CN220428880U - Wafer alignment polishing mechanism and wafer processing equipment - Google Patents
Wafer alignment polishing mechanism and wafer processing equipment Download PDFInfo
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- CN220428880U CN220428880U CN202322315053.XU CN202322315053U CN220428880U CN 220428880 U CN220428880 U CN 220428880U CN 202322315053 U CN202322315053 U CN 202322315053U CN 220428880 U CN220428880 U CN 220428880U
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- 238000005498 polishing Methods 0.000 title claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 5
- 238000005286 illumination Methods 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a wafer alignment polishing mechanism and wafer processing equipment, wherein the wafer alignment polishing mechanism comprises a workbench driven by a driving device to rotate, a group of light holes with equal circumferences are formed in the workbench, a light source and a light reflecting mechanism are arranged below the workbench, the light emitted by the light source can be reflected to a preset position at the bottom of the workbench by the light reflecting mechanism, and the preset position is a position where the light holes can rotate. The utility model can make the light-emitting cup of the light source to the position where the light-transmitting hole can rotate through the light reflecting mechanism, can flexibly adjust the light source to other feasible positions when the driving device interferes with the installation of the light source, is convenient for adjusting the position of the light source, and can effectively make the light-emitting of the light source to the position where the light-transmitting hole can rotate through the light path design of the light reflecting mechanism under the condition of not adjusting the position of the light source, thereby providing reliable illumination conditions for image recognition pairs.
Description
Technical Field
The utility model relates to the field of wafer processing, in particular to a wafer alignment polishing mechanism and wafer processing equipment.
Background
In the process of cutting the tai drum wafer ring, the light source is required to polish the light transmission hole on the workbench and the image analysis is combined to determine the centering state of the wafer, and specifically, the structure disclosed in the Chinese patent application with the application publication number of CN114643656A can be adopted.
However, for a small-sized wafer, the light hole is located closer to the center of the table, and at this time, the position of the light source needs to be adjusted so that the light emitted from the light source can be effectively driven into the light hole located further inward, but the space occupied by the driving device for driving the table to rotate is unchanged, which causes inconvenience in adjusting the mounting position of the light source.
Disclosure of Invention
The present utility model is directed to solving the above-mentioned problems in the prior art, and provides a wafer alignment polishing mechanism and a wafer processing apparatus.
The aim of the utility model is achieved by the following technical scheme:
the wafer alignment polishing mechanism comprises a workbench driven by a driving device to rotate, a group of light holes with equal circumference are formed in the workbench, a light source and a light reflecting mechanism are arranged below the workbench, the light emitted by the light source can be reflected to a preset position at the bottom of the workbench by the light reflecting mechanism, and the preset position is a position where the light holes can rotate.
Preferably, in the wafer alignment polishing mechanism, the light source is arranged on an adjusting member for adjusting the height and the horizontal position of the light source.
Preferably, in the wafer alignment polishing mechanism, the light reflecting mechanism includes a first reflector and a second reflector, the first reflector is disposed right above the light source and is obliquely disposed on the support, the light emitted by the light source is reflected to the second reflector by the first reflector, and the second reflector is obliquely disposed on the support and can reflect the light to the predetermined position.
Preferably, in the wafer alignment polishing mechanism, the support includes a first plate, a second plate and a third plate which are connected in a triangle, and the first plate+
The piece slope sets up on first plate and the second plate, first reflector sets up on the first plate, the second plate level sets up and is provided with on it with the first perforation that light source and first reflector correspond, the vertical setting of third plate and on be provided with the second perforation that first reflector corresponds.
Preferably, in the wafer alignment polishing mechanism, a lower connecting portion is formed on the second plate, an upper connecting portion is formed on the third plate, the upper connecting portion and the lower connecting portion have flush oblique mounting surfaces, and the first plate is disposed at the oblique mounting surfaces of the upper connecting portion and the lower connecting portion.
Preferably, in the wafer alignment polishing mechanism, the second plate and the third plate are integrally formed.
Preferably, in the wafer alignment polishing mechanism, the support plate is connected with a lifting device for driving the support plate to lift.
Preferably, in the wafer alignment polishing mechanism, the support is disposed on a top plate of a protective cover, a side plate of the protective cover extends to a position below the light source, and an avoidance hole corresponding to the light source is disposed on the top plate.
Wafer processing apparatus comprising a wafer alignment polishing mechanism as described in any one of the preceding claims.
The technical scheme of the utility model has the advantages that:
the utility model can make the light-emitting cup of the light source to the position where the light-transmitting hole can rotate through the light reflecting mechanism, can flexibly adjust the light source to other feasible positions when the driving device interferes with the installation of the light source, is convenient for adjusting the position of the light source, and can effectively make the light-emitting of the light source to the position where the light-transmitting hole can rotate through the light path design of the light reflecting mechanism under the condition of not adjusting the position of the light source, thereby providing reliable illumination conditions for image recognition pairs.
The optical path of the utility model has simple structure, easy realization and good stability.
The support has a stable structure, can provide stable support for the installation of the first reflector, and is convenient to assemble and debug.
The height of the mounting plate is adjustable, and the light path can be conveniently changed through the lifting of the second reflecting mirror, so that the mounting plate is more flexible to apply and more convenient to debug.
Drawings
FIG. 1 is a perspective view of a wafer alignment polishing mechanism of the present utility model;
fig. 2 is a perspective view of a wafer alignment polishing mechanism with a protective cover of the present utility model.
Detailed Description
The objects, advantages and features of the present utility model are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the utility model, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the utility model.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in the specific orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The wafer alignment polishing mechanism disclosed by the utility model is described below with reference to the accompanying drawings, as shown in fig. 1, the wafer alignment polishing mechanism comprises a workbench 100 driven by a driving device 200 to rotate, a group of light holes 101 with equal circumferences are formed on the workbench 100, the number of the light holes 101 is four, circles formed by surrounding the light holes is concentric with the workbench 100, and the four light holes 101 are positioned on the outer side of the driving device 200.
A light source 300 and a light reflecting mechanism 400 are disposed below the table 100, and the light reflecting mechanism 400 reflects light emitted from the light source 300 to a predetermined position at the bottom of the table 100, where the predetermined position is a position where the light transmitting hole 101 can rotate.
As shown in fig. 1, the light source 300 may be a variety of known possible light sources 300, preferably a point light source, and the light source 300 is disposed on an adjusting member 500 for adjusting the height and horizontal position thereof. The adjusting part 500 comprises a bottom connecting plate 501, a mounting plate 502 and a light source fixing part 503, wherein the bottom connecting plate 501 is fixed on a slide carriage 700 where the driving device 200 is located, the mounting plate 502 is arranged on the bottom connecting plate 501 in an adjustable position, specifically, the mounting plate 502 is an L-shaped plate, two waist-shaped holes 504 are formed in a bottom transverse plate of the L-shaped plate, the extending directions of the two waist-shaped holes 504 are perpendicular to a side vertical plate of the mounting plate 502, the side surface of the side vertical plate, which is opposite to the bottom transverse plate, is provided with the light source fixing part 503, two strip-shaped holes 505 are formed in the side vertical plate, and the extending directions of the strip-shaped holes 505 are perpendicular to the extending directions of the waist-shaped holes 504, so that the light source fixing part 503 can be arranged on the side vertical plate in an adjustable position along the strip-shaped holes 505. The light source fixing member 503 may have a structure that is feasible, for example, the light source fixing member 503 has a fixing hole with an adjustable aperture, the axis of the fixing hole is parallel to the axis of the light transmitting hole 101, and the light source 300 is fixed in the fixing hole. Of course, the light source 300 may be fixed to the light source fixing member 503 in other manners, for example, by screwing the light source fixing member 503.
As shown in fig. 1, the light reflecting mechanism 400 includes a first reflecting mirror 401 and a second reflecting mirror 402, the first reflecting mirror 401 is disposed directly above the light source 300 and is disposed obliquely, the light emitted by the light source 300 is reflected by the first reflecting mirror 401 to the second reflecting mirror 402, and the second reflecting mirror 402 reflects the light to the predetermined position. The first mirror 401 and the second mirror 402 may also be known plane mirrors, which are not limited herein.
As shown in fig. 1, in order to facilitate the installation of the first reflective mirror 401, the first reflective mirror 401 is disposed on a bracket 403, the bracket 403 includes a first plate 404, a second plate 405 and a third plate 406 which are connected in a triangle shape, the first plate 404 is disposed on the first plate 404 and the second plate 405 in an inclined manner, the first reflective mirror 401 is disposed on the first plate 404, the second plate 405 is disposed horizontally and has disposed thereon a first through hole 407 corresponding to the light source 300 and the first reflective mirror 401, and the third plate 406 is disposed vertically and has disposed thereon a second through hole 408 corresponding to the first reflective mirror 401.
As shown in fig. 1, in order to facilitate the connection of the first plate 404 with the second plate 405 and the third plate 406 and to ensure the stable state thereof, a lower connection portion 409 is formed on the second plate 405, and the lower connection portion 409 is located on the top surface of the second plate 405 and is a triangular block. The third plate 406 has an upper connecting portion 410 formed thereon, and the upper connecting portion 410 is specifically located at a side of the second plate 405 facing the first plate 404 and is a triangular block. The upper and lower connection parts have flush inclined mounting surfaces, the first plate 404 is disposed at the inclined mounting surfaces of the upper and lower connection parts, and the first plate 404 is fastened at the upper and lower connection parts by screws during specific connection.
The second plate 405 and the third plate 406 may be formed by machining and bending, or may be assembled by welding, screwing, etc., and in order to ensure structural stability and support, the second plate 405 and the third plate 406 are integrally formed, preferably integrally injection-molded.
As shown in fig. 1, the second reflector 402 is disposed on a support plate 411, the support plate 411 is disposed obliquely, the second reflector 402 is parallel to the upper surface of the support plate 411, and the bottom of the support plate 411 is connected with a lifting device 412 for driving the support plate to lift, where the lifting device 412 may be a hydraulic cylinder, a linear motor, an electric push rod, or other viable elements, and the lifting device 412 is disposed on the slide carriage without limitation.
As shown in fig. 2, in order to facilitate the installation of the bracket 403 and protect the light source 300, the bracket 403 is disposed on a top plate 601 of a protection cover 600, the top plate 601 is enclosed on the periphery of the driving device 200, a side plate 602 of the protection cover 600 extends to below the light source 300 and shields the lifting device 412, and a avoidance hole corresponding to the light source 300 is disposed on the top plate 601.
Example 2
The embodiment discloses wafer processing equipment which comprises the wafer alignment polishing mechanism.
The utility model has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the utility model.
Claims (9)
1. The wafer alignment polishing mechanism comprises a workbench driven by a driving device to rotate, and a group of light holes with equal circumference are formed in the workbench, and the wafer alignment polishing mechanism is characterized in that: the light source and the light reflecting mechanism are arranged below the workbench, the light emitted by the light source can be reflected to a preset position at the bottom of the workbench by the light reflecting mechanism, and the preset position is a position where the light transmitting hole can rotate.
2. The wafer alignment polishing mechanism as set forth in claim 1, wherein: the light source is arranged on the adjusting piece for adjusting the height and the horizontal position of the light source.
3. The wafer alignment polishing mechanism as set forth in claim 1, wherein: the light reflecting mechanism comprises a first reflecting mirror and a second reflecting mirror, the first reflecting mirror is arranged right above the light source and obliquely arranged on the support, light rays emitted by the light source are reflected to the second reflecting mirror through the first reflecting mirror, and the second reflecting mirror is obliquely arranged on the support plate and can reflect the light rays to the preset position.
4. A wafer alignment polishing mechanism as recited in claim 3, wherein: the support is including being triangle-shaped connected first plate, second plate and third plate, first plate slope sets up on first plate and the second plate, first reflector sets up on the first plate, the second plate level set up and be provided with on it with the first perforation that light source and first reflector correspond, the vertical setting of third plate and on it be provided with the second perforation that first reflector corresponds.
5. The wafer alignment polishing mechanism as recited in claim 4, wherein: the second plate is provided with a lower connecting part, the third plate is provided with an upper connecting part, the upper connecting part and the lower connecting part are provided with flush inclined mounting surfaces, and the first plate is arranged at the inclined mounting surfaces of the upper connecting part and the lower connecting part.
6. The wafer alignment polishing mechanism as recited in claim 4, wherein: the second plate and the third plate are integrally formed.
7. A wafer alignment polishing mechanism as recited in claim 3, wherein: the support plate is connected with a lifting device for driving the support plate to lift.
8. A wafer alignment polishing mechanism as recited in claim 3, wherein: the support is arranged on a top plate of a protective cover, a side plate of the protective cover extends to the lower side of the light source, and an avoidance hole corresponding to the light source is formed in the top plate.
9. Wafer processing equipment, its characterized in that: a wafer alignment polishing mechanism comprising any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315053.XU CN220428880U (en) | 2023-08-28 | 2023-08-28 | Wafer alignment polishing mechanism and wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315053.XU CN220428880U (en) | 2023-08-28 | 2023-08-28 | Wafer alignment polishing mechanism and wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220428880U true CN220428880U (en) | 2024-02-02 |
Family
ID=89699020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322315053.XU Active CN220428880U (en) | 2023-08-28 | 2023-08-28 | Wafer alignment polishing mechanism and wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220428880U (en) |
-
2023
- 2023-08-28 CN CN202322315053.XU patent/CN220428880U/en active Active
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