CN220429582U - Silicon wafer printing equipment and battery production system - Google Patents
Silicon wafer printing equipment and battery production system Download PDFInfo
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- CN220429582U CN220429582U CN202321908675.7U CN202321908675U CN220429582U CN 220429582 U CN220429582 U CN 220429582U CN 202321908675 U CN202321908675 U CN 202321908675U CN 220429582 U CN220429582 U CN 220429582U
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- 238000007639 printing Methods 0.000 title claims abstract description 139
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 116
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 110
- 239000010703 silicon Substances 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 166
- 235000012431 wafers Nutrition 0.000 claims abstract description 107
- 230000000712 assembly Effects 0.000 claims abstract description 44
- 238000000429 assembly Methods 0.000 claims abstract description 44
- 238000007790 scraping Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 230000006872 improvement Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides silicon wafer printing equipment and a battery production system, and relates to the technical field of photovoltaic battery production. The silicon wafer printing equipment comprises a machine table, and an input mechanism, a printing mechanism and an output mechanism which are sequentially arranged on the machine table. The printing mechanism comprises a screen plate assembly, a plurality of adjusting mechanisms and a plurality of scraper assemblies; the scraper assemblies are arranged above the screen assembly and are used for printing a plurality of silicon wafers positioned below the screen assembly when scraping on the screen assembly; the scraper components are respectively connected with the adjusting mechanisms, the adjusting mechanisms are used for adjusting the positions of the scraper components relative to the screen plate components, and the adjusting mechanisms are mutually independent. The battery production system provided by the utility model adopts the silicon wafer printing equipment. The silicon wafer printing equipment and the battery production system provided by the utility model can solve the problem that the printing quality is affected when a plurality of silicon wafers are printed at the same time.
Description
Technical Field
The utility model relates to the technical field of photovoltaic cell production, in particular to silicon wafer printing equipment and a cell production system.
Background
As the demand for batteries increases, so too does the demand for battery production on an industrial line. The maximum utilization rate of the high-efficiency battery production line is evaluated, the production line is mainly arranged in a limited space, the maximum production line capacity is maximally exerted, the coating equipment with large capacity is continuously updated, and the equipment structure of each matched equipment is also changed towards the equipment with large capacity. The biggest challenge to screen printing is that the silver paste used in heterojunction cells is more viscous than Perc cells, the printing speed is still limited, and the feed back speed is low, so that the improvement of efficiency can only be obtained by increasing the printer, and the reduction of the occupied area of equipment as much as possible is considered.
The conventional practice only considers the tandem screen printing equipment, so that the efficiency of each section of screen printing is improved, and even three tandem screen printing is considered to carry out printing work, wherein one of the three tandem screen printing works has the basic operations of problems, sizing agent and the like, and other tandem equipment can only stop there to wait for printing, and the normal printing work is directly affected.
In addition, even if a plurality of printers are adopted to work simultaneously, the problem of cold joint exists, and the printing quality of the battery is directly affected.
Disclosure of Invention
The utility model aims to provide a silicon wafer printing device and a battery production system, which can solve the technical problem that the printing quality is affected due to the fact that the same printing effect is difficult to ensure in the simultaneous printing process of a plurality of silicon wafers in the prior art.
Embodiments of the utility model may be implemented as follows:
an embodiment of the present utility model provides a silicon wafer printing apparatus, including:
the printing device comprises a machine table, an input mechanism, a printing mechanism and an output mechanism which are sequentially arranged on the machine table;
the input mechanism comprises a plurality of input lines for conveying silicon wafers;
the printing mechanism comprises a screen plate assembly, a plurality of adjusting mechanisms and a plurality of scraper assemblies; the scraper assemblies are arranged above the screen assembly and are used for printing a plurality of silicon wafers positioned below the screen assembly when scraping on the screen assembly; the scraper assemblies are respectively connected with the adjusting mechanisms, the adjusting mechanisms are used for adjusting the positions of the scraper assemblies relative to the screen plate assemblies, and the adjusting mechanisms are mutually independent.
Optionally, the adjusting mechanism includes:
a first moving mechanism having a first slider capable of moving along a first preset direction
The second moving mechanism is connected to the first sliding block and provided with a second sliding block capable of moving along a second preset direction;
the scraper component is connected to the second sliding block;
the first preset direction is perpendicular to the second preset direction, and the second preset direction is vertical up-down direction.
Optionally, the adjusting mechanism further includes a third moving mechanism, the third moving mechanism has a third slider capable of moving along a third preset direction, the first moving mechanism is connected to the third slider, the third preset direction is perpendicular to the first preset direction, and the third preset direction is perpendicular to the second preset direction.
Optionally, the screen assembly comprises a plurality of screens which are independent from each other, and the screens are in one-to-one correspondence with the scraper assemblies; each screen plate is respectively arranged below a plurality of scraper components.
Optionally, the plurality of reticles are arranged along a first preset direction, and each reticle is arranged in an extending manner along a third preset direction.
Optionally, each of the screens is used for printing one or half of the silicon wafer.
Optionally, the printing mechanism further comprises a body structure and a moving body; the main body structure is arranged on the machine table, and a sliding rail extending along a third preset direction is arranged on the main body structure; the movable body is movably connected to the sliding rail; the plurality of adjusting mechanisms are arranged on the moving body along a first preset direction; the first preset direction is perpendicular to the third preset direction.
Optionally, the moving body includes a first carrier, a second carrier, and a fourth moving mechanism; the first bearing piece is in sliding fit with the sliding rail, the fourth moving mechanism is arranged on the first bearing piece and provided with a fourth sliding block capable of moving along the first preset direction, and the second bearing piece is connected with the fourth sliding block; the adjusting mechanisms are arranged on the second bearing piece.
Optionally, the second bearing member spans over the screen assembly along the first preset direction.
A battery production system comprises the silicon wafer printing equipment. The silicon wafer printing apparatus includes:
the printing device comprises a machine table, an input mechanism, a printing mechanism and an output mechanism which are sequentially arranged on the machine table;
the input mechanism comprises a plurality of input lines for conveying silicon wafers;
the printing mechanism comprises a screen plate assembly, a plurality of adjusting mechanisms and a plurality of scraper assemblies; the scraper assemblies are arranged above the screen assembly and are used for printing a plurality of silicon wafers positioned below the screen assembly when scraping on the screen assembly; the scraper assemblies are respectively connected with the adjusting mechanisms, the adjusting mechanisms are used for adjusting the positions of the scraper assemblies relative to the screen plate assemblies, and the adjusting mechanisms are mutually independent.
Compared with the prior art, the silicon wafer printing equipment and the battery production system provided by the utility model have the beneficial effects that:
in the silicon wafer printing equipment, the input mechanism can convey a plurality of silicon wafers to the printing mechanism, and in the printing mechanism, the positions of the plurality of scraper assemblies can be respectively and independently adjusted by the plurality of adjusting mechanisms, so that the positions of the scraper assemblies can be adjusted according to the actual conditions of the scraper assemblies, the screen plate assemblies and the silicon wafers, the plurality of scraper assemblies can be ensured to effectively scrape on the silicon wafers for printing, and the phenomenon of virtual printing of the silicon wafers is avoided; even in the case of generating the dummy print, the doctor assembly corresponding to the dummy print can be independently completed to eliminate the phenomenon of the dummy print. Based on the method, the technical problem that the printing quality is affected due to the fact that the same printing effect is difficult to ensure in the process of simultaneously printing a plurality of silicon chips in the prior art can be solved. In addition, it is worth to say that this silicon chip lithography apparatus can carry a plurality of silicon chips to printing subassembly through input mechanism to accomplish the printing of a plurality of silicon chips simultaneously, and then can make the whole volume of silicon chip lithography apparatus accomplish the promotion of printing efficiency under the prerequisite that does not excessively increase area.
Further, because a plurality of half tone among the half tone subassembly adopts mutually independent mode to set up for can independently print between every half tone and the scraper subassembly that corresponds, prevent the print job of a plurality of silicon chips and influence each other, and then can prevent because the too big phenomenon that leads to other scraper subassemblies to appear virtual seal of one of them scraper subassembly effort, and then can promote the printing quality. And can be according to
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first view angle of a silicon wafer printing apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a second view angle of a silicon wafer printing apparatus according to an embodiment of the present application;
FIG. 3 is a schematic view of a partial structure of a printing mechanism according to an embodiment of the present application;
FIG. 4 is a schematic view of another partial structure of a printing mechanism according to an embodiment of the present application;
fig. 5 is a schematic view of still another partial structure of the printing mechanism according to the embodiment of the present application.
Icon: 10-a silicon wafer printing device; 100-machine; 200-an input mechanism; 210-an input line; 300-printing mechanism; 310-a body structure; 320-sliding rails; 330-moving the body; 331-a first carrier; 332-a second carrier; 333-fourth movement mechanism; 340-screen assembly; 341-screen printing; 350-an adjustment mechanism; 351-a first movement mechanism; 352-a second movement mechanism; 360-scraper assembly; 400-an output mechanism; 410-output line; 510-a first transfer mechanism; 520-a second transfer mechanism.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present utility model and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
It should be noted that the features of the embodiments of the present utility model may be combined with each other without conflict.
Referring to fig. 1, a silicon wafer printing apparatus 10 for screen printing a silicon wafer is provided in an embodiment of the present application. The silicon wafer printing device 10 can improve the technical problem that the same printing effect is difficult to ensure in the simultaneous printing process of a plurality of silicon wafers in the prior art, so that the printing quality is affected due to the existence of a virtual printing phenomenon.
In this embodiment, referring to fig. 1 and 2 in combination, a silicon wafer printing apparatus 10 includes a machine 100, and an input mechanism 200, a printing mechanism 300 and an output mechanism 400 sequentially disposed on the machine 100. The input mechanism 200 is used for inputting silicon wafers, the printing mechanism 300 is used for printing the silicon wafers, and the output mechanism 400 is used for outputting the printed silicon wafers. The machine 100 may be used to provide a load bearing function to the input mechanism 200, the printing mechanism 300, and the output mechanism 400. In addition, the printing mechanism 300 is provided with a printing position for placing the silicon wafer, and provides a bearing function for the silicon wafer so as to ensure the stability of the silicon wafer in the printing process and ensure the printing quality. In this embodiment, the input mechanism 200 includes a plurality of input lines 210 for transporting silicon wafers for simultaneously inputting a plurality of silicon wafers. Printing mechanism 300 includes a screen assembly 340, a plurality of adjustment mechanisms 350, and a plurality of doctor assemblies 360. The scraper assemblies 360 are all arranged above the screen assembly 340 and are used for printing a plurality of silicon wafers positioned below the screen assembly 340 when scraping on the screen assembly 340; notably, the print station is located below the screen assembly 340. The doctor assemblies 360 are respectively connected to the adjusting mechanisms 350, the adjusting mechanisms 350 are used for adjusting the positions of the doctor assemblies 360 relative to the screen assembly 340, and the adjusting mechanisms 350 are independent.
That is, in the silicon wafer printing apparatus 10 provided in this embodiment, the input mechanism 200 can convey a plurality of silicon wafers to the printing mechanism 300, and in the printing mechanism 300, since the plurality of adjusting mechanisms 350 can respectively and independently adjust the positions of the plurality of doctor assemblies 360, the positions of the doctor assemblies 360 can be adjusted according to the actual conditions of the doctor assemblies 360, the screen assemblies 340 and the silicon wafers, so that the plurality of doctor assemblies 360 can effectively scrape on the silicon wafers to perform printing, and the phenomenon of virtual printing of the silicon wafers is avoided; even in the case of generating the dummy print, the doctor assembly 360 corresponding to the dummy print can be independently completed to eliminate the phenomenon of the dummy print. Based on the method, the technical problem that the printing quality is affected due to the fact that the same printing effect is difficult to ensure in the process of simultaneously printing a plurality of silicon chips in the prior art can be solved. In addition, it should be noted that, the silicon wafer printing apparatus 10 can convey a plurality of silicon wafers to the printing assembly through the input mechanism 200, so as to complete printing of the plurality of silicon wafers at the same time, and further, the overall volume of the silicon wafer printing apparatus 10 can not excessively increase the occupied area, so as to complete improvement of the printing efficiency.
In this embodiment, taking fig. 1 as an example, the first preset direction is the direction indicated by the X arrow in fig. 1, and the second preset direction is the direction indicated by the Y arrow in fig. 1. In addition, in fig. 1, the direction indicated by the Z arrow is a third preset direction, where the third preset direction is a vertical up-down direction; of course, it is noted that the up-down direction means the up-down direction in the case where the silicon wafer printing apparatus 10 is normally operated. It is noted that the first preset direction, the second preset direction and the third preset direction are perpendicular to each other.
In this embodiment, referring to fig. 4 and fig. 5 in combination, the screen assembly 340 includes a plurality of screens 341, the plurality of screens 341 are in one-to-one correspondence with the plurality of doctor assemblies 360, and the plurality of screens 341 are respectively disposed below the plurality of doctor assemblies 360; each doctor assembly 360 is adapted to doctor over a corresponding screen 341 for printing a silicon wafer. Because a plurality of half tone 341 adopt mutually independent mode setting for can independently print between every half tone 341 and the scraper subassembly 360 that correspond, prevent the print job of a plurality of silicon chips from influencing each other, and then can prevent because the too big phenomenon that leads to other scraper subassemblies 360 to appear of one of them scraper subassembly 360 effort, and then can promote the printing quality.
Alternatively, in this embodiment, each screen 341 is used to print one or half of a silicon wafer.
In the case of fig. 4, a plurality of screens 341 are arranged in a first preset direction, and each screen 341 extends in a third preset direction. That is, during the movement of the doctor assembly 360 in the third predetermined direction, the doctor assembly is scraped along the extending direction of the screen 341, so that the screen printing can be performed on the corresponding silicon wafer under the screen 341.
Alternatively, in the present embodiment, the adjustment mechanism 350 includes a first movement mechanism 351 and a second movement mechanism 352; the first moving mechanism 351 has a first slider (not shown) movable in a first preset direction; the second moving mechanism 352 is connected to the first slider, and the second moving mechanism 352 has a second slider (not shown) capable of moving along a second predetermined direction; the scraper assembly 360 is connected to the second slider.
That is, in the case that a deviation occurs in the positional relationship between the doctor assembly 360 and the corresponding screen 341, the pressing down or lifting up of the doctor assembly 360 can be adjusted by the second moving mechanism 352, so that the situation that excessive scraping occurs due to excessive acting force of the doctor assembly 360 on the screen 341 is prevented, and the phenomenon that virtual printing is caused due to too small acting force of the doctor assembly 360 on the screen 341 can be prevented, and thus, the printing quality can be effectively adjusted. The corresponding condition of the doctor assembly 360 and the screen 341 is adjusted by the first moving mechanism 351, so that the doctor assembly 360 is ensured to be opposite to the screen 341, and high-quality printing is realized.
It is noted that the first moving mechanism 351 has a first guide rail for carrying the first slider and a first driving structure for driving the first slider; the second moving mechanism 352 has a second guide rail for carrying the second slider and a second driving structure for driving the second slider, which are all of the prior art and are not described herein.
Optionally, in other embodiments of the present application, the adjusting mechanism 350 further includes a third moving mechanism (not shown), where the third moving mechanism has a third slider that can move along a third preset direction, and the first moving mechanism 351 is connected to the third slider. Wherein the third movement mechanism can adjust the position of the doctor assembly 360 in a third preset direction, whereby the starting and ending position of the doctor assembly 360 on the screen 341 can be adjusted, and the print quality can be adjusted.
Based on this, the position of the doctor assembly 360 relative to the screen 341 can be effectively adjusted based on the first moving mechanism 351, the second moving mechanism 352 and the third moving mechanism, so that each doctor assembly 360 can complete high-quality printing operation, and the printing quality is improved.
It should be understood that in other embodiments of the present application, the setting of the third movement mechanism may be eliminated, as in fig. 5. Because the multiple screens 341 are independent, the position of the screen 341 can be adjusted to ensure that the doctor assembly 360 corresponds to the accurate starting position on the screen 341, so as to improve the printing quality.
In the present embodiment, the plurality of first moving mechanisms 351 are independently controlled, and the plurality of second moving mechanisms 352 are independently controlled. That is, it is ensured that each doctor assembly 360 can be independently controlled, ensuring that each doctor assembly 360 can effectively complete printing, improving print quality.
Optionally, in this embodiment, the printing mechanism 300 further includes a main body structure 310 and a moving body 330, where the main body structure 310 is disposed on the machine 100, and a sliding rail 320 extending along a third preset direction is disposed on the main body structure 310; the moving body 330 is movably connected to the sliding rail 320; the plurality of adjustment mechanisms 350 are disposed on the moving body 330 in a first predetermined direction. In the process of moving the moving body 330 relative to the main body structure 310, the adjusting mechanism 350 and the doctor assembly 360 disposed on the adjusting mechanism 350 can be driven to move along the third preset direction, so as to achieve the purpose of scraping on the screen 341 to print the silicon wafer.
Further, in the present embodiment, the moving body 330 includes a first carrier 331, a second carrier 332, and a fourth moving mechanism 333; the first bearing member 331 is slidably matched with the sliding rail 320, the fourth moving mechanism 333 is arranged on the first bearing member 331 and provided with a fourth sliding block capable of moving along a first preset direction, and the second bearing member 332 is connected with the fourth sliding block; the plurality of adjusting mechanisms 350 are disposed on the second carrier 332.
The fourth moving mechanism 333 is configured to integrally adjust the positions of the plurality of doctor assemblies 360 in the first preset direction, and the adjustment of the plurality of doctor assemblies 360 by the fourth moving mechanism 333 can be regarded as coarse positioning of the plurality of doctor assemblies 360; after the rough positioning of the plurality of doctor assemblies 360 is completed, the precise positioning of each doctor assembly 360 may be achieved by the respective first movement mechanism 351. Through the setting of fourth moving mechanism 333, the efficiency of adjusting scraper assembly 360 can be improved, the debugging of silicon wafer printing equipment 10 can be completed rapidly, the printing operation can be put into rapidly, and the printing efficiency can be improved.
In the present embodiment, the fourth moving mechanism 333 may employ a screw driving structure to realize the movement of the fourth slider.
It should be understood that in other embodiments of the present application, the setting of the fourth moving mechanism 333 may be also be omitted.
Optionally, the second carrier 332 is disposed transversely above the screen assembly 340 along the first predetermined direction. The second bearing piece 332 spans over the screen plate assembly 340, so that the plurality of scraper assemblies 360 can be conveniently corresponding to the plurality of screen plates 341 respectively, and the plurality of scraper assemblies 360 can also conveniently scrape on the plurality of screen plates 341 respectively, thereby realizing synchronous printing of the plurality of silicon wafers.
In this embodiment, the input mechanism 200 includes a plurality of input lines 210, each of the plurality of input lines 210 being used to transport silicon wafers. The silicon wafer printing apparatus 10 further includes a first transfer mechanism 510, where the first transfer mechanism 510 includes a plurality of first fine adjustment mechanisms, the plurality of first fine adjustment mechanisms are in one-to-one correspondence with the plurality of input lines 210, and the plurality of first fine adjustment mechanisms are in one-to-one correspondence with the plurality of screen 341; the first fine adjustment mechanism is used for grabbing the silicon wafer conveyed by the corresponding input line 210, and is also used for placing the grabbed silicon wafer under the corresponding screen 341.
By arranging a plurality of input lines 210 to synchronously carry out the conveying of the silicon wafers, the printing of the plurality of silicon wafers can be synchronously completed, the occupied area of the silicon wafer printing equipment 10 can not be excessively increased, and meanwhile, the printing efficiency can be efficiently improved, so that the silicon wafer printing equipment 10 can meet the requirement of front-end equipment with high yield. The purpose of improving printing efficiency under the condition of reasonably carrying out space layout is achieved.
Correspondingly, the output mechanism 400 includes a plurality of output lines 410, and the plurality of output lines 410 are used for outputting the printed silicon wafers. The silicon wafer printing apparatus 10 further includes a second transfer mechanism 520, where the second transfer mechanism 520 includes a plurality of second fine adjustment mechanisms, the plurality of second fine adjustment mechanisms are in one-to-one correspondence with the plurality of output lines 410, and the plurality of second fine adjustment mechanisms are in one-to-one correspondence with the plurality of screen 341; the second fine adjustment mechanism is used for grabbing the silicon wafer which is printed under the corresponding screen 341 and placing the grabbed silicon wafer on the corresponding output line 410.
The plurality of output lines 410 are provided to output a plurality of silicon wafers simultaneously finished printing, ensuring that the plurality of printed silicon wafers finished simultaneously are output efficiently, and further ensuring that the printing operation is performed in order.
In this embodiment, the first transfer mechanism 510 and the second transfer mechanism 520 have the same structure, and the structure of the first transfer mechanism 510 will be described below as an example.
The first transfer mechanism 510 includes a bracket, a rail, a slider, a fine adjustment mechanism, and an image capturing device. The support is arranged at one end of the input mechanism 200 close to the printing mechanism 300, and the support is arranged at two sides of the input mechanism 200. The track is arranged on the bracket and extends along a third preset direction. The sliding piece is slidably connected to the rail and can move along the rail in a third preset direction. The fine adjustment mechanism is provided with a suction structure for sucking the silicon wafer, and the fine adjustment structure can drive the suction structure to move in a first preset direction, a second preset direction and a third preset direction and can also drive the suction structure to rotate. The image acquisition device is arranged on the fine adjustment mechanism and is used for acquiring image information of the silicon wafer so as to conveniently control the first transfer mechanism 510 to grasp the silicon wafer and convey the silicon wafer to a designated position.
Through the arrangement of the first transfer mechanism 510 and the second transfer mechanism 520, after the silicon wafer is grabbed by the suction structure on one side of the input mechanism 200, the posture of the silicon wafer can be adjusted through the fine adjustment mechanism, so that the silicon wafer is accurately placed on the support structure, the silicon wafer is convenient to correspond to the screen 341, and the printing quality is improved. And on one side of the output mechanism 400, the silicon wafer can be efficiently grasped by setting the fine adjustment mechanism, so that the output of the silicon wafer is efficiently completed.
Based on the above-mentioned silicon wafer printing device 10, a battery production system (not shown) is further provided in the embodiments of the present application, and the above-mentioned silicon wafer printing device 10 is adopted in the battery production system, so that the battery production system can improve the technical problem that the printing quality is affected due to the existence of a virtual printing phenomenon because the same printing effect is difficult to be ensured in the process of simultaneously printing a plurality of silicon wafers in the prior art.
In summary, in the silicon wafer printing apparatus 10 and the battery production system, the input mechanism 200 can convey a plurality of silicon wafers to the printing mechanism 300, and in the printing mechanism 300, the positions of the plurality of doctor assemblies 360 can be adjusted independently by the plurality of adjusting mechanisms 350, so that the positions of the doctor assemblies 360 can be adjusted according to the actual conditions of the doctor, the screen assembly 340 and the silicon wafers, and the doctor assemblies 360 can be ensured to effectively scrape on the silicon wafers for printing, so that the phenomenon of virtual printing of the silicon wafers is avoided; even in the case of generating the dummy print, the doctor assembly 360 corresponding to the dummy print can be independently completed to eliminate the phenomenon of the dummy print. Based on the method, the technical problem that the printing quality is affected due to the fact that the same printing effect is difficult to ensure in the process of simultaneously printing a plurality of silicon chips in the prior art can be solved. In addition, it should be noted that, the silicon wafer printing apparatus 10 can convey a plurality of silicon wafers to the printing assembly through the input mechanism 200, so as to complete printing of the plurality of silicon wafers at the same time, and further, the overall volume of the silicon wafer printing apparatus 10 can not excessively increase the occupied area, so as to complete improvement of the printing efficiency. Further, since the plurality of screen plates 341 are arranged in a mutually independent manner, each screen plate 341 and the corresponding scraper component 360 can be independently printed, so that the mutual influence of the printing operation of a plurality of silicon wafers is prevented, the phenomenon that other scraper components 360 are subjected to virtual printing due to overlarge acting force of one scraper component 360 can be prevented, and the printing quality can be improved.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present utility model should be included in the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (10)
1. A silicon wafer printing apparatus, comprising:
the printing device comprises a machine table, an input mechanism, a printing mechanism and an output mechanism which are sequentially arranged on the machine table;
the input mechanism comprises a plurality of input lines for conveying silicon wafers;
the printing mechanism comprises a screen plate assembly, a plurality of adjusting mechanisms and a plurality of scraper assemblies; the scraper assemblies are arranged above the screen assembly and are used for printing a plurality of silicon wafers positioned below the screen assembly when scraping on the screen assembly; the scraper assemblies are respectively connected with the adjusting mechanisms, the adjusting mechanisms are used for adjusting the positions of the scraper assemblies relative to the screen plate assemblies, and the adjusting mechanisms are mutually independent.
2. The silicon wafer printing apparatus according to claim 1, wherein the adjustment mechanism comprises:
a first moving mechanism having a first slider capable of moving along a first preset direction
The second moving mechanism is connected to the first sliding block and provided with a second sliding block capable of moving along a second preset direction;
the scraper component is connected to the second sliding block;
the first preset direction is perpendicular to the second preset direction, and the second preset direction is vertical up-down direction.
3. The silicon wafer printing apparatus according to claim 2, wherein the adjustment mechanism further comprises a third movement mechanism having a third slider movable in a third preset direction, the first movement mechanism being connected to the third slider, the third preset direction being perpendicular to the first preset direction, the third preset direction being perpendicular to the second preset direction.
4. The silicon wafer printing apparatus according to claim 1, wherein the screen assembly comprises a plurality of screens independent of each other, the plurality of screens being in one-to-one correspondence with the plurality of doctor assemblies; each screen plate is respectively arranged below a plurality of scraper components.
5. The silicon wafer printing apparatus according to claim 4, wherein a plurality of the screen plates are arranged in a first preset direction, and each of the screen plates is extended in a third preset direction.
6. A silicon wafer printing apparatus according to claim 4, wherein each screen is used to print one or half of the silicon wafer.
7. The silicon wafer printing apparatus of claim 1, wherein the printing mechanism further comprises a body structure and a moving body; the main body structure is arranged on the machine table, and a sliding rail extending along a third preset direction is arranged on the main body structure; the movable body is movably connected to the sliding rail; the plurality of adjusting mechanisms are arranged on the moving body along a first preset direction; the first preset direction is perpendicular to the third preset direction.
8. The silicon wafer printing apparatus of claim 7, wherein the moving body comprises a first carrier, a second carrier, and a fourth moving mechanism; the first bearing piece is in sliding fit with the sliding rail, the fourth moving mechanism is arranged on the first bearing piece and provided with a fourth sliding block capable of moving along the first preset direction, and the second bearing piece is connected with the fourth sliding block; the adjusting mechanisms are arranged on the second bearing piece.
9. The silicon wafer printing apparatus of claim 8, wherein the second carrier is disposed transversely above the screen assembly in the first predetermined direction.
10. A battery production system comprising a silicon wafer printing apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908675.7U CN220429582U (en) | 2023-07-19 | 2023-07-19 | Silicon wafer printing equipment and battery production system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321908675.7U CN220429582U (en) | 2023-07-19 | 2023-07-19 | Silicon wafer printing equipment and battery production system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220429582U true CN220429582U (en) | 2024-02-02 |
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| CN202321908675.7U Active CN220429582U (en) | 2023-07-19 | 2023-07-19 | Silicon wafer printing equipment and battery production system |
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