CN220402141U - Domain control host and vehicle for improving EMC reliability - Google Patents

Abstract

The utility model provides a domain control host for improving EMC reliability and a vehicle, wherein the domain control host for improving EMC reliability comprises a shell, a first storage position and a second storage position, wherein the first storage position is arranged at the top of the shell, the second storage position is arranged at the bottom of the shell, and a separation plate is arranged between the first storage position and the second storage position; the first circuit board is arranged on the first accommodating position; the second circuit board is arranged at the second accommodating position; the plug connectors are arranged at the end part of the shell, the number of the plug connectors is multiple, and the plug connectors are connected with the first circuit board and the second circuit board. This domain accuse host computer that promotes EMC reliability is used for holding the first holding position of first circuit board and is used for holding the second holding position of second circuit board through the casing formation, and first circuit board and second circuit board are layered structure, cancel the strong, the low problem of precision of seal that shield cover and shell fragment brought in original structure, have promoted the reliability that promotes the EMC of domain accuse host computer.

Description

Domain control host and vehicle for improving EMC reliability

Technical Field

The application relates to the technical field of automobile electronic products, in particular to a domain control host and a vehicle for improving EMC reliability.

Background

Electromagnetic compatibility (EMC, electromagnetic Compatibility) refers to the ability of a device or system to function properly in its electromagnetic environment without undue electromagnetic disturbance to anything in the environment, protecting on-board radios and other sensitive equipment, and requiring stringent electromagnetic immunity from the vehicle to ensure proper operation of the vehicle in a harsh electromagnetic environment. The electronic and electric components on the whole car occupy a great proportion, the electromagnetic compatibility problem is closely related to the safety of the whole car, and the EMC test of the car electronics has become one of the most serious challenges facing car manufacturers and suppliers. The current new energy automobile develops rapidly, the integration level of domain control fusion is high, and the reliability requirement on a host is very high.

The existing cabin domain control often cannot achieve a good effect on EMC test reliability, and mainly because of the top-down limitation of the existing domain control structure, the large-area exposure of the connector is likely to be caused, and EMC is easy to be disturbed. When the top cap machine casing, sub-circuit board, shield cover, main circuit board, bottom such top-down scheme are pressed in the domain accuse now, need have a shield cover between main circuit board and sub-circuit board, the shield cover is by metal shrapnel and support group layer, metal shrapnel machining precision is insufficient, bending deformation easily, lead to unable and connector body ground connection, and the support is the panel beating piece of bending, unable complete closure of accomplishing, EMC reliability greatly reduced, connector position failure probability is biggest.

Therefore, a domain master for improving EMC reliability is needed to solve the above problems.

Disclosure of Invention

In view of the above, in order to overcome the defects of the prior art, the utility model provides a domain control host and a vehicle for improving EMC reliability, and effectively solves the problem that the EMC reliability of the existing domain control host is reduced and the position of a connector is invalid due to the structure.

According to a first aspect of the present utility model, there is provided a domain master for improving EMC reliability, where the domain master for improving EMC reliability includes a housing having a first accommodating position and a second accommodating position, the first accommodating position is disposed at a top of the housing, the second accommodating position is disposed at a bottom of the housing, and a partition plate is disposed between the first accommodating position and the second accommodating position; the first circuit board is arranged on the first accommodating position; the second circuit board is arranged on the second accommodating position; the plug connectors are arranged at the end part of the shell, the number of the plug connectors is multiple, and the plug connectors are connected with the first circuit board and the second circuit board.

Preferably, the first circuit board is connected with the second circuit board through a connector, the isolation board is provided with a via hole, and the connector part penetrates through the via hole.

Preferably, the domain control host for improving EMC reliability further includes a first cover board and a second cover board, where the first cover board is covered on the first circuit board, and the second cover board is covered on the second circuit board; when the first cover plate is covered on the first circuit board, the periphery of the first cover plate protrudes out of the periphery of the first circuit board; and under the condition that the second cover plate is covered on the second circuit board, the periphery of the second cover plate protrudes out of the periphery of the second circuit board.

Preferably, a plurality of first accommodating grooves are formed at the end part of the first accommodating position, a plurality of second accommodating grooves are formed at the end part of the second accommodating position, and the plurality of first accommodating grooves and the plurality of second accommodating grooves are used for accommodating the plurality of plug connectors; the side edges of each first accommodating groove and the side edges of each second accommodating groove are formed into isolation rib plates.

Preferably, the isolating rib plate is provided with a plurality of conductive foam.

Preferably, the plurality of conductive foam is arranged on the top surface of the isolation rib plate of the first accommodating groove; the conductive foam is arranged on the bottom surface of the isolation rib plate of the second accommodating groove.

Preferably, the first circuit board contacts the conductive foam located on the top surface of the isolation rib plate of the first accommodating groove under the condition that the plug connector is plugged in the first accommodating groove; and under the condition that the plug connector is plugged in the second accommodating groove, the second circuit board contacts the conductive foam positioned on the bottom surface of the isolation rib plate of the second accommodating groove.

Preferably, the first accommodation position is disposed at a first end of the top of the housing, a second end of the top of the housing is formed with a heat dissipation air duct, the heat dissipation air duct includes a plurality of heat dissipation baffles, and the plurality of heat dissipation baffles are uniformly disposed at the second end of the top of the housing.

Preferably, the first circuit board is connected to the housing through first connectors, the number of the first connectors is plural, and the plural first connectors are uniformly disposed on the outer peripheral side of the first circuit board; the second circuit board is connected to the shell through second connecting pieces, the number of the second connecting pieces is multiple, and the second connecting pieces are uniformly arranged on the second circuit board.

According to a second aspect of the present utility model there is provided a vehicle, wherein the vehicle comprises a domain master for improving EMC reliability as described above.

According to the domain control host for improving EMC reliability, the first accommodating position for accommodating the first circuit board and the second accommodating position for accommodating the second circuit board are formed through the shell, the first circuit board and the second circuit board are designed to be of layered structures, the problems of weak tightness and low precision caused by the shielding cover and the elastic sheet in the original structure are solved, and the EMC reliability of the domain control host is improved.

In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 illustrates a schematic structure diagram of a domain master for improving EMC reliability according to an embodiment of the utility model;

fig. 2 is a schematic structural diagram illustrating internal components of a domain master for improving EMC reliability according to an embodiment of the utility model;

FIG. 3 shows a schematic structural diagram of a first storage bit according to an embodiment of the utility model;

FIG. 4 shows a schematic structural diagram of a second storage bit according to an embodiment of the utility model;

fig. 5 shows a bottom view of the first cover plate and the first circuit board according to an embodiment of the utility model;

fig. 6 shows a top view of a second cover plate and a second circuit board according to an embodiment of the utility model.

Reference numerals: 1-a housing; 101-a first accommodation bit; 102-a second accommodation bit; 103-a first accommodation groove; 104-a second accommodating groove; 105-isolating rib plates; 106-conductive foam; 107-vias; 108-isolating plates; 2-a first circuit board; 3-a second circuit board; 4-plug-in components; a 5-connector; 6-a first cover plate; 7-a second cover plate; 8-a heat dissipation baffle; 9-a heat radiation fan; 10-screws; 11-a third cover plate.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a thorough understanding of the methods, apparatus, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and/or systems described herein will be apparent after an understanding of the present disclosure. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but rather, obvious variations may be made upon an understanding of the present disclosure, other than operations that must occur in a specific order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided solely to illustrate some of the many possible ways of implementing the methods, devices, and/or systems described herein that will be apparent after a review of the disclosure of the present application.

In the entire specification, when an element (such as a layer, region or substrate) is described as being "on", "connected to", "bonded to", "over" or "covering" another element, it may be directly "on", "connected to", "bonded to", "over" or "covering" another element or there may be one or more other elements interposed therebetween. In contrast, when an element is referred to as being "directly on," directly connected to, "or" directly coupled to, "another element, directly on," or "directly covering" the other element, there may be no other element intervening therebetween.

As used herein, the term "and/or" includes any one of the listed items of interest and any combination of any two or more.

Although terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, component, region, layer or section discussed in examples described herein could also be termed a second member, component, region, layer or section without departing from the teachings of the examples.

For ease of description, spatially relative terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be oriented "below" or "lower" relative to the other element. Thus, the term "above … …" includes both orientations "above … …" and "below … …" depending on the spatial orientation of the device. The device may also be otherwise positioned (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. Singular forms also are intended to include plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are intended to specify the presence of stated features, integers, operations, elements, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, operations, elements, and/or groups thereof.

Variations from the shapes of the illustrations as a result, of manufacturing techniques and/or tolerances, are to be expected. Accordingly, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shapes that occur during manufacture.

The features of the examples described herein may be combined in various ways that will be apparent after an understanding of the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible as will be apparent after an understanding of the present disclosure.

According to the first aspect of the present utility model, as shown in fig. 1 to 6, the domain control host for improving EMC reliability may be used for a new energy automobile, and by adjusting the overall structure, two circuit boards are respectively disposed at the top and bottom of the housing 1, so as to cancel the shielding case in the original design scheme, avoid the problem of EMC reliability reduction caused by deformation of the spring plate and incomplete sealing of the bracket, and improve EMC reliability of the host. The domain master for improving EMC reliability may include a housing 1, a first circuit board 2, a second circuit board 3, and a plug 4.

In the following description, detailed structures of the housing 1, the first circuit board 2, the second circuit board 3, and the plug connector 4 of the domain master for improving EMC reliability will be described in detail with reference to fig. 1 to 6.

As shown in fig. 1 to 6, in the embodiment, the housing 1 is used as an overall structure and a main support of the domain master for improving EMC reliability, and two circuit boards are respectively disposed at the top and bottom of the housing 1 by improving the shape and specific structure of the housing 1. Specifically, the casing 1 has a first accommodation position 101 and a second accommodation position 102, the first accommodation position 101 is located at the top of the casing 1, the second accommodation position 102 is located at the bottom of the casing 1, and a separation plate 108 is disposed between the first accommodation position 101 and the second accommodation position 102, and since the first accommodation position 101 and the second accommodation position 102 respectively need to be mounted with a circuit board, the two accommodation positions need to be subjected to separation treatment, and the separation plate 108 is directly designed between the first accommodation position 101 and the second accommodation position 102, so that separation can be simply and efficiently realized. In addition, the first accommodating portion 101 may form a sealed first accommodating cavity with a first cover plate 6 described below, and the second accommodating portion 102 may form a sealed second accommodating cavity with a second cover plate 7 described below, for accommodating the first circuit board 2 and the second circuit board 3, respectively. Further, since the second circuit board 3 serves as a main circuit board and the first circuit board 2 serves as a sub circuit board in the embodiment, the first circuit board 2 is smaller in size than the second circuit board 3, and thus the second accommodating chamber is larger in volume than the first accommodating chamber.

As shown in fig. 1 to 6, in the embodiment, the first circuit board 2 and the second circuit board 3 may be circuit boards used in the prior art, and the structure, the circuit, and the like thereof are well known to those skilled in the art.

As shown in fig. 1 to 6, in the embodiment, the connectors 4 are disposed at the end of the housing 1, the number of connectors 4 may be plural, and the connectors 4 may be disposed at the top and bottom of the housing 1 and electrically connected to the first circuit board 2 and the second circuit board 3, respectively. One end of the plug connector 4 stretches into the first accommodating cavity and the second accommodating cavity, and the other end of the plug connector is positioned outside the shell 1, so that the plug connector is convenient to plug. In addition, since the number of the connectors 4 is plural, the specifications of the connectors 4 may be different, and specific selection may be performed according to the use requirement.

This domain accuse host computer that promotes EMC reliability cancels shield cover in the former design, arranges two circuit boards in the top and the bottom of casing 1 respectively, owing to form two inclosed accommodation cavity, avoids the EMC reliability reduction problem that leads to because of the shell fragment warp, the support can not be totally closed, promotes host computer EMC reliability.

Preferably, as shown in fig. 1 to 6, in the embodiment, the partition plate 108 of the housing 1 is provided with a via hole 107. Specifically, the first accommodating portion 101 is recessed downward from the top of the housing 1, and a via hole 107 is formed at an end of the recess, and the via hole 107 is used for passing through the connector 5. The first circuit board 2 and the second circuit board 3 may be connected by the connector 5, and the connector 5 may partially pass through the through hole 107, so that one end of the connector 5 may be located at the first accommodating position 101 and connected to the first circuit board 2, and the other end may be located at the second accommodating position 102 and connected to the second circuit board 3. The connector 5 may be, for example, a BTB connector (board-to-board connector) in the prior art, and its model and specification may be specifically selected according to the use requirement and the specification of the circuit board.

Preferably, as shown in fig. 1 to 6, in an embodiment, the domain master for improving EMC reliability may further include a first cover plate 6 and a second cover plate 7, where the first cover plate 6 is covered on the top of the first circuit board 2, and the second cover plate 7 is covered on the bottom of the second circuit board 3; in this way, the first cover plate 6, the first circuit board 2 and the first accommodation site 101 of the housing 1 form a closed first accommodation cavity, and the second cover plate 7, the second circuit board 3 and the second accommodation site 102 of the housing 1 form a closed second accommodation cavity.

Preferably, as shown in fig. 5 and 6, in the embodiment, in the case where the first cover plate 6 is provided to cover the first circuit board 2, the outer periphery of the first cover plate 6 protrudes from the outer periphery of the first circuit board 2; in the case where the second cover plate 7 is provided to cover the second circuit board 3, the outer periphery of the second cover plate 7 protrudes from the outer periphery of the second circuit board 3. The first cover plate 6 and the second cover plate 7 can thus completely cover the first circuit board 2 and the second circuit board 3.

Preferably, as shown in fig. 3 and 4, in the embodiment, the end of the first accommodation site 101 is formed with a plurality of first accommodation grooves 103 for accommodating a plurality of connectors 4 located at the top of the housing 1; the end of the second accommodating position 102 is provided with a plurality of second accommodating grooves 104 for accommodating a plurality of connectors 4 at the bottom of the shell 1; the side edges of each first receiving groove 103 and each second receiving groove 104 are formed as barrier ribs 105. Specifically, the first accommodating groove 103 and the second accommodating groove 104 can be regarded as a plurality of groove structures formed by the isolating rib plates 105, and the grooves are recessed toward the first accommodating position 101 of the housing 1, so that the plug connector 4 is plugged into the groove structures. Meanwhile, due to the arrangement of the isolation rib plates 105, gaps at the connecting positions of the connectors 4 can be reduced, a sealing structure in the edge-wrapping mode of the connectors 4 is formed, and the reliability of EMC is improved.

Preferably, as shown in fig. 3 to 6, in the embodiment, the side wall of the first cover plate 6 extends to the edge of the first circuit board 2 and covers the first circuit board 2, the height between the side wall of the first cover plate 6 and the connector may be 0.5mm, and the distance between the isolation rib plate 105 and the edge of the first cover plate 6 is smaller, and the isolation rib plate is close to fit. The side wall of the second cover plate 7 extends to the edge of the second circuit board 3 and covers the second circuit board 3, and the height of the side wall of the second cover plate 7 from the connector may be 0.5mm. In this way, a completely covered closed structure can be formed for the plug-in connector 4.

Preferably, as shown in fig. 3 and 4, in an embodiment, the top surface of the spacer rib 105 is provided with a plurality of conductive foam 106. The plurality of conductive foam 106 is arranged on the top surface of the isolation rib plate 105 of the first accommodating groove 103; the plurality of conductive foam 106 is disposed on the bottom surface of the isolation rib plate 105 of the second accommodating groove 104.

Preferably, as shown in fig. 3 and 4, in the embodiment, in the case that the connector 4 is inserted into the first accommodating groove 103, the first circuit board 2 contacts the conductive foam 106 located on the top surface of the isolation rib 105 of the first accommodating groove 103; in the case that the connector 4 is inserted into the second accommodating groove 104, the second circuit board 3 contacts the conductive foam 106 located at the bottom surface of the isolation rib 105 of the second accommodating groove 104.

The plug connector 4 positioned at the top of the shell 1 is arranged on the bottom surface of the first circuit board 2, conductive foam 106 is uniformly distributed in the peripheral side area of the plug connector 4 positioned at the top of the shell 1, and the isolation rib plate 105 is in contact conduction with the first circuit board 2 through the conductive foam 106 to form a closed cavity.

The connectors 4 at the bottom of the housing 1 are arranged on the top surface of the second circuit board 3, preferably with a pitch of 4mm or more between the connectors 4. Conductive foam 106 is uniformly distributed in the peripheral area of the plug connector 4 at the bottom of the shell 1, and the isolation rib plate 105 is in contact conduction with the second circuit board 3 to form a closed cavity. The top and the bottom of casing 1 all have and are formed with the spacer rib plate 105 and form confined cavity with first circuit board 2 and second circuit board 3, and spacer rib plate 105 switches on with the conductive foam 106 of the paster of first circuit board 2 and second circuit board 3, plays excellent ground shielding effect, further promotes the reliability of EMC.

Preferably, as shown in fig. 1 to 6, in the embodiment, the first accommodating portion 101 is disposed at a first end of the top of the housing 1, and the second end of the top of the housing 1 is formed with a heat dissipation duct, and the heat dissipation duct may include a plurality of heat dissipation partitions 8, and the plurality of heat dissipation partitions 8 are uniformly disposed at the second end of the top of the housing. The heat dissipation air channel can also comprise a heat dissipation fan 9, wherein the heat dissipation fan 9 is arranged at one end of the heat dissipation air channel, and a third cover plate 11 is arranged on the top cover of the plurality of heat dissipation clapboards 8, so that the heat dissipation air channel is formed.

Preferably, as shown in fig. 1 to 6, in the embodiment, the first circuit board 2 is connected to the housing 1 by the first connection members, the number of which is plural, the plural first connection members being uniformly disposed on the outer peripheral side of the first circuit board 2; the second circuit board 3 is connected to the housing 1 through second connectors, the number of which is plural, and the plural second connectors are uniformly disposed on the second circuit board 3. The first and second connectors may each be screws 10 for ease of installation.

Preferably, the housing 1 may be a die cast.

This domain accuse host computer that promotes EMC reliability is through designing first circuit board 2 and second circuit board 3 at the top and the bottom of casing 1 to utilize the structural feature of the die casting piece of casing 1 and electrically conductive foam 106 contact conduction ground connection, cancel the shield cover in the former design scheme, avoid the EMC reliability reduction problem that leads to because of the shell fragment warp, the precision of shell fragment is low, the support can not seal completely, promote the EMC reliability of domain accuse host computer.

This domain accuse host computer that promotes EMC reliability is used for holding the first holding position of first circuit board and is used for holding the second holding position of second circuit board through the casing formation, designs first circuit board and second circuit board into layered structure, and the leakproofness that the shield cover in the original structure and shell fragment brought is not strong, the problem that the precision is low is cancelled, has promoted the reliability that promotes domain accuse host computer's EMC.

Further, according to a second aspect of the present utility model, there is provided a vehicle comprising a domain master for improving EMC reliability as described above.

Finally, it should be noted that: the foregoing examples are merely specific embodiments of the present application, and are not intended to limit the scope of the present application, but the present application is not limited thereto, and those skilled in the art will appreciate that while the foregoing examples are described in detail, the present application is not limited thereto. Any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or make equivalent substitutions for some of the technical features within the technical scope of the disclosure of the present application; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a promote domain accuse host computer of EMC reliability which characterized in that, promote domain accuse host computer of EMC reliability includes:

the shell is provided with a first containing position and a second containing position, the first containing position is arranged at the top of the shell, the second containing position is arranged at the bottom of the shell, and a separation plate is arranged between the first containing position and the second containing position;

the first circuit board is arranged on the first accommodating position;

the second circuit board is arranged on the second accommodating position;

the plug connectors are arranged at the end part of the shell, the number of the plug connectors is multiple, and the plug connectors are connected with the first circuit board and the second circuit board.

2. The domain master for improving EMC reliability according to claim 1, wherein the first circuit board and the second circuit board are connected by a connector, the partition plate is provided with a via hole, and the connector part is penetrated through the via hole.

3. The domain control host for improving EMC reliability according to claim 1, further comprising a first cover plate and a second cover plate, wherein the first cover plate is covered on the first circuit board, and the second cover plate is covered on the second circuit board;

when the first cover plate is covered on the first circuit board, the periphery of the first cover plate protrudes out of the periphery of the first circuit board;

and under the condition that the second cover plate is covered on the second circuit board, the periphery of the second cover plate protrudes out of the periphery of the second circuit board.

4. The domain master for improving EMC reliability according to claim 1, wherein a plurality of first receiving grooves are formed at an end of the first receiving position, a plurality of second receiving grooves are formed at an end of the second receiving position, and the plurality of first receiving grooves and the plurality of second receiving grooves are used for receiving the plurality of connectors;

the side edges of each first accommodating groove and the side edges of each second accommodating groove are formed into isolation rib plates.

5. The domain master for improving EMC reliability of claim 4, wherein the spacer rib is provided with a plurality of conductive foam.

6. The domain control host for improving EMC reliability according to claim 5, wherein a plurality of the conductive foam is disposed on a top surface of the isolation rib plate of the first receiving groove;

the conductive foam is arranged on the bottom surface of the isolation rib plate of the second accommodating groove.

7. The domain master of claim 6, wherein the first circuit board contacts the conductive foam located on the top surface of the spacer rib of the first receiving groove with the plug inserted into the first receiving groove;

and under the condition that the plug connector is plugged in the second accommodating groove, the second circuit board contacts the conductive foam positioned on the bottom surface of the isolation rib plate of the second accommodating groove.

8. The domain control host for improving EMC reliability according to claim 1, wherein the first accommodation site is disposed at a first end of a top of the housing, a second end of the top of the housing is formed with a heat dissipation air duct, the heat dissipation air duct includes a plurality of heat dissipation partitions, and the plurality of heat dissipation partitions are uniformly disposed at the second end of the top of the housing.

9. The domain master for improving EMC reliability according to any one of claims 1 to 8, wherein the first circuit board is connected to the housing through a first connection member, the number of the first connection members being plural, the plural first connection members being uniformly disposed on an outer peripheral side of the first circuit board;

the second circuit board is connected to the shell through second connecting pieces, the number of the second connecting pieces is multiple, and the second connecting pieces are uniformly arranged on the second circuit board.

10. A vehicle comprising a domain master for improving EMC reliability according to any one of claims 1 to 9.