CN220430906U - Packaging structure - Google Patents

Abstract

The application discloses a packaging structure, which comprises a substrate, wherein the substrate comprises a first surface, a second surface and a first side surface, and the first side surface is positioned between the first surface and the second surface; the substrate is provided with a concave part, a plurality of first buffer grooves are formed at intervals on the edge of the first surface, and a plurality of second buffer grooves are formed at intervals on the edge of the second surface; at least two first buffer grooves are arranged adjacent to the first side surface, and the first surface is provided with a first support rib extending towards the first side surface, a firstThe support rib is positioned between the two first buffer grooves; at least two second buffer grooves are arranged adjacent to the first side surface, and the second surface is provided with second support ribs extending towards the first side surface, and the second support ribs are positioned between the two second buffer grooves; wherein, in the direction from the first surface to the second surface, the first support rib and the second support rib are staggered _。 The packaging structure can improve the anti-falling and anti-vibration performance of the electrical product in the transportation and carrying processes.

Description

Packaging structure

Technical Field

The present application relates to a packaging structure.

Background

At present, in order to ensure the performance of electric products such as water storage type electric water heaters, electric rice cookers and the like when the electric products are transported in logistics, the products are assembled into a foam packaging structure and packaged, and the products are required to be subjected to reliability test such as falling, treading, vibration and the like.

In the related art, the packaging structure is only designed into a simple cover body to bear the electrical products, and the design in detail is insufficient, so that the practical stress situation is not fully considered, and the anti-falling and vibration testing performances of the packaging structure are still to be improved.

Disclosure of Invention

The embodiment of the application provides a packaging structure, which can improve the anti-falling and anti-vibration performance of an electric product in the transportation and carrying processes.

The packaging structure is used for packaging electric products and comprises a substrate, wherein the substrate comprises a first surface, a second surface and a first side surface, the first surface and the second surface are arranged opposite to each other, and the first side surface is located between the first surface and the second surface;

the substrate is provided with a concave part which is recessed in the direction from the first surface to the second surface, the concave part is used for embedding a power supply product, a plurality of first buffer grooves are formed in the edge of the first surface at intervals, the first buffer grooves are positioned at the outer side of the concave part, a plurality of second buffer grooves are formed in the edge of the second surface at intervals, and the second buffer grooves are positioned at the outer side of the concave part;

at least two first buffer grooves are arranged adjacent to the first side surface, and the first surface is formed with first support ribs extending towards the first side surface, and the first support ribs are positioned between the two first buffer grooves; at least two of the second buffer grooves are arranged adjacent to the first side surface, and the second surface is formed with second support ribs extending towards the first side surface, and the second support ribs are positioned between the two second buffer grooves;

wherein, in the direction from the first surface to the second surface, the first support rib and the second support rib are staggered.

In some embodiments, the substrate further comprises two second sides connected between the first surface and the second surface, the two second sides being connected at two ends of the first side, respectively;

the first buffer groove comprises at least two first sub grooves and at least one second sub groove, the at least two first sub grooves are distributed at intervals along the extending direction of the first side face, the second sub grooves are arranged adjacent to the second side face, buffer ribs are formed between the first sub grooves and the second sub grooves, which are close to the corners between the first side face and the second side face, and the buffer ribs extend from the concave parts towards the corners between the first side face and the second side face.

In some embodiments, the second buffer slot includes at least two third sub slots and at least one fourth sub slot, the at least two third sub slots being spaced apart along the extension direction of the first side;

the fourth sub-groove is close to the corner formed by the first side face and the second side face, and the projection of the buffer rib in the direction from the first surface to the second surface is located in the area range of the fourth sub-groove.

In some embodiments, the substrate further comprises two third sides connected between the first surface and the second surface, and two ends of the third sides are respectively connected with two ends of the second sides away from the first sides;

wherein the first buffer slot further includes a first corner slot adjacent to a corner position formed by the third side and the second side, and the second buffer slot further includes a second corner slot adjacent to a corner position formed by the third side and the second side.

In some embodiments, the first corner groove and the second corner groove have different opening areas, and the first corner groove and the second corner groove at least partially overlap in a direction from the first surface to the second surface.

In some embodiments, the width of each of the first support rib, the second support rib, and the cushioning rib is no less than 15 millimeters

In some embodiments, the concave portion is a receiving groove formed by recessing the first surface, the second surface is further formed with a subtracting groove in a recessing mode, the subtracting groove is opposite to the receiving groove, and the plurality of second buffering grooves are located outside the subtracting groove.

In some embodiments, a distance between a bottom wall of the subtracting tank and a bottom wall of the accommodating tank in a direction from the first surface to the second surface is not less than 20 mm.

In some embodiments, the first surface and the second surface are spaced apart by no less than 70 millimeters;

in some embodiments, the first buffer slot has a depth greater than a depth of the second buffer slot, the first buffer slot has a depth less than 30 millimeters, and the first buffer slot has a depth less than 20 millimeters;

and/or the distance between the groove bottom wall of the first buffer groove and the groove bottom wall of the second buffer groove in the direction from the first surface to the second surface is not less than 20 mm.

According to the packaging structure, the first buffer grooves and the second buffer grooves are formed in the edge positions of the two surfaces of the substrate in a recessed mode, the first support ribs are formed between the two first buffer grooves adjacent to the first side face, the second support ribs are formed between the two second buffer grooves adjacent to the first side face, and the first support ribs and the second support ribs are staggered in the direction from the first surface to the second surface, so that a plurality of support points for effectively supporting the whole packaging structure can be formed in the extending direction of the first side face, and when the electric product protected by the packaging structure is placed on the lower surface of the first side face, in the transportation and carrying process, even if a falling condition occurs, the impact force transmitted from the first side face can be uniformly conducted and dissipated to the inside of the packaging structure through the first support ribs and the second support ribs, and the packaging structure is not easy to be damaged due to stress concentration in the falling and collision processes, and the electric product can be effectively protected.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from the structures shown in these drawings without inventive effort to a person of ordinary skill in the art.

FIG. 1 is a schematic perspective view of an embodiment of a package structure of the present application;

FIG. 2 is a schematic elevational view of the packaging structure shown in FIG. 1;

FIG. 3 is a schematic view of the back side structure of the package structure shown in FIG. 1;

fig. 4 is a schematic cross-sectional structure of the package structure shown in fig. 1.

Reference numerals illustrate:

100. a base; 110. a first surface; 111. a first buffer tank; 112. a first subslot; 113. a second subslot; 114. a first corner groove; 115. a concave portion; 116. a first support rib; 117. a buffer rib; 120. a second surface; 121. a second buffer tank; 122. a third sub-slot; 123. a fourth sub-slot; 124. a second corner groove; 125. a material reduction groove; 126. a second support rib; 130. a first side; 140. a second side; 150. and a third side.

The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some of the aspects of the present application as detailed in the accompanying claims.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context. Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In many electrical products, such as water storage electric water heater, electric cooker, etc., a packaging structure is usually provided when leaving the factory, and in related art, the packaging structure includes an outer packaging structure and an inner packaging structure, the inner packaging structure directly contacts with the electrical products, and the outer packaging structure is sleeved outside the inner packaging structure to form a finished selling unit. The outer packing structure has the forms of a paper box, a wooden box, a metal box and the like, and the inner packing structure is generally made of a certain elastic material, such as foam material, for buffering and protecting the electrical products. Of course, in some cases, it may be in the form of a separate inner packaging structure.

The application provides a packaging structure, mainly improves to interior packaging structure, promotes anti-falling, the vibration resistance of electrical products in transportation, handling.

Referring to fig. 1 and 2, in the embodiment of the present application, the packaging structure includes a base 100, and the base 100 may be a cubic structure, and in the solution exemplarily shown in the drawings, the base 100 is generally in the form of a flat cuboid. The substrate 100 includes a first surface 110, a second surface 120, and a first side 130, where the first surface 110 is opposite to the second surface 120, and the first side 130 is located between the first surface 110 and the second surface 120. The first surface 110 and the second surface 120 are two end surfaces of the rectangular parallelepiped form of the substrate 100 in the thickness direction, that is, two surfaces with a larger area on the substrate 100.

The substrate 100 may be made of foam, for example, polystyrene foam, and the substrate 100 is formed with a recess 115 recessed in a direction from the first surface 110 to the second surface 120 for embedding the power supply product during molding, and the first surface 110 is further formed with a plurality of first buffer grooves 111, and the plurality of first buffer grooves 111 are spaced along an edge of the first surface 110 and are located outside the recess 115. The edge of the second surface 120 is concavely formed with a plurality of second buffer grooves 121 arranged at intervals, and the projection of the second buffer grooves 121 on the first surface 110 falls outside the concave portion 115. Taking the case that the packaging structure is applied to the Chu Shuishi electric water heater as an example, the body of the water storage type electric water heater is generally of a long structure, such as a cylinder shape, the two packaging structures can be respectively fixed at two ends of the water storage type electric water heater, namely, the concave part 115 can be in the form of a containing groove with a groove bottom wall, the opening shape of the containing groove is adapted to the outline shape of the water storage type electric water heater, the end part of the water storage type electric water heater is embedded into the containing groove, and the two packaging structures support and protect the two ends of the water storage type electric water heater. It can be appreciated that in some forms, the water storage type electric water heater can be installed by three packaging structures, wherein one packaging structure is fixed at the middle position of the water storage type electric water heater, the concave part 115 in the packaging structure at the middle position can be replaced by a through hole, the through hole penetrates through the first surface 110 and the second surface 120 at the same time, and the water storage type electric water heater can be more comprehensively buffer protected by the arrangement mode of the three packaging structures.

At least two first buffer grooves 111 are disposed adjacent to the first side 130, and the plurality of first buffer grooves 111 adjacent to the first side 130 are arranged at intervals along the extending direction of the first side 130 on the first surface 110, further, the first surface 110 is further formed with first support ribs 116, the first support ribs 116 extend from the edge of the recess 115 toward the first side 130, wherein the first support ribs 116 are formed between two adjacent first buffer grooves 111 in the first buffer grooves 111 adjacent to the first side 130. Further, at least two second buffer grooves 121 are disposed on the second surface 120 adjacent to the first side 130, and the plurality of second buffer grooves 121 adjacent to the first side 130 are arranged on the second surface 120 at intervals along the extending direction of the second side 140, and similarly, the second surface 120 is further formed with second support ribs 126, and the second support ribs 126 extend from the recess 115 toward the first side 130.

In the above description, the first support rib 116 and the second support rib 126 are formed by the material of the base 100 between two adjacent buffer grooves, please refer to fig. 3, wherein the first support rib 116 and the second support rib 126 are disposed offset in the direction from the first surface 110 to the second surface 120.

Thus, according to the packing structure of the embodiment of the present application, by forming the first buffer groove 111 and the second buffer groove 121 recessed at the edge positions of the two surfaces of the base 100, and forming the first support rib 116 between the two first buffer grooves 111 adjacent to the first side 130 and the second support rib 126 between the two second buffer grooves 121 adjacent to the first side 130, and the first support rib 116 and the second support rib 126 are staggered in the direction from the first surface 110 to the second surface 120, whereby the first support rib 116 and the second support rib 126 can be formed with a plurality of support points for effectively supporting the entire packing structure in the extending direction of the first side 130, then the electric product protected by the packing structure of the present application, when the first side 130 is placed as the lower surface, during transportation and handling, even if a drop situation occurs, the impact force transmitted from the first side 130 can be uniformly conducted and dissipated to the inside of the packing structure through the first support rib 116 and the second support rib 126, so that the packing structure is not easily damaged in the extending direction of the first side 130, resulting in such a concentrated stress situation of the electric product can be formed effectively.

Further, the first support rib 116 and the second support rib 126 each have a first end proximate to the recess 115 and a second end proximate to the first side 130, wherein the second end of the first support rib 116 is a different distance from the first side 130 than the second end of the second support rib 126 is from the first side 130, and the first end of the first support rib 116 is a different distance from the recess 115 than the first end of the second support rib 126 is from the recess 115. In the arrangement illustrated by way of example in fig. 3, the first end of the second support rib 126 is closer to the recess than the first end of the first support rib 116, while the second end of the second support rib 126 is closer to the first side 130 than the second end of the first support rib 116. By arranging such that the first support rib 116 and the second support rib 126 form a gradient supporting effect in the direction from the first side 130 to the concave portion 115, a spring-like multi-stage buffering effect is formed in the force transmission direction from the first side 130 to the concave portion 115, so that dissipation and alleviation of impact force can be effectively achieved.

In one embodiment, the substrate 100 further includes two second sides 140 connected between the first surface 110 and the second surface 120, and the two second sides 140 are connected to two ends of the first side 130, respectively. The first buffer slot 111 includes at least two first sub-slots 112 and at least one second sub-slot 113, where the at least two first sub-slots 112 are arranged at intervals along the extending direction of the first side 130, and the first supporting rib 116 is formed between two adjacent first sub-slots 112. The second sub groove 113 is disposed adjacent to the second side 140, and the base body 100 is formed with a buffer rib 117 between the first sub groove 112 and the second sub groove 113 near a corner between the first side 130 and the second side 140, the buffer rib 117 extending from the recess 115 toward the corner between the first side 130 and the second side 140. In the case that the base body 100 is in the form of a flat rectangular parallelepiped, the buffer rib 117 extends almost along the diagonal direction of the base body 100, and by the arrangement of the buffer rib 117, when the electric product packaged and protected by the packaging structure of the present application contacts the placement surface at the diagonal position of the base body 100, the impact force can be effectively conducted and dispersed through the buffer rib 117, so that the contact of the placement surface at the corner position of the packaging structure can be avoided, and the situation that the corner position is broken due to stress concentration due to the impact or vibration can be avoided.

Further, the second buffer groove 121 includes at least two third sub-grooves 122 and at least one fourth sub-groove 123, the at least two third sub-grooves 122 are arranged at intervals along the extending direction of the first side 130, and the second support rib 126 is formed between two adjacent third sub-grooves 122 of the third sub-grooves 122 adjacent to the first side 130.

In the solution shown in the drawing by way of example, it can be seen that, in the drawing, two second sides 140 on the left and right sides and the corner position of the first side 130 are respectively provided with a fourth sub-groove 123, and two buffer ribs 117 are provided on the first surface 110, and the projections of the two buffer ribs 117 in the direction from the first surface 110 to the second surface 120 are respectively located in the area of one fourth sub-groove 123. With such an arrangement, when the base 100 first contacts the supporting surface with the corner between the first side 130 and the second side 140, since the projection of the buffer rib 117 on the second surface 120 falls within the area of the fourth sub-groove 123, that is, the caliber size of the opening of the fourth sub-groove 123 is slightly larger than the length size of the buffer rib 117, the material surrounding the fourth sub-groove 123 of the base 100 first deforms to release the impact force once, and then the buffer rib 117 releases and releases the impact force for the second time, so that the fourth sub-groove 123 and the buffer rib 117 cooperate with each other to form a spring-like mechanism to achieve a multi-level buffer effect, thereby effectively avoiding the structural failure at the corner position due to stress concentration.

In an actual application scene, the outer package of the electrical product is usually marked with a sign of the placement direction, that is, a carrier can place the first side 130 of the base body 100 downwards according to the prompt of the sign, and the arrangement of the above structure can effectively ensure that the impact force is effectively relieved and released under the condition that the package structure falls off in a prismatic manner (that is, the first side 130 is impacted) and falls off in a angular manner (that is, the corner positions of the first side 130 and the second side 140 are impacted), so that the self structure is also effectively protected. Then the situation is more complicated in the actual handling, and it is impossible to completely avoid the situation that other positions of the packaging structure are impacted due to errors of the carrier.

To this end, the base 100 further includes a third side 150 connected between the two second surfaces 120, and two ends of the third side 150 are respectively connected to ends of the two second sides 140 away from the first side 130; wherein the first buffer slot 111 further comprises a first corner slot 114 adjacent to the corner position formed by the third side 150 and the second side 140, and the second buffer slot 121 further comprises a second corner slot 124 adjacent to the corner position formed by the third side 150 and the second side 140. In the illustrated embodiment, the first corner slots 114 on the first surface 110 are two and are located near two corners formed by the second side 140 and the third side 150, respectively, and the second corner slots 124 on the second surface 120 are two and are located near two corners formed by the second side 140 and the third side 150, respectively. Through the arrangement of the first corner groove 114 and the second corner groove 124, the buffer release can be carried out when the impact is received at each corner position of the packaging structure, so that the packaging structure is ensured to be more stable when the external force is received.

Further, the opening areas of the first corner groove 114 and the second corner groove 124 are different, and the first corner groove 114 and the second corner groove 124 at least partially overlap in the direction from the first surface 110 to the second surface 120. By the arrangement of the first corner groove 114 and the second corner groove 124 which are at least partially overlapped, the material of the base body 100 at the positions corresponding to the first corner groove 114 and the second corner groove 124 also forms a spring-like structure, so that the impact force can be effectively released by buffering for a plurality of times when the impact is received.

Referring to fig. 4, in order to ensure structural stability, the widths d1 of the first support rib 116, the second support rib 126, and the buffer rib 117 are not less than 15 mm.

Further, the distance d2 between the first surface 110 and the second surface 120 is not less than 70 mm, that is, the thickness of the entire substrate 100 is not less than 70 mm. Of course, the thicker the substrate 100 is, the better, the larger the thickness of the substrate 100 is, which leads to the oversized packaging structure, and the more material is used, the higher the cost is. In the case of satisfying the structural strength, the thickness of the base 100 may be 70 mm or more.

With continued reference to fig. 4, the depth of the first buffer slot 111 is greater than the depth of the second buffer slot 121, the depth of the first buffer slot 111 is less than 30 mm, and the depth of the second buffer slot 121 is less than 20 mm. For example, in the case where the thickness of the base 100 takes a value of 70 mm, the depth of the first buffer groove 111 may take a maximum value of 29 mm, and the depth of the second buffer groove 121 may take a maximum value of 19 mm. This ensures that the material thickness of the substrate 100 between the first buffer tank 111 and the second buffer tank 121 is at least 20 mm, i.e., the distance d3 between the tank bottom wall of the first buffer tank 111 and the tank bottom wall of the second buffer tank 121 in the direction from the first surface 110 to the second surface 120 is not less than 20 mm. Thereby effectively ensuring structural strength.

Further, the second surface 120 is further concavely formed with a relief groove 125, and a plurality of second buffer grooves 121 are located outside the relief groove 125. The arrangement of the material reducing groove 125 can reduce the production and manufacturing cost of the packaging structure. On the other hand, the strength of the package structure is also ensured on the basis of cost reduction, and for this reason, the distance d4 between the bottom wall of the trough 125 and the bottom wall of the concave portion 115 as the accommodation trough is not less than 20 mm in the direction from the first surface 110 to the second surface 120.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it should be understood that, if there is an azimuth or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc., based on the azimuth or positional relationship shown in the drawings, this is for convenience of description and simplification of the description, but does not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus terms describing the positional relationship in the drawings are merely used for illustration and are not to be construed as limitations of the present application, and specific meanings of the terms described above may be understood by those of ordinary skill in the art according to specific circumstances.

The foregoing description of the preferred embodiment of the present utility model is not intended to limit the utility model to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (10)

1. The packaging structure is used for packaging an electric product and is characterized by comprising a substrate, wherein the substrate comprises a first surface, a second surface and a first side surface, the first surface and the second surface are arranged opposite to each other, and the first side surface is positioned between the first surface and the second surface;

the substrate is provided with a concave part which is recessed in the direction from the first surface to the second surface, the concave part is used for embedding a power supply product, a plurality of first buffer grooves are formed in the edge of the first surface at intervals, the first buffer grooves are positioned at the outer side of the concave part, a plurality of second buffer grooves are formed in the edge of the second surface at intervals, and the second buffer grooves are positioned at the outer side of the concave part;

at least two first buffer grooves are arranged adjacent to the first side surface, and the first surface is formed with first support ribs extending towards the first side surface, and the first support ribs are positioned between the two first buffer grooves; at least two of the second buffer grooves are arranged adjacent to the first side surface, and the second surface is formed with second support ribs extending towards the first side surface, and the second support ribs are positioned between the two second buffer grooves;

wherein, in the direction from the first surface to the second surface, the first support rib and the second support rib are staggered.

2. The packaging structure of claim 1, wherein said base further comprises two second sides connected between said first surface and said second surface, said two second sides being connected at opposite ends of said first sides, respectively;

the first buffer groove comprises at least two first sub grooves and at least one second sub groove, the at least two first sub grooves are distributed at intervals along the extending direction of the first side face, the second sub grooves are arranged adjacent to the second side face, buffer ribs are formed between the first sub grooves and the second sub grooves, which are close to the corners between the first side face and the second side face, and the buffer ribs extend from the concave parts towards the corners between the first side face and the second side face.

3. The packaging structure of claim 2, wherein the second buffer slot comprises at least two third sub-slots and at least one fourth sub-slot, the at least two third sub-slots being spaced apart along the direction of extension of the first side;

the fourth sub-groove is close to the corner formed by the first side face and the second side face, and the projection of the buffer rib in the direction from the first surface to the second surface is located in the area range of the fourth sub-groove.

4. A packaging structure as claimed in claim 3, wherein the base further comprises two third sides connected between the first surface and the second surface, the ends of the third sides being connected to the ends of the two second sides remote from the first sides, respectively;

wherein the first buffer slot further includes a first corner slot adjacent to a corner position formed by the third side and the second side, and the second buffer slot further includes a second corner slot adjacent to a corner position formed by the third side and the second side.

5. The packaging structure of claim 4, wherein the first corner groove and the second corner groove have different opening areas, and wherein the first corner groove and the second corner groove at least partially overlap in a direction from the first surface to the second surface.

6. A packaging structure as claimed in claim 3, wherein the width of each of the first support rib, the second support rib and the cushioning rib is not less than 15 mm.

7. The packaging structure of any one of claims 1 to 6, wherein the concave portion is a receiving groove formed by recessing the first surface, the second surface is further formed by recessing a material reducing groove, the material reducing groove is disposed opposite to the receiving groove, and the plurality of second buffer grooves are located outside the material reducing groove.

8. The packaging structure of claim 7, wherein a distance between a bottom wall of the subtracting tank and a bottom wall of the containing tank in a direction from the first surface to the second surface is not less than 20 mm.

9. The packaging structure of any one of claims 1 to 6, wherein the first surface and the second surface are spaced apart by no less than 70 millimeters.

10. The packaging structure of any one of claims 1 to 6, wherein the first buffer slot has a depth greater than a depth of the second buffer slot, the first buffer slot has a depth less than 30 millimeters, and the first buffer slot has a depth less than 20 millimeters;

and/or the distance between the groove bottom wall of the first buffer groove and the groove bottom wall of the second buffer groove in the direction from the first surface to the second surface is not less than 20 mm.