CN220400545U - Protective cover for power semiconductor module - Google Patents
Protective cover for power semiconductor module Download PDFInfo
- Publication number
- CN220400545U CN220400545U CN202321979580.4U CN202321979580U CN220400545U CN 220400545 U CN220400545 U CN 220400545U CN 202321979580 U CN202321979580 U CN 202321979580U CN 220400545 U CN220400545 U CN 220400545U
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- CN
- China
- Prior art keywords
- protection cover
- module
- power semiconductor
- semiconductor module
- sides
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 230000001681 protective effect Effects 0.000 title claims description 23
- 238000003825 pressing Methods 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to a power semiconductor module protection cover, which comprises a module and a protection cover arranged at the far end of the module, wherein two sides of the length direction of the protection cover are in buckling connection with corresponding positions of the module, two sides of the width direction of the protection cover are in pin connection with corresponding positions of the module, a frame is arranged at the edge of the near end of the protection cover, the frame is buckled with the far end of the module, a central area of the protection cover is separated from the TIM surface of the module, the structure is simple, the influence of TIM materials in the production and transportation processes is reduced, and the heat dissipation of the power module is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging equipment, in particular to a power semiconductor module protective cover.
Background
In the packaging process of the power semiconductor module, a heat conduction interface material TIM is sometimes required to be smeared on a heat dissipation bottom plate of the power module, so as to reduce the contact thermal resistance between the module and the heat sink. Because the applied TIM material has low hardness, the shape and volume of the TIM material are changed due to false touch or rubbing during the production process or transportation, so that the heat dissipation performance of the module is affected, the production and transportation cost is greatly increased, and no device special for protecting the TIM material of the power module is available in the prior art.
Disclosure of Invention
The present utility model is directed to providing a protective cover for a power semiconductor module, which solves one or more of the problems of the prior art.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the power semiconductor module protection cover comprises a module and a protection cover arranged at the far end of the module, wherein two sides of the length direction of the protection cover are connected with corresponding positions of the module in a buckling mode, two sides of the width direction of the protection cover are connected with corresponding positions of the module in a bolt mode, a frame is arranged at the edge of the near end of the protection cover, and the frame is buckled with the far end of the module.
Further, the protection cover is provided with first extension parts along two sides of the width direction, the proximal ends of the first extension parts are provided with positioning pins, the modules are correspondingly provided with second extension parts along two sides of the width direction, and the second extension parts are provided with mounting holes for the positioning pins to be clamped in.
Further, the locating pin is conical.
Further, an open slot is formed in the middle of the positioning pin.
Further, the safety cover sets up the buckle along length direction both sides, the module sets up along length direction both sides and buckle complex chimb.
Further, the buckle comprises a pressing part and a hook part connected to the proximal end of the pressing part.
Further, the proximal end of the pressing portion is connected with the protective cover through two fulcrums.
Further, the protection cover is rectangular.
Further, the protective cover is formed by injection molding.
Compared with the prior art, the utility model has the following beneficial technical effects:
according to the power semiconductor module protection cover, the peripheral frame around the proximal end of the protection cover is buckled with the module, the central area of the protection cover is separated from the TIM surface of the module, meanwhile, the protection cover modules are clamped and positioned through the clamping buckles and the positioning pins, the structure is simple, the influence of TIM materials in the production and transportation processes is reduced, and the heat dissipation performance of the power module is guaranteed.
And (II) the buckle comprises a pressing part and a hook part connected to the proximal end of the pressing part, and the proximal end of the pressing part is connected with the protective cover through two fulcrums, so that the buckle can be pressed and deformed within the angle range of opening and buckling.
Drawings
Fig. 1 is an isometric view of a protective cover for a power semiconductor module protective cover according to an embodiment of the present utility model.
Fig. 2 is a schematic front view of a protective cover of a power semiconductor module according to an embodiment of the utility model.
Fig. 3 is a schematic side view of a protective cover of a power semiconductor module according to an embodiment of the utility model.
Fig. 4 is an isometric view of a power semiconductor module protection cover according to an embodiment of the present utility model.
Fig. 5 is a schematic structural diagram of a positioning pin in a power semiconductor module protection cover according to an embodiment of the utility model.
Fig. 6 is a schematic structural diagram of a buckle in a power semiconductor module protection cover according to an embodiment of the utility model.
The reference numerals in the drawings:
1. a module; 11. a convex edge; 12. a second extension; 121. a mounting hole; 2. a protective cover; 21. a fulcrum; 22. a buckle; 221. a pressing part; 222. a hook part; 23. a frame; 24. a first extension; 25. a positioning pin; 251. an open slot.
Detailed Description
For a better understanding of the utility model with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or essential characteristics thereof.
In the description of the present utility model, the positional or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In order to more clearly describe the structure of the power semiconductor module protection cover, the present utility model defines terms of "distal end" and "proximal end", specifically, "distal end" means an end far away from the ground, and "proximal end" means an end close to the ground, taking fig. 3 as an example, the lower end of the protection cover 2 in fig. 3 is a proximal end, and the upper end of the protection cover 2 in fig. 3 is a distal end.
Example 1
Referring to fig. 4, 5 and 6, the power semiconductor module protection cover includes a module 1 and a protection cover 2 disposed at a distal end of the module 1, two sides of the protection cover 2 in a length direction are connected with a buckle 22 at a position corresponding to the module 1, two sides of the protection cover 2 in a width direction are connected with a latch at a position corresponding to the module 1, a frame 23 is disposed at a proximal edge of the protection cover 2, and the frame 23 is buckled with a distal end of the module 1.
Specifically, the frame 23 is used for supporting the protection cover 2, so as to avoid the contact between the middle part of the protection cover 2 and the part of the module 1 coated with TIM.
The specific structure of the protective cover 2 and the module 1 is described as follows:
referring to fig. 1, 2, 4 and 5, further, the protective cover 2 is provided with first extending portions 24 along two sides of the width direction, a positioning pin 25 is disposed at a proximal end of the first extending portions 24, the module 1 is correspondingly provided with second extending portions 12 along two sides of the width direction, and the second extending portions 12 are provided with mounting holes 121 for the positioning pins 25 to be clamped. Preferably, in the power semiconductor module protection cover of the present utility model, the positioning pin 25 is tapered so as to be conveniently snapped into the mounting hole 121.
Referring to fig. 1, 2 and 5, further, an open slot 251 is formed in the middle of the positioning pin 25, so that the positioning pin 25 can elastically deform when being clamped into the mounting hole 121, and the positioning pin 25 can be fastened with the mounting hole 121.
Referring to fig. 1, 2, 3, 4 and 6, further, the protecting cover 2 is provided with a buckle 22 along two sides of the length direction, and the module 1 is provided with a convex edge 11 matched with the buckle 22 along two sides of the length direction.
Referring to fig. 3 and 6, further, the buckle 22 includes a pressing portion 221 and a hook portion 222 connected to a proximal end of the pressing portion 221.
Referring to fig. 1 and 2, further, the proximal end of the pressing portion 221 is connected to the protecting cover 2 through two supporting points 21, so that the buckle 22 can be pressed and deformed within the angular range of opening and buckling.
Referring to fig. 1 and 2, further, the protection cover 2 is rectangular.
Further, the protective cover 2 is formed by injection molding.
The specific working procedure of the utility model is as follows:
the protective cover 2 is arranged on the module 1 coated with TIM, and the frame 23 around the proximal end of the protective cover 2 is buckled with the module 1 to separate the central area of the protective cover 2 from the TIM surface of the module 1. The positioning pins 25 on both sides of the protective cover 2 in the width direction are clamped into the mounting holes 121 of the module 1 to perform positioning and fixing functions, and the pressing parts 221 on both sides of the protective cover 2 in the length direction are pressed to clamp the convex edge 11 of the module 1 by the clamping buckles 22, so that the protective cover 2 can be simply removed by pressing the pressing parts 221 of the clamping buckles 22 on both sides again during disassembly.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (9)
1. The power semiconductor module safety cover, its characterized in that: the power semiconductor module protection cover comprises a module and a protection cover arranged at the far end of the module, wherein two sides of the length direction of the protection cover are connected with corresponding positions of the module in a buckling mode, two sides of the width direction of the protection cover are connected with corresponding positions of the module in a bolt mode, a frame is arranged at the edge of the near end of the protection cover, and the frame is buckled with the far end of the module.
2. The power semiconductor module protection cover of claim 1, wherein: the protection cover is provided with first extending parts along two sides of the width direction, the proximal ends of the first extending parts are provided with positioning pins, the modules are correspondingly provided with second extending parts along two sides of the width direction, and the second extending parts are provided with mounting holes for the positioning pins to be clamped in.
3. The power semiconductor module protection cover according to claim 2, wherein: the locating pin is conical.
4. The power semiconductor module protection cover according to claim 2, wherein: an open slot is formed in the middle of the positioning pin.
5. The power semiconductor module protection cover of claim 1, wherein: the safety cover sets up the buckle along length direction both sides, the module sets up along length direction both sides and buckle complex chimb.
6. The power semiconductor module protection cover according to claim 5, wherein: the buckle comprises a pressing part and a hook part connected to the proximal end of the pressing part.
7. The power semiconductor module protection cover according to claim 6, wherein: the proximal end of the pressing part is connected with the protective cover through two fulcrums.
8. The power semiconductor module protection cover of claim 1, wherein: the protection cover is rectangular.
9. The power semiconductor module protection cover of claim 1, wherein: the protective cover is formed by injection molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321979580.4U CN220400545U (en) | 2023-07-26 | 2023-07-26 | Protective cover for power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321979580.4U CN220400545U (en) | 2023-07-26 | 2023-07-26 | Protective cover for power semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220400545U true CN220400545U (en) | 2024-01-26 |
Family
ID=89612343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321979580.4U Active CN220400545U (en) | 2023-07-26 | 2023-07-26 | Protective cover for power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220400545U (en) |
-
2023
- 2023-07-26 CN CN202321979580.4U patent/CN220400545U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |