CN220413507U - Ceramic sputtering furnace - Google Patents
Ceramic sputtering furnace Download PDFInfo
- Publication number
- CN220413507U CN220413507U CN202322057206.5U CN202322057206U CN220413507U CN 220413507 U CN220413507 U CN 220413507U CN 202322057206 U CN202322057206 U CN 202322057206U CN 220413507 U CN220413507 U CN 220413507U
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- pipeline
- magnetron sputtering
- sputtering target
- cooling
- mounting
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- 239000000919 ceramic Substances 0.000 title claims abstract description 27
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 27
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 68
- 238000001816 cooling Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000002826 coolant Substances 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 17
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 239000013077 target material Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model relates to a ceramic sputtering furnace, which comprises a shell, a magnetron sputtering target assembly and a cooling medium source, wherein the shell is provided with a vacuum chamber; the magnetron sputtering target assembly comprises a magnetron sputtering target and a cooling pipeline, the magnetron sputtering target is arranged in a vacuum chamber, the magnetron sputtering target is provided with a mounting cavity with an opening at one side, the opening is arranged on the end face of one end of the magnetron sputtering target, the cooling pipeline is arranged in the mounting cavity, the cooling pipeline comprises a first pipeline and a second pipeline, the first pipeline extends spirally around the second pipeline and is matched with the mounting cavity, one end of the first pipeline is communicated with one end of the second pipeline, the other end of the first pipeline is provided with a liquid inlet, and the other end of the second pipeline is provided with a liquid outlet; the cooling medium source is respectively communicated with the liquid inlet and the liquid outlet, and is used for conveying cooling medium from the liquid inlet into the cooling pipeline. The utility model can obviously improve the heat dissipation and cooling effects of the magnetron sputtering target.
Description
Technical Field
The utility model relates to the technical field of coating equipment, in particular to a ceramic sputtering furnace.
Background
The principle of magnetron sputtering deposition film is that a certain voltage is applied between an anode and a cathode sputtering target material to form a static field with enough intensity, then, relatively easy ionized inert gas is introduced into a vacuum chamber, gas ionization glow discharge is generated under the action of the static field, the inert gas ionizes and produces high-energy inert gas cations and secondary electrons, the high-energy inert gas cations fly to the surface of the cathode sputtering target in an accelerating way under the action of the electric field, the surface of the target material is bombarded by high energy, sputtering action is carried out on the surface of the target material, and sputtered target atoms are deposited on a substrate to form the film.
In the working process of the magnetron sputtering coating machine, the temperature of the magnetron sputtering target is continuously increased, and when the temperature of the magnetron sputtering target is too high, the generated radiant heat is easy to cause the deformation of the base film, the coating is affected, and the cooling effect of the conventional magnetron sputtering coating machine is poor.
Disclosure of Invention
In view of the foregoing, it is necessary to provide a ceramic sputtering furnace for solving the technical problem of poor cooling effect in the prior art.
The present utility model provides a ceramic sputtering furnace comprising:
a housing provided with a vacuum chamber;
the magnetron sputtering target assembly comprises a magnetron sputtering target and a cooling pipeline, wherein the magnetron sputtering target is arranged in the vacuum chamber, the magnetron sputtering target is provided with a mounting cavity with an opening at one side, the opening is formed in the end face of one end of the magnetron sputtering target, the cooling pipeline is arranged in the mounting cavity, the cooling pipeline comprises a first pipeline and a second pipeline, the first pipeline is spirally extended around the second pipeline and is matched with the mounting cavity, one end of the first pipeline is communicated with one end of the second pipeline, the other end of the first pipeline is provided with a liquid inlet, and the other end of the second pipeline is provided with a liquid outlet which extends out of the mounting cavity from the opening;
and the cooling medium source is respectively communicated with the liquid inlet and the liquid outlet and is used for conveying cooling medium from the liquid inlet to the cooling pipeline.
Optionally, the magnetron sputtering target includes mount pad and target, the mount pad install in the vacuum chamber, the mount pad cavity sets up in order to constitute the installation cavity, the target is the tube-shape setting, the target cover is located the periphery of mount pad.
Optionally, the magnetron sputtering target further comprises a plugging cover, the plugging cover is arranged at the opening, the plugging cover is used for plugging the installation cavity, two avoidance holes are formed in the plugging cover, corresponding to the first pipeline and the second pipeline, and the two avoidance holes are respectively matched with the first pipeline and the second pipeline.
Optionally, the shell is provided with a mounting hole communicated with the vacuum chamber, the upper end of the mounting seat extends out of the vacuum chamber from the mounting hole, and the circumference of the upper end of the mounting seat is provided with threads;
the magnetron sputtering target further comprises a lock nut, and the lock nut is in threaded fit with the mounting seat so as to fix the mounting seat.
Optionally, the magnetron sputtering target further comprises a sealing member, wherein the sealing member is arranged in the mounting hole and is in sealing fit with the periphery of the mounting seat, and the sealing member is used for sealing the mounting hole.
Optionally, the cooling pipeline further comprises a connecting pipeline, the connecting pipeline extends along the horizontal direction, and two ends of the connecting pipeline are respectively connected with the first pipeline and the second pipeline.
Optionally, the ceramic sputtering furnace further comprises a connecting piece, wherein the connecting piece is arranged at the bottom of the installation cavity and connected with the connecting pipeline for fixing the cooling pipeline.
Optionally, the connecting piece includes mutually supporting magnetic part and adsorption piece, the magnetic part is located the bottom of installation cavity, the adsorption piece is located connecting tube, the magnetic part with the cooperation is inhaled to the adsorption piece magnetism, so that will connecting tube is fixed in the bottom of installation cavity.
Optionally, the magnetron sputtering target assembly is provided with a plurality of magnetron sputtering target assemblies, and the magnetron sputtering target assemblies are arranged in the vacuum chamber at intervals.
Optionally, the housing is provided with an outlet communicating with the vacuum chamber;
the ceramic sputtering furnace further comprises a door body, the door body is rotatably installed on the shell and corresponds to the outlet, and the door body is used for opening and closing the outlet.
Compared with the prior art, in the ceramic sputtering furnace provided by the utility model, the magnetron sputtering target is arranged in the vacuum chamber, the mounting cavity is arranged on the magnetron sputtering target, the cooling pipeline is arranged in the mounting cavity and comprises the first pipeline and the second pipeline, the first pipeline extends around the second pipeline in a spiral shape and is matched with the mounting cavity, one end of the first pipeline is communicated with one end of the second pipeline, the other end of the first pipeline is provided with the liquid inlet, the liquid outlet is arranged at the other end of the second pipeline, when the ceramic sputtering furnace is particularly used, the cooling medium is fed into the cooling pipeline from the liquid inlet, when the cooling medium flows in the cooling pipeline, heat exchange is carried out with the magnetron sputtering target, so that the temperature of the magnetron sputtering target is reduced, and finally, the cooling medium is discharged from the liquid outlet, and the cooling pipeline is arranged.
The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and its details set forth in the accompanying drawings. Specific embodiments of the present utility model are given in detail by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a schematic diagram of a ceramic sputtering furnace according to an embodiment of the present utility model;
FIG. 2 is a partial cross-sectional view of the ceramic sputtering furnace of FIG. 1;
FIG. 3 is an enlarged schematic view of portion A of FIG. 2;
FIG. 4 is an enlarged schematic view of portion B of FIG. 2;
FIG. 5 is a schematic front view of the magnetron sputtering target assembly of FIG. 1;
FIG. 6 is a schematic perspective view of the magnetron sputtering target assembly of FIG. 5;
fig. 7 is a schematic perspective view of the cooling duct of fig. 5.
Reference numerals illustrate:
1-shell, 11-vacuum chamber, 2-magnetron sputtering target assembly, 21-magnetron sputtering target, 211-mount, 2111-mount, 212-target, 22-cooling pipeline, 221-first pipeline, 222-second pipeline, 223-liquid inlet, 224-liquid outlet, 225-connecting pipeline; 23-plugging cover, 24-locking nut, 25-sealing element, 3-connecting element, 31-magnetic element, 32-absorbing element and 4-door body.
Detailed Description
Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings, which form a part hereof, and together with the description serve to explain the principles of the utility model, and are not intended to limit the scope of the utility model.
Referring to fig. 1 to 7, the ceramic sputtering furnace comprises a shell 1, a magnetron sputtering target assembly 2 and a cooling medium source, wherein the shell 1 is provided with a vacuum chamber 11; the magnetron sputtering target assembly 2 comprises a magnetron sputtering target 21 and a cooling pipeline 22, the magnetron sputtering target 21 is arranged in the vacuum chamber 11, the magnetron sputtering target 21 is provided with a mounting cavity 2111 with an opening at one side, the opening is arranged on the end face of one end of the magnetron sputtering target 21, the cooling pipeline 22 is arranged in the mounting cavity 2111, the cooling pipeline 22 comprises a first pipeline 221 and a second pipeline 222, the first pipeline 221 extends spirally around the second pipeline 222 and is matched with the mounting cavity 2111, one end of the first pipeline 221 is communicated with one end of the second pipeline 222, the other end of the first pipeline 221 is provided with a liquid inlet 223, the other end of the second pipeline 222 is provided with a liquid outlet 224, and the liquid inlet 223 and the liquid outlet 224 extend out of the mounting cavity 2111 from the opening; the cooling medium source is respectively communicated with the liquid inlet 223 and the liquid outlet 224, and is used for conveying the cooling medium from the liquid inlet 223 into the cooling pipeline 22.
In the ceramic sputtering furnace provided by the utility model, the magnetron sputtering target 21 is arranged in the vacuum chamber 11, the magnetron sputtering target 21 is provided with the installation cavity 2111, the cooling pipeline 22 is arranged in the installation cavity 2111, the cooling pipeline 22 comprises the first pipeline 221 and the second pipeline 222, the first pipeline 221 is spirally extended around the second pipeline 222 and is matched with the installation cavity 2111, one end of the first pipeline 221 is communicated with one end of the second pipeline 222, the other end of the first pipeline 221 is provided with the liquid inlet 223, the other end of the second pipeline 222 is provided with the liquid outlet 224, when the magnetron sputtering target 21 is specifically used, the cooling medium is fed into the cooling pipeline 22 from the liquid inlet 223, when the cooling medium flows in the cooling pipeline 22, heat exchange is carried out with the magnetron sputtering target 21, so that the temperature of the magnetron sputtering target 21 is reduced, and finally the cooling medium is discharged out of the cooling pipeline 22 from the liquid outlet 224, the inside each magnetron sputtering target is provided with the cooling pipeline 22, the heat of the magnetron sputtering target 21 is taken away, the purpose of greatly improving the heat exchange effect of the magnetron sputtering target 21 is achieved, the first heat exchange effect of the magnetron sputtering target 21 is greatly improved, and the first heat exchange effect of the magnetron sputtering target 21 is greatly improved, and the heat exchange effect is greatly improved, and the first heat exchange effect is greatly improved.
Specifically, the specific form of the magnetron sputtering target 21 is not limited, in this embodiment, the magnetron sputtering target 21 includes a mounting seat 211 and a target 212, the magnetron sputtering target 21 includes the mounting seat 211 and the target 212, the mounting seat 211 is mounted in the vacuum chamber 11, the mounting seat 211 is hollow to form the mounting cavity 2111, the target 212 is in a cylindrical arrangement, and the target 212 is sleeved on the periphery of the mounting seat 211, so that the target 212 is detachably mounted on the mounting seat 211.
Specifically, in order to seal the installation cavity 2111, in this embodiment, the magnetron sputtering target 21 further includes a sealing cover 23, the sealing cover 23 is covered on the opening, the sealing cover 23 is used for sealing the installation cavity 2111, the sealing cover 23 is provided with two avoidance holes corresponding to the first pipeline 221 and the second pipeline 222, the two avoidance holes are respectively matched with the first pipeline 221 and the second pipeline 222, so that the sealing cover 23 can seal the installation cavity 2111, and can also play a limiting role on the first pipeline 221 and the second pipeline 222, so that the first pipeline 221 and the second pipeline 222 are prevented from shaking.
Specifically, since the magnetron sputtering target 21 is located in the vacuum chamber 11, in order to facilitate replacement of the target 212, in this embodiment, the housing 1 is provided with a mounting hole communicating with the vacuum chamber 11, the upper end of the mounting seat 211 extends out of the vacuum chamber 11 from the mounting hole, and a thread is provided on the circumference of the upper end of the mounting seat 211; the magnetron sputtering target 21 further comprises a lock nut 24, and the lock nut 24 is in threaded fit with the mounting base 211 to fix the mounting base 211. The mounting hole with the external diameter looks adaptation of target 212, during the concrete use, will earlier lock nut 24 is dismantled, will target 212 is taken out from mounting hole department, later to change target 212, after waiting to change to accomplish, lock nut 24 with mount pad 211 screw thread fit, so set up, it is convenient to change, improved work efficiency, and, lock nut 24 can play the fixed effect of mount pad 211, and can also restrict target 212 moves along the radial direction, plays the fixed purpose of target 212.
Specifically, since the vacuum chamber 11 needs to be vacuumized, the vacuum chamber 11 needs to be sealed, so as to avoid air leakage at the mounting hole, in this embodiment, the magnetron sputtering target 21 further includes a sealing member 25, where the sealing member 25 is disposed in the mounting hole and is in sealing fit with the outer periphery of the mounting seat 211, and the sealing member 25 is used to seal the mounting hole. The mounting hole can be sealed by the arrangement, and air leakage at the mounting hole is avoided.
Specifically, the connection manner of the first pipe 221 and the second pipe 222 is not limited, and in this embodiment, the cooling pipe 22 further includes a connection pipe 225, the connection pipe 225 is disposed to extend in a horizontal direction, and two ends of the connection pipe 225 are connected to the first pipe 221 and the second pipe 222, respectively.
Specifically, since the overall length of the cooling pipe 22 is long, in order to avoid the cooling pipe 22 from shaking in the installation cavity 2111, in this embodiment, the ceramic sputtering furnace further includes a connector 3, the connector 3 is disposed at the bottom of the installation cavity 2111, and the connector 3 is connected to the connection pipe 225 for fixing the cooling pipe 22. So set up, the one end of cooling pipe 22 is passed through the shutoff lid 23 is spacing fixed, and the other end is passed through the connecting piece 3 is spacing fixed, can fix completely cooling pipe 22 avoids it to rock in installation cavity 2111.
Specifically, the specific form of the connector 3 is not limited, in this embodiment, the connector 3 includes a magnetic member 31 and an absorbing member 32 that are matched with each other, the magnetic member 31 is disposed at the bottom of the installation cavity 2111, the absorbing member 32 is disposed on the connecting pipe 225, and the magnetic member 31 is magnetically matched with the absorbing member 32 to fix the connecting pipe 225 at the bottom of the installation cavity 2111. Through the magnetic attraction and matching of the magnetic piece 31 and the adsorption piece 32, the purpose of fixing the cooling pipeline 22 can be achieved, and the installation and the disassembly are convenient.
Specifically, a plurality of magnetron sputtering target assemblies 2 are provided, and a plurality of magnetron sputtering target assemblies 2 are arranged in the vacuum chamber 11 at intervals.
Specifically, the housing 1 is provided with an outlet communicating with the vacuum chamber 11; the ceramic sputtering furnace further comprises a door body 4, the door body 4 is rotatably installed on the shell 1 and corresponds to the outlet, and the door body 4 is used for opening and closing the outlet.
The present utility model is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model.
Claims (10)
1. A ceramic sputtering furnace, comprising:
a housing provided with a vacuum chamber;
the magnetron sputtering target assembly comprises a magnetron sputtering target and a cooling pipeline, wherein the magnetron sputtering target is arranged in the vacuum chamber, the magnetron sputtering target is provided with a mounting cavity with an opening at one side, the opening is formed in the end face of one end of the magnetron sputtering target, the cooling pipeline is arranged in the mounting cavity, the cooling pipeline comprises a first pipeline and a second pipeline, the first pipeline is spirally extended around the second pipeline and is matched with the mounting cavity, one end of the first pipeline is communicated with one end of the second pipeline, the other end of the first pipeline is provided with a liquid inlet, and the other end of the second pipeline is provided with a liquid outlet which extends out of the mounting cavity from the opening;
and the cooling medium source is respectively communicated with the liquid inlet and the liquid outlet and is used for conveying cooling medium from the liquid inlet to the cooling pipeline.
2. The ceramic sputtering furnace according to claim 1, wherein the magnetron sputtering target comprises a mounting seat and a target material, the mounting seat is mounted in the vacuum chamber, the mounting seat is arranged in a hollow mode to form the mounting chamber, the target material is arranged in a cylindrical mode, and the target material is sleeved on the periphery of the mounting seat.
3. The ceramic sputtering furnace according to claim 2, wherein the magnetron sputtering target further comprises a plugging cover, the plugging cover is arranged at the opening and used for plugging the installation cavity, two avoidance holes are formed in the plugging cover corresponding to the first pipeline and the second pipeline, and the two avoidance holes are respectively matched with the first pipeline and the second pipeline.
4. A ceramic sputtering furnace according to claim 3, wherein the housing is provided with a mounting hole communicated with the vacuum chamber, the upper end of the mounting seat extends out of the vacuum chamber from the mounting hole, and the circumference of the upper end of the mounting seat is provided with threads;
the magnetron sputtering target further comprises a lock nut, and the lock nut is in threaded fit with the mounting seat so as to fix the mounting seat.
5. The ceramic sputtering furnace of claim 4 wherein the magnetron sputtering target further comprises a seal disposed within the mounting hole and in sealing engagement with the outer periphery of the mounting seat, the seal being configured to seal the mounting hole.
6. The ceramic sputtering furnace according to claim 1, wherein the cooling pipe further comprises a connecting pipe extending in a horizontal direction, and both ends of the connecting pipe are connected to the first pipe and the second pipe, respectively.
7. The ceramic sputtering furnace according to claim 6, further comprising a connecting member provided at a bottom of the mounting chamber, the connecting member being connected to the connecting pipe for fixing the cooling pipe.
8. The ceramic sputtering furnace according to claim 7, wherein the connecting member comprises a magnetic member and an adsorption member which are mutually matched, the magnetic member is arranged at the bottom of the installation cavity, the adsorption member is arranged on the connecting pipe, and the magnetic member is magnetically matched with the adsorption member so as to fix the connecting pipe at the bottom of the installation cavity.
9. The ceramic sputtering furnace of claim 1 wherein a plurality of said magnetron sputtering target assemblies are provided, a plurality of said magnetron sputtering target assemblies being spaced apart within said vacuum chamber.
10. Ceramic sputter furnace according to claim 1, characterized in that the housing is provided with an outlet communicating with the vacuum chamber;
the ceramic sputtering furnace further comprises a door body, the door body is rotatably installed on the shell and corresponds to the outlet, and the door body is used for opening and closing the outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322057206.5U CN220413507U (en) | 2023-07-31 | 2023-07-31 | Ceramic sputtering furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322057206.5U CN220413507U (en) | 2023-07-31 | 2023-07-31 | Ceramic sputtering furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220413507U true CN220413507U (en) | 2024-01-30 |
Family
ID=89642571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322057206.5U Active CN220413507U (en) | 2023-07-31 | 2023-07-31 | Ceramic sputtering furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220413507U (en) |
-
2023
- 2023-07-31 CN CN202322057206.5U patent/CN220413507U/en active Active
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