CN220428071U

CN220428071U - Semiconductor clamp

Info

Publication number: CN220428071U
Application number: CN202321492198.0U
Authority: CN
Inventors: 韦梅杰; 曹毓国; 包晗
Original assignee: Jiangsu Mingfu Kaicheng Semiconductor Research Institute Co ltd
Current assignee: Jiangsu Mingfu Kaicheng Semiconductor Research Institute Co ltd
Priority date: 2023-06-13
Filing date: 2023-06-13
Publication date: 2024-02-02
Anticipated expiration: 2033-06-13

Abstract

The utility model relates to a semiconductor clamp which comprises a mounting frame, wherein a driving assembly is arranged on the inner side of the mounting frame, a clamping assembly is arranged on the driving assembly, the driving assembly comprises a supporting block, one end of the supporting block is fixedly connected with the inner side wall of the mounting frame, the upper end part of the supporting block is slidably connected with a supporting plate, the upper end part of the supporting plate is fixedly connected with two fixing blocks, the outer side of a right side fixing block is fixedly provided with a servo motor, and an output shaft of the servo motor is fixedly connected with a screw rod, one end of the screw rod penetrates through the right side fixing block and is rotatably connected with a left side fixing block. This semiconductor clamp, through the cooperation of extrusion piece grip block, when the rotating electrical machines that starts drives the go-between through support column and connecting rod and rotate, can drive the arc face of extrusion piece inclined plane extrusion grip block, drive the centre of a circle department removal of grip block towards the support column, it is fixed to place the semiconductor sheet of multiple size and shape on the board to carry out the centre of a clamp, improves the suitability of whole clamp.

Description

Semiconductor clamp

Technical Field

The utility model relates to the technical field of clamps, in particular to a semiconductor clamp.

Background

The fixture is a technological device for rapidly fastening workpieces during machining, so that a machine tool, a cutter and the workpieces keep correct relative positions, is an indispensable component for machining, and is driven by the development of machine tool technology to high-speed, high-efficiency, precise, compound, intelligent and environment-friendly directions, so that the fixture technology is developing to high-precision, high-efficiency, module, combination, general and economic directions.

The semiconductor can also use the gauge to carry out clamping processing in the course of working generally, like the utility model of bulletin No. CN216902878U, the disclosed clamp for semiconductor chip processing uses through the mutual cooperation of bottom plate, spring cylinder, first spring, connecting plate, connecting block, connecting axle, push rod, connecting rod, bolt, clamp splice, slider and slide rail, can make the device firm with the product centre gripping, the problem that the offset influences the processing effect when processing of general clamp for semiconductor chip processing leads to the product because of the unstable product of centre gripping becomes flexible appears, the damage rate of product has been reduced, the yield of product has been improved, product processing's efficiency has been improved, thereby further the practicality of device has been improved.

However, when the clamp in the above application is used for semiconductor workpieces, the clamping specification is relatively single, and the clamp is not suitable for fixing semiconductor wafers of various sizes and shapes, so that the suitability of the whole clamp is reduced, and the whole clamp still has a certain limitation in the use process, so that the semiconductor clamp is proposed to solve the above problems.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a semiconductor clamp which has the advantages of improving the adaptability of the whole clamp and the like, and solves the problem of lower adaptability of the whole clamp.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor clamp comprises a mounting frame, wherein a driving assembly is arranged on the inner side of the mounting frame, and a clamping assembly is arranged on the driving assembly;

the driving assembly comprises a supporting block, one end of the supporting block is fixedly connected with the inner side wall of the mounting frame, the upper end part of the supporting block is slidably connected with a supporting plate, the upper end part of the supporting plate is fixedly connected with two fixing blocks, the right side of the supporting plate is fixedly provided with a servo motor, an output shaft of the servo motor is fixedly connected with a screw rod, one end of the screw rod penetrates through the right side fixing block and is rotationally connected with the left side fixing block, the outer side of the screw rod is in threaded connection with a supporting seat, the inner side of the fixing block is fixedly connected with a cross rod, one end of the cross rod penetrates through the supporting seat, the lower end part of the supporting plate is fixedly provided with a driving motor, the output end of the driving motor is fixedly connected with a gear, and the outer side of the supporting block is fixedly connected with a rack, one end of which is meshed with the gear;

the clamping assembly comprises a rotating motor, the mounting groove has been seted up to the upper end of supporting seat, rotating motor fixedly connected with is in the inboard of mounting groove, the output shaft fixedly connected with support column of rotating motor, the upper end fixedly connected with montant of supporting seat, the upper end fixedly connected with of montant places the board, place the inside of board and seted up the perforation, the outside fixedly connected with connecting rod of support column, the one end fixedly connected with go-between of connecting rod, the inboard fixedly connected with extrusion piece of go-between, the inboard sliding connection of perforation has one end to extend to the inboard grip block of go-between, the gag lever post that the one end runs through the grip block of perforated inboard fixedly connected with one end, fixedly connected with spring between grip block and the perforated inboard.

Further, the screw hole that is located the screw rod outside is offered to the inside of supporting seat, the screw hole cooperates with the screw thread in the screw rod outside.

Further, the upper end fixedly connected with one end of supporting shoe extends to the inside slider of backup pad, the spout that is located the slider outside has been seted up to the lower tip of backup pad, spout and slider sliding connection, the slider is the T font.

Further, the number of the through holes and the clamping blocks is four, and the four clamping blocks and the through holes are distributed on the placing plate in an annular equidistant mode.

Further, the extrusion block is triangular, and one side of the clamping block, which is close to the connecting ring, is arc-shaped.

Further, the inboard fixedly connected with antiskid rubber pad of grip block, the spacing hole in the gag lever post outside has been seted up to the inside of grip block.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this semiconductor clamp, through the cooperation of extrusion piece grip block, when the rotating electrical machines that starts drives the go-between through support column and connecting rod and rotate, can drive the arc face of extrusion piece inclined plane extrusion grip block, drive the centre of a circle department removal of grip block towards the support column, it is fixed to place the semiconductor sheet of multiple size and shape on the board to carry out the centre of a clamp, improves the suitability of whole clamp.

2. This semiconductor clamp, through the cooperation of screw rod and gear, when making the servo motor that starts drive the screw rod and rotate, can drive the horizontal reciprocating motion of supporting seat on the horizontal pole, and the driving motor that starts drives the gear and rotate, after with the rack cooperation, can drive backup pad back and forth reciprocating motion on the supporting shoe, drive the semiconductor sheet material of fixing and carry out diversified removal, improve the machining efficiency of semiconductor sheet material.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a clamping assembly according to the present utility model;

FIG. 3 is a top view of the connecting ring structure of the present utility model.

In the figure: 1 mounting frame, 2 driving components, 21 supporting blocks, 22 supporting plates, 23 fixing blocks, 24 screw rods, 25 cross rods, 26 supporting seats, 27 racks, 28 gears, 29 driving motors, 210 servo motors, 3 clamping components, 31 mounting grooves, 32 rotating motors, 33 connecting rods, 34 connecting rings, 35 perforations, 36 springs, 37 supporting columns, 38 limiting rods, 39 clamping blocks, 310 placing plates, 311 extrusion blocks and 312 vertical rods.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-2, a semiconductor clamp in this embodiment includes a mounting frame 1, a driving assembly 2 is disposed on an inner side of the mounting frame 1, and a clamping assembly 3 is disposed on the driving assembly 2.

The drive assembly 2 includes the supporting shoe 21 of one end and the inside wall fixed connection of mounting bracket 1, the upper end sliding connection of supporting shoe 21 has backup pad 22, the upper end fixedly connected with of backup pad 22 is fixed block 23 that is two in quantity, the outside fixed mounting of right side fixed block 23 has servo motor 210, servo motor 210's output shaft fixedly connected with one end runs through right side fixed block 23 and rotates the screw rod 24 of being connected with left side fixed block 23, screw rod 24's outside threaded connection has supporting seat 26, the inboard fixedly connected with one end of fixed block 23 runs through the horizontal pole 25 of supporting seat 26, the lower tip fixed mounting of backup pad 22 has driving motor 29, driving motor 29's output fixedly connected with gear 28, the outside fixedly connected with one end of supporting shoe 21 and gear 28 meshed rack 27.

In this embodiment, when the started servo motor 210 drives the screw 24 to rotate, the support base 26 can be driven to reciprocate transversely on the cross bar 25, and the started driving motor 29 drives the gear 28 to rotate, and after being matched with the rack 27, the support plate 22 can be driven to reciprocate back and forth on the support block 21, so as to drive the fixed semiconductor wafer to move in multiple directions.

The support seat 26 is internally provided with a threaded hole positioned at the outer side of the screw 24, and the threaded hole is matched with threads at the outer side of the screw 24, so that the rotating screw 24 can drive the support seat 26 to transversely reciprocate at the outer side of the cross rod 25.

In addition, the upper end of the support block 21 is fixedly connected with a sliding block, one end of which extends to the inside of the support block 22, the lower end of the support block 22 is provided with a sliding groove positioned at the outer side of the sliding block, the sliding groove is in sliding connection with the sliding block, and the sliding block is T-shaped, so that when the support block 22 is driven by the gear 28 and the rack 27, the sliding block can stably slide back and forth on the support block 21 through the sliding block and the sliding groove.

Referring to fig. 2-3, in this embodiment, the clamping assembly 3 includes a rotating motor 32, an installation groove 31 is formed at an upper end portion of a supporting seat 26, the rotating motor 32 is fixedly connected to an inner side of the installation groove 31, an output shaft of the rotating motor 32 is fixedly connected with a supporting column 37, an upper end portion of the supporting seat 26 is fixedly connected with a vertical rod 312, an upper end portion of the vertical rod 312 is fixedly connected with a placing plate 310, a through hole 35 is formed in an inner portion of the placing plate 310, a connecting rod 33 is fixedly connected to an outer side of the supporting column 37, one end of the connecting rod 33 is fixedly connected with a connecting ring 34, an extrusion block 311 is fixedly connected to an inner side of the connecting ring 34, one end of the inner side of the through hole 35 is slidably connected with a clamping block 39, one end of the inner side of the through hole 35 penetrates through a limiting rod 38 of the clamping block 39, and a spring 36 is fixedly connected between the clamping block 39 and the inner side of the through hole 35.

In this embodiment, when the started rotating motor 32 drives the connecting ring 34 to rotate through the support column 37 and the connecting rod 33, the extrusion block 311 can be driven to extrude the arc surface of the clamping block 39 by the inclined surface, so as to drive the clamping block 39 to move towards the center of the support column 37, so as to clamp and fix semiconductor wafers with various sizes and shapes placed on the placing plate 310.

The number of the through holes 35 and the clamping blocks 39 is four, and the four clamping blocks 39 and the through holes 35 are distributed on the placing plate 310 at equal intervals in a ring shape, so that the semiconductor wafer placed on the placing plate 210 can be stably clamped and fixed by the four movable clamping blocks 39.

In addition, the extruding block 311 is triangular, and one side of the clamping block 39, which is close to the connecting ring 34, is arc-shaped, so that the arc-shaped end of the clamping block 39 can be extruded by the rotating extruding block 311, thereby driving the clamping block 39 to slide on the limiting block 38.

Secondly, an anti-skid rubber pad is fixedly connected to the inner side of the clamping block 39, and a limiting hole positioned on the outer side of the limiting rod 38 is formed in the clamping block 39, so that the clamping block 39 can stably slide in the inner side of the through hole 35.

The working principle of the embodiment is as follows:

after the semiconductor sheet to be processed is placed on the placing plate 310, the rotating motor 32 can be started to drive the supporting column 37, the connecting rod 33 and the connecting ring 34 to rotate in an annular mode, the rotating connecting ring 34 drives the four extrusion blocks 311 to rotate in a following mode, the inclined faces of the oiling blocks 311 can extrude the arc faces of the clamping blocks 39 to drive the clamping blocks 39 to move towards the circle center of the supporting column 37 in the through holes 35, the semiconductor sheet placed on the placing plate 310 is clamped and fixed in various sizes and shapes, the suitability of the whole clamp is improved, the started servo motor 210 can drive the supporting seat 26 to transversely reciprocate on the cross rod 25 when driving the screw 24 to rotate, the started driving motor 29 can drive the gear 28 to rotate, and after being matched with the rack 27, the supporting plate 22 can be driven to reciprocate back and forth on the supporting block 21 to drive the fixed semiconductor sheet to move in a multidirectional mode, and the processing efficiency of the semiconductor sheet is improved.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Semiconductor clamp, including mounting bracket (1), its characterized in that: a driving assembly (2) is arranged on the inner side of the mounting frame (1), and a clamping assembly (3) is arranged on the driving assembly (2);

the driving assembly (2) comprises a supporting block (21) with one end fixedly connected with the inner side wall of the mounting frame (1), the upper end part of the supporting block (21) is slidably connected with a supporting plate (22), the upper end part of the supporting plate (22) is fixedly connected with two fixed blocks (23), a servo motor (210) is fixedly arranged on the outer side of the fixed blocks (23), an output shaft of the servo motor (210) is fixedly connected with a screw rod (24) with one end penetrating through the right fixed block (23) and rotationally connected with the left fixed block (23), the outer side of the screw rod (24) is in threaded connection with a supporting seat (26), one end of the inner side of the fixed block (23) is fixedly connected with a cross rod (25) with one end penetrating through the supporting seat (26), the lower end part of the supporting plate (22) is fixedly connected with a driving motor (29), the output end of the driving motor (29) is fixedly connected with a gear (28), and the outer side of the supporting block (21) is fixedly connected with a rack (27) with one end meshed with the gear (28).

The utility model provides a clamping assembly (3) is including rotating motor (32), mounting groove (31) have been seted up to the upper end of supporting seat (26), the inboard at mounting groove (31) of rotation motor (32) fixed connection, the output shaft fixedly connected with support column (37) of rotation motor (32), the upper end fixedly connected with montant (312) of supporting seat (26), the upper end fixedly connected with of montant (312) places board (310), perforation (35) have been seted up to the inside of placing board (310), the outside fixedly connected with connecting rod (33) of support column (37), the one end fixedly connected with go-between (34) of connecting rod (33), the inboard fixedly connected with extrusion piece (311) of go-between (34), the inboard sliding connection of perforation (35) has one end to extend to the inboard grip block (39) of go-between (39), the inboard fixedly connected with one end of perforation (35) runs through stop lever (38), fixedly connected with spring (36) between grip block (39) and the inboard of perforation (35).

2. A semiconductor clip according to claim 1, wherein: the inside of supporting seat (26) is offered and is located the screw hole in screw rod (24) outside, the screw hole cooperates with the screw thread in screw rod (24) outside.

3. A semiconductor clip according to claim 1, wherein: the upper end of the supporting block (21) is fixedly connected with a sliding block, one end of the sliding block extends to the inside of the supporting plate (22), a sliding groove positioned on the outer side of the sliding block is formed in the lower end of the supporting plate (22), the sliding groove is in sliding connection with the sliding block, and the sliding block is in a T shape.

4. A semiconductor clip according to claim 1, wherein: the number of the through holes (35) and the clamping blocks (39) is four, and the four clamping blocks (39) and the through holes (35) are distributed on the placing plate (310) in an annular equidistant mode.

5. A semiconductor clip according to claim 1, wherein: the extrusion block (311) is triangular, and one side of the clamping block (39) close to the connecting ring (34) is arc-shaped.

6. A semiconductor clip according to claim 1, wherein: the inner side of the clamping block (39) is fixedly connected with an anti-slip rubber pad, and a limiting hole positioned on the outer side of the limiting rod (38) is formed in the clamping block (39).