CN220439415U - Chip ceramic capacitor assembly - Google Patents
Chip ceramic capacitor assembly Download PDFInfo
- Publication number
- CN220439415U CN220439415U CN202321925502.6U CN202321925502U CN220439415U CN 220439415 U CN220439415 U CN 220439415U CN 202321925502 U CN202321925502 U CN 202321925502U CN 220439415 U CN220439415 U CN 220439415U
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- China
- Prior art keywords
- chip ceramic
- shell
- clamping
- ceramic capacitor
- capacitor assembly
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 abstract description 18
- 238000009434 installation Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model relates to the technical field of chip ceramic capacitors and discloses a chip ceramic capacitor assembly which comprises a shell, wherein sealing covers are arranged on two sides of the shell, a placement cavity is formed in the shell, a first chip ceramic core capacitor body is arranged in the placement cavity, a second clamping groove is formed in the inner wall of the placement cavity, and a first clamping groove is formed in the end wall of the outer side of the shell. The inner sides of the sealing covers on the two sides of the shell are provided with extrusion blocks, the extrusion blocks are internally provided with embedded cavities for embedding pins, after the corresponding pins are embedded into the embedded cavities, the installation positions of the corresponding pins are adjusted according to the positions of the limiting grooves, then the sealing covers and the clamping parts II on the extrusion blocks are clamped with the clamping grooves I and the clamping grooves II on the corresponding shell through the clamping parts I and the clamping parts II, so that the sealing covers are clamped with the shell, at the moment, the pins are in extrusion contact with the corresponding chip ceramic core capacitor body to form a complete circuit, and the chip ceramic capacitor assembly can be rapidly disassembled and assembled, and violent disassembly is avoided.
Description
Technical Field
The utility model relates to the technical field of chip ceramic capacitors, in particular to a chip ceramic capacitor component.
Background
Ceramic capacitors are produced by spraying silver layers on both sides of a ceramic substrate using ceramic as a dielectric, and then firing a silver thin film at low temperature as a plate, and have various shapes such as a tube shape, a circular shape, and the like.
However, after using the capacitor, since it does not possess the function of dismantling fast, so when dismantling the capacitor, most adopt destructive dismantlement mode, can lead to the unable continuous assembly of capacitor after dismantling to use from this, simultaneously when the capacitor is dismantled, owing to do not possess the function to the inner core centre gripping, and then when dismantling the inner core, can't change the processing fast to the inner core. Accordingly, a chip ceramic capacitor assembly is provided by those skilled in the art to solve the problems set forth in the background art described above.
Disclosure of Invention
(one) solving the technical problems
In view of the shortcomings of the prior art, the present utility model provides a chip ceramic capacitor assembly to solve the problems set forth in the background art.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chip ceramic capacitor subassembly, includes the shell, the shell both sides are provided with the closing cap, set up the chamber in the shell, it is provided with chip ceramic core electric capacity body one to settle the intracavity, set up joint groove two on the intracavity wall, set up joint groove one on the shell outside end wall, joint groove one-to-one is provided with the spacing groove, closing cap one side is installed joint spare one, two be provided with the extrusion piece between the joint spare one, joint spare two are installed to extrusion piece week side, the embedded chamber has been seted up on the extrusion piece.
Preferably, the chip ceramic core capacitors are provided with the chip ceramic core capacitors II on one side, and solder paste is arranged between the chip ceramic core capacitors I and the chip ceramic core capacitors II, so that a large amount of labor cost can be saved, and the production efficiency is improved.
Preferably, the first clamping piece is clamped with the first clamping groove, the second clamping piece is clamped with the second clamping groove, and the chip ceramic capacitor assembly can be quickly disassembled and assembled, so that violent disassembly is avoided.
Preferably, the embedded intracavity is provided with the pin, the upper portion and the spacing groove joint of pin, the pin lower part is provided with V-arrangement joint portion, and the pin is installed with the mounting groove on the circuit board can use the mode of joint, avoids traditional welding to take off the welding easily and the problem of difficult dismantlement.
Preferably, the shell and the sealing cover are made of epoxy resin.
(III) beneficial effects
Compared with the prior art, the utility model provides a chip ceramic capacitor component, which has the following beneficial effects:
through the design, the closing cap inboard of shell both sides is provided with the extrusion piece, and has seted up the embedded chamber of inlaying the pin in the extrusion piece, after with the embedded chamber of the pin that will correspond, the mounted position of corresponding pin is adjusted according to the position of spacing groove, carry out the joint through closing cap, joint spare on the extrusion piece, joint spare two and the joint groove on the corresponding shell first, joint groove second afterwards, make closing cap and shell carry out the joint, at this moment, the pin carries out extrusion contact with the piece formula ceramic core electric capacity body that corresponds, form complete circuit, and this piece formula ceramic capacitor assembly can carry out quick assembly disassembly, violent dismantlement has been avoided.
Drawings
Fig. 1 is a schematic perspective view of a chip ceramic capacitor assembly according to an embodiment of the present application.
Fig. 2 is a structural exploded view of a chip ceramic capacitor assembly provided in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of solder paste in a chip ceramic capacitor assembly according to an embodiment of the present application.
In the figure: 1. a housing; 101. a placement cavity; 102. the clamping groove I; 103. a clamping groove II; 104. a limit groove; 2. a cover; 201. the clamping piece I; 202. extruding a block; 203. the clamping piece II; 204. an embedded cavity; 3. pins; 301. a V-shaped clamping part; 5. a first chip ceramic core capacitor body; 6. a second chip ceramic core capacitor body; 7. and (5) solder paste.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides a technical scheme, please refer to fig. 1 and 2, a chip ceramic capacitor assembly, which comprises a shell 1, wherein sealing covers 2 are arranged on two sides of the shell 1, the shell 1 and the sealing covers 2 are both made of epoxy resin, a placement cavity 101 is formed in the shell 1, a chip ceramic core capacitor body I5 is arranged in the placement cavity 101, a clamping groove II 103 is formed in the inner wall of the placement cavity 101, a clamping groove I102 is formed in the end wall of the outer side of the shell 1, a limit groove 104 is formed in one side of the clamping groove I102, a clamping piece I201 is arranged on one side of the sealing cover 2, an extrusion block 202 is arranged between the two clamping pieces I201, a clamping piece II 203 is arranged on the periphery of the extrusion block 202, and an embedded cavity 204 is formed in the extrusion block 202;
referring to fig. 2 and 3, a first chip ceramic core capacitor body 5 is provided with a second chip ceramic core capacitor body 6 on one side, a solder paste 7 is disposed between the first chip ceramic core capacitor body 5 and the second chip ceramic core capacitor body 6, so that a lot of labor costs can be saved, the production efficiency is improved, a first clamping member 201 is clamped with a first clamping groove 102, a second clamping member 203 is clamped with a second clamping groove 103, the chip ceramic capacitor assembly can be rapidly disassembled and assembled, violent disassembly is avoided, a pin 3 is disposed in the embedded cavity 204, the upper portion of the pin 3 is clamped with a limiting groove 104, a V-shaped clamping portion 301 is disposed at the lower portion of the pin 3, and the pin 3 can be installed in a clamping manner with an installation groove on a circuit board, so that the problems of easy disassembly and poor disassembly in traditional welding are avoided.
The working principle of the device is as follows: the chip ceramic capacitor component consists of a shell 1, a sealing cover 2, a chip ceramic core capacitor body and pins 3, wherein the shell 1 and the sealing cover 2 are made of epoxy resin;
the first chip ceramic core capacitor body 5 and the second chip ceramic core capacitor body 6 are arranged in the arranging cavity 101 of the shell 1, and the first chip ceramic core capacitor body 5 and the second chip ceramic core capacitor body 6 are welded and fixed by the solder paste 7, so that a large amount of labor cost can be saved, and the production efficiency is improved;
an extrusion block 202 is arranged on the inner sides of the sealing cover 2 on two sides of the shell 1, an embedded cavity 204 for embedding the pins 3 is formed in the extrusion block 202, after the corresponding pins 3 are embedded in the embedded cavity 204, the installation positions of the corresponding pins 3 are adjusted according to the positions of the limiting grooves 104, then the sealing cover 2 and the clamping part I201 and the clamping part II 203 on the extrusion block 202 are clamped with the clamping groove I102 and the clamping groove II 103 on the corresponding shell 1, so that the sealing cover 2 is clamped with the shell 1, and at the moment, the pins 3 are in extrusion contact with the corresponding chip ceramic core capacitors to form a complete circuit;
and the lower part of pin 3 all adopts V-arrangement joint portion 301 for pin 3 can use the mode of joint to install with the mounting groove on the circuit board, avoids traditional welding to take off the problem of welding easily, and this piece formula ceramic capacitor subassembly can carry out quick assembly disassembly, has avoided violently dismantling.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
In this document, unless specifically stated and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A chip ceramic capacitor assembly comprising a housing (1), characterized in that: the novel ceramic capacitor is characterized in that sealing covers (2) are arranged on two sides of the shell (1), a placement cavity (101) is formed in the shell (1), a first chip ceramic capacitor body (5) is arranged in the placement cavity (101), a second clamping groove (103) is formed in the inner wall of the placement cavity (101), a first clamping groove (102) is formed in the outer side end wall of the shell (1), a limiting groove (104) is formed in one side of the first clamping groove (102), a first clamping piece (201) is arranged on one side of the sealing cover (2), a second clamping piece (203) is arranged on the periphery of the first clamping piece (201), and an embedded cavity (204) is formed in the second clamping piece (202).
2. A chip ceramic capacitor assembly according to claim 1, wherein: and a second chip ceramic core capacitor body (6) is arranged on one side of the first chip ceramic core capacitor body (5).
3. A chip ceramic capacitor assembly according to claim 2, wherein: and solder paste (7) is arranged between the first chip ceramic core capacitor (5) and the second chip ceramic core capacitor (6).
4. A chip ceramic capacitor assembly according to claim 1, wherein: the first clamping piece (201) is clamped with the first clamping groove (102), and the second clamping piece (203) is clamped with the second clamping groove (103).
5. A chip ceramic capacitor assembly according to claim 1, wherein: the embedded cavity (204) is internally provided with a pin (3), the upper part of the pin (3) is clamped with the limiting groove (104), and the lower part of the pin (3) is provided with a V-shaped clamping part (301).
6. A chip ceramic capacitor assembly according to claim 1, wherein: the shell (1) and the sealing cover (2) are made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321925502.6U CN220439415U (en) | 2023-07-20 | 2023-07-20 | Chip ceramic capacitor assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321925502.6U CN220439415U (en) | 2023-07-20 | 2023-07-20 | Chip ceramic capacitor assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220439415U true CN220439415U (en) | 2024-02-02 |
Family
ID=89703448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321925502.6U Active CN220439415U (en) | 2023-07-20 | 2023-07-20 | Chip ceramic capacitor assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220439415U (en) |
-
2023
- 2023-07-20 CN CN202321925502.6U patent/CN220439415U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |