CN220427081U

CN220427081U - Nozzle applicable to blind area welding and selective wave soldering device

Info

Publication number: CN220427081U
Application number: CN202322075182.6U
Authority: CN
Inventors: 刘元; 窦小明; 姜加伟
Original assignee: Quick Intelligent Equipment Co ltd
Current assignee: Quick Intelligent Equipment Co ltd
Priority date: 2023-08-02
Filing date: 2023-08-02
Publication date: 2024-02-02
Anticipated expiration: 2033-08-02

Abstract

The utility model relates to the technical field of welding nozzles, in particular to a nozzle applicable to blind area welding and a selective wave crest welding device, wherein the nozzle is provided with a main body section and a bias part protruding out of the side wall of one side of the top end of the main body section; the offset part is designed on the main body section, so that the offset part can enter the blind area, and the welding area above the inside of the blind area is welded by spraying molten solder from the working area on the offset part, thereby overcoming the interference of the blind area structure on welding and realizing the selective wave soldering of the blind area; the gap of the reflow region is arranged in a staggered manner with the working region, so that the reflow molten solder is prevented from falling onto the shielding surface of the blind region, the workpiece is prevented from being polluted, the contact opportunity of the molten solder and oxygen can be reduced, the cleaning period of the nozzle can be prolonged, and the cost is saved.

Description

Nozzle applicable to blind area welding and selective wave soldering device

Technical Field

The utility model relates to the technical field of welding nozzles, in particular to a nozzle applicable to blind zone welding, and also relates to a selective wave crest welding device comprising the nozzle applicable to blind zone welding.

Background

In the field of PCB board welding, a selective wave soldering device is generally adopted to carry out welding operation, for example, a wave soldering furnace for wave soldering is disclosed in Chinese patent publication No. CN107252946A, which mainly adopts a nozzle with an annular structure, when in welding, the middle of the nozzle upwards ejects wave crests, then a welding area is welded, and meanwhile, ejected tin liquid falls from the periphery of the nozzle and flows back into a tin pot again;

however, when the nozzle of the crest beating furnace is used for welding the special-shaped workpiece plate, if the welding area of the special-shaped workpiece plate is in a narrow space (blind area), the welding can be difficult to be completed, and the molten tin reflowed during the welding also easily falls at the bottom of the narrow space of the workpiece plate, so that the workpiece plate is polluted.

Disclosure of Invention

The utility model aims to solve the technical problems that: in order to solve the problems that a nozzle for selective wave soldering is difficult to weld a welding area of a special-shaped workpiece plate in a narrow space and molten tin reflowed during welding is easy to fall to the bottom of the workpiece plate in the narrow space, so that the workpiece plate is polluted, the nozzle applicable to blind area welding is provided, and the selective wave soldering device comprising the nozzle applicable to blind area welding is also provided.

The technical scheme adopted for solving the technical problems is as follows: a nozzle applicable to blind zone welding comprises a main body section and a biasing part protruding out of one side wall of the top end of the main body section, wherein a channel for molten solder to flow is formed in the main body section;

the top end of the nozzle is provided with an upward opening spraying cavity, one side of the inside of the spraying cavity is a working area positioned at the top end of the biasing part, the other side of the inside of the spraying cavity is a backflow area positioned at the top end of the main body section, and at least one side of the backflow area is provided with a notch;

the channel is communicated with the working area and is used for supplying molten solder to the working area;

the molten solder sprayed above the working area is used for contacting with a welding area of the workpiece so as to perform welding operation;

the working area and the reflow area are in communication with each other such that molten solder flows from the working area to the reflow area and spills outwardly through the gap.

Further, the outer wall of the main body section is provided with a downward extending guide groove at the side where the notch is located, and the upper end of the guide groove extends to the notch and is communicated with the notch.

Further, the direction from the working area to the backflow area is a first direction, the notches are formed in two sides of the backflow area in the second direction, the second direction is perpendicular to the first direction, the outer walls of two sides of the main body section in the second direction are provided with diversion trenches, and the upper ends of the diversion trenches extend to the notches of the sides of the diversion trenches and are communicated with the notches of the sides of the diversion trenches.

Further, the groove bottom of the diversion trench gradually inclines from top to bottom in a direction away from the central line of the backflow area.

Further, the bottom of the working area is a second bottom wall surface, the bottom of the backflow area is a first bottom wall surface, and the height of the second bottom wall surface is lower than that of the first bottom wall surface.

Further, a dam is arranged on the side of the ejection cavity, where the notch is located, the height of the top end face of the dam is higher than that of the first bottom wall face, and the top end face of the dam defines the bottommost end of the notch.

Further, one end of the second bottom wall surface far away from the backflow area is provided with a flow guide surface, the flow guide surface is gradually inclined from top to bottom towards the central line direction of the backflow area, one end of the flow guide surface far away from the backflow area is connected with one side wall of the working area far away from the backflow area through a third bottom wall surface, and the height of the third bottom wall surface is higher than that of the second bottom wall surface but lower than that of the first bottom wall surface.

Further, the bottom end of the channel is provided with an inlet for introducing molten solder into the channel, the top end of the side wall of the channel is provided with a lateral hole, the channel is communicated with the bottom end of the working area through the lateral hole, and the lateral hole is arranged opposite to the flow guiding surface.

Further, the device also comprises a mounting seat, wherein the mounting seat is provided with a plug-in section, the peripheral wall of the plug-in section is provided with a positioning boss, and a communication hole is formed in the mounting seat;

the bottom end of the main body section is provided with a root, a mounting hole matched with the plug-in section is formed in the root, and at least one positioning groove matched with the positioning boss is formed in the inner peripheral wall of the mounting hole;

the inserting section is inserted into the mounting hole, the positioning boss is correspondingly positioned in the positioning groove, and the communication hole is communicated with the inlet of the channel.

The utility model also provides a selective wave soldering device which comprises the nozzle applicable to blind zone soldering.

The beneficial effects of the utility model are as follows: according to the nozzle applicable to blind area welding, the offset part is designed on the main body section, so that the offset part can enter the blind area, and the welding area above the inside of the blind area is welded by spraying molten solder from the working area on the offset part, so that the interference of a blind area structure on welding is overcome, and selective wave soldering of the blind area is realized; the gap of the reflow region is arranged in a staggered manner with the working region, so that the reflow molten solder is prevented from falling onto the shielding surface of the blind region, the workpiece is prevented from being polluted, the contact opportunity of the molten solder and oxygen can be reduced, the cleaning period of the nozzle can be prolonged, and the cost is saved.

Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the present application, which proceeds with reference to the accompanying drawings.

Drawings

The utility model will be further described with reference to the drawings and examples.

FIG. 1 is a three-dimensional schematic view of a nozzle side of the present utility model applicable to blind zone welding;

FIG. 2 is a three-dimensional schematic view of the other side of the nozzle of the present utility model applicable to blind zone welding;

FIG. 3 is a schematic cross-sectional view of a nozzle of the present utility model that is applicable to blind zone welding;

FIG. 4 is an enlarged partial schematic view of FIG. 3A;

FIG. 5 is a three-dimensional schematic view of a nozzle of the present utility model applicable to blind zone welding in selective wave soldering of a blind zone of a workpiece;

FIG. 6 is a schematic cross-sectional view of a nozzle of the present utility model applicable to blind zone welding in selective wave soldering of a blind zone of a workpiece.

In the figure: 1. the main body section (101), the backflow area (101 a), the first bottom wall surface (102), the channel (102 a), the inlet (102 b), the lateral hole (103), the notch (104) and the diversion trench;

2. a biasing portion 201, a working area 201a, a second bottom wall surface 201b, a guide surface 201c, and a third bottom wall surface;

3. root, 301, mounting hole, 301a, positioning groove;

4. a barrage;

5. the device comprises a mounting seat 501, an inserting section 501a, a positioning boss 501b and a communication hole;

6. a workpiece 601, a transverse portion 601a, a welding area 602, a longitudinal portion 602a, a shielding surface 603 and a blind area;

a1, a first direction, b1, a second direction, c1 and a central line.

Detailed Description

The utility model will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the utility model and therefore show only those features which are relevant to the utility model, and orientation and reference (e.g., up, down, left, right, etc.) may be used solely to aid in the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.

As shown in fig. 1-6, a nozzle applicable to blind zone welding is provided with a main body section 1 and a biasing part 2 protruding from one side wall of the top end of the main body section 1, wherein the biasing part 2 is integrally connected with the main body section 1, the main body section 1 can be, but is not limited to, a square structure, specifically, for example, two adjacent side walls of four side walls of the main body section 1 can be vertically arranged with each other, a channel 102 for molten solder to flow is formed in the main body section 1, and the molten solder can be flexibly selected according to practical selective wave soldering requirements, for example, the molten solder is molten tin;

the top end of the nozzle is provided with an upward opening spraying cavity, one side of the inside of the spraying cavity is provided with a working area 201 positioned at the top end of the biasing part 2, the other side of the inside of the spraying cavity is provided with a backflow area 101 positioned at the top end of the main body section 1, at least one side of the backflow area 101 is provided with a notch 103, and the height of the top end surface of the working area 201 is higher than the bottommost height of the notch 103;

the channel 102 communicates with the working area 201, and supplies molten solder to the working area 201;

as shown in fig. 5 and 6, molten solder ejected above the work area 201 is used to contact with the soldering region 601a of the work piece 6 to perform a soldering operation; the workpiece 6 may be a special-shaped PCB board, which has a transverse portion 601 and a longitudinal portion 602 connected below the transverse portion 601, the welding region 601a is located on the lower surface of the transverse portion 601, a shielding surface 602a protrudes from the longitudinal portion 602, and the shielding surface 602a is located directly below the welding region 601a, i.e. a space between the shielding surface 602a and the transverse portion 601 constitutes a narrow space, which may also be referred to as a blind area 603;

the working area 201 and the reflow area 101 communicate with each other such that molten solder flows from the working area 201 to the reflow area 101 and overflows out through the gap 103.

According to the nozzle applicable to blind area welding, the offset part 2 is designed on the main body section 1, so that the offset part 2 can enter the blind area 603, and the welding operation is carried out on the welding area 601a above the inside of the blind area 603 by spraying molten solder from the working area 201 on the offset part 2, so that the interference of the welding operation on the structure of the blind area 603 is overcome, selective wave soldering of the blind area 603 is realized, moreover, the notch 103 of the reflow area 101 forms a layout staggered with the working area 201, the molten solder sprayed from the working area 201 overflows through the notch 103 of the reflow area 101, the molten solder is ensured not to fall onto the shielding surface 602a of the blind area 603, the workpiece 6 is prevented from being polluted, and the molten solder overflowed from the notch 103 finally falls back into a molten solder container (such as a tin pot); here, compared with the conventional nozzle which sprays wave peaks from the middle upwards and falls down from the whole periphery to reflow into the tin pot, the molten solder in the embodiment can only flow out from the notch 103, so that the chance of the molten solder contacting with oxygen is greatly reduced in the flowing process, and the tin slag is correspondingly reduced by reducing the contact surface, thereby prolonging the cleaning period of the nozzle and saving the cost.

In some examples, as shown in fig. 1 and 2, the outer wall of the main body section 1 is located at the side of the notch 103 and is provided with a downward extending diversion trench 104, the upper end of the diversion trench 104 extends to the notch 103 and is communicated with the notch 103, so that molten solder flowing out of the notch 103 is limited to flow downwards into the tin pot along the diversion trench 104, the contact opportunity of the molten solder and oxygen is further reduced, and the generation of tin slag is reduced; and the parts other than the diversion trenches 104 attached to the outer wall of the main body section 1 during the downward flow of the molten solder are avoided.

When the notch 103 is formed on one side of the reflow region 101, the main body section 1 is correspondingly formed with the diversion trench 104 on one side, and when the notch 103 is formed on two sides of the reflow region 101, the main body section 1 is correspondingly formed with the diversion trench 104 on two sides, which is not limited in this embodiment, for example, the concrete structure of the main body section 1 with the diversion trench 104 on two sides may be: the direction from the working area 201 to the reflow area 101 is a first direction a1, the two sides of the reflow area 101 in a second direction b1 are provided with notches 103, the second direction b1 is perpendicular to the first direction a1, the outer walls of the two sides of the main body section 1 in the second direction b1 are provided with guide grooves 104, and the upper ends of the guide grooves 104 extend to the notches 103 on the side where the guide grooves 104 are located and are communicated with the notches 103 on the side where the guide grooves are located;

the center line c1 of the reflow region 101 specifically extends along the up-down direction, the first direction a1, the second direction b1 and the center line c1 are perpendicular to each other, the bottoms of the flow guide grooves 104 gradually incline from top to bottom in a direction away from the center line c1 of the reflow region 101, and the distance between the flow guide grooves 104 corresponding to the two sides gradually increases from top to bottom and is distributed in a splayed shape, so that effective guiding can be always formed on the molten solder in the downward flowing process.

In some examples, as shown in fig. 3 and 4, the bottom end of the channel 102 is provided with an inlet 102a for introducing molten solder into the channel 102, the top end of the side wall of the channel 102 is provided with a lateral hole 102b, the channel 102 is communicated with the bottom end of the working area 201 through the lateral hole 102b, the bottom of the working area 201 is provided with a second bottom wall surface 201a, the bottom of the reflow area 101 is provided with a first bottom wall surface 101a, and the height of the second bottom wall surface 201a is lower than that of the first bottom wall surface 101a, so that the molten solder supplied by the channel 102 can not directly enter the working area 201, but firstly enter the working area 201 and then flow to the reflow area 101, thereby being beneficial to forming a virtuous circle reflow path, and the virtuous circle of the molten solder is beneficial to improving the welding effect; when the molten solder enters the discharge chamber, the wave crest is discharged from the working area 201, and the volume of the working area 201 is small relative to the volume of the entire discharge chamber, so that the wave crest is advantageously discharged from the working area 201.

In some examples, as shown in fig. 1 and 4, a dam 4 is provided on the side of the ejection chamber where the notch 103 is located, and the dam 4 may extend into the working area 201, that is, two ends of the dam 4 may be respectively connected to two opposite side walls of the ejection chamber in the first direction a1, the height of the top end surface of the dam 4 is higher than the height of the first bottom wall surface 101a, and the top end surface of the dam 4 defines the bottommost portion of the notch 103, so that molten solder is collected in advance in the reflow area 101 and overflows through the notch 103, so that molten solder can flow stably at the ejection chamber.

In some examples, as shown in fig. 1 and 4, an end of the second bottom wall 201a away from the reflow region 101 has a guiding surface 201b, the guiding surface 201b gradually slopes from top to bottom toward the center line c1 of the reflow region 101, the end of the guiding surface 201b away from the reflow region 101 is connected to a side wall of the working region 201 away from the reflow region 101 through a third bottom wall 201c, the height of the third bottom wall 201c is higher than that of the second bottom wall 201a but lower than that of the first bottom wall 101a, the guiding surface 201b is opposite to the lateral hole 102b, the molten solder in the channel 102 collides with the guiding surface 201b when flowing into the working region 201 from the lateral hole 102b, and the guiding surface 201b guides the molten solder to flow upward, and may further increase the strength of the bottom of the working region 201 at the corner.

In some examples, as shown in fig. 5 and 6, the device further comprises a mounting seat 5, wherein the mounting seat 5 is specifically and fixedly mounted at a tin pot containing molten solder, the mounting seat 5 is provided with a plug-in section 501, the peripheral wall of the plug-in section 501 is provided with a positioning boss 501a, and a communication hole 501b is formed in the interior;

the bottom end of the main body section 1 is provided with a root part 3, the root part 3 can be integrally formed with the main body section 1, the cross section area of the nozzle at the root part 3 is larger than the cross section area of the main body section 1, the nozzle is in a structure with a thin main body section 1 and a thick root part 3, the root part 3 is internally provided with a mounting hole 301 matched with the plug-in section 501, the mounting hole 301 can be a round hole but not lower than the round hole, and the inner peripheral wall of the mounting hole 301 is provided with at least one positioning groove 301a matched with the positioning boss 501 a;

the inserting section 501 is inserted into the mounting hole 301, and the positioning boss 501a is correspondingly positioned in the positioning groove 301a, the cross sections of the positioning boss 501a and the positioning groove 301a can be arc-shaped, but not limited to, and the communication hole 501b is communicated with the inlet 102a of the channel 102; the circumferential positioning between the plug section 501 and the communication hole 501b can be realized through the matching of the positioning boss 501a and the positioning groove 301a, so that the nozzle can be accurately positioned and installed;

the positioning grooves 301a in the mounting hole 301 may be circumferentially spaced apart by a plurality of positioning grooves 301a, so that when the positioning boss 501a is matched with the positioning grooves 301a at different circumferential positions, the nozzle will correspondingly present different circumferential mounting orientations, thereby realizing that the nozzle has a plurality of mounting orientations.

In some examples, a selective wave soldering apparatus, including the nozzle applicable to the blind spot soldering, further includes a molten solder container for holding molten solder (the molten solder container is, for example, a tin pot, and the tin pot can heat and preserve the molten solder in the molten solder container), the mount 5 is fixed on the tin pot, and the molten solder in the tin pot can be pumped into the communication hole 501b of the mount 5 by a delivery pump, and then reaches the channel 102 of the nozzle through the communication hole 501b, and the delivery pump can be, but is not limited to, an electromagnetic pump, an impeller pump, and the like.

The working principle of the nozzle applicable to blind area welding is as follows:

during welding, the offset part 2 of the nozzle is positioned in the blind area 603 of the workpiece 6, so that the working area 201 is aligned with the welding area 601a above the inner part of the blind area 603;

starting an electromagnetic pump, pumping molten solder in a tin pot into a communication hole 501b and reaching a channel 102 through the communication hole 501b, then enabling the molten solder in the channel 102 to enter a working area 201 from a lateral hole 102b, and then upwards spraying out from the working area 201 to form wave peaks, so that the molten solder is contacted with a welding area 601a above the inside of a dead zone 603 for welding operation, then enabling the molten solder in the working area 201 to flow to a reflow zone 101 and overflow outwards from a notch 103 of the reflow zone 101, enabling the molten solder overflowed from the notch 103 to directly flow downwards into the tin pot along a diversion trench 104 to form a benign circulation reflow path, and improving the welding effect by virtue of the benign circulation of molten tin;

so, not only realized the selective wave soldering of blind area 603, but also can not pollute the shielding surface 602a in the blind area 603, can also reduce the contact chance with oxygen at the in-process that molten solder flows back to reduce the production of tin dross, prolong the clearance cycle of tin dross in the electromagnetic pump, and then practice thrift use cost.

The above-described preferred embodiments according to the present utility model are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims

1. The utility model provides a nozzle that can be applicable to blind area welding which characterized in that: the nozzle is provided with a main body section (1) and a biasing part (2) protruding out of the side wall of the top end side of the main body section (1), and a channel (102) for molten solder to flow is formed in the main body section (1);

the top end of the nozzle is provided with an upward opening spraying cavity, one side of the inside of the spraying cavity is a working area (201) positioned at the top end of the biasing part (2), the other side of the inside of the spraying cavity is a backflow area (101) positioned at the top end of the main body section (1), and at least one side of the backflow area (101) is provided with a notch (103);

the channel (102) is communicated with the working area (201) and supplies molten solder to the working area (201);

the molten solder sprayed above the working area (201) is used for contacting with a welding area (601 a) of the workpiece (6) so as to perform welding operation;

the working area (201) and the reflow area (101) are in communication with each other such that molten solder flows from the working area (201) to the reflow area (101) and overflows out through the gap (103).

2. The nozzle applicable to blind spot welding as set forth in claim 1, wherein: the outer wall of the main body section (1) is provided with a downward extending diversion trench (104) at the side where the notch (103) is located, and the upper end of the diversion trench (104) extends to the notch (103) and is communicated with the notch (103).

3. The nozzle applicable to blind spot welding as set forth in claim 2, wherein: the direction from the working area (201) to the backflow area (101) is a first direction (a 1), the notches (103) are formed in two sides of the backflow area (101) in a second direction (b 1), the second direction (b 1) is perpendicular to the first direction (a 1), guide grooves (104) are formed in the outer walls of two sides of the main body section (1) in the second direction (b 1), and the upper ends of the guide grooves (104) extend to the notches (103) of the side where the guide grooves are located and are communicated with the notches (103) of the side where the guide grooves are located.

4. The nozzle applicable to blind spot welding as set forth in claim 2, wherein: the groove bottom of the diversion groove (104) gradually inclines from top to bottom in a direction away from the central line (c 1) of the backflow area (101).

5. The nozzle applicable to blind spot welding as set forth in claim 1, wherein: the bottom of the working area (201) is a second bottom wall surface (201 a), the bottom of the backflow area (101) is a first bottom wall surface (101 a), and the height of the second bottom wall surface (201 a) is lower than that of the first bottom wall surface (101 a).

6. The nozzle applicable to blind spot welding as recited in claim 5, wherein: the side of the ejection cavity, which is located at the notch (103), is provided with a barrage (4), the height of the top end face of the barrage (4) is higher than that of the first bottom wall face (101 a), and the top end face of the barrage (4) defines the bottommost end of the notch (103).

7. The nozzle applicable to blind spot welding as recited in claim 5, wherein: one end of the second bottom wall surface (201 a) far away from the backflow area (101) is provided with a flow guide surface (201 b), the flow guide surface (201 b) is gradually inclined from top to bottom towards the central line (c 1) direction of the backflow area (101), one end of the flow guide surface (201 b) far away from the backflow area (101) is connected with one side wall of the working area (201) far away from the backflow area (101) through a third bottom wall surface (201 c), and the height of the third bottom wall surface (201 c) is higher than that of the second bottom wall surface (201 a) but lower than that of the first bottom wall surface (101 a).

8. The nozzle applicable to blind spot welding as recited in claim 7, wherein: the bottom end of the channel (102) is provided with an inlet (102 a) for introducing molten solder into the channel (102), the top end of the side wall of the channel (102) is provided with a lateral hole (102 b), the channel (102) is communicated with the bottom end of the working area (201) through the lateral hole (102 b), and the lateral hole (102 b) is arranged opposite to the flow guiding surface (201 b).

9. The nozzle applicable to blind spot welding as recited in claim 8, wherein: the device further comprises a mounting seat (5), wherein the mounting seat (5) is provided with a plug-in section (501), the peripheral wall of the plug-in section (501) is provided with a positioning boss (501 a), and a communication hole (501 b) is formed in the mounting seat;

the bottom end of the main body section (1) is provided with a root (3), the root (3) is internally provided with a mounting hole (301) matched with the plug-in section (501), and the inner peripheral wall of the mounting hole (301) is at least provided with a positioning groove (301 a) matched with the positioning boss (501 a);

the inserting section (501) is inserted into the mounting hole (301), the positioning boss (501 a) is correspondingly positioned in the positioning groove (301 a), and the communication hole (501 b) is communicated with the inlet (102 a) of the channel (102).

10. A selective wave soldering apparatus, characterized in that: a nozzle comprising a nozzle as claimed in any one of claims 1 to 9 which is suitable for blind zone welding.