CN220445414U - Invisible cutting equipment - Google Patents

Abstract

The utility model discloses a stealthy cutting equipment, which comprises: a cutter holder configured with a substrate; the cutting head is mounted on the substrate, the cutting head is provided with an optical path and comprises a lens barrel and an objective lens, and the objective lens is mounted on the lens barrel in a lifting manner; the height measurement probe is arranged on the substrate, the distance between the objective lens and the wafer is measured in real time by the height measurement probe, and the height measurement probe and the cutting head move together relative to the wafer along the cutting direction; the follow-up actuator is respectively connected with the lens cone and the objective lens, the follow-up actuator is in communication connection with the distance sensor, the follow-up actuator is installed on the substrate, and the follow-up actuator drives the objective lens to lift in real time. According to the invisible cutting equipment provided by the embodiment of the utility model, height measurement and cutting can be performed simultaneously, and the invisible cutting equipment has the advantages of high cutting precision, high working efficiency and the like.

Description

Invisible cutting equipment

Technical Field

The utility model relates to the field of chip processing, in particular to invisible cutting equipment.

Background

In the prior art, the invisible cutting device has low flatness of the surface of the wafer during the scanning process, so that the wafer surface undulation easily causes errors in the process of cutting the wafer by the cutting head. To reduce dicing errors, it is necessary to adjust the dicing head to the wafer's distance according to the wafer's surface. The cutting process comprises a height measurement process and a cutting process which are completed in two steps, the working efficiency is low, the height measurement process and the cutting process are separated, errors exist in a height measurement moving line and a cutting moving line, and the operation precision of invisible cutting equipment is affected.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a stealth cutting apparatus, which can measure height and cut simultaneously, and has advantages of high cutting precision, improved working efficiency, etc.

In order to achieve the above object, according to an embodiment of the present utility model, there is provided a variety of invisible cutting apparatus including: a cutter holder configured with a substrate; the cutting head is arranged on the substrate and comprises a lens cone and an objective lens, and the objective lens is arranged on the lens cone in a lifting manner; the height measurement probe is arranged on the substrate, the distance between the objective lens and the wafer is measured in real time by the height measurement probe, and the height measurement probe and the cutting head move together relative to the wafer along the cutting direction; the follow-up actuator is respectively connected with the lens cone and the objective lens, the follow-up actuator is in communication connection with the height measurement probe, the follow-up actuator is installed on the substrate, and the follow-up actuator drives the objective lens to lift in real time.

According to the invisible cutting equipment provided by the embodiment of the utility model, height measurement and cutting can be performed simultaneously, and the invisible cutting equipment has the advantages of high cutting precision, high working efficiency and the like.

According to some embodiments of the utility model, the base plate is configured with a probe mount toward the cutting direction, the altimeter probe being mounted to the probe mount.

According to some embodiments of the utility model, the probe holder comprises: the fixing frame is fixedly arranged on the cutting machine bracket; the fine tuning sliding table is movably arranged on the fixing frame, the height measuring probe is arranged on the fine tuning sliding table, and the fine tuning sliding table drives the height measuring probe to horizontally move along the direction perpendicular to the cutting direction.

Further, the fine tuning slide includes: the fixing plate is arranged on the fixing frame and is provided with a first sliding rail extending horizontally; the sliding plate is provided with a second sliding rail parallel to the first sliding rail, the sliding plate can slide relative to the fixed plate through the first sliding rail and the second sliding rail, and the height measurement probe is arranged on the sliding plate; the adjusting piece is arranged on the fixed plate and the sliding plate respectively, and the adjusting piece adjusts the relative positions of the sliding plate and the fixed plate.

Further, locking screws are connected to the upper edges of the fixed plate and the sliding plate, and the locking screws are suitable for locking the fixed plate and the sliding plate.

According to some embodiments of the utility model, the invisible cutting apparatus further comprises: the camera component is used for identifying the coordinates of the wafer, the camera component is fixed with the fixing frame, and the height measurement probe horizontally adjusts the position along the direction perpendicular to the cutting direction according to the coordinate point of the wafer identified by the camera component.

According to some specific embodiments of the utility model, the camera assembly comprises: the high-power camera component is mounted on the lens barrel, and the light path of the high-power camera component irradiates the wafer through the lens barrel to identify the coordinates of the wafer. And the low-power camera assembly is arranged on the fixing frame, and the low-power camera irradiates the wafer to identify the coordinates of the wafer.

Further, the low power camera includes: a low power camera bracket mounted on the fixing frame; the low-power camera body is mounted on the low-power camera support, and the low-power camera body and the height measurement probe are adjacent to each other.

According to some embodiments of the utility model, the follow-up actuator is sleeved on the lens barrel, the objective lens is connected to the bottom of the follow-up actuator, and the follow-up actuator drives the objective lens to lift relative to the lens barrel in real time.

According to some embodiments of the utility model, the bottom surface of the altimeter probe is between a highest point and a lowest point of the elevation of the bottom surface of the objective lens.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic view of the construction of a stealth cutting apparatus according to an embodiment of the present utility model;

FIG. 2 is a side view of a stealth cutting device according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a stealth cutting device according to an embodiment of the present utility model;

fig. 4 is a schematic structural view of a fine tuning slipway of the invisible cutting apparatus according to an embodiment of the present utility model.

Reference numerals:

invisible cutting apparatus 1, cutter holder 100, substrate 110, cutting head 200, lens barrel 210, objective lens 220, and method of manufacturing the same,

Height measurement probe 300, follow-up actuator 400, probe holder 111, holder 112,

Fine tuning sliding table 113, fixed plate 114, sliding plate 115, adjusting piece 116, locking screw 117,

A camera assembly 500, a high power camera assembly 510, a low power camera assembly 520, a low power camera mount 521,

A low power camera body 522.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and to simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the description of the utility model, a "first feature" or "second feature" may include one or more of such features.

In the description of the present utility model, "plurality" means two or more.

The invisible cutting apparatus 1 according to an embodiment of the present utility model is described below with reference to the accompanying drawings.

As shown in fig. 1-4, a stealth cutting apparatus 1 according to an embodiment of the present utility model includes a cutter carriage 100, a cutting head 200, a height measurement probe 300, and a follow-up actuator 400.

The cutter frame 100 is configured with a base plate 110. The cutting head 200 is mounted on the substrate 110, the cutting head 200 is formed with an optical path and includes a lens barrel 210 and an objective lens 220, and the objective lens 220 is liftably mounted on the lens barrel 210. The height measurement probe 300 is mounted on the substrate 110, and the height measurement probe 300 measures the distance between the objective lens 220 and the wafer in real time, and the height measurement probe 300 and the dicing head 200 move together with respect to the wafer in the dicing direction. The follow-up actuator 400 is respectively connected to the lens barrel 210 and the objective 220, the follow-up actuator 400 is in communication connection with the altimeter probe 300, the follow-up actuator 400 is mounted on the substrate 110, and the follow-up actuator 400 drives the objective 220 to lift in real time.

Firstly, introducing the principle of invisible cutting, namely, the invisible cutting is a cutting technology of gathering laser beams in the wafer material of a workpiece to form a starting point laser-induced perforation for cutting, and then applying stress to the wafer to cut the wafer into small chips. For example, in the process of dicing a wafer, the stealth dicing machine 1 has a certain roughness, the surface is not very smooth, the undulation of the wafer surface may cause errors in laser dicing, the error of the dicing head 200 is nano-scale, and thus the height measurement probe 300 is required to measure the distance between the objective lens 220 and the wafer. In order to measure the distance, it is first necessary to set the reference positions of the cutting head 200 and the altimeter probe 300 in the height direction, and the bottom surface of the altimeter probe 300 and the bottom surface of the objective lens 220 are substantially at the same level. The height measurement probe 300 is positioned in front of the cutting head 200, and the cutting head 200 and the height measurement probe 300 move together in the cutting direction when the cutting head 200 performs laser cutting. The height measurement probe 300 transmits test data to the cutting head 200 while the front side detects the distance from the wafer, and the cutting head 200 is controlled to be lifted by the follow-up actuator 400 according to the distance data detected by the height measurement probe 300. That is, when there is a protrusion or depression at the wafer, the height of the cutting head 200 is adjusted in real time by the height recognized by the height measuring probe 300, thereby ensuring the cutting accuracy in the thickness direction of the wafer.

According to the invisible cutting apparatus 1 of the embodiment of the present utility model, by mounting the cutting head 200 and the height measurement probe 300 on the substrate 110, the height measurement probe 300 detects the distance between the height measurement probe 300 and the wafer, and since the reference positions of the height measurement probe 300 and the objective lens 220 are preset, the distance detected by the height measurement probe 300 can be synchronized to the distance between the objective lens 220 and the wafer. The height measurement probe 300 detects a distance at a front side in a cutting direction and the cutting head 200 cuts at a rear side, when the wafer surface is fluctuated, the distance detected by the height measurement probe 300 is also changed, the height measurement probe 300 transmits distance values at various times to the follow-up actuator 400, and the follow-up actuator 400 lifts the objective lens 220 according to the measured distances at various positions in the cutting direction, so that the focus of the laser cutting head 200 is maintained at the same position in the thickness direction of the wafer, and errors of a height measurement moving line can be eliminated. The height measurement probe 300 detects the distance from the wafer and simultaneously the cutting head 200 cuts synchronously, so that the two works of height measurement and cutting are completed at one time, the production efficiency is improved, errors caused by separation of the height measurement process and the cutting process are avoided, and the precision of laser cutting is improved.

Therefore, according to the invisible cutting device 1 provided by the embodiment of the utility model, height measurement and cutting can be performed simultaneously, and the invisible cutting device has the advantages of high cutting precision, improved working efficiency and the like.

In some embodiments of the present utility model, as shown in fig. 1, a probe holder 111 is configured to face a cutting direction of a substrate 110, and a height measurement probe 300 is mounted to the probe holder 111.

For example, the probe support 111 and the substrate 110 may collectively surround the cutting head 200, with the cutting head 200 and the altimeter probe 300 being located on either side of the probe support 111. The arrangement of the altimeter probe 300 and the cutting head 200 is more compact, and by mounting the altimeter probe 300 to the probe holder 111, the probe holder 111 has higher rigidity, improving the stability of the probe holder 111.

In some embodiments of the present utility model, as shown in FIG. 1, the probe holder 111 includes a fixed mount 112 and a fine tuning slide 113.

The mount 112 is fixedly mounted to the cutter frame 100. The fine tuning sliding table 113 is movably installed on the fixing frame 112, the height measurement probe 300 is installed on the fine tuning sliding table 113, and the fine tuning sliding table 113 drives the height measurement probe 300 to horizontally move along the direction perpendicular to the cutting direction.

It will be appreciated that the altimeter probe 300 and the objective lens 220 need to be maintained in the direction of the extent of the dicing tunnel, and thus the adjustment position in the width direction of the dicing tunnel is required. Specifically, the height measurement probe 300 and the cutting head 200 are located at the midpoint position in the width direction of the cutting path, and the midpoint position can be obtained by detecting the highest point and the lowest point on both sides of the cutting path, that is, the positions to which the height measurement probe 300 and the cutting head 200 need to be adjusted. By constructing the fine tuning sliding table 113, the height measuring probe 300 and the cutting head 200 can be kept at the midpoint position of the cutting path and the extending line of the cutting path, the position of the fine tuning sliding table 113 can be adjusted in advance before working, and the position can be adjusted in real time in the moving process, so that the accuracy of measuring the height of the width direction of the cutting path and the accuracy of the cutting position of the cutting head 200 are ensured.

Further, as shown in fig. 4, the fine adjustment slide table 113 includes a fixed plate 114, a slide plate 115, and an adjustment piece 116. The fixing plate 114 is mounted on the fixing frame 112, and the fixing plate 114 is provided with a first sliding rail extending along the horizontal direction. The sliding plate 115 is provided with a second sliding rail parallel to the first sliding rail, the sliding plate 115 is slidable relative to the fixed plate 114 through the first sliding rail and the second sliding rail, and the height measurement probe 300 is mounted on the sliding plate 115. The adjusting member 116 is mounted to the fixed plate 114 and the sliding plate 115, respectively, and the adjusting member 116 adjusts the relative positions of the sliding plate 115 and the fixed plate 114.

For example, the first sliding rail and the second sliding rail are two, the two first sliding rails are arranged in parallel on the upper side and the lower side, and the second sliding rail is arranged corresponding to the first sliding rail on the upper side and the lower side respectively. The fine adjustment sliding table 113 manually adjusts the position of the altimeter probe 300 before working through the adjusting piece 116, or the adjusting piece 116 can also be an electric adjusting piece, and the position of the altimeter probe 300 can be adjusted in real time in the cutting and ranging process. The fixed plate 114 and the sliding plate 115 are rectangular, and a larger connecting plate can be connected to one side of the sliding plate 115, which is opposite to the fixed plate 114, so that the connecting area of the height measuring probe 300 is larger, and the height measuring probe 300 is more stable.

Further, as shown in fig. 4, locking screws 117 are coupled to upper edges of the fixed plate 114 and the sliding plate 115, and the locking screws 117 are adapted to lock the fixed plate 114 and the sliding plate 115. The locking screw 117 passes through the top of the fixed plate 114 and is adapted to stop against the top of the sliding plate 115, locking the fixed plate 114 and the sliding plate 115 after the position is adjusted so that the fixed plate 114 and the sliding plate 115 are not moved any more, and the altimeter probe 300 remains fixed.

In some embodiments of the present utility model, as shown in fig. 1, the invisible cutting apparatus 1 further comprises a camera assembly 500. The camera assembly 500 is used for recognizing coordinates of the wafer, the camera assembly 500 is fixed to the fixing frame 111, and the height measurement probe 300 horizontally adjusts a position along a direction perpendicular to the dicing direction according to the coordinate point of the wafer recognized by the camera assembly 500.

For example, the camera assembly 500 may be mounted on the lens barrel 210 to irradiate a wafer from an optical path inside the lens barrel 210, or may be mounted on the substrate 110 or the holder 112 to directly irradiate the wafer. The camera assembly 500 photographs the wafer to obtain the coordinates of the marks of the wafer, and positions the dicing head 200 and the coordinates of the wafer. The relative positions of the wafer and the cutting head 200 during the cutting process of the cutting head 200 are adjusted in real time according to the positioning coordinates of the camera assembly 500.

In some embodiments of the present utility model, as shown in fig. 1 and 3, the camera assembly 500 includes a high power camera assembly 510 and a low power camera assembly 520. The high power camera assembly 510 is mounted on the lens barrel 210, and the optical path of the high power camera assembly 510 irradiates the wafer through the lens barrel 210 to identify the coordinates of the wafer. The low power camera assembly 520 is mounted to the mount 112 and the low power camera irradiates the wafer to identify the coordinates of the wafer.

The high-power camera assembly 510 and the low-power camera assembly 520 respectively perform coarse positioning and precise positioning on the wafer and the altimeter probe 300, specifically, the origin of the cutting head 200 is used, the coordinates of the wafer are adjusted to correspond to the cutting head 200, so as to achieve the positioning function, for example, after the high-power camera assembly 510 is used for positioning, the low-power camera assembly 520 can respectively perform irradiation recheck positioning on the wafer, and the relative positions of the wafer and the cutting head 200 in the cutting process are adjusted in real time according to the positioning data of the high-power camera and the low-power camera.

Further, as shown in fig. 3, the low power camera includes a low power camera mount 521 and a low power camera body 522. The low power camera mount 521 is mounted to the mount 112. The low power camera body 522 is mounted to the low power camera mount 521, and the low power camera body 522 and the altimeter probe 300 are adjacent to each other. The low power camera is mounted on the fixed frame 112 and is on the same side of the fixed frame 112 as the fine tuning slide 113.

In some embodiments of the present utility model, as shown in fig. 3, a follower actuator 400 is sleeved on the lens barrel 210, the objective lens 220 is connected to the bottom of the follower actuator 400, and the follower actuator 400 drives the objective lens 220 to lift and lower relative to the lens barrel 210 in real time.

The follow-up actuator 400 and the cutting head 200 are integrated into a whole structure, so that the cutting head 200 and the follow-up actuator 400 form modularization, and the follow-up actuator 400 adjusts the lifting of the objective lens 220 so as to enable the cutting focus to move up and down, and adapt to the concave and convex surfaces of the wafer.

In some embodiments of the present utility model, as shown in FIG. 2, the bottom surface of altimeter probe 300 is between the highest and lowest points of elevation of the bottom surface of objective lens 220. Specifically, the reference distance between the height measurement probe 300 and the wafer is determined according to the distance between the height measurement probe 300 and the wafer surface, the bottom surface of the objective lens 220 and the bottom surface of the height measurement probe 300 are kept at the same horizontal plane, when the distance between the height measurement probe 300 and the wafer surface changes, real-time distance data are sent to the follow-up actuator 400, the follow-up actuator 400 controls the objective lens 220 to lift according to the test data of the height measurement probe 300, the height of the objective lens 220 is always the same as the height of the height measurement probe 300, and the accuracy of the cutting position of the cutting head 200 in the thickness direction of the wafer is ensured.

Other constructions and operations of the invisible cutting device 1 according to the embodiments of the present utility model are known to those skilled in the art and will not be described in detail herein.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A stealth cutting apparatus, comprising:

a cutter holder configured with a substrate;

the cutting head is arranged on the substrate and comprises a lens cone and an objective lens, and the objective lens is arranged on the lens cone in a lifting manner;

the height measurement probe is arranged on the substrate, the distance between the objective lens and the wafer is measured in real time by the height measurement probe, and the height measurement probe and the cutting head move together relative to the wafer along the cutting direction;

the follow-up actuator is respectively connected with the lens cone and the objective lens, the follow-up actuator is in communication connection with the height measurement probe, the follow-up actuator is installed on the substrate, and the follow-up actuator drives the objective lens to lift in real time.

2. The stealth cutting apparatus of claim 1, wherein the substrate is configured with a probe mount toward a cutting direction, the height measurement probe being mounted to the probe mount.

3. The stealth cutting apparatus of claim 2, wherein the probe-holder comprises:

the fixing frame is fixedly arranged on the cutting machine bracket;

the fine tuning sliding table is movably arranged on the fixing frame, the height measuring probe is arranged on the fine tuning sliding table, and the fine tuning sliding table drives the height measuring probe to horizontally move along the direction perpendicular to the cutting direction.

4. A stealth cutting apparatus according to claim 3, wherein the fine tuning slip comprises:

the fixing plate is arranged on the fixing frame and is provided with a first sliding rail extending horizontally;

the sliding plate is provided with a second sliding rail parallel to the first sliding rail, the sliding plate can slide relative to the fixed plate through the first sliding rail and the second sliding rail, and the height measurement probe is arranged on the sliding plate;

the adjusting piece is arranged on the fixed plate and the sliding plate respectively, and the adjusting piece adjusts the relative positions of the sliding plate and the fixed plate.

5. The invisible cutting apparatus according to claim 4, wherein locking screws are connected to upper edges of the fixed plate and the sliding plate, the locking screws being adapted to lock the fixed plate and the sliding plate.

6. The invisible cutting apparatus according to claim 3, further comprising:

the camera component is used for identifying the coordinates of the wafer, the camera component is fixed with the fixing frame, and the height measurement probe horizontally adjusts the position along the direction perpendicular to the cutting direction according to the coordinate point of the wafer identified by the camera component.

7. The invisible cutting apparatus according to claim 6, wherein the camera assembly comprises:

the high-power camera component is mounted on the lens barrel, and an optical path of the high-power camera component irradiates a wafer through the lens barrel to identify coordinates of the wafer;

and the low-power camera assembly is arranged on the fixing frame, and the low-power camera irradiates the wafer to identify the coordinates of the wafer.

8. The invisible cutting apparatus according to claim 7, wherein the low power camera comprises:

a low power camera bracket mounted on the fixing frame;

the low-power camera body is mounted on the low-power camera support, and the low-power camera body and the height measurement probe are adjacent to each other.

9. The invisible cutting apparatus according to claim 1, wherein the follow-up actuator is sleeved on the lens barrel, the objective lens is connected to the bottom of the follow-up actuator, and the follow-up actuator drives the objective lens to lift and lower relative to the lens barrel in real time.

10. The stealth cutting apparatus of claim 9, wherein the bottom surface of the altimeter probe is between a highest point and a lowest point of the elevation of the bottom surface of the objective lens.