CN220463491U - 一种抛光结构 - Google Patents
一种抛光结构 Download PDFInfo
- Publication number
- CN220463491U CN220463491U CN202321389189.9U CN202321389189U CN220463491U CN 220463491 U CN220463491 U CN 220463491U CN 202321389189 U CN202321389189 U CN 202321389189U CN 220463491 U CN220463491 U CN 220463491U
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- CN
- China
- Prior art keywords
- polishing
- pressure distribution
- distribution ring
- polishing head
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims abstract description 119
- 235000012431 wafers Nutrition 0.000 claims abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 abstract description 9
- 239000007788 liquid Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- -1 coarse polishing pad Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
TTV | TAPER | |
加压板(底部为凸出弧形) | <1.5μm | -0.7μm<TAPER<0.7μm |
加压板(底部为平面) | <3μm | -1.5μm<TAPER<1.5μm |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321389189.9U CN220463491U (zh) | 2023-06-02 | 2023-06-02 | 一种抛光结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321389189.9U CN220463491U (zh) | 2023-06-02 | 2023-06-02 | 一种抛光结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220463491U true CN220463491U (zh) | 2024-02-09 |
Family
ID=89773110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202321389189.9U Active CN220463491U (zh) | 2023-06-02 | 2023-06-02 | 一种抛光结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220463491U (zh) |
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2023
- 2023-06-02 CN CN202321389189.9U patent/CN220463491U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 300384 Tianjin Binhai New Area Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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CP03 | Change of name, title or address |