, when the edge of the disk-shaped structure is manually grasped and installed, the gap between the edge of the installation space and the edge of the disk-shaped structure is small, only 26.5mm (in fig. 1, the inner ring is the disk-shaped structure of the heating disk, the outer ring is the circular installation space, and the double arrow is the gap of 26.5 mm), which limits the movement of the human hand and is inconvenient to install.

Disclosure of Invention

The utility model aims at providing an installation frock to in having solved prior art, when upwards installing ceramic heating dish through the manual work, not only lead to the installation inconvenient because the restriction of installation space, and ceramic heating dish has the problem of risk that drops in the installation.

According to the application, a mounting fixture is provided for mounting a heating plate on a semiconductor device, the mounting fixture comprises a main body frame, a sliding rail and a fixing mechanism, the fixing mechanism is used for fixing the heating plate, the sliding rail is arranged in the main body frame, the fixing mechanism is arranged on the sliding rail in a sliding mode, the main body frame comprises a mounting part, the main body frame is fixedly mounted with the semiconductor device through the mounting part, and the heating plate is driven by the fixing mechanism to slide on the sliding rail so as to enable the heating plate to be fed into a preset mounting position of the semiconductor device.

In any of the above technical solutions, further, the fixing mechanism includes a residual ring-shaped carrier, and the carrier is connected to the slide rail through a bottom end of the residual ring, so that the annular opening of the residual ring is used for fixing the heating plate in the annular opening.

In any of the above technical solutions, further, the main body frame further includes a base and a supporting member, the sliding rail and the mounting portion are both disposed on the base, the supporting member is slidably connected with the sliding rail, the bearing member is disposed on the supporting member, and an axis of the bearing member is parallel to an extending direction of the sliding rail.

In any of the above technical solutions, further, the fixing mechanism further includes a clamping member, the clamping member is fixedly connected with the bearing member, a protruding eave is formed on an inner side of the bearing member, and a clamping gap is formed between the protruding eave and the clamping member, so as to be used for fixing the heating plate.

In any of the above technical solutions, further, the number of the clamping members is two, each clamping member includes a rod portion and a head portion disposed at a first end of the rod portion, hole portions are disposed at two ends of the annular opening of the bearing member, the rod portion of the clamping member passes through the supporting member and the hole portions to be fixed on the supporting member and the bearing member, and the clamping gap is formed between the protruding eave and the head portion.

In any of the above technical solutions, further, the fixing mechanism further includes a nut, where the nut is disposed at the second end of the rod portion, and the nut is in threaded connection with the rod portion and can abut against the supporting member.

In any of the above technical solutions, further, the base includes a bottom wall and surrounding walls respectively disposed on opposite sides of the bottom wall, the sliding rail is disposed on the bottom wall, an extending direction of the sliding rail is parallel to a setting direction of the surrounding walls, the mounting portion is fixedly connected with the surrounding walls, and the bearing member and the mounting portion are disposed on the same side of the supporting member.

In any of the above technical solutions, further, the supporting member is perpendicular to the bottom wall, and a plane where the axis of the bearing member and the center line of the sliding rail are located is perpendicular to the bottom wall.

In any of the above technical solutions, further, a pad body is disposed on a side of the head facing the eave, and hardness of the pad body and hardness of the bearing member are both smaller than hardness of the heating plate.

In any of the above technical solutions, further, the installation fixture further includes a hanging portion, and the hanging portion connects the second end of the rod portion and the supporting member.

The beneficial effects of this application include:

the installation frock of this application for install the heating plate on semiconductor device. When the heating plate is installed through the installation tool, the installation tool can be installed at a preset position of the semiconductor device through the installation part according to the field requirement; then the heating plate is installed and fixed on the fixing mechanism; finally, the heating plate is driven to slide on the sliding rail through the fixing mechanism so as to be sent to a preset installation position of the semiconductor device. Compared with the prior art, only the fixing mechanism is needed to slide, the heating plate is not needed to be manually lifted for installation, and the falling risk is avoided. Moreover, compared with the prior art, the heating plate is installed without extending hands into the gap, and the installation process is simple and convenient.

In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 shows a positional relationship between a circular mounting space near a mounting hole of a conventional semiconductor device and a disk-like structure of a heating plate;

FIG. 2 shows an overall structural schematic of an installation tool according to an embodiment of the present application;

fig. 3 shows a schematic structural view of fig. 2 at a first viewing angle;

FIG. 4 shows an enlarged schematic view of portion A of FIG. 3;

fig. 5 shows a schematic structural view of fig. 2 at a second viewing angle;

fig. 6 shows a schematic structural view of fig. 2 at a third viewing angle;

fig. 7 shows a schematic structural view of fig. 2 at a fourth viewing angle.

Icon: 100-carriers; 101-convex eaves; 200-clamping piece; 201-a stem; 202-head; 203-a nut; 204-pad body; 300-base; 301-a bottom wall; 302-an enclosure wall; 400-support; 500-sliding rails; 600-slide block; 700-reinforcements; 800-mounting part; 900-hanging portion.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, apparatus, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the present disclosure. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but rather, obvious variations may be made upon an understanding of the present disclosure, other than operations that must occur in a specific order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided solely to illustrate some of the many possible ways of implementing the methods, devices, and/or systems described herein that will be apparent after a review of the disclosure of the present application.

For ease of description, spatially relative terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be oriented "below" or "lower" relative to the other element. Thus, the term "above … …" includes both orientations "above … …" and "below … …" depending on the spatial orientation of the device. The device may also be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. Singular forms also are intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to specify the presence of stated features, integers, operations, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, and/or groups thereof.

Variations from the shapes of the illustrations as a result, of manufacturing techniques and/or tolerances, are to be expected. Accordingly, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacture.

The features of the examples described herein may be combined in various ways that will be apparent after an understanding of the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the present disclosure.

The application provides an installation frock to in having solved prior art, when upwards installing ceramic heating dish through the manual work, not only lead to the installation inconvenient because of the restriction of installation space, and ceramic heating dish has the problem of risk that drops in the installation.

According to the installation tool, as shown in fig. 2, the installation tool comprises a main body frame, a sliding rail 500 and a fixing mechanism, wherein the fixing mechanism can fix a heating plate; the sliding rail 500 is arranged on the main body frame, and the fixing mechanism is arranged on the sliding rail 500 in a sliding way; the main body frame includes a mounting part 800, and the mounting tool can be mounted on an external semiconductor device through the mounting part 800.

When the mounting fixture is specifically used, firstly, the mounting fixture is mounted on a preset position of a semiconductor device through a mounting part 800 according to field requirements (for example, according to the position of a mounting hole of the existing semiconductor device);

then, mounting and fixing the heating plate to the fixing mechanism so that the columnar structure of the heating plate is aligned with the mounting hole of the semiconductor device;

finally, the heating plate or the fixing mechanism is manually pushed, so that the fixing mechanism and the heating plate slide on the sliding rail 500, and the columnar structure of the heating plate slides into the mounting hole of the semiconductor device to finish the mounting of the heating plate.

In the mounting process, before the heating plate is mounted and fixed on the fixing mechanism, the fixing mechanism should be slid to an initial position (namely, a position far away from the mounting hole of the semiconductor device), so that the fixing mechanism is far away from the mounting hole of the semiconductor device, and when the heating plate is manually mounted on the fixing mechanism, the mounting space is large, and the heating plate can be simply and conveniently fixed on the fixing mechanism; after the heating plate is fixed, the fixing mechanism can be slid to the end position to mount the columnar structure of the heating plate into the mounting hole.

To sum up, for prior art, this application when installing the heating plate, only need slide fixed establishment drive the heating plate slide on the slide rail with the heating plate send into semiconductor device's mounting hole can, need not the manual work and lift the heating plate installation, do not have the risk that drops. Moreover, compared with the prior art, the heating plate is installed without extending hands into the gap, and the installation process is simple and convenient. The specific structure and function of the installation tool of the present application will be described in detail below.

In the embodiment of the present application, as shown in fig. 2, the fixing mechanism may include a residual ring-shaped carrier 100, where the carrier 100 is slidably connected to the sliding rail 500, and the carrier 100 is capable of fixing the heating plate. Here, the residual ring refers to a residual ring structure, and preferably, the carrier 100 is semi-ring-shaped. The semi-annular carrier 100 may hold a disk-like structure of the hotplate.

As an example, as shown in fig. 2, the main body frame includes a base 300 and a support 400, wherein a slide rail 500 is provided at the base 300 and has an extension direction, a carrier 100 is provided at the support 400 (here, the support 400 may be formed with an arc-shaped notch cooperating with the carrier 100, the carrier 100 may be fixed to the support 400 by a screw), and the support 400 is slidably connected with the slide rail 500. Here, the axis of the semi-ring-shaped carrier 100 is parallel to the extending direction to ensure that the columnar structure of the heating plate enters the mounting hole of the semiconductor device in the extending direction during the sliding of the heating plate.

As an example, as shown in fig. 2, the fixing mechanism further includes a clamping member 200, where the clamping member 200 is disposed on the carrier 100, and the protruding edge 101 is formed on the inner side of the carrier 100. Preferably, the ledge 101 is continuously disposed along the inner circumference of the carrier 100 (here, the inner side of the carrier 100 refers to the side of the carrier 100 facing away from the slide rail 500), and a clamping gap is formed between the ledge 101 and the clamping member 200, and the clamping gap clamps a disk-shaped structure for fixing the heating plate.

Further, as shown in fig. 4, the number of the holders 200 may be two, and each holder 200 includes a stem 201 and a head 202 disposed at a first end of the stem 201. In this embodiment, the opening of the carrier 100 faces away from the base 300, both ends of the carrier 100 are provided with hole portions, and the rod portion 201 included in each clamping member 200 passes through the supporting member 400 and the corresponding hole portion, wherein the head 202 protrudes toward the inner side of the carrier 100, and a clamping gap is formed between the flange 101 and the head 202 for clamping and fixing the disc-shaped structure of the heating disc.

Further, with continued reference to fig. 4, a pad 204 is disposed on a side of the head 202 facing the ledge 101, where the hardness of the pad 204 and the carrier 100 is less than the hardness of the ceramic heating plate, so as to prevent the hard head 202 or the hard carrier 100 from scratching the ceramic heating plate. In this embodiment, the pad 204 may be a PC pad, and the carrier 100 may be a PTFE pad (polytetrafluoroethylene pad).

Further, with continued reference to fig. 4, the securing mechanism may further include a nut 203, the nut 203 being disposed at the second end of the stem 201, the nut 203 being threadably coupled to the stem 201 and capable of tightening the support 400. In use, the nut 203 can be loosened and the distance of the head 202 from the ledge 101 adjusted to accommodate different heating plates, in particular, to accommodate the plate-like structure of heating plates of different thicknesses. After the adjustment is completed, the nut 203 is tightened to lock the clip 200.

Further, as shown in fig. 5, the installation fixture may further include a hanging portion 900, a second end of the hanging portion 900 connecting the rod portion 201 and the support 400. In this manner, when the clip 200 is detached from the carrier 100, the hanging portion 900 may hang the clip 200, preventing the clip 200 from falling to the ground or into the cavity of the semiconductor device. Here, the hanging portion 900 is preferably a chain, a first end of which connects the second end of the rod portion 201, and a second end of which connects the support 400 (not illustrated in fig. 2 to 7).

Further, as shown in fig. 2, the installation fixture may further include a reinforcing portion 700 and a slider 600, where the slider 600 is slidably connected with the sliding rail 500 and is located on a side of the sliding rail 500 opposite to the base 300, the reinforcing portion 700 is fixed with the slider 600 by a screw, and is located on a side of the slider 600 opposite to the sliding rail 500, and a side of the reinforcing portion 700 facing the support 400 is welded or integrally formed with the support 400, so that the connection strength of the entire installation fixture is improved.

In the embodiment of the present application, as shown in fig. 3, the base 300 includes a bottom wall 301 and two surrounding walls 302, wherein the sliding rail 500 is fixed to the bottom wall 301 by screws, and both surrounding walls 302 are parallel to the sliding rail 500. Preferably, the sliding rail 500 is disposed at a middle position of the bottom wall 301, the carrier 100 and the support 400 are disposed at a middle position of the bottom wall 301, and the support 400 is perpendicular to the bottom wall 301, such that a plane in which an axis of the carrier 100 and a center line of the sliding rail 500 are both perpendicular to the bottom wall 301. Therefore, when the heating plate or the fixing mechanism is manually pushed, the columnar structure of the heating plate can be accurately and conveniently slid into the mounting hole of the semiconductor device, so that the mounting of the heating plate is completed.

In the embodiment of the present application, the mounting portion 800 may be provided in the enclosure wall 302, specifically, as shown in fig. 5, in two side portions of each enclosure wall 302 opposite to each other in the extending direction, one of the side portions is larger in mounting area than the other side portion, and further one of the side portions may be mounted as the mounting portion 800 with the semiconductor device. For example, the mounting portion 800 may be mounted with the semiconductor device by a fixing pin.

In the present embodiment, as shown in fig. 6, the mounting portion 800 on each enclosure wall 302 may also be screwed with a PTFE pad, which can prevent the mounting portion 800 from scratching the semiconductor device.

In the present embodiment, the carrier 100 and the mounting portion 800 are both located on the same side of the support 400. Thus, the installation and the use of the installation tool are convenient.

Specifically, as shown in fig. 7, the view angle state of the installation tool in fig. 7 is a substantially installation state in actual operation. And in the view angle state of the installation tool illustrated in fig. 7, the carrier 100 is located at the end position.

With continued reference to fig. 7, when the fixture is installed to fix the heating plate, the plate-like structure of the heating plate is fixed to the carrier 100, and the columnar structure of the heating plate faces upward, i.e., toward the mounting hole of the semiconductor device.

In specific use, before the heating plate is mounted and fixed on the carrier 100, the carrier 100 should be slid to an initial position (i.e. a position away from the mounting hole of the semiconductor device, i.e. the lower end of the sliding rail 500 in fig. 6), so that the carrier 100 is away from the mounting hole of the semiconductor device, and when the heating plate is manually mounted on the carrier 100, the mounting space is large, and the heating plate can be simply and conveniently fixed on the carrier 100; after the heater plate is secured, the carrier 100 may be slid to the end position (i.e., the position in fig. 6) to mount the columnar structure of the heater plate into the mounting hole. In this embodiment, the linear travel of the slide rail 500 is preferably 250mm.

To sum up, this application installs the heating plate through installation frock, for prior art, only need promote heating plate or fixed establishment slip can, need not the manual work and lift the heating plate installation, the risk that does not have to drop. In addition, compared with the prior art, the heating plate is installed without extending human hands into the gap, and the installation process is simple and convenient.

Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present application, and are not intended to limit the scope of the present application, but the present application is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, the present application is not limited thereto. Any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims (10)

1. An installation frock for install heating plate on semiconductor device, its characterized in that, installation frock includes main body frame, slide rail (500) and fixed establishment, fixed establishment is used for fixing the heating plate, slide rail (500) set up in main body frame, fixed establishment slides and sets up on slide rail (500), main body frame includes installation department (800), main body frame passes through installation department (800) with semiconductor device fixed mounting drives through fixed establishment the heating plate slides on slide rail (500) in order to send into the heating plate semiconductor device's default mounted position.

2. The mounting fixture of claim 1, wherein the securing mechanism comprises a residual ring-shaped carrier (100), the carrier (100) being connected to the slide rail (500) by a residual ring-shaped bottom end such that the residual ring-shaped annular opening is outwardly adapted to secure the heating plate within the annular opening.

3. The mounting fixture according to claim 2, wherein the main body frame further comprises a base (300) and a support member (400), the slide rail (500) and the mounting portion (800) are both provided to the base (300),

the supporting piece (400) is in sliding connection with the sliding rail (500), the bearing piece (100) is arranged on the supporting piece (400),

the axis of the bearing piece (100) is parallel to the extending direction of the sliding rail (500).

4. A mounting fixture according to claim 3, wherein the fixing mechanism further comprises a clamping member (200), the clamping member (200) is fixedly connected with the carrier (100), a ledge (101) is formed on the inner side of the carrier (100), and a clamping gap is formed between the ledge (101) and the clamping member (200) for fixing the heating plate.

5. The mounting fixture according to claim 4, wherein the number of clamping members (200) is two, each clamping member (200) comprises a rod portion (201) and a head portion (202) arranged at a first end of the rod portion (201), hole portions are arranged at two ends of the annular opening of the bearing member (100), the rod portion (201) of the clamping member (200) penetrates through the supporting member (400) and the hole portions to be fixed on the supporting member (400) and the bearing member (100), and the clamping gap is formed between the convex edge (101) and the head portion (202).

6. The mounting fixture according to claim 5, wherein the fixing mechanism further comprises a nut (203), the nut (203) being arranged at the second end of the rod portion (201), the nut (203) being in threaded connection with the rod portion (201) and being capable of abutting against the support member (400).

7. A mounting fixture according to claim 3, wherein the base comprises a bottom wall (301) and surrounding walls (302) respectively arranged on two opposite sides of the bottom wall (301), the sliding rail (500) is arranged on the bottom wall (301), the extending direction of the sliding rail (500) is parallel to the arranging direction of the surrounding walls (302), the mounting part (800) is fixedly connected with the surrounding walls (302), and the bearing part (100) and the mounting part (800) are arranged on the same side of the supporting part (400).

8. The mounting fixture according to claim 7, wherein the support (400) is perpendicular to the bottom wall (301), and the plane in which the axis of the carrier (100) and the center line of the slide rail (500) are both perpendicular to the bottom wall (301).

9. The mounting fixture according to claim 5, wherein a pad (204) is provided on a side of the head (202) facing the flange (101), and wherein the hardness of both the pad (204) and the carrier (100) is less than the hardness of the heating plate.

10. The mounting fixture according to claim 5, further comprising a hanging portion (900), the hanging portion (900) connecting the second end of the rod portion (201) and the support (400).