CN220446557U

CN220446557U - Stamping die for thicker wave-absorbing material

Info

Publication number: CN220446557U
Application number: CN202321453066.7U
Authority: CN
Inventors: 麦家辉; 梁书勇
Original assignee: Chuanyang Electronic Chongqing Co ltd
Current assignee: Chuanyang Electronic Chongqing Co ltd
Priority date: 2023-06-08
Filing date: 2023-06-08
Publication date: 2024-02-06
Anticipated expiration: 2033-06-08

Abstract

The utility model discloses a stamping die for thicker wave-absorbing materials, which comprises an upper die and a lower die matched with the upper die, wherein a first stamping knife, a second stamping knife, a third stamping knife and a fourth stamping knife are sequentially arranged on the lower surface of the upper die along the feeding direction, the first stamping knife and the second stamping knife are used for stamping two linear cuts on the wave-absorbing materials, the third stamping knife and the fourth stamping knife are used for stamping two broken line type cuts on the wave-absorbing materials, and the two linear cuts and the two broken line type cuts enclose a closed polygon consistent with the appearance of a product. The remarkable effects are as follows: the extrusion deformation of the thick wave-absorbing material during punching is effectively avoided, and the quality of the product obtained after punching is ensured.

Description

Stamping die for thicker wave-absorbing material

Technical Field

The utility model relates to the technical field of production and processing of electromagnetic shielding materials, in particular to a punching die for thicker wave-absorbing materials.

Background

Wave absorbing materials, which are materials that absorb or substantially attenuate electromagnetic wave energy incident upon their surfaces, thereby reducing electromagnetic wave interference. In engineering application, the wave absorbing material is required to have light weight, heat resistance, moisture resistance, corrosion resistance and the like besides high absorptivity of electromagnetic waves in a wider frequency band.

In the existing wave-absorbing material production, sheet materials are mostly adopted for punching, die cutting and production. However, when the die-cutting and stamping process is performed to produce the wave-absorbing material with a thicker thickness (the thickness is more than 0.5 mm), the wave-absorbing material is often deformed due to extrusion of the stamping die, so that the quality of the product obtained after stamping is not ensured, and even the product cannot be installed and used.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide a stamping die for thicker wave-absorbing materials, which can effectively avoid extrusion deformation of the thicker wave-absorbing materials during stamping by a stamping die cutting mode of segmented stamping and reintegration.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a punching die for thicker wave-absorbing materials is characterized in that: including last mould and with the lower mould of this last mould looks adaptation the lower surface of going up the mould has set gradually first punching cutter, second punching cutter, third punching cutter and fourth punching cutter along the direction of delivering material, first punching cutter is used for punching out two linear type incisions on the wave-absorbing material with the second punching cutter, third punching cutter is used for punching out two broken line type incisions on the wave-absorbing material with the fourth punching cutter, two linear type incision with two broken line type incisions enclose into with the consistent confined polygon of product appearance.

Further, a plurality of positioning holes are formed in the upper die, positioning columns with positions matched with the positioning holes are fixed on the lower die, and the upper ends of the positioning columns deeply extend into the positioning holes.

Further, the diameters of the positioning holes and the positioning columns are not smaller than 4mm, and the distance between the two positioning holes in the width direction of the upper die is not smaller than 38mm.

Further, the direction of the linear notch punched by the first punching cutter and the second punching cutter is perpendicular to the feeding direction of the wave-absorbing material.

Further, the length of the first punching cutter is smaller than that of the second punching cutter.

Further, the third punching cutter and the fourth punching cutter are consistent in structure and are arranged in a back direction.

Further, the polygon enclosed by the two linear cuts and the two broken line type cuts is in a convex shape.

The utility model has the remarkable effects that: the novel punching die has the advantages that the novel punching die is simple in structure and convenient to use, two linear cuts are punched on a wave-absorbing material through the first punching knife and the second punching knife, two broken line type cuts are punched on the wave-absorbing material through the third punching knife and the fourth punching knife, and the two linear cuts and the two broken line type cuts are integrated into a closed polygon consistent with the appearance of a product, so that extrusion deformation of the thick wave-absorbing material caused by thickness deviation during punching is effectively avoided, and the quality of the product obtained after punching is guaranteed.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the structure of the upper die;

fig. 3 is a schematic view of the structure of the lower die;

fig. 4 is a schematic structural view of the die-formed product of the present utility model.

Detailed Description

The following describes the embodiments and working principles of the present utility model in further detail with reference to the drawings.

As shown in fig. 1-3, a stamping die for thicker wave-absorbing materials comprises an upper die 1 and a lower die 2 matched with the upper die 1, wherein a first stamping knife 3, a second stamping knife 4, a third stamping knife 5 and a fourth stamping knife 6 are sequentially arranged on the lower surface of the upper die 1 along the feeding direction, the first stamping knife 3 and the second stamping knife 4 are used for stamping two linear cuts on the wave-absorbing materials, the directions of the linear cuts stamped by the first stamping knife 3 and the second stamping knife 4 are perpendicular to the feeding direction of the wave-absorbing materials, the third stamping knife 5 and the fourth stamping knife 6 are used for stamping two broken line type cuts on the wave-absorbing materials, and the two linear cuts and the two broken line type cuts enclose a closed polygon consistent with the appearance of the product.

Referring to fig. 1-3, a plurality of positioning holes 7 are formed in the upper die 1, a plurality of positioning columns 8 with positions corresponding to the positioning holes 7 are fixed on the lower die 2, and the upper ends of the positioning columns 8 extend into the positioning holes 7.

The cooperation of locating hole 7 and reference column 8 can enough realize the location sliding fit between upper mould 1 and the lower mould 2, can also set up the interval of two reference columns 8 in width direction to be consistent with the width of wave-absorbing material area to through the spacing effect of both sides reference column 8, thereby carry out quick location to wave-absorbing material area, thereby also can effectually prevent the material area off tracking under the condition of not addding deviation correcting device in addition, thereby can guarantee the machining precision of product, make the product can satisfy the electronic product demand of increasingly high requirement, moreover can reduce the material that consumes that brings because of unqualified product in the production process.

Further, the diameters of the positioning holes 7 and the positioning columns 8 are not smaller than 4mm, and the distance between the two positioning holes 7 in the width direction of the upper die 1 is not smaller than 38mm.

Preferably, the length of the first punching blade 3 is smaller than that of the second punching blade 4; the third punching cutter 5 and the fourth punching cutter 6 are identical in structure and are arranged in a back direction, and the third punching cutter 5 is taken as an example for explanation, and comprises a first cutter body 51 and a second cutter body 52 which are arranged along the feeding direction of the wave-absorbing material, the first cutter body 51 and the second cutter body 52 are connected with a third cutter body 53, and the first cutter body 51 and the third cutter body 53 and the second cutter body 52 and the third cutter body 53 are vertically connected.

In this embodiment, the polygon enclosed by the two linear cuts and the two fold-line cuts is in a convex shape, that is, the polygon enclosed by the first punching blade 3, the second punching blade 4, the third punching blade 5 and the fourth punching blade 6 is in a convex shape.

The punching mold of this embodiment punches two linear cuts on the wave-absorbing material through the first punching blade 3 and the second punching blade 4, simultaneously punches two fold line type cuts on the wave-absorbing material through the third punching blade 5 and the fourth punching blade 6, integrates the two linear cuts and the two fold line type cuts into a closed polygon consistent with the product appearance, and takes down the punched polygonal inner wave-absorbing material from the material belt to obtain the required product, as shown in fig. 4. The embodiment adopts a sectional punching and re-integration punching and die-cutting mode, thereby effectively avoiding the extrusion deformation of the thick wave-absorbing material during punching and ensuring the quality of the product obtained after punching.

The technical scheme provided by the utility model is described in detail. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.

Claims

1. A stamping die for thicker wave absorbing material, characterized in that: including last mould and with the lower mould of this last mould looks adaptation the lower surface of going up the mould has set gradually first die-cut sword, second die-cut sword, third die-cut sword and fourth die-cut sword along the direction of delivering material, first die-cut sword is used for punching two linear type incisions on the wave-absorbing material with the second die-cut sword, the orientation of the linear type incision that first die-cut sword and second die-cut sword were punched with the direction of delivering material of wave-absorbing material is mutually perpendicular, third die-cut sword is used for punching two broken line type incisions on the wave-absorbing material with fourth die-cut sword, two linear type incisions with two broken line type incisions enclose into with the consistent confined polygon of product appearance.

2. The stamping die for thicker wave absorbing material as defined in claim 1, wherein: the upper die is provided with a plurality of positioning holes, the lower die is fixedly provided with a plurality of positioning columns with positions corresponding to the positioning holes, and the upper ends of the positioning columns deeply extend into the positioning holes.

3. The stamping die for thicker wave absorbing material as defined in claim 2, wherein: the diameters of the positioning holes and the positioning columns are not smaller than 4mm, and the distance between the two positioning holes in the width direction of the upper die is not smaller than 38mm.

4. The stamping die for thicker wave absorbing material as defined in claim 1, wherein: the length of the first punching cutter is smaller than that of the second punching cutter.

5. The stamping die for thicker wave absorbing material as defined in claim 1, wherein: the third punching cutter and the fourth punching cutter are identical in structure and are arranged in a back direction.

6. The stamping die for thicker wave absorbing materials according to any one of claims 1-5, wherein: the polygon enclosed by the two linear cuts and the two fold line type cuts is in a convex shape.