CN220454359U - U-shaped full enclosure capillary structure temperature equalizing plate - Google Patents
U-shaped full enclosure capillary structure temperature equalizing plate Download PDFInfo
- Publication number
- CN220454359U CN220454359U CN202320497231.2U CN202320497231U CN220454359U CN 220454359 U CN220454359 U CN 220454359U CN 202320497231 U CN202320497231 U CN 202320497231U CN 220454359 U CN220454359 U CN 220454359U
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- Prior art keywords
- copper
- shaped
- capillary structure
- upper plate
- plate
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 43
- 239000002086 nanomaterial Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a U-shaped all-around capillary structure temperature equalizing plate, which relates to the technical field of VC temperature equalizing plates and comprises a copper upper plate, and is characterized in that the outer surface of the copper upper plate is welded with a copper lower plate, the inner side surface of the copper upper plate is provided with a U-shaped groove, the inner side surface of the copper lower plate is fixedly connected with a plurality of support columns, a steam channel is arranged between one or more groups of two adjacent U-shaped grooves on the inner side surface of the copper upper plate, and micro grooves are formed in the end surfaces of two sides of an opening of each U-shaped groove; the utility model eliminates the traditional VC attaching Mesh on the inner wall, adopts the U-shaped full-enclosed capillary structure to replace the Mesh capillary structure, can greatly reduce manpower and cost, improve production quality and production efficiency, while the z-axis steam space is improved by about 25 percent compared with the traditional structural performance.
Description
Technical Field
The utility model relates to the technical field of VC temperature equalization plates, in particular to a U-shaped all-around capillary structure temperature equalization plate.
Background
The vacuum cavity vapor chamber is similar to a heat pipe in principle, but the heat pipe is in one-dimensional linear heat conduction in conduction mode, and the heat in the vacuum cavity vapor chamber is conducted on a two-dimensional surface, so that the efficiency is higher, specifically, liquid at the bottom of the vacuum cavity is evaporated and diffused into the vacuum cavity after absorbing the heat of a chip, the heat is conducted onto a heat radiation fin, and then condensed into liquid to return to the bottom, and the evaporation and condensation processes similar to a refrigerator air conditioner are fast circulated in the vacuum cavity, so that quite high heat radiation efficiency is realized;
the conventional VC temperature equalization plate is generally directly attached with Mesh on the inner wall, so that the labor, the production quality and the cost of the VC temperature equalization plate are too high in the production process, the batch production is inconvenient, and the z-axis steam space of the conventional structure is lower;
so that the number of the parts to be processed, the U-shaped all-around capillary structure temperature equalizing plate is needed to be designed to solve the problems.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a U-shaped all-around capillary structure temperature equalizing plate.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the U-shaped full-surrounding capillary structure temperature equalizing plate comprises a copper upper plate, a copper lower plate is welded on the outer surface of the copper upper plate, U-shaped grooves are formed in the inner side surface of the copper upper plate, a plurality of support columns are fixedly connected to the inner side surface of the copper lower plate, steam channels are arranged between one group or a plurality of groups of two adjacent U-shaped grooves in the inner side surface of the copper upper plate, and micro grooves are formed in the end surfaces of two sides of an opening of each U-shaped groove.
Preferably, the copper upper plate, the copper lower plate and the side surfaces of the support columns are all arranged in a surface roughening manner.
Preferably, the solder between the copper upper plate and the copper lower plate is solder paste.
Preferably, the support column is located inside the U-shaped groove, and a gap exists between the U-shaped groove and the support column.
Preferably, the U-shaped groove and the support column are in a linear or S-shaped curve along the length direction of the copper upper plate or the copper lower plate, and the support column and the U-shaped groove correspond to each other.
Preferably, the outer surfaces of the U-shaped groove and the support column are provided with micro-nano structures, and the height of each micro-nano structure is about two to thirty micrometers.
The utility model has the following beneficial effects:
through setting up support column and steam channel, cancel traditional VC and adhere to Mesh at the inner wall, adopt the U font to surround the capillary structure entirely and replace Mesh capillary structure can greatly reduce manpower, cost, improve production quality and production efficiency, the while is compared traditional structural performance z axle steam space and is promoted about 25%.
Drawings
FIG. 1 is a schematic structural view of a main body of a U-shaped all-around capillary structure temperature equalization plate provided by the utility model;
FIG. 2 is a schematic diagram of a laminated structure of a U-shaped all-around capillary structure temperature equalization plate according to the present utility model;
FIG. 3 is a schematic diagram of the overall structure of the U-shaped all-around capillary structure temperature equalization plate provided by the utility model;
FIG. 4 is a schematic view showing the structure of the S-shape inside the U-shaped full-surrounding capillary structure temperature equalization plate according to the present utility model
In the figure: 1. a copper upper plate; 2. a copper lower plate; 3. a U-shaped groove; 4. a micro-trench; 5. a support column; 6. a steam channel.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-3, the novel high-efficiency high-temperature heat exchanger comprises a copper upper plate 1, a copper lower plate 2 is welded on the outer surface of the copper upper plate 1, a U-shaped groove 3 is formed in the inner side surface of the copper upper plate 2, a plurality of supporting columns 5 are fixedly connected to the inner side surface of the copper lower plate 2, the U-shaped groove 3 and the supporting columns 5 are in linear or S-shaped curves along the length direction of the copper upper plate 1 or the copper lower plate 2, the supporting columns 5 and the U-shaped groove 3 correspond to each other, a steam channel 6 is arranged between one or more groups of two adjacent U-shaped grooves 3 in the inner side surface of the copper upper plate 1, micro grooves 4 are formed in the end surfaces of two sides of an opening of the U-shaped groove 3, the conventional VC is omitted, mesh is attached on the inner wall, a U-shaped full-surrounding capillary structure is adopted to replace the Mesh capillary structure, labor and cost are greatly reduced, production quality and production efficiency are improved, and meanwhile compared with the conventional structural performance, and z-axis steam space is improved by about 25%.
As shown in fig. 3 and 4, the U-shaped groove 3 and the support column 5 are in a linear or S-shaped curve along the length direction of the copper upper plate 1 or the copper lower plate 2, and the support column 5 and the U-shaped groove 3 correspond to each other.
The specific working principle of the utility model is as follows:
the VC temperature equalizing plate is a vacuum cavity with a fine structure on the inner wall and is usually made of copper; when heat is conducted from a heat source to a VC cavity, a gasification phenomenon is generated after cooling liquid in the cavity is heated, the liquid is gasified and absorbs heat, the volume is rapidly expanded to fill the whole cavity, a condensation phenomenon is generated when a gas phase working medium contacts a relatively cold area, the heat absorbed before condensation is released, the condensed cooling liquid returns to an evaporation heat source through a capillary channel of a microstructure (the driving force of the whole cycle is capillary force), and the process is repeatedly performed in the cavity.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1.U font fully surrounds capillary structure samming board, including copper upper plate (1), its characterized in that, the surface welding of copper upper plate (1) has copper hypoplastron (2), the medial surface of copper upper plate is equipped with U type groove (3), the medial surface fixedly connected with of copper hypoplastron (2) a plurality of support columns (5), be provided with steam channel (6) between two adjacent U type grooves (3) of a set or multiunit of medial surface of copper upper plate (1), the opening both sides terminal surface of U type groove (3) is equipped with microchannel (4).
2. The U-shaped full-surrounding capillary structure temperature equalizing plate according to claim 1, wherein the copper upper plate (1), the copper lower plate (2) and the side surfaces of the supporting columns (5) are all arranged in a surface roughening manner.
3. The U-shaped all-around capillary structure temperature equalizing plate according to claim 1, wherein the solder between the copper upper plate (1) and the copper lower plate (2) is solder paste.
4. The U-shaped all-around capillary structure temperature equalizing plate according to claim 1, wherein the support column (5) is located inside the U-shaped groove (3), and a gap exists between the U-shaped groove (3) and the support column (5).
5. The U-shaped all-around capillary structure temperature equalization plate according to claim 1, wherein the U-shaped groove (3) and the support column (5) are in linear or S-shaped curves along the length direction of the copper upper plate (1) or the copper lower plate (2), and the support column (5) and the U-shaped groove (3) correspond to each other.
6. The U-shaped all-around capillary structure temperature equalizing plate according to claim 1, wherein the outer surfaces of the U-shaped groove (3) and the support column (5) are provided with micro-nano structures, and the height of the micro-nano structures is two to thirty micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320497231.2U CN220454359U (en) | 2023-03-15 | 2023-03-15 | U-shaped full enclosure capillary structure temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320497231.2U CN220454359U (en) | 2023-03-15 | 2023-03-15 | U-shaped full enclosure capillary structure temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220454359U true CN220454359U (en) | 2024-02-06 |
Family
ID=89737870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320497231.2U Active CN220454359U (en) | 2023-03-15 | 2023-03-15 | U-shaped full enclosure capillary structure temperature equalizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220454359U (en) |
-
2023
- 2023-03-15 CN CN202320497231.2U patent/CN220454359U/en active Active
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