CN220457450U - Sensor assembly, middle frame assembly and electronic equipment - Google Patents

Abstract

The present disclosure relates to a sensor assembly, a middle frame assembly and an electronic device, comprising: a substrate; a sensor disposed on the substrate; and a sealing member, an inner surface of the sealing member being in contact with a side surface of the substrate lying in a different plane, an outer surface of the sealing member opposite to the inner surface being for contact with a housing. The present disclosure provides for the seal to fully or partially surround the substrate by the seal making contact with the substrate on different sides. The outer surface of the seal can in turn be in contact with the housing to be assembled, so that a seal of the sensor is achieved. Compared with the related art, the sealing element can be in multi-point contact with the substrate, so that the stability between the sealing element and the substrate is improved. Therefore, the substrate and the sealing element do not need to be additionally assembled and connected, and the mounting error is avoided, so that the occupied space of the sensor assembly in the XY direction is reduced, and the electronic equipment is light and thin.

Description

Sensor assembly, middle frame assembly and electronic equipment

Technical Field

The disclosure relates to the technical field of electronic equipment, and in particular relates to a sensor assembly, a middle frame assembly and electronic equipment.

Background

With the development of electronic device technology, more and more electronic devices are equipped with sensor assemblies to realize various functions, such as adjusting screen brightness, etc. The sensor assembly is sealed inside the electronic equipment, and is guaranteed not to be interfered by pollution.

However, the sensor assembly occupies more space inside the electronic device while being sealed, which is not beneficial to the light and thin of the electronic device.

Disclosure of Invention

To overcome the problems in the related art, the present disclosure provides a sensor assembly, a center assembly, and an electronic device.

According to a first aspect of embodiments of the present disclosure, there is provided a sensor assembly comprising: a substrate; a sensor disposed on the substrate; and a sealing member, an inner surface of the sealing member being in contact with a side surface of the substrate lying in a different plane, an outer surface of the sealing member opposite to the inner surface being for contact with a housing.

In some embodiments, the seal comprises: a first portion provided opposite to a side surface of the substrate in a thickness direction; and a second portion disposed opposite to the substrate in a horizontal direction.

In some embodiments, the first portion is disposed opposite to a peripheral side surface of the substrate in a thickness direction.

In some embodiments, the second portion has a first opening, and the sensor is located within the first opening.

In some embodiments, the seal is a resilient member.

In some embodiments, the seal is an interference fit with the base plate.

In some embodiments, the seal comprises at least one of: rubber, thermoplastic elastomer, liquid silica gel, thermoplastic polyurethane, polyvinyl chloride soft rubber or plastic.

In some embodiments, the sensor comprises at least one of: a light sensor, an anti-flicker sensor, a proximity sensor, an acceleration sensor, a gyro sensor, or a temperature sensor.

According to a second aspect of embodiments of the present disclosure, there is also provided a middle frame assembly, comprising: a middle frame; and a sensor assembly as in any of the above embodiments, wherein an outer surface of the seal opposite the inner surface is in contact with a housing, the housing being the middle frame.

In some embodiments, the middle frame comprises: the sensor assembly is arranged in the accommodating cavity, the side face of the accommodating cavity is provided with a reinforcing rib, the reinforcing rib extends along the thickness direction of the middle frame, and the sealing element is in contact with the reinforcing rib.

In some embodiments, the receiving cavity has a second opening, and the sensor is located in the second opening.

According to a third aspect of embodiments of the present disclosure, there is also provided an electronic device, including: a sensor assembly as in any one of the embodiments above, or a midframe assembly as in any one of the embodiments above.

In some embodiments, further comprising: the main board is arranged on one side of the middle frame of the electronic equipment; and the display screen is arranged on the other side of the middle frame of the electronic device, wherein the sensor of the sensor assembly faces the display screen, the substrate of the sensor assembly is connected to the main board, and the thickness of the substrate extends towards the direction of the display screen.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

the present disclosure provides for the seal to fully or partially surround the substrate by the seal making contact with the substrate on different sides. The outer surface of the seal can in turn be in contact with the housing to be assembled, so that a seal of the sensor is achieved. Compared with the related art, the sealing element can be in multi-point contact with the substrate, so that the stability between the sealing element and the substrate is improved. Therefore, the substrate and the sealing element do not need to be additionally assembled and connected, and the mounting error is avoided, so that the occupied space of the sensor assembly in the XY direction is reduced, and the electronic equipment is light and thin.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a front view of a sensor assembly shown according to an exemplary embodiment.

Fig. 2 is an exploded view of a sensor assembly shown according to an exemplary embodiment from the front side.

Fig. 3 is an exploded view of a sensor assembly shown according to an exemplary embodiment from the rear side.

FIG. 4 is a cross-sectional view of a sensor assembly, according to an exemplary embodiment.

Fig. 5 is a schematic structural view of a middle frame assembly according to an exemplary embodiment.

Fig. 6 is a schematic diagram of a housing cavity and sensor assembly, according to an exemplary embodiment.

Fig. 7 is a schematic view showing a structure of a receiving chamber and a reinforcing rib according to an exemplary embodiment.

Fig. 8 is a partial structural diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

In the related art, the sensor assembly is sealed by adopting the planar assembly of the flat plate and the substrate, specifically, the flat plate is stuck on the middle frame, and the sealing of the sensor assembly is realized by using the rib position of the flat plate to be assembled with the rib position of one surface of the substrate.

However, since the flat plate member needs to be assembled and connected with the substrate, assembly tolerance needs to be considered in the manufacturing process, so that the occupied space of the flat plate member in the XY direction is too large, and the sensor assembly occupies too much space of the middle frame, which is not beneficial to the development of light and thin electronic equipment.

In order to solve the above technical problems, a sensor assembly 1 is provided according to an embodiment of the present disclosure.

It is understood that the sensor assembly 1 according to the present disclosure may be adapted for use in any of the electronic devices 8 listed below.

It will be appreciated that the electronic device 8 referred to in this disclosure may also be referred to as a Terminal device, a Terminal, a User Equipment (UE), a Mobile Station (MS), an electronic device (MT), etc., is a device that provides voice and/or data connectivity to a User. For example, the electronic device 8 may be a handheld device, an in-vehicle device, or the like having a wireless connection function. Currently, examples of the electronic device 8 may be: a smart Phone (Mobile Phone), a pocket computer (Pocket Personal Computer, PPC), a palm top computer, a personal digital assistant (Personal Digital Assistant, PDA), a notebook computer, a tablet computer, a wearable device, or a vehicle-mounted device, etc. In addition, the electronic device 8 may also be an in-vehicle device in the case of a vehicle networking (V2X) communication system. It should be understood that embodiments of the present disclosure are not limited to the particular technology and particular device modality employed by the electronic device 8. In the following description, a mobile phone is taken as an example, but the present disclosure is not limited thereto.

FIG. 1 is a front view of a sensor assembly shown according to an exemplary embodiment. Fig. 2 is an exploded view of a sensor assembly shown according to an exemplary embodiment from the front side. Fig. 3 is an exploded view of a sensor assembly shown according to an exemplary embodiment from the rear side.

In some embodiments, as shown in fig. 1-3, the sensor assembly 1 generally includes a substrate 2, a sensor 3, and a seal 4.

As shown in fig. 1, the sensor 3 may be provided on the substrate 2. Wherein the inner surface 41 of the seal 4 may be in contact with a side of the substrate 2 lying in a different plane, and the outer surface 42 of the seal 4 opposite the inner surface 41 may be adapted to be in contact with the housing.

In this embodiment, the inner surface 41 of the sealing member 4 contacts with the side surface of the substrate 2 in different planes, so that the sealing member 4 forms a form of surrounding or partially surrounding the substrate 2, and the outer surface 42 of the sealing member 4 contacts with the housing of the sensor assembly 1 to be assembled, so that the sensor 3 can be sealed. Compared with the related art, the sensor assembly 1 disclosed by the disclosure has the advantages that the sealing element 4 contacts with the substrate 2 on different sides, and the different sides of the substrate 2 contact with the sealing element 4, so that the relative stability between the sealing element 4 and the substrate 2 can be improved, and the substrate 2 and the sealing element 4 are not required to be assembled and connected, so that the existence of assembly tolerance is avoided, the occupied space of the sensor assembly 1 in the XY direction is reduced, and the thinning of the electronic equipment 8 are facilitated.

As shown in fig. 2 or 3, the inner surface 41 of the seal 4 may be a surface on the inner boundary of the seal 4, which is in contact with the inner space. The inner surface 41 of the seal 4 in the present disclosure may be in contact with the side of the different plane of the substrate 2, i.e. the seal 4 may have at least two adjacent faces with different extension directions, may be in contact with the side of the different plane of the substrate 2.

For example, in some embodiments, as shown in fig. 1-3, the seal 4 may be an open cuboid, two pairs of oppositely disposed sides of the seal 4 may each be in contact with sides around the substrate 2, a side perpendicular to the oppositely disposed sides may face a side of the substrate 2 where the electronics are located, and at least a portion of the outer surface 42 of the seal 4 opposite the inner surface 41 may be configured to contact the housing. With this setting, the sealing member 4 can realize the omnidirectional is sealed and the protection to base plate 2 all around, provides bigger sealing area around base plate 2, and sealed effect is better, and life is longer, and sealing member 4 can prevent dust, liquid and gas entering in the multiple directions of base plate 2, protects electronic device not receive environmental pollution and damage.

However, the present disclosure is not limited thereto, and in other embodiments, the sealing member 4 may have two adjacent surfaces extending in different directions, in which case the cross section of the sealing member 4 may be in an "L" shape, the inner surface 41 of the sealing member 4 may contact a side surface of the substrate 2 in a different plane, and the outer surface 42 of the sealing member 4 opposite to the inner surface 41 may contact a housing, and in some cases, sealing of the substrate 2 may be achieved by this arrangement.

In other embodiments, the seal 4 may have three adjacent faces extending in different directions, in which case the cross-section of the seal 4 may be "U" shaped, the inner face 41 of the seal 4 may also be in contact with a side of the substrate 2 in a different plane, and the outer face 42 of the seal 4 opposite the inner face 41 may also be in contact with, in some cases, in which case sealing of the substrate 2 may also be achieved.

It will be appreciated that the present disclosure is not specifically limited to the specific form of the seal 4, but the above is merely an exemplary illustration of which forms the seal 4 may exist in, but is not limited to the case described in the above embodiments. As long as the inner surface 41 of the sealing member 4 can be in contact with a side surface of the substrate 2 which is located in a different plane. That is, as long as it is under such conditions, a person skilled in the art can set and adjust the specific form of the seal 4 according to the actual situation.

Wherein the substrate 2 of the sensor assembly 1 may provide power supply and signal output for the sensor 3, and the substrate 2 may also provide mechanical support for the sensor 3, fixing the position and orientation of the sensor 3. Therefore, the substrate 2 may be a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, an aluminum substrate, a high-frequency board, a thick copper board, or the like, but the present disclosure is not particularly limited to the type of the substrate 2, i.e., a person skilled in the art may set and adjust the type thereof according to actual circumstances, as long as the substrate 2 can realize providing power supply and signal output to the sensor 3, and the substrate 2 may also provide mechanical support to the sensor 3.

In some embodiments, the sensor 3 may comprise at least one of: a light sensor, an anti-flicker sensor, a proximity sensor, an acceleration sensor, a gyro sensor, a temperature sensor, or the like.

It should be noted that, the sensor 3 in the present disclosure may be the sensor 3 required for implementing various functions in the electronic device 8, for example, in some embodiments, the electronic device 8 may sense the intensity of ambient light by using a light sensor, so as to adjust the screen brightness of the electronic device 8, so that the screen brightness may be matched with the ambient light, and the screen may be visible under strong external light and not dazzling under weak external light.

In other embodiments, the electronic device 8 may also sense the intensity of the ambient light by using a proximity sensor to automatically adjust or turn off the screen, for example, taking the electronic device 8 as a mobile phone, when the user brings the mobile phone close to the ear, the proximity sensor will detect the distance of the object, and automatically adjust the brightness of the screen or automatically turn off the screen, so as to save the battery power, and avoid the irritation of the excessively bright screen to the eyes or the false touch of the screen during the call.

In other embodiments, the electronic device 8 may also detect the flicker frequency of the light source by using a flicker sensor, and automatically adjust the exposure time and white balance of the camera, so as to avoid the problem of flickering or streaking of the photographed pictures and videos. The photographing effect under low light conditions is improved, thereby providing clearer and stable photographs and videos. For example, when in an indoor or low light environment, the lights may blink at a fixed frequency, such as 60Hz or 50Hz. If the exposure time of the camera is not synchronous with the flicker frequency of the light, the problems of flickering or stripes of the shot photo or video can be caused. The flicker frequency of the light source is detected by using the flicker sensor, and the exposure time and the white balance of the camera are automatically adjusted, so that the problems of flickering or stripes of photographed pictures and videos are avoided. The photographing effect under low light conditions is improved, thereby providing clearer and stable photographs and videos.

In other embodiments, the above-described various sensors may also be integrated in the electronic device 8 on the same substrate 2, i.e. the sensor 3 may comprise a combination of light sensors, anti-flicker sensors and proximity sensors, as the case may be. Alternatively, in another possible case, the sensor 3 may also include any one or a combination of an acceleration sensor, a gyro sensor, or a temperature sensor. However, the present disclosure is not limited thereto, i.e. the person skilled in the art may adjust the type or the matching combination according to the actual situation.

The seal 4 in the present disclosure may seal against the substrate 2 and/or the sensor 3 on the substrate 2, preventing dust, liquids, and gases from entering the sensor 3 and/or the interior of the substrate 2, protecting the sensor 3 and/or the substrate 2 from environmental contamination and damage. For example, in some embodiments, the seal 4 may be an elastic member. The seal 4 may be provided by an elastic member. On the one hand, the elastic piece can provide precompression between the base plate 2 and the shell, can generate elastic return force, can adapt to the shape of the base plate 2 and the shell well, ensures that the sealing piece 4 is closely contacted with the base plate 2 and the shell for a long time, and ensures that the sealing piece 4 achieves the best sealing effect. On the other hand, the elastomer is a good electromagnetic shielding material, and can also effectively prevent electromagnetic interference from entering the substrate 2 and protect electronic circuits.

However, the present disclosure is not limited thereto and in other embodiments, the seal 4 may be a rigid material (e.g., iron, aluminum, copper, or epoxy, etc.) that may subject the seal 4 to greater pressures.

It should be noted that the type of the sealing member 4 is not particularly limited, that is, a person skilled in the art may set and adjust the type according to the actual situation, so long as the sealing member 4 can seal and protect the substrate 2 and/or the sensor 3 on the substrate 2.

FIG. 4 is a cross-sectional view of a sensor assembly, according to an exemplary embodiment.

In some embodiments, as shown in fig. 1 to 4, the sealing member 4 may include a first portion 43 and a second portion 44, wherein the first portion 43 may be disposed opposite to a side of the substrate 2 in the thickness direction D1, and the second portion 44 may be disposed opposite to the substrate 2 in the horizontal direction D2.

In this embodiment, the first portion 43 may be disposed opposite to at least one side of the substrate 2 in the thickness direction D1, the first portion 43 and the second portion 44 may form the whole of the sealing member 4, different sides of the substrate 2 contact the sealing member 4 to improve the relative stability between the sealing member 4 and the substrate 2, and avoid the existence of assembly tolerance, so as to reduce the occupied space of the sensor assembly 1 in the XY direction, and facilitate the thinning of the electronic device 8.

In some embodiments, the first portion 43 may be disposed opposite to the peripheral side surface of the substrate 2 in the thickness direction D1.

In this embodiment, the first portion 43 may surround the peripheral side of the substrate 2, so as to realize omnibearing sealing and protection of the periphery of the substrate 2, and provide a larger sealing area around the substrate 2, so that the sealing effect is better and the service life is longer.

In some embodiments, the second portion 44 may have a first opening 45 and the sensor 3 may be located within the first opening 45.

In this embodiment, the first opening 45 may provide a receiving environment for the sensor 3 to receive signals. One side of the sensor 3 receiving the signal may be directed through the first opening 45 towards the side where the signal is located, so that the sensor 3 receives the signal and converts it into an electrical signal.

The signal received by the sensor 3 may be a light intensity signal, a signal of light change, an electromagnetic signal when an object approaches, a temperature signal or a humidity signal, etc., but the present disclosure is not particularly limited to the type of signal received by the sensor 3, for example, when the sensor 3 is a light sensor, the light intensity signal may be received. For another example, when the sensor 3 is a proximity sensor, an electromagnetic signal or the like when an object approaches may be received, that is, a person skilled in the art may set the type of signal to be received by the sensor 3 according to the actual situation.

In some embodiments, the seal 4 may comprise at least one of: rubber, thermoplastic elastomer, liquid silica gel, thermoplastic polyurethane, polyvinyl chloride soft rubber or plastic.

It should be noted that the seal 4 of the present disclosure may be made of different materials to meet different usage conditions. Different materials have different properties, such as high and low temperature resistance, water resistance, dust resistance, mechanical strength and the like. Suitable materials may be selected according to the requirements of a particular use environment.

For example, the seal 4 may, where possible, exert its respective advantages by using different materials in combination. For example, rubber may be used to achieve a basic seal, and then liquid silicone may be used at critical locations to improve the seal. This can reduce the cost while ensuring the sealing effect.

The present disclosure is not limited thereto and, in another possible case, the seal 4 may also be better adapted to different use temperature conditions. For example, silicone rubber may be used to accommodate high temperature conditions and polyvinyl chloride soft gel may be used to accommodate low temperature conditions.

It will be appreciated that the present disclosure is not specifically limited to the particular type of seal 4, but rather the above is merely an exemplary illustration of what types of seals 4 may be present, and is not limited to what is described in the above embodiments.

In some embodiments, the seal 4 may be an interference fit with the base plate 2. The interference fit may create a large contact pressure, ensure no gap between the substrate 2 and the seal 4, prevent the ingress of gas, liquid and dust, and may also create a small gap between the substrate 2 and the seal 4, prevent the leakage of current through these gaps, and may provide better electrical insulation between the substrate 2 and the seal 4.

Fig. 5 is a schematic structural view of a middle frame assembly according to an exemplary embodiment. Fig. 6 is a schematic diagram of a housing cavity and sensor assembly, according to an exemplary embodiment.

Based on the same concept, as shown in fig. 5 to 6, the embodiment of the present disclosure further provides a middle frame assembly 5. The middle frame assembly 5 may include a middle frame 6 and the sensor assembly 1 of any of the embodiments described above. Wherein the outer surface 42 of the seal 4 opposite the inner surface 41 may be in contact with a housing, which may be the middle frame 6.

It should be noted that, the middle frame 6 may be a frame of the electronic device 8 that carries various components therein, and the middle frame 6 may be located between the screen and the rear cover of the electronic device 8.

In this embodiment, the sensor assembly 1 may be disposed on the middle frame 6, and the outer surface 42 of the sealing member 4 contacts with the middle frame 6, so that the sensor assembly 1 and the middle frame 6 may be sealed by the sealing member 4, preventing the sensor assembly 1 from being affected by the external environment, and improving the waterproof and dustproof effects of the middle frame 6.

In the electronic device 8, the space for accommodating the sensor assembly 1 in the middle frame 6 is limited, and in the related art, since the flat plate member of the sensor assembly 1 occupies a large space, part of the support rib position of the middle frame 6 is lost.

Fig. 7 is a schematic view showing a structure of a receiving chamber and a reinforcing rib according to an exemplary embodiment.

In some embodiments, as shown in fig. 6 or 7, the middle frame 6 may include a receiving cavity 7, the sensor assembly 1 is disposed in the receiving cavity 7, a side surface of the receiving cavity 7 has a reinforcing rib 72, the reinforcing rib 72 extends in a thickness direction D1 of the middle frame 6, and the sealing member 4 is in contact with the reinforcing rib 72.

In this embodiment, since the sensor assembly 1 occupies a smaller space inside the middle frame 6 than the related art, in the middle frame 6 of the present disclosure, the inside of the accommodating chamber 7 accommodating the sensor assembly 1 may have the reinforcing rib 72, the reinforcing rib 72 may be disposed along the thickness direction D1 of the middle frame 6 together with the thickness extending direction of the middle frame 6, the reinforcing rib 72 may intercept the transmission of the external force, and may further improve the supporting strength of the middle frame 6, thereby improving the overall strength of the middle frame 6.

In an exemplary embodiment, as shown in fig. 7, the accommodating cavity 7 of the middle frame 6 may be made of metal of the middle frame 6, and two sides may be made of plastic materials, so that when external force enters, the external force can be transmitted through the first path 100 and/or the second path 200, and the existence of the reinforcing ribs 72 can prevent the two forces from being transmitted to the area of the main board 81, thereby improving the stress environment of the main board 81. And the blocking of the force can also improve the stress in the middle frame 6 and avoid the variation and deformation of the flatness.

In some embodiments, the receiving cavity 7 has a second opening 71, and the sensor 3 is located in the second opening 71. The sensor 3 may receive an external signal through the second opening 71 so that the sensor 3 receives the signal and converts it into an electrical signal.

Fig. 8 is a partial structural diagram of an electronic device according to an exemplary embodiment.

Based on the same conception, the disclosed embodiment also provides an electronic device 8. The electronic device 8 may comprise the sensor assembly 1 of any of the embodiments described above, or the electronic device 8 may comprise the middle frame assembly 5 of any of the embodiments described above.

In some embodiments, as shown in fig. 8, the electronic device 8 may further include a motherboard 81 and a display screen (not shown). The main board 81 may be disposed on one side of the middle frame 6 of the electronic device 8, the display screen may be disposed on the other side of the middle frame 6 of the electronic device 8, wherein the sensor 3 of the sensor assembly 1 may face the display screen, the substrate 2 of the sensor assembly 1 may be connected to the main board 81, and the thickness of the substrate 2 may extend toward the display screen.

In this embodiment, the substrate 2 of the sensor assembly 1 may be connected to the motherboard 81, and electrically connected to the motherboard 81, so that the sensor assembly 1 can obtain power and signal transmission. The thickness direction D1 of the substrate 2 extends in the display screen direction, which is advantageous for the sensor 3 to sense an external signal.

Embodiments of the present disclosure may form contact with the substrate 2 on different sides by the seal 4, and the seal 4 may completely or partially surround the substrate 2. The outer surface 42 of the seal 4 can in turn be in contact with the housing to be assembled, so that a seal of the sensor 3 is achieved. Compared with the related art, the sealing member 4 can be in multi-point contact with the substrate 2, so that the stability between the sealing member and the substrate is improved. Therefore, there is no need to perform additional assembly connection of the substrate 2 and the sealing member 4, and installation errors are avoided, so that the occupied space of the sensor assembly 1 in the XY direction is reduced, and the thinning of the electronic device 8 is facilitated.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the technical concepts disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (13)

1. A sensor assembly, comprising:

a substrate;

a sensor disposed on the substrate; and

and a sealing member, an inner surface of the sealing member being in contact with a side surface of the substrate lying in a different plane, and an outer surface of the sealing member opposite to the inner surface being for contact with the housing.

2. The sensor assembly of claim 1, wherein the seal comprises:

a first portion provided opposite to a side surface of the substrate in a thickness direction; and

and a second portion disposed opposite to the substrate in a horizontal direction.

3. The sensor assembly of claim 2, wherein,

the first portion is disposed opposite to the peripheral side surfaces of the substrate in the thickness direction.

4. The sensor assembly of claim 2, wherein,

the second portion has a first opening, and the sensor is located within the first opening.

5. The sensor assembly of any one of claims 1 to 4, wherein,

the sealing element is an elastic element.

6. The sensor assembly of claim 5, wherein,

the seal is in interference fit with the base plate.

7. The sensor assembly of claim 5, wherein the seal comprises at least one of:

rubber, thermoplastic elastomer, liquid silica gel, thermoplastic polyurethane, polyvinyl chloride soft rubber or plastic.

8. The sensor assembly of any one of claims 1 to 4, wherein the sensor comprises at least one of:

a light sensor, an anti-flicker sensor, a proximity sensor, an acceleration sensor, a gyro sensor, or a temperature sensor.

9. A center assembly, comprising:

a middle frame; and

the sensor assembly of any one of claim 1 to 8,

wherein an outer surface of the seal opposite the inner surface is in contact with a housing, the housing being the center.

10. The mullion assembly of claim 9, wherein the mullion comprises:

the sensor assembly is arranged in the accommodating cavity, the side face of the accommodating cavity is provided with a reinforcing rib, the reinforcing rib extends along the thickness direction of the middle frame, and the sealing element is in contact with the reinforcing rib.

11. The middle frame assembly of claim 10, wherein the frame assembly comprises,

the receiving cavity has a second opening, and the sensor is located in the second opening.

12. An electronic device, comprising:

the sensor assembly of any one of claims 1 to 8; or alternatively

A centre frame assembly according to any one of claims 9 to 11.

13. The electronic device of claim 12, further comprising:

the main board is arranged on one side of the middle frame of the electronic equipment; and

a display screen arranged on the other side of the middle frame of the electronic equipment,

the sensor of the sensor assembly faces the display screen, the substrate of the sensor assembly is connected to the main board, and the thickness of the substrate extends towards the direction of the display screen.