CN220402060U - Circuit board drilling device - Google Patents
Circuit board drilling device Download PDFInfo
- Publication number
- CN220402060U CN220402060U CN202323571679.3U CN202323571679U CN220402060U CN 220402060 U CN220402060 U CN 220402060U CN 202323571679 U CN202323571679 U CN 202323571679U CN 220402060 U CN220402060 U CN 220402060U
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- CN
- China
- Prior art keywords
- drilling
- roller
- circuit board
- laser
- receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005553 drilling Methods 0.000 title claims abstract description 66
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000000428 dust Substances 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model provides a circuit board drilling device which comprises an unreeling mechanism, a laser drilling mechanism and a material receiving mechanism, wherein the laser drilling mechanism comprises a supporting platform, a drilling supporting plate which is arranged at the upper end of the supporting platform and can move forwards and backwards, and two groups of laser components which are arranged in parallel and positioned above the supporting plate, the unreeling mechanism and the material receiving mechanism are respectively arranged at the front end and the rear end of the supporting platform, a plurality of vacuum adsorption holes are formed in the upper end of the drilling supporting plate, and each group of laser components comprises a plurality of laser heads which can move left and right and up and down. The utility model has simple structure, can improve synchronous drilling efficiency by arranging two groups of laser components which are arranged in parallel, can improve drilling continuity by arranging the unreeling mechanism and the material receiving mechanism, and further improves processing efficiency.
Description
Technical Field
The utility model relates to the field of circuit board processing, in particular to a circuit board drilling device.
Background
The existing circuit board is generally perforated through laser drilling equipment when perforating, but the existing laser drilling equipment sequentially perforates the part needing to be perforated through a single laser head after feeding the circuit board, so that the machining efficiency is relatively low, and the machining requirement of products cannot be met.
Disclosure of Invention
In order to solve the problem of low laser drilling efficiency of a circuit board in the prior art, the utility model provides a circuit board drilling device capable of rapidly and continuously drilling.
The utility model provides a circuit board drilling device which comprises an unreeling mechanism, a laser drilling mechanism and a material receiving mechanism, wherein the laser drilling mechanism comprises a supporting platform, a drilling supporting plate which is arranged at the upper end of the supporting platform and can move forwards and backwards, and two groups of laser components which are arranged in parallel and positioned above the supporting plate, the unreeling mechanism and the material receiving mechanism are respectively arranged at the front end and the rear end of the supporting platform, a plurality of vacuum adsorption holes are formed in the upper end of the drilling supporting plate, and each group of laser components comprises a plurality of laser heads which can move left and right and up and down.
As a further improvement of the utility model, the unreeling mechanism comprises a unreeling roller, a guide roller, a receiving platform, a first step difference roller and a feeding roller which are sequentially arranged, wherein the feeding roller corresponds to the front end position of the drilling support plate, which moves back and forth.
As a further improvement of the utility model, the receiving mechanism comprises a receiving roller, a second step roller, a dust removing roller, a receiving roller and a release film winding roller which are sequentially arranged, wherein the receiving roller corresponds to the back end position of the drilling support plate, which moves back and forth.
As a further improvement of the utility model, the material receiving mechanism further comprises a cutter mechanism arranged below the material receiving roller.
As a further improvement of the utility model, one side of the feeding roller is also provided with a first ion air gun.
As a further improvement of the utility model, one side of the receiving roller is provided with a second ion air gun.
As a further improvement of the utility model, an ion fan is arranged on one side of the support platform, which is positioned on the drilling support plate.
As a further improvement of the utility model, a first translation mechanism is arranged between the drilling support plate and the support platform, and the first translation mechanism is a linear motor module.
As a further development of the utility model, each set of said laser assemblies comprises two laser heads.
The beneficial effects of the utility model are as follows: the utility model has simple structure, can improve synchronous drilling efficiency by arranging two groups of laser components which are arranged in parallel, can improve drilling continuity by arranging the unreeling mechanism and the material receiving mechanism, and further improves processing efficiency.
Drawings
FIG. 1 is a schematic diagram of a circuit board drilling device according to the present utility model;
FIG. 2 is a schematic view of a circuit board drilling device according to the present utility model;
FIG. 3 is a schematic view of a laser drilling mechanism of a circuit board drilling device according to the present utility model;
FIG. 4 is a schematic diagram of an unreeling mechanism of a circuit board drilling device of the present utility model;
fig. 5 is a schematic structural diagram of a receiving mechanism of a circuit board drilling device.
Reference numerals: 1-unreeling mechanism; 2-a laser drilling mechanism; 3-a material receiving mechanism; 4-ion fans; 11-a discharging roller; 12-guiding rollers; 13-a first step roller; 14-a feeding roller; 15-a first ion wind gun; 16-receiving a material platform; 21-a support platform; 22-a drilling support plate; a 23-laser assembly; 231-laser head; 31-receiving rolls; 32-a second step roller; 33-a dust removal roller; 34-a receiving roller; 35-a release film wind-up roll; 36-a cutter mechanism; 37-second ion wind gun.
Detailed Description
In the description of the present utility model, it should be understood that if there is a description of an orientation, such as an orientation or positional relationship indicated above, below, front, rear, left, right, etc., the orientation description may be based on the orientation or positional relationship shown in the drawings, only for convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, if there is a description of the number, the meaning of a number is one or more, the meaning of a number is two or more, greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
As shown in fig. 1 to 5, the utility model discloses a circuit board drilling device, which comprises an unreeling mechanism 1, a laser drilling mechanism 2 and a material collecting mechanism 3, wherein the laser drilling mechanism 2 comprises a supporting platform 21, a drilling supporting plate 22 which is arranged at the upper end of the supporting platform 21 and can move forwards and backwards, and two groups of laser components 23 which are arranged above the supporting plate in parallel, the unreeling mechanism 1 and the material collecting mechanism 3 are respectively arranged at the front end and the rear end of the supporting platform 21 and are used for feeding and discharging the drilling supporting plate 22, a plurality of vacuum adsorption holes for adsorbing and fixing an upper end product are arranged at the upper end of the drilling supporting plate 22, the vacuum adsorption holes are communicated with a vacuumizing device, each group of laser components 23 comprises a plurality of laser heads 231 which can move left and right and up and down and laser path mechanisms for controlling the laser heads 231 to generate laser, so that the circuit board can be synchronously punched through the laser heads 231, the punching efficiency is greatly improved, the processing requirements are met, and the production cost is reduced.
The laser light path mechanism is a mature technical scheme in the art, and is not described herein, the X-axis direction of the laser head 231 is driven by a linear motor to translate, the Z-axis direction is driven by a screw rod mechanism to move, and the left-right and up-down movement of the laser head 231 is a mature technical scheme in the art, and is not described herein.
During operation, the unreeling mechanism 1 unreels and conveys the circuit board material to the upper end of the drilling support plate 22, then the end is rolled up through the material collecting mechanism 3, the circuit board on the drilling support plate 22 is adsorbed and fixed through the vacuum adsorption hole and then moves from front to back, at this moment, the two groups of parallel laser components 23 start to work, the laser heads 231 start to synchronously punch holes on the circuit board in sequence, and the material is collected through the material collecting mechanism 3 after punching.
In this technical scheme, as shown in fig. 2 and 4, the unreeling mechanism 1 includes a unreeling roller 11, a guiding roller 12, a receiving platform 16, a first step roller 13 and a feeding roller 14 which are sequentially arranged, the feeding roller 14 corresponds to the front end position of the drilling support plate 22 moving back and forth, the receiving mechanism 3 includes a receiving roller 31, a second step roller 32, a dedusting roller 33, a receiving roller 34 and a release film wind-up roller 35 which are sequentially arranged, and the receiving roller 31 corresponds to the rear end position of the drilling support plate 22 moving back and forth. The unreeling roller 11 is used for unreeling circuit board materials, the guide roller 12 is used for guiding the material conveying of the unreeling roller, the material receiving table 16 is used for bonding the head end of new materials and the tail end of the previous materials on the material receiving table when the materials are required to be replaced, the new materials can be directly pulled away by the new materials, so that the new materials do not need to be reeled again, the installation time of the new materials is saved, the processing efficiency is improved, the first step difference roller 13 and the second step difference roller 32 can be respectively lifted, the movement of the materials is controlled by the lowering of the second step difference roller 32 and the lifting of the first step difference roller 13, the structure is simpler, the feeding roller 14 is used for corresponding to the front end direction of the drilling support plate 22, the smooth feeding of the materials is ensured, the material receiving roller 31 is used for guiding the output of the perforated circuit board materials, the two dust removal rollers 33 are used for clamping the materials to adhere the surfaces of the materials, the material receiving roller 34 is used for reeling the processed circuit board, and the reeling film is used for reeling film removal and the release film reeling roller 35 is used for reeling the removed film.
In this technical scheme, as shown in fig. 2 and 5, the material receiving mechanism 3 further includes a cutter mechanism 36 disposed below the material receiving roller 34, so that the punched circuit board can be cut to a corresponding size according to different requirements, and the material receiving operation is not required to be performed through the material receiving roller 34, which can not meet different process requirements.
Unreeling mechanism and receipts material mechanism still all are equipped with the mechanism of rectifying, and the mechanism of rectifying sets up in unreeling mechanism and receipts material mechanism's lower extreme, and it is consistent through sensor and rectifying the driver control translation assurance receive and unreel the position, should rectify the mechanism and be prior art, just need not be repeated here.
In this technical scheme, feed roll 14 one side still is equipped with first ion air gun 15, connect material roll 31 one side to be equipped with second ion air gun 37 for carry out static to the circuit board material and get rid of, guarantee the processing effect, in some embodiments, still be equipped with brush and adsorption equipment respectively in one side of first ion air gun 15 and second ion air gun 37, can reach the effect of dust removal.
In this technical scheme, the supporting platform 21 is located one side of the drilling supporting plate 22 is further provided with an ion fan 4, so as to further improve the static eliminating effect.
In this technical scheme, drilling backup pad 22 with be equipped with first translation mechanism between the supporting platform 21, first translation mechanism is linear electric motor module, can carry out accurate the carrying to the product, guarantees the requirement of machining precision.
In this technical scheme, every group laser subassembly 23 includes two laser heads 231, not only can satisfy machining efficiency like this, and the overall arrangement is also more reasonable moreover.
The utility model has simple structure, can improve the synchronous drilling efficiency by arranging two groups of laser assemblies 23 which are arranged in parallel, can improve the drilling continuity by arranging the unreeling mechanism 1 and the material receiving mechanism 3, and further improves the processing efficiency.
The foregoing is a further detailed description of the utility model in connection with the preferred embodiments, and it is not intended that the utility model be limited to the specific embodiments described. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the utility model, and these should be considered to be within the scope of the utility model.
Claims (9)
1. A circuit board drilling device is characterized in that: including unreeling mechanism, laser drilling mechanism and receipts material mechanism, laser drilling mechanism includes supporting platform, locates the drilling backup pad that supporting platform upper end and can reciprocate and be located two sets of parallel arrangement's of backup pad top laser subassembly, unreeling mechanism with receive material mechanism and locate respectively supporting platform's front and back both ends, drilling backup pad upper end is equipped with a plurality of vacuum absorption holes, every group laser subassembly includes a plurality of laser head that can control and reciprocate.
2. The circuit board drilling device of claim 1, wherein: the unreeling mechanism comprises a unreeling roller, a guide roller, a receiving platform, a first step roller and a feeding roller which are sequentially arranged, wherein the feeding roller corresponds to the front end position of the drilling support plate, which moves back and forth.
3. The circuit board drilling device of claim 1, wherein: the receiving mechanism comprises a receiving roller, a second step roller, a dust removing roller, a receiving roller and a release film winding roller which are sequentially arranged, and the receiving roller corresponds to the back end position of the drilling support plate, which moves back and forth.
4. A circuit board drilling apparatus according to claim 3, wherein: the material receiving mechanism further comprises a cutter mechanism arranged below the material receiving roller.
5. The circuit board drilling device according to claim 2, wherein: and a first ion air gun is further arranged on one side of the feeding roller.
6. A circuit board drilling apparatus according to claim 3, wherein: and a second ion air gun is arranged on one side of the receiving roller.
7. The circuit board drilling device of claim 1, wherein: and an ion fan is arranged on one side of the support platform, which is positioned on the drilling support plate.
8. The circuit board drilling device of claim 1, wherein: and a first translation mechanism is arranged between the drilling support plate and the support platform, and the first translation mechanism is a linear motor module.
9. The circuit board drilling device of claim 1, wherein: each set of the laser assemblies includes two laser heads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323571679.3U CN220402060U (en) | 2023-12-27 | 2023-12-27 | Circuit board drilling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323571679.3U CN220402060U (en) | 2023-12-27 | 2023-12-27 | Circuit board drilling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220402060U true CN220402060U (en) | 2024-01-26 |
Family
ID=89604273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323571679.3U Active CN220402060U (en) | 2023-12-27 | 2023-12-27 | Circuit board drilling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220402060U (en) |
-
2023
- 2023-12-27 CN CN202323571679.3U patent/CN220402060U/en active Active
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