CN211429753U

CN211429753U - Electronic device

Info

Publication number: CN211429753U
Application number: CN202020209890.8U
Authority: CN
Inventors: 唐际武
Original assignee: Realme Chongqing Mobile Communications Co Ltd
Current assignee: Realme Chongqing Mobile Communications Co Ltd
Priority date: 2020-02-24
Filing date: 2020-02-24
Publication date: 2020-09-04
Anticipated expiration: 2030-02-24

Abstract

The application provides an electronic device, including casing, conductive probe, button circuit board subassembly, inside circuit board subassembly and button subassembly. The shell is provided with a side wall, the side wall comprises a first surface, a second surface and a side surface, the first surface and the second surface are arranged in a reverse mode, the side surface is connected with the first surface and the second surface, the first surface is provided with a mounting hole, the second surface is provided with a through hole, the side surface is provided with a mounting groove, and the mounting hole and the through hole are communicated with the mounting groove; the conductive probe penetrates through the through hole and comprises a first end and a second end which are arranged oppositely, the first end is exposed in the mounting groove, and the second end is exposed on the second surface; the key circuit board assembly is arranged in the mounting groove; the inner circuit board assembly is arranged on one side of the side wall close to the second surface and can be electrically connected with the key circuit board assembly through a conductive probe; the key assembly penetrates through the mounting hole and abuts against the key circuit board assembly. The electronic equipment provided by the application has better waterproof capability.

Description

Electronic device

Technical Field

The application relates to the technical field of product structures, in particular to an electronic device.

Background

The waterproof problem of electronic equipment has been paid attention to, and functional keys of electronic equipment, such as a power key and a volume key, are often weak links of waterproofing. Therefore, how to improve the waterproof capability of the electronic device key becomes a hot research problem in the industry.

Disclosure of Invention

The application provides an electronic device, including casing, conductive probe, button circuit board subassembly, inside circuit board subassembly and button subassembly. The shell is provided with a side wall, the side wall comprises a first surface and a second surface which are arranged in an opposite mode and a side face for connecting the first surface and the second surface, the first surface is provided with an installation hole, the second surface is provided with a through hole, the side face is provided with an installation groove, and the installation hole and the through hole are both communicated with the installation groove; the conductive probe penetrates through the through hole and comprises a first end and a second end which are arranged oppositely, the first end is exposed in the mounting groove, and the second end is exposed on the second surface; the key circuit board assembly is arranged in the mounting groove; the inner circuit board assembly is arranged on one side of the side wall close to the second surface and can be electrically connected with the key circuit board assembly through the conductive probe; the key assembly penetrates through the mounting hole and abuts against the key circuit board assembly.

For realizing the function of electronic equipment button, generally need set up the logical groove that communicates one side space that is close to the second surface of mounting groove and lateral wall on the side of casing lateral wall for be connected through striding the flexible circuit board who locates this logical groove between button circuit board subassembly and the internal circuit board subassembly, lead to the waterproof performance of groove department weak, make casing surface's continuity relatively poor. Among the electronic equipment that this application provided, only need set up the through-hole that is close to one side space on the second surface of intercommunication mounting groove and lateral wall on the second surface of lateral wall, can be so that through the electrically conductive probe connection who wears to locate the through-hole between key circuit board subassembly and the internal circuit board subassembly, need not to set up logical groove on the side, be favorable to improving the continuity of casing surface, avoid appearing waterproof weak area on the casing, be favorable to improving electronic equipment's waterproof ability.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an electronic device provided herein;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is an enlarged schematic view of a portion of the structure of FIG. 2;

FIG. 4 is an exploded view of the key circuit board assembly of FIG. 2;

FIG. 5 is another exploded view of the key circuit board assembly of FIG. 2;

FIG. 6 is a schematic diagram of the internal circuit board assembly of FIG. 2;

FIG. 7 is a schematic diagram of the structure of the conductive probe of FIG. 2;

FIG. 8 is a schematic sectional view of a part of the structure of the housing of FIG. 2;

fig. 9 is a schematic structural diagram of the key assembly in fig. 2;

fig. 10 is a schematic view of the key assembly and the bracket of fig. 2 cooperating with each other;

FIG. 11 is another schematic diagram of the electronic device of FIG. 1;

FIG. 12 is another schematic diagram of an electronic device provided herein;

fig. 13 is a schematic structural diagram of the electronic device in fig. 12.

Detailed Description

It should be noted that "electronic device" in this application includes, but is not limited to, devices that are configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). Such as smart phones, tablets, laptops, wearable devices, and the like.

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 2 and fig. 3 together, fig. 1 is a schematic structural diagram of an electronic device 100 provided in the present application, fig. 2 is an exploded schematic diagram of the electronic device 100 in fig. 1, and fig. 3 is an enlarged schematic diagram of a portion of the structure in fig. 2. The electronic device 100 includes a housing 10, a conductive probe 20, a key circuit board assembly 30, an internal circuit board assembly 40, and a key assembly 50. The terms "comprising" and "having," as well as any variations thereof, in this application are intended to cover non-exclusive inclusions.

The casing 10 has a side wall 11, the side wall 11 includes a first surface 111 and a second surface 112 opposite to each other and a side surface 113 connecting the first surface 111 and the second surface 112, the first surface 111 has a mounting hole 1111, the second surface further has a through hole 1121, the side surface 113 has a mounting groove 1131, and the mounting hole 1111 and the through hole 1121 are both communicated with the mounting groove 1131. The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.

Further, the housing 10 may be a middle frame of the electronic device 100, and of course, the housing 10 may also be a rear cover of the electronic device 100. Specifically, the housing 10 may further include a bottom wall 12 and four side walls 11 connected end to end, where the side walls 11 and the bottom wall 12 jointly enclose a receiving space 101. One of the sidewalls 11 may include a first surface 111 and a second surface 112 opposite to each other, and a side surface 113 connecting the first surface 111 and the second surface 112, where the first surface 111 may be an external surface of the electronic device 100, the second surface 112 may be located inside the electronic device 100, and the first surface 111 and the second surface 112 may be parallel to each other.

The key circuit board assembly 30 is disposed in the mounting groove 1131. The application is not particularly limited as to how the key circuit board assembly 30 is fixed in the mounting groove 1131, and for example, the key circuit board assembly 30 can be fixed in the mounting groove 1131 by the bracket 70. Specifically, the electronic device 100 further includes a bracket 70, where the bracket 70 is also disposed in the mounting groove 1131, specifically on a side of the key circuit board assembly 30 close to the key assembly 50, and is used to fix the key circuit board assembly 30 in the mounting groove 1131.

Referring to fig. 4 and 5, fig. 4 is an exploded view of the key circuit board assembly 30 in fig. 2, fig. 5 is another exploded view of the key circuit board assembly 30 in fig. 2, the key circuit board assembly 30 may include a key circuit board 31 and a touch switch 32 disposed on a side of the key circuit board 31 close to the key circuit assembly 50, a first copper exposed area 3121 is disposed on a surface of the key circuit board 31 away from the key circuit assembly 50, the first copper exposed area 3121 is configured to be electrically connected to the conductive probe 20, and the key circuit assembly 50 can abut against the touch switch 32 when pressed to communicate with a circuit of the key circuit board 31.

Further, the key circuit board 31 may be a strip-shaped flat circuit board, and includes a first circuit board 311 and a second circuit board 312 which are arranged side by side in a length direction thereof and connected to each other. A side surface of the first circuit board 311 close to the conductive probe 20 may be provided with a reinforcing plate 33, and the touch switch 32 may be fixedly disposed on a side surface of the first circuit board 311 far from the conductive probe 20. A reinforcing plate 33 may be disposed on a side surface of the second circuit board 312 away from the conductive probe 20, and a first exposed copper region 3121 may be disposed on a side surface of the second circuit board 312 close to the conductive probe 20, where the first exposed copper region 3121 is electrically connected to the conductive probe 20.

The internal circuit board assembly 40 is disposed on a side of the sidewall 11 close to the second surface 112, and can be electrically connected to the key circuit board assembly 30 through the conductive probe 20. Specifically, the internal circuit board assembly 40 may be disposed inside the accommodating space 101 and electrically connected to a main board of the electronic device 100.

Further, referring to fig. 6, fig. 6 is a schematic structural diagram of the internal circuit board assembly 40 in fig. 2, the internal circuit board assembly 40 may be fixedly disposed on the housing 10 and include a flexible circuit board 41 and a reinforcing plate 42, the reinforcing plate 42 is disposed on a side of the flexible circuit board 41 away from the side wall 11, a second copper exposing area 4111 is disposed on a side surface of the flexible circuit board 41 close to the side wall 11, and the second copper exposing area 4111 is electrically connected to the conductive probe 20.

Further, as shown in fig. 6, the flexible circuit board 41 may include a first portion 411 and a second portion 412 disposed at an angle, the first portion 411 and the second portion 412 may both be disposed in a plate shape, and the first portion 411 and the second portion 412 may be further connected to each other. The first portion 411 may be fixed on the second surface 112 of the sidewall 11, a side surface of the first portion 411 close to the conductive probe 20 may be provided with a second copper exposing region 4111, the second copper exposing region 4111 is electrically connected to the conductive probe 20, and a side surface of the first portion 411 away from the conductive probe 20 may be provided with a stiffener 42. The second portion 412 may be electrically connected to a motherboard of the electronic device 100.

The conductive probe 20 is disposed through the through hole 1121 for connecting the key circuit board assembly 30 located in the mounting groove 1131 and the internal circuit board assembly 40 located in the accommodating space 101. For example, the outer surface of the conductive probe 20 may be provided with an elastic layer (not shown in the drawings), and the size of the conductive probe 20 may be slightly larger than that of the through hole 1121, so that the conductive probe 20 and the housing 10 are tightly connected without a gap to prevent water from entering.

Referring to fig. 7, fig. 7 is a schematic structural diagram of the conductive probe 20 in fig. 2. The conductive probe 20 includes a first end 21 and a second end 22 opposite to each other, the first end 21 is exposed in the mounting groove 1131, and the second end 22 is exposed on the second surface 112. Specifically, the first end 21 of the conductive probe 20 may be exposed inside the mounting groove 1131 to abut against the first exposed copper region 3121 disposed on the key circuit board assembly 30, and the second end 22 of the conductive probe 20 may be exposed inside the receiving space 101 to abut against the second exposed copper region 4111 disposed on the internal circuit board assembly 40.

With respect to the installation method of the conductive probe, the present application is not limited, for example, during the installation process of the conductive probe, the first end 21 of the conductive probe 20 may extend from the inside of the receiving space 101 to the inside of the mounting groove 1131, so that the first end 21 of the conductive probe 20 is exposed in the mounting groove 1131, and the second end 22 is exposed in the receiving space.

Further, the first end 21 and the second end 22 of the conductive probe 20 may be configured to be elastically stretchable, so that the connection between the conductive probe 20 and the key circuit board assembly 30 and the internal circuit board assembly 40 is more reliable, which is beneficial to improving the stability of the electronic device 100. Of course, it is also possible to provide one of the first end 21 or the second end 22 of the conductive probe 20 to be elastically stretchable and the other to be non-stretchable. For example, the conductive probe 20 may include a cylindrical body 23, a first probe 24 and a second probe 25, the first probe 24 may be inserted into one end of the cylindrical body 23 and may be extended and retracted with respect to the cylindrical body 23, and the second probe 25 may be inserted into the other end of the cylindrical body 23 and may be extended and retracted with respect to the cylindrical body 23. The first probe 24 of the conductive probe 20 may be exposed inside the mounting groove 1131 to abut against the first copper exposed region 3121 disposed on the key circuit board assembly 30, and the second probe 25 of the conductive probe 20 may be exposed inside the accommodating space 101 to abut against the second copper exposed region 4111 disposed on the internal circuit board assembly 40.

Further, as shown in fig. 7, the cylindrical body 23 may be cylindrically disposed, the first probe 24 and the second probe 25 may be cylindrically disposed, and the diameters of the first probe 24 and the second probe 25 may be slightly smaller than the inner diameter of the cylindrical body 23, so that the first probe 24, the second probe 25 and the cylindrical body 23 are tightly fitted. Optionally, a protrusion 231 may be disposed on the cylindrical body 23 to limit and fix the conductive probe 20 to the sidewall 11. For example, the protrusion 231 may be disposed annularly and may be sleeved on the outer surface of the cylindrical body 23. The protrusion 231 may be limited to the second surface 112 of the sidewall 11 to prevent the conductive probe 20 from sliding into the mounting groove 1131. The projection 231 may be integrally formed with the cylindrical body 23.

Further, the number of the conductive probes 20 is equal to the number of the through holes 1121, and may be one or more. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. For example, the number of the conductive probes 20 may be two, that is, the number of the through holes 1121 is also two, so as to ensure reliable contact between the key circuit board assembly 30 and the internal circuit board assembly 40, and improve the reliability of the electronic device 100. The material of the conductive probe 20 is not limited in this application, and may be any conductive metal material, such as copper alloy, aluminum alloy, magnesium alloy, etc.

Further, the electronic device 100 provided by the present application further includes an elastic sealing member 60, where the elastic sealing member 60 is fixedly disposed on the housing 10 or the key circuit board assembly 30 and surrounds the conductive probe 20 to achieve waterproof and dustproof effects. Specifically, the elastic sealing member 60 may be disposed between the key circuit board assembly 30 and the housing 10, surrounding the conductive probe 20, and sealed and waterproof by a certain interference compression. The elastic sealing element 60 can be adhered to the surface of the second circuit board 312 close to the conductive probe 20 by an adhesive, and can also be adhered to the inner wall of the mounting groove 1131 by an adhesive, and of course, the elastic sealing element 60 can also be integrally formed with the housing 10 by an in-mold injection molding method. The specific material of the elastic sealing member 60 is not particularly limited in the present application, and for example, the elastic sealing member 60 may be made of various materials such as foam, silicone, etc.

The key assembly 50 penetrates through the mounting hole 1111 and abuts against the key circuit board assembly 30. The key assembly 50 can be pressed against the touch switch 32 in the key circuit board assembly 30 to communicate with the circuit of the key circuit board 31.

Further, referring to fig. 8, 9 and 10, fig. 8 is a cross-sectional view of a portion of casing 10 in fig. 2, fig. 9 is a structural view of key assembly 50 in fig. 2, fig. 10 is a structural view of key assembly 50 in fig. 2 cooperating with bracket 70, and mounting hole 1111 includes a first hole segment 11111 and a second hole segment 11112, and second hole segment 11112 communicates first hole segment 11111 with mounting hole 1131. The key assembly 50 comprises a key cap 51 and a key block 52, wherein at least part of the key cap 51 is accommodated in the first hole segment 11111; the key block 52 is disposed through the second hole segment 11112, one end of the key block 52 is fixedly connected to the key cap 51, and the other end of the key block abuts against the key circuit board assembly 30.

Further, the first hole segment 11111 may be a long strip-shaped slot formed on the first surface 111 of the casing 10, and is used for accommodating the key cap 51. The key cap 51 is also strip-shaped, and the key cap 51 and the key block 52 can be integrally formed. The key cap 51 may have a portion received in the first hole segment 11111 and another portion exposed outside the electronic device 100 for receiving a pressing force; the key block 52 can be fixedly connected with the middle position of the key cap 51.

Further, the electronic device 100 provided by the present application further includes a support 70, where the support 70 is disposed in the mounting groove 1131, and is located on one side of the key circuit board assembly 30 close to the key assembly 50, so as to fix the key circuit board assembly 30 in the mounting groove 1131. Specifically, the support 70 may include a first surface 71 and a second surface 72 that are disposed opposite to each other, the first surface 71 of the support 70 abuts against the key circuit board assembly 30, and the second surface 72 of the support 70 abuts against an inner wall of the mounting groove 1131, so as to fix the key circuit board assembly 30 in the mounting groove 1131 in a limited manner, thereby avoiding a change in position of the key circuit board assembly 30 and improving reliability of the electronic device 100.

Further, the second hole segment 11112 may include a first sub-hole segment 111121 and a second sub-hole segment 111122 that are arranged side by side, the button block 52 is inserted into the first sub-hole segment 111121, the key assembly 50 further includes a fixture block 53, the fixture block 53 is fixedly connected to the key cap 51, and the fixture block 53 is inserted into the second sub-hole segment 111122 and is matched with a fastening position arranged on the bracket 70 to prevent the key assembly 50 from falling off.

Further, the number of the first sub-hole segments 111121 may be one, the number of the second sub-hole segments 111122 may be two, and two second sub-hole segments 111122 are symmetrically distributed on both sides of the first sub-hole segments 111121. The geometric center of the first sub-aperture segment 111121 may be collinear with the geometric center of the first aperture segment 11111, and the geometric center of the first sub-aperture segment 111121 may be collinear with the geometric centers of the two second sub-aperture segments 111122. Correspondingly, the number of the two latch blocks 53 is two, the two latch blocks 53 are respectively fixedly connected with two ends of the key cap 51, and the two latch blocks 53 respectively penetrate through the two second sub-hole sections 111122 to be matched with the buckling positions arranged on the latch blocks 53.

Further, referring to fig. 11, fig. 11 is another schematic structural diagram of the electronic device 100 in fig. 1, the electronic device 100 provided in the present application may further include a display screen 110 and a rear cover 120, the housing 10 connects the display screen 110 and the rear cover 120, the display screen 110, the rear cover 120 and the sidewall 11 of the housing 10 jointly enclose to form an accommodating space 130, and the internal circuit board assembly 40 is disposed in the accommodating space 130.

Of course, the display screen 110 is mainly used for displaying, and the display screen 110 may be an LCD display screen or an OLED display screen. Further, the display screen 110 may also be used to receive input instructions from a user. The rear cover 120 is mainly used to protect the internal structure of the electronic device 100. The display screen 110, the rear cover 120 and the side wall 11 of the casing 10 together enclose a receiving space 130, and other components (not shown) of the electronic device 100, such as a chip, a battery, a camera and various sensors, may be further disposed in the receiving space 130.

Further, referring to fig. 12 and 13 together, fig. 12 is another schematic diagram of the electronic device provided in the present application, fig. 13 is a schematic diagram of the structure of the electronic device in fig. 12, and the electronic device 200 may further include an RF circuit 210, a memory 220, an input unit 230, a display unit 240 (i.e., the display screen 120 in the above embodiment), a sensor 250, an audio circuit 260, a wifi module 270, a processor 280, a power supply 290, and the like. The RF circuit 210, the memory 220, the input unit 230, the display unit 240, the sensor 250, the audio circuit 260, and the wifi module 270 are respectively connected to the processor 280; the power supply 290 is used to supply power to the entire electronic device 200.

Specifically, the RF circuit 210 is used for transmitting and receiving signals; the memory 220 is used for storing data instruction information; the input unit 230 is used for inputting information, and may specifically include a touch panel 231 and other input devices 232 such as operation keys; the display unit 240 may include a display panel 241, etc.; the sensor 250 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 261 and a microphone (or a microphone, or a receiver assembly in the above embodiments) 262 are connected to the processor 280 through the audio circuit 260 for receiving and transmitting sound signals; the wifi module 270 is configured to receive and transmit wifi signals, and the processor 280 is configured to process data information of the mobile electronic device. With regard to the related technical features of the receiver assembly, please refer to the related description of the above embodiments of the receiver assembly, and detailed description thereof will not be provided herein.

In order to realize the functions of the keys of the electronic device 100, a through groove communicating the mounting groove 1131 with the accommodating space 101 is generally required to be formed on the side surface 113 of the side wall 11 of the housing 10, so that the key circuit board assembly 30 and the internal circuit board assembly 40 are connected through a flexible circuit board spanning the through groove, and the through groove has a weak waterproof performance, so that the continuity of the surface of the housing 10 is poor. In the electronic device 100 provided by the present application, only the through hole 1121 of the communicating installation groove 1131 and the accommodating space 101 needs to be opened on the second surface 112 of the side wall 11, so that the key circuit board assembly 30 and the internal circuit board assembly 40 can be connected through the conductive probe 20 penetrating through the through hole 1121, a through groove does not need to be opened on the side surface 113, which is beneficial to improving the continuity of the surface of the housing 10, avoiding the occurrence of a waterproof weak area on the housing 10, and is beneficial to improving the waterproof capability of the electronic device 100.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. An electronic device, comprising:

the side wall of the shell comprises a first surface, a second surface and a side surface, wherein the first surface and the second surface are arranged oppositely, the side surface is used for connecting the first surface and the second surface, the first surface is provided with a mounting hole, the second surface is provided with a through hole, the side surface is provided with a mounting groove, and the mounting hole and the through hole are both communicated with the mounting groove;

the conductive probe penetrates through the through hole and comprises a first end and a second end which are arranged oppositely, the first end is exposed in the mounting groove, and the second end is exposed on the second surface;

the key circuit board assembly is arranged in the mounting groove;

the inner circuit board assembly is arranged on one side of the side wall close to the second surface and can be electrically connected with the key circuit board assembly through the conductive probe;

and the key assembly penetrates through the mounting hole and abuts against the key circuit board assembly.

2. The electronic apparatus according to claim 1, wherein the conductive probe comprises a cylindrical main body, a first probe inserted into one end of the cylindrical main body and being extendable and retractable with respect to the cylindrical main body, and a second probe inserted into the other end of the cylindrical main body and being extendable and retractable with respect to the cylindrical main body.

3. The electronic device of claim 2, wherein the cylindrical body is provided with a protrusion portion to limit the conductive probe to be fixed on the side wall.

4. The electronic device of claim 1, wherein the key circuit board assembly includes a key circuit board and a touch switch disposed on a side of the key circuit board close to the key assembly, a first copper exposing area is disposed on a surface of the key circuit board away from the key assembly, the first copper exposing area abuts against the first end of the conductive probe, and the key assembly can abut against the touch switch when pressed to communicate with a circuit of the key circuit board.

5. The electronic device according to claim 1 or 4, wherein the internal circuit board assembly is fixedly disposed on the housing and includes a flexible circuit board and a stiffener, the stiffener is disposed on a side of the flexible circuit board away from the side wall, a side surface of the flexible circuit board close to the side wall is provided with a second copper exposed area, and the second copper exposed area abuts against the second end of the conductive probe.

6. The electronic device of claim 1, further comprising:

and the elastic sealing piece is fixedly arranged on the shell or the key circuit board assembly and surrounds the conductive probe to realize water and dust prevention.

7. The electronic device of claim 6, wherein the resilient seal is integrally formed with the housing.

8. The electronic device of claim 1, further comprising:

the support, set up in the mounting groove, the support is located close to of key circuit board subassembly one side of key circuit board subassembly is used for inciting somebody to action key circuit board subassembly is fixed in the mounting groove.

9. The electronic device of claim 8, wherein the mounting hole includes a first hole section and a second hole section, the second hole section communicating the first hole section and the mounting groove, the key assembly comprising:

the key cap is at least partially accommodated in the first hole section;

and the key block penetrates through the second hole section, one end of the key block is fixedly connected with the key cap, and the other end of the key block is abutted against the key circuit board assembly.

10. The electronic device of claim 9, wherein the second hole section includes a first sub-hole section and a second sub-hole section arranged side by side, the key block is disposed through the first sub-hole section, and the key assembly further includes:

and the clamping block is fixedly connected with the key cap, penetrates through the second sub-through hole and is matched with the buckling position arranged on the support to prevent the key assembly from falling off.

11. The electronic device of claim 1, further comprising a display screen and a rear cover, wherein the housing is connected to the display screen and the rear cover, the display screen, the rear cover and side walls of the housing together enclose a receiving space, and the internal circuit board assembly is disposed in the receiving space.