CN220391704U - Plastic film mechanism for silicon wafer packaging - Google Patents
Plastic film mechanism for silicon wafer packaging Download PDFInfo
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- CN220391704U CN220391704U CN202320965205.8U CN202320965205U CN220391704U CN 220391704 U CN220391704 U CN 220391704U CN 202320965205 U CN202320965205 U CN 202320965205U CN 220391704 U CN220391704 U CN 220391704U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 44
- 239000010703 silicon Substances 0.000 title claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 229920006255 plastic film Polymers 0.000 title claims abstract description 23
- 239000002985 plastic film Substances 0.000 title claims abstract description 23
- 239000012785 packaging film Substances 0.000 claims abstract description 64
- 229920006280 packaging film Polymers 0.000 claims abstract description 64
- 238000005520 cutting process Methods 0.000 claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims abstract description 40
- 239000002356 single layer Substances 0.000 claims abstract description 29
- 239000012943 hotmelt Substances 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 238000005096 rolling process Methods 0.000 claims description 19
- 239000012528 membrane Substances 0.000 claims description 18
- 238000007599 discharging Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000009423 ventilation Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 409
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
A plastic film mechanism for packaging silicon wafers, which is at least provided with a film making unit and a film cutting unit; the film forming unit comprises a film folding plate, a film guiding plate and an auxiliary plate which are arranged along the transmission direction; the film folding plate can reversely guide the two layers of films which are tightly attached to each other into a single layer of film; the film guide plate and the auxiliary plate are buckled up and down, so that two side edges of the single-layer film are arranged in a crossed and overlapped mode to form a packaging film with a barrel-shaped structure; the film cutting unit is provided with a linear hot-melt knife, and is used for cutting the tail end opening of the packaging film provided with the silicon wafer group and plugging the front end opening of the next packaging film. The utility model can accurately and safely discharge and send films, rapidly and stably reversely expand the double-layer films into single-layer films, is convenient for manufacturing a cylindrical packaging film structure which is connected by cross superposition at the bottom and is arranged with a single-end opening, only needs to cut the single end of each packaging film, and has no waste of redundant films; the structure with the crossed and overlapped lower bottom surfaces is easier to be kneaded and unpacked.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer packaging equipment, and particularly relates to a plastic film mechanism for silicon wafer packaging.
Background
An important ring step in the silicon wafer ending stage during silicon wafer packaging is achieved, but the layout structure of packaging films is complex during packaging in the prior art, the waste of the manufactured packaging films is serious, the films on the sides of four sides or the sides of one adjacent two sides of a silicon wafer group are subjected to hot melt cutting, and the cut films are required to be recovered by arranging a recovery device, so that the film utilization rate is low and the films are not easy to disassemble during follow-up die stripping.
Disclosure of Invention
The utility model provides a plastic film mechanism for silicon wafer packaging, which solves the technical problems that the prior plastic film is seriously wasted due to unreasonable structural design, and the film is not easy to disassemble in the follow-up demolding.
In order to solve at least one of the technical problems, the utility model adopts the following technical scheme:
a plastic film mechanism for packaging silicon wafers, which is at least provided with a film making unit and a film cutting unit;
the film forming unit comprises a film folding plate, a film guiding plate and an auxiliary plate which are arranged along the transmission direction;
the film folding plate can reversely guide the two layers of films which are tightly attached to each other into a single layer of film;
the film guide plate and the auxiliary plate are buckled up and down, so that two side edges of the single-layer film are arranged in a crossed and overlapped mode to form a packaging film with a barrel-shaped structure;
the film cutting unit is provided with a linear hot-melt knife, and is used for cutting the tail end opening of the packaging film provided with the silicon wafer group and plugging the front end opening of the next packaging film.
Further, the film folding plate is positioned right above the center line position of the silicon wafer group and is a straight plate which is vertically arranged;
the upper end face of the film folding plate is an inclined face obliquely arranged towards one side far away from the film cutting unit;
a guide wheel is arranged at one side of the membrane folding plate, which is far away from the membrane cutting unit;
the membrane folding plate and the guide wheel enter the double-layer membrane from one side of the opening edge of the double-layer membrane, and the guide wheel abuts against the folding line edge of the double-layer membrane.
Furthermore, the film guide plate and the auxiliary plate are of L-shaped structures, and the enclosed area is penetrated by the conveying belt and is an inner cavity of the packaging film;
the film guide plates on two sides of the transmission belt are identical in height and are symmetrically arranged relative to the film folding plates;
the vertical surfaces of the auxiliary plates on two sides of the transmission belt are all positioned on the inner side of the film guiding plate, and the lower bottom surfaces of the auxiliary plates are mutually intersected and partially overlapped and have height differences.
Furthermore, the horizontal plane and the vertical plane of the film guiding plate are rectangular structures, the end faces of one side of the film cutting unit are inclined in the same direction towards the direction close to one side of the film folding plate, and the inclination angles are the same, and the inclination angles are acute angles and the same;
preferably, the inclination angle ranges from 30 to 45 °;
the vertical surface of the auxiliary plate is of a rectangular structure, and the end surface of one side, far away from the film cutting unit, of the vertical surface is inclined towards the direction close to one side of the film guide plate;
preferably, the inclined surface in the vertical surface of the auxiliary plate is an extension of the inclined surface in the vertical surface of the film guide plate arranged on the same side of the inclined surface;
the horizontal plane of the auxiliary plate is of a right triangle structure, and the right-angle side of the auxiliary plate is arranged at one end of the vertical plane of the auxiliary plate far away from the inclined plane;
and a plurality of ventilation holes are also formed in the film guide plate and the auxiliary plate.
Furthermore, two film guide rods with different lengths are arranged on two sides of the film folding plate, and the positions of the film guide rods are at the same height as the lower bottom surface of the film folding plate and are higher than the horizontal plane of the film guide plate;
a flat plate which is arranged vertically to the film folding plate is arranged below the film folding plate and is positioned above the conveying belt;
the flat plate is arranged between the vertical surfaces of the film guide plates at two sides and symmetrically arranged relative to the film folding plates, and a plurality of rows of round through holes are formed in the flat plate.
Further, a film outlet unit and a film feeding unit are arranged above the film making unit;
the film outlet unit, the film feeding unit and the film making unit are all connected to the same frame body;
the film cutting unit is arranged at the outer side of the frame body, and one side, close to the film cutting unit, of the film making unit is connected with the frame body;
the film outlet unit and the film feeding unit are both positioned above the film making unit, and the film feeding unit is arranged close to one side of the film making unit.
Further, the film outlet unit comprises a film rolling barrel, a brush barrel and a film feeding barrel which are arranged in parallel with the film folding plate, wherein,
the film rolling cylinders are arranged in parallel and used for supporting the film rolls of the double-layer films, and the end parts of the film rolling cylinders are connected with the film discharging motor and used for discharging the double-layer films;
the brush cylinder is positioned below the film rolling cylinder and is a brush cylinder with a gap;
a plurality of punchers perpendicular to the axis of the brush cylinder are arranged along the axial direction of the brush cylinder, and are matched with the outer wall surface of the brush cylinder and used for punching the double-layer film;
the film feeding cylinder is arranged on the roller and positioned below the hairbrush cylinder.
Further, the film feeding unit comprises a plurality of film guiding cylinders for guiding out films and adjusting the film outlet positions of the double-layer films, so that the films are positioned right above the film folding plate after being guided by the film guiding cylinders in sequence;
all the film guide cylinders are arranged on one side of the film feeding cylinder, which is close to the film folding plate;
one of the film guide cylinders is a tensioning cylinder wheel and is hinged with a swing arm capable of swinging reciprocally;
and a sensor is arranged above the swing arm, and the sensor recognizes the position of the swing arm to control the film roll to start or stop film discharging.
Further, a film guide cylinder is arranged between the film guide cylinder hinged with the swing arm and the film feeding cylinder;
all film guiding cylinders are arranged on one side, close to the film folding plate, of the film guiding cylinder hinged with the swing arm except the film guiding cylinder hinged with the swing arm and the film guiding cylinder positioned between the film guiding cylinder and the film feeding cylinder hinged with the swing arm.
Further, the film cutting device also comprises a pressing cylinder for controlling the lifting of the hot melt knife and a film sealing plate in counterpoint contact with the hot melt knife,
the hot melt knife is perpendicular to the direction of the conveying belt and is suspended right above the film sealing plate through the lower air cylinder;
after the silicon chip group completely passes through the film sealing plate, the pressing cylinder controls the hot melt knife to press down to contact with the film sealing plate so as to cut off and seal the opening end of the packaging film to form a fluffy packaging film; and closing the port of the next packaging film, which is close to one side of the hot melt knife.
The plastic film mechanism for packaging the silicon wafers can accurately and safely discharge and send films, can rapidly and stably reversely expand double-layer films into single-layer films, is convenient for manufacturing a cylindrical packaging film structure with the bottoms being connected in a crossed and overlapped mode and arranged in a single-end opening mode, only needs to cut one end of each packaging film, and does not waste redundant films; the packaging film with the cross-overlapped lower bottom surfaces can be formed after thermoplastic, and the packaging film can be rapidly unsealed by only rubbing the lower bottom surfaces of the packaging film.
Drawings
FIG. 1 is a film routing diagram of a film molding mechanism for packaging silicon wafers;
FIG. 2 is a perspective view of a film outlet unit according to the present utility model;
FIG. 3 is a perspective view of a film forming unit according to the present utility model;
FIG. 4 is a bottom view of a film forming unit according to the present utility model;
FIG. 5 is a side view of a film forming unit according to the present utility model;
FIG. 6 is a front view of a film forming unit according to the present utility model;
fig. 7 is a perspective view of a film cutting device according to the present utility model.
In the figure:
10. film outlet unit 11, film roll 12 and film rolling cylinder
13. Brush cylinder 14, hole puncher 15 and frame
16. Film discharging motor 20, film feeding unit 21 and film feeding cylinder
22. Film guide cylinder 23, swing arm 30 and film making unit
31. Film folding plate 32, film guiding rod 33 and guide wheel
34. Film guiding plate 35, auxiliary plate 36 and flat plate
37. Packaging film 40, film cutting unit 41 and hot melt knife
42. Film sealing plate 43, lower pressing cylinder 44 and film cutting support
Detailed Description
The utility model will now be described in detail with reference to the drawings and specific examples.
The present embodiment proposes a plastic film mechanism for packaging silicon wafers, as shown in fig. 1, which is provided with a film outlet unit 10, a film feeding unit 20, a film making unit 30 and a film cutting unit 40, wherein the film outlet unit 10, the film feeding unit 20 and the film making unit 30 are all fixed on a frame 15, and the film cutting unit 40 is located at the rear side of the frame 15. The film discharging unit 10, the film feeding unit 20 and the film making unit 30 are arranged on the frame body 15 in parallel along the transmission direction, both ends of the film discharging unit 10 and the film feeding unit 20 are fixed on the frame body 15, and a single end of the film making unit 30 is connected with the frame body 15; the film discharging unit 10 and the film feeding unit 20 are positioned above the film forming unit 30, and the film feeding unit 20 is arranged at one side close to the film forming unit 30.
The silicon wafer group in the application is a square silicon wafer, but can also be a rectangular silicon wafer. The dimension of the silicon wafer group along the transmission direction is set as the length of the silicon wafer group, and the dimension of the silicon wafer group crossing the width direction of the transmission belt is set as the width of the silicon wafer group.
The film-making unit 30 can separate the double-layer films and enable the double-layer films to be arranged diagonally so as to form a packaging film 37 with a cylindrical structure, wherein the lower end faces of the packaging film 37 are arranged in a crossing and overlapping mode, and the front end opening of the packaging film 37 is closed to form a cylindrical film which is arranged in a single-opening mode and can be used for loading silicon wafer groups. The film cutting unit 40 can only seal the tail end opening of the packaging film 37 carrying the silicon wafer group and form the packaging film 37 with the next single opening, namely, the packaging film 37 with the front end opening sealed and the tail end opening opened is formed, the positions of other packaging films 37 do not need to be cut, all the packaging films 37 are attached to the surface of the silicon wafer group, the packaging quality is good, the film utilization rate is high, the packaging films 37 can be detached only by rubbing the crossed overlapping positions of the lower end surfaces of the packaging films 37, and the packaging film cutting device is rapid and accurate.
Specifically, as shown in fig. 1 to 2, the film unit 10 includes a frame body 15, a film roll 11, a film roll 12, a brush drum 13 arranged in parallel in the transport direction; the film feeding unit 20 comprises a film feeding cylinder 21 and a film guiding cylinder 22 which are axially parallel to the film roll 11; the film forming unit 30 includes a film folding plate 31, a film guiding rod 32, a film guiding plate 34, an auxiliary plate 35 and a plate 36 parallel to the conveyor belt. The frame body 15 is a hollow fixed frame, and two ends of the film rolling cylinder 12, the hairbrush cylinder 13, the film feeding cylinder 21 and the film guiding cylinder 22 are connected to two side frame bodies of the frame body 15 and are arranged in a staggered manner up and down, namely, are not overlapped with each other along the height direction; the film folding plate 31, the film guiding rod 32, the film guiding plate 34, the auxiliary plate 35 and the flat plate 36 are all connected to the frame body 15 in a single end mode, and the suspension end of the auxiliary plate is one side close to the regulating mechanism 30.
The two sides below the film roll 11 are provided with film rolling cylinders 12 which are oppositely arranged, the two film rolling cylinders 12 share one film discharging motor 16, and the film discharging motor 16 can provide power for the film rolling cylinders 12 so as to drive the film rolling cylinders 12 to roll out films. The lower bottom surface of the film roll 11 is supported by two film rolling cylinders 12 symmetrically arranged, and both ends of the film roll 11 are blocked by stoppers placed on both sides of the frame body 15 to prevent the film roll 612 from being stably placed on the upper surface of the film rolling cylinders 12 to prevent deflection.
The film roll 11 is a double-layer film structure with a center folded, an opening edge is arranged near one side of the film cutting unit 40, and a folding closed fold line edge is arranged near one side of the normalizing mechanism 30. The double-layer film is guided and separated by the film folding plate 31 after being output from the film feeding cylinder 21 to be changed into a single-layer film structure, and after the two side edges of the single-layer film are sequentially guided and separated in opposite directions by the film guide rods 32, the film guide plates 34 and the auxiliary plates 35 which are arranged on the two sides of the film folding plate 31, the double-layer film is overlapped in a crossing way from the lower part of the conveying belt to form a packaging film 37 which can be used for loading the silicon wafer group. When any one of the packaging films 37 enters the film cutting unit 40, the cut end thereof is heat-sealed as the terminal end of the packaging film 37; correspondingly, the cut end can be also heat-sealed as the inlet end of the next packaging film 37; that is, each of the packaging films 37 is of a single-ended closed structure.
The brush cylinder 13 is a cylinder shaft surrounded by a gap-arranged brush, a plurality of parallel punchers 14 are arranged on the outer wall shaft of the brush cylinder 13, and the punchers 14 are matched with the outer wall surface of the brush cylinder 13 and are used for punching the double-layer film. The puncher 14 is perpendicular to the axial direction of the brush cylinder 13 and penetrates through the film surface to enter a brush gap of the brush cylinder 13, is arranged at intervals along the length direction of the brush cylinder 13, is positioned on one side of the brush cylinder 13 far away from the film roll 11, and is positioned at the lower right side of the film roll 11 together with the brush cylinder 13, namely, the height of the brush cylinder 13 is lower than that of the film roll 12, and is positioned on the outer side of the film roll 12, and is arranged in a dislocation mode with the film roll 12 or the film roll 11.
The puncher 14 is an annular block, the axis of the puncher is parallel to the axis of the brush cylinder 13, a plurality of needles perpendicular to the outer wall surface of the annular block are arranged on the annular block, and all the needles rotate along with the axial direction of the puncher 14. The outer wall surface of the annular block is closely attached to the outer wall surface of the brush cylinder 13, so that the needle head can be perpendicular to the film surface in contact with the brush cylinder 13 and penetrate through the film membrane to enter a brush gap on the brush cylinder 13, and after the film surface is perforated.
The brush cylinder 13 rotates in opposite directions to the puncher 14, that is, the brush cylinder 13 rotates in the forward direction and the punching air 614 rotates in the reverse direction, and the needle on the puncher 14 can pass through the gap of the brush cylinder 13 to punch the unfolded film surface so that the air in the film is discharged during the thermoplastic process.
The film feeding cylinder 21 is disposed on the left side of the brush cylinder 13 obliquely below and is mainly used for feeding out the film with the holes and changing the conveying direction of the film so that the conveying direction of the film moves towards the side close to the conveying belt. The film feeding cylinder 21 arranged on the roller is tightly pressed to enable the film feeding cylinder to be oppositely extruded to tightly press the film, so that abnormal use caused by film loosening in the film discharging process is prevented; meanwhile, the two film feeding cylinders 21 are used for oppositely extruding the film, and the clearance air in the film can be discharged through the air exhaust holes, so that the air exhaust holes can work normally in the film molding process.
The film feeding unit 20 is provided with a plurality of film guiding cylinders 22 for guiding out the film and adjusting the film outlet position of the double-layer film, so that the film is positioned right above the film folding plate 31 after being guided by the plurality of film guiding cylinders 22 in sequence. In this application, four film guiding cylinders 22 are disposed on the left side of the film feeding cylinder 21, that is, on one side of the film feeding cylinder 21 near the film folding plate 31. One of the film guiding cylinders 22 is positioned at the left lower part of the film feeding cylinder 21 and is fixedly arranged at one side close to the film feeding cylinder 21. One of the film guiding cylinders 22 is a tensioning cylinder wheel which is hinged with a swing arm 23 capable of swinging reciprocally, and the film guiding cylinder 22 hinged with the swing arm 23 is arranged close to the film guiding cylinder 22 on the side close to the film feeding cylinder 21 and is positioned below the film guiding cylinder 22 on the side close to the film feeding cylinder 21. Except for the film guide cylinder 22 hinged with the swing arm 23 and the film guide cylinder 22 positioned between the film guide cylinder 22 hinged with the swing arm 23 and the film feeding cylinder 21, the other two film guide cylinders 22 are all arranged at the same height on one side of the frame body 15, which is close to the film folding plate 31, of the film guide cylinder 22 hinged with the swing arm 23. The four film guiding drums 22 are sequentially arranged along the width direction of the conveying belt and are not overlapped with each other, so that the film can be guided to be discharged, and the film can be gradually close to one side of the conveying belt and can be stretched and moved.
The sensor recognizes the position of the swing arm 23 to control the film roll 11 to start or stop film ejection. When the film is stressed, the swing arm 23 is pulled to move upwards, the swing arm 23 is sensed by a sensor above the swing arm 23, the sensor informs the system of entering a film discharging operation mode, and then the system informs the film discharging motor 16 to start to operate, and the film discharging motor 16 drives the film rolling barrel 12 to roll so as to drive the film roll 11 to start to discharge the film. When the film loosens, the swing arm 23 swings downwards, the sensor cannot recognize the signal of the swing arm 23, namely, the system is informed to enter a film discharging stop mode, the system is informed to stop working of the film discharging motor 16, the film rolling barrel 12 is not driven to roll any more, and the film roll 11 stops discharging the film.
In the application, the horizontal and transverse coordinates of the axial positions of all the film guide cylinders 22 are different from each other, and the horizontal and transverse coordinates of the axial positions of the film feeding cylinder 614, the brush cylinder 13, the film rolling cylinder 612 and the film roll 11 are also different from each other, so that all cylinder shafts can be reasonably and normally arranged on the frame body 15 within a limited space range, and the space utilization rate is high; and can ensure that the film is stably and accurately put and taken out of the film in sequence along the transmission direction, thereby forming a sustainable and safe film-putting and conveying mechanism.
As shown in fig. 3-6, in the film-making unit 30, the film-folding plate 31 can reversely guide the two-layer film which is tightly attached to the film-making unit into a single-layer film; the film guiding plate 34 and the auxiliary plate 35 are vertically buckled, so that two side edges of the single-layer film are overlapped in a crossing way to form a packaging film 37 with a barrel-shaped structure, and the side arranged in the crossing way is positioned on the lower bottom surface of the packaging film 37.
The membrane folding plate 31 is of a vertical plate structure and is positioned right above the center line position of the silicon wafer group, so that the two-layer thin film which is tightly attached to the membrane folding plate can be reversely opened into a single-layer thin film, and the upper end surface of the membrane folding plate 31 is an inclined surface which is obliquely arranged towards one side far away from the membrane cutting unit 40 and is positioned right below the outermost membrane guiding cylinder 22, so that the double-layer thin film can be reversely opened conveniently. The suspending end of the film folding plate 31 is provided with a guide wheel 33 which is axially perpendicular to the length direction of the film folding plate 31, the guide wheel 33 and the film folding plate 31 enter the inner side of the double-layer film from the opening edge of the double-layer film, and the guide wheel 33 abuts against the folding line edge of the double-layer film, so that the double-layer film output from the film feeding cylinder 21 is conveniently separated into a single-layer film structure.
A flat plate 36 horizontally and transversely arranged is arranged below the film folding plate 31, and the lower end surface of the film folding plate 31 and the upper end surface of the flat plate 36 are arranged in a clearance mode, so that a film can pass through conveniently. The film folding plate 31 and one end of the flat plate 36 close to the film cutting unit 40 are fixedly connected, and the other end is suspended.
The two sides of the film folding plate 31 are respectively provided with a film guiding rod 32, and the side of the film guiding rod 32 is respectively provided with a film guiding plate 34 and an auxiliary plate 35 which are arranged in parallel with the flat plate 36. Wherein, the film guiding plates 34 on two sides are respectively arranged with the film folding plates 31 and the flat plates 36 on the same side in a clearance way.
The film guide plate 34 and the auxiliary plate 35 are of L-shaped structures and are oppositely arranged, and the vertical folds of the film guide plate 34 and the auxiliary plate 35 are arranged at one side far away from the film folding plate 31 and are arranged up and down in opposite directions; the film guiding plate 34 is located above the conveying belt, the auxiliary plate 35 is located below the conveying belt, and then a 'mouth' -shaped structure can be formed by the film guiding plate 34, the flat plate 36 and the auxiliary plate 35 on two sides, and the conveying belt is enclosed in the 'mouth' -shaped structure.
In the present embodiment, the horizontal lateral width of the film guide plate 34 on either one side is larger than the horizontal lateral width of the flat plate 36 on the same side thereof and the horizontal lateral width of the auxiliary plate 35; and the horizontal planes of the auxiliary plates 35 on the two sides have height differences, so that the horizontal planes of the height differences of the edges on the two sides of the single-layer film can be overlapped in a crossing way. That is, the outer end surface of the flat plate 36 is surrounded by the vertical folds of the film guide plates 34 on both sides, and the vertical folds of the lower auxiliary plate 35 are also located inside the vertical folds of the film guide plates 34. The provision of the flat plate 36 increases the safety of the film running in rows through the film guide bars 32 on both sides, and also allows the film to pass over the film guide plate 34 without being affected by other components above the level thereof, so as to ensure that the wafer stack transported on the conveyor can be transported in a packaging film 37 without being blocked by foreign matter.
The film guiding plates 34 on the two sides of the belt are the same in height and are symmetrically arranged relative to the film folding plate 31; the vertical surfaces of the auxiliary plates 35 on both sides of the conveyor belt are positioned on the inner side of the film guiding plate 34, and the lower bottom surfaces thereof are mutually intersected and partially overlapped and have height differences, so that the lower bottom surfaces of the auxiliary plates 35 with certain height differences on both side edges of the single-layer film are conveniently overlapped in a crossed manner, and the height differences are generally in the range of 1-5mm.
The two side film guide rods 32 have the same horizontal height, and the height of the film guide rods 32 is higher than the position height of the film guide plate 34 and is positioned at the lower end surface of the film folding plate 619. The length of the film guide rod 32 at the side close to the film roll 11 is shorter than that of the film guide rod 32 at the side far from the film roll 11; the film guide rod 32 is arranged to position the initial positions of the two side edges of the single-layer film which are outwards expanded after the double-layer film is guided and expanded by the film guide plate 31 and the guide wheel 33, so that the single-layer film is close to the lower edge of the film guide plate 31 for plastic expansion, and then the single-layer film is wound by the film guide rod 32 and then wound along the outer wall surface of the film guide plate 34, so that the single-layer film is horizontally and transversely expanded from the top of the film guide plate 31 through the film guide rod 32. This structure can prevent the problem that the unfolded single-layer film is directly transmitted along the corner edge of the film guiding plate 34 in an inclined way from the upper end face of the film guiding plate 31, and the film is easy to deform and cannot be controlled due to the too large variation range. The single-layer film is thinner, directly passes through the upper end face of the film folding plate 31, is not transitionally transferred by the film guide rod 32, and is extremely easy to scratch; and the arrangement of the film guide rods 32 can ensure the safety and the integrity of deflection angle bending of the film on the film guide plate 34.
The film guide rod 32 on the side of the film guide plate 34 far away from the film roll 11 is positioned at the transverse gap between the film guide plate 34 and the film folding plate 31, so as to enlarge the angle of the film to the side far away from the film folding plate 31, and rapidly lead the film to be guided and separated by the guide wheel 33 and then be unfolded in a single layer. The film guide rod 32 on the side of the film guide plate 34 near the side of the film roll 11 is positioned right above the side film guide plate 34, and the position is convenient for the unfolded single-layer film to be arranged only on one side of the film guide plate 31 so as to improve the stability of film transmission.
The horizontal plane and the vertical plane of the film guiding plate 34 are rectangular structures, the end faces of the side far away from the film cutting unit 40 are inclined in the same direction towards the direction close to one side of the film folding plate 31, and the inclination angles theta are the same and are acute angles and the angles are the same; preferably, the inclination angle θ is in the range of 30-45 °. The endpoints of 30 degrees and 45 degrees are selected, and of course, 35 degrees and 40 degrees are all possible. The end, close to the guide wheel 33, of the horizontal plane and the vertical plane of the suspended ends of the film guiding plates 34 and the auxiliary plates 35 at both sides is provided with a bevel edge inclined towards one side of the position of the conveying belt, so as to improve the transition of the film from the horizontal transverse direction to the vertical direction, ensure the stability and the reliability of the film overlapping cross connection transmission, and ensure that the included angles of the bevel edge and the conveying direction are acute angles and have the same angle.
The vertical surface of the auxiliary plate 35 is a rectangular structure, and the end surface of the vertical surface at the side far away from the film cutting unit 40 is inclined towards the direction close to one side of the film guiding plate 34; preferably, the inclined surface in the vertical surface of the auxiliary plate 35 is an extension of the inclined surface in the vertical surface of the diaphragm plate 34 provided on the same side thereof. That is, the inclined surfaces of the suspended ends of the film guide plate 34 and the auxiliary plate 35 are inclined along the same inclination angle θ, and the length of the film guide plate 34 is longer than that of the horizontal surface and the vertical surface of the auxiliary plate 35. This configuration facilitates folding of the corner edges of the film adjacent to the beveled edges after unfolding and allows for rapid cross-connection with the opposite edges along the position of the auxiliary plate 35 below the conveyor belt to reduce the amount of resistance experienced by the film.
The horizontal plane of the auxiliary plate 35 is a right triangle structure, and the right-angle side thereof is configured at one end of the vertical plane thereof, which is far from the inclined plane, that is, at the side near the film cutting unit 40, so that the shaping of the front end of the packaging film 37 is facilitated, the front end thereof is completely supported, and a cylindrical film structure is formed.
In order to improve the smoothness of the ventilation of the holes punched by the puncher 14 on the single-layer film, a plurality of ventilation holes are required to be arranged on the film guiding plate 34 and the auxiliary plate 35; at the same time, a plurality of rows of round through holes are arranged on the flat plate 36, so as to facilitate air dispersion.
The film roll 11 is driven by the film roll 12 to rotate so as to send out the double-layer film, and the double-layer film is punched by the puncher 14 when crossing the brush roll 13, extruded by the film feed roll 21 and led out, and led in by the film guide rolls 22 in turn so as to adjust the transmission direction, so that the width of the double-layer film is set along the transmission direction. After being guided by the guide wheel 33 and the film folding plate 31, the double-layer film is arranged in a reversing way on the inner side surface and the outer side surface, and a single-layer film structure is formed. The two sides of the single-layer film are extended outwards from the two sides of the film folding plate 31, and after being respectively positioned and transferred out by the film guide rods 32, the two sides of the single-layer film are sequentially wound along the outer wall surface of the film guide plate 34 and the outer wall surface of the auxiliary plate 35 and are mutually crossed and overlapped and interconnected to form a cylinder structure, namely the packaging film 37. The lower end surfaces overlap the crosswise arranged wrapping film 37 and also facilitate the opening of the wrapping film therefrom by the consumer.
The silicon wafer group enters the packaging film 37 along the conveying belt and synchronously moves forward along with the packaging film 37, and enters the film cutting unit 40 together, so that the relative fixation of the positions of the silicon wafer group and the packaging film 37 is ensured. After the silicon wafer group and the packaging film 37 completely enter the film cutting unit 40, cutting off the tail end port of the packaging film 37 to enable the silicon wafer group to be loosely wrapped by the film; and then, after thermoplastic treatment, the film is contracted, and the silicon wafer group tightly wrapped by the film can be formed.
As shown in fig. 7, the film cutting unit 40 includes a hot melt knife 41 for cutting a film, a film sealing plate 42 adapted to the hot melt knife 41, and a lower air cylinder 43 for driving the hot melt knife 41 to move up and down, wherein the lower air cylinder 43 is fixed on a film cutting support 44, the hot melt knife 41 is suspended below the lower air cylinder 43 and is arranged across the width direction of the conveying belt, the hot melt knife 41 is located right above the film sealing plate 42, and the hot melt knife 41 and the film sealing plate 42 are both in a linear structure. The film sealing plate 42 is positioned below the conveying belt and is positioned at a gap position between the conveying belt on one side of the film cutting unit 40 and the conveying belt on one side of the plastic film device 61, and after the hot melting knife 41 is contacted with the film sealing plate 42, the film can be cut off.
After the silicon wafer group enters the packaging film 37, the silicon wafer group is driven by the conveyor belt to move along the conveying direction together with the packaging film 37 toward the hot-melt knife 41 side. After the silicon wafer group completely passes through the film sealing plate 42, the pressing cylinder 43 controls the hot melt knife 41 to press downwards to contact with the film sealing plate so as to cut off and seal the open end of the packaging film 37 to form a fluffy packaging film; and the port of the next packaging film 37 close to one side of the hot melt knife 41 is closed, namely a single-port closed structure is formed.
When the die is required to be disassembled, the double-layer film overlapped on the lower bottom surface of the packaging film is a corrugated film, so that the film is extremely easy to manually rub, is soft due to rapid rubbing, is convenient to disassemble, and is convenient and practical.
The plastic film mechanism for packaging the silicon wafers can accurately and safely discharge and send films, can rapidly and stably reversely expand double-layer films into single-layer films, is convenient for manufacturing a cylindrical packaging film structure with the bottoms being connected in a crossed and overlapped mode and arranged in a single-end opening mode, only needs to cut one end of each packaging film, and does not waste redundant films; the packaging film with the cross-overlapped lower bottom surfaces can be formed after thermoplastic, and the packaging film can be rapidly unsealed by only rubbing the lower bottom surfaces of the packaging film.
The foregoing detailed description of the embodiments of the utility model has been presented only to illustrate the preferred embodiments of the utility model and should not be taken as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (12)
1. A plastic film mechanism for packaging silicon wafers is characterized by being provided with at least a film making unit and a film cutting unit;
the film forming unit comprises a film folding plate, a film guiding plate and an auxiliary plate which are arranged along the transmission direction;
the film folding plate can reversely guide the two layers of films which are tightly attached to each other into a single layer of film;
the film guide plate and the auxiliary plate are buckled up and down, so that two side edges of the single-layer film are arranged in a crossed and overlapped mode to form a packaging film with a barrel-shaped structure;
the film cutting unit is provided with a linear hot-melt knife, and is used for cutting the tail end opening of the packaging film provided with the silicon wafer group and plugging the front end opening of the next packaging film.
2. The plastic film mechanism for packaging the silicon wafers according to claim 1, wherein the film folding plate is positioned right above the center line position of the silicon wafer group and is a vertical straight plate;
the upper end face of the film folding plate is an inclined face obliquely arranged towards one side far away from the film cutting unit;
a guide wheel is arranged at one side of the membrane folding plate, which is far away from the membrane cutting unit;
the membrane folding plate and the guide wheel enter the double-layer membrane from one side of the opening edge of the double-layer membrane, and the guide wheel abuts against the folding line edge of the double-layer membrane.
3. The plastic film mechanism for packaging silicon chips according to claim 1 or 2, wherein the film guide plate and the auxiliary plate are of L-shaped structures, and the enclosed area is penetrated by a conveying belt and is an inner cavity of the packaging film;
the film guide plates on two sides of the transmission belt are identical in height and are symmetrically arranged relative to the film folding plates;
the vertical surfaces of the auxiliary plates on two sides of the transmission belt are all positioned on the inner side of the film guiding plate, and the lower bottom surfaces of the auxiliary plates are mutually intersected and partially overlapped and have height differences.
4. The plastic film mechanism for packaging silicon chips of claim 3, wherein the horizontal plane and the vertical plane of the film guiding plate are rectangular structures, and the end faces of one side of the film guiding plate far away from the film cutting unit are inclined in the same direction towards the direction close to one side of the film folding plate, and the inclination angles are the same and are acute angles and the same.
5. The plastic film mechanism for packaging silicon chips as defined in claim 4, wherein the inclination angle is in the range of 30-45 °;
the vertical surface of the auxiliary plate is of a rectangular structure, and the end surface of one side, far away from the film cutting unit, of the vertical surface is inclined towards the direction close to one side edge of the film guiding plate.
6. The plastic film mechanism for packaging silicon chips as defined in claim 4, wherein the inclined surface of the auxiliary plate is an extension of the inclined surface of the vertical surface of the film guide plate provided on the same side thereof;
the horizontal plane of the auxiliary plate is of a right triangle structure, and the right-angle side of the auxiliary plate is arranged at one end of the vertical plane of the auxiliary plate far away from the inclined plane;
and a plurality of ventilation holes are also formed in the film guide plate and the auxiliary plate.
7. The plastic film mechanism for packaging silicon chips as defined in claim 1, wherein two film guide rods with different lengths are further arranged on two sides of the film folding plate, and the positions of the film guide rods are at the same height as the lower bottom surface of the film folding plate and are higher than the horizontal plane of the film guide plate;
a flat plate which is arranged vertically to the film folding plate is arranged below the film folding plate and is positioned above the conveying belt; the flat plate is arranged between the vertical surfaces of the film guide plates at two sides and symmetrically arranged relative to the film folding plates, and a plurality of rows of round through holes are formed in the flat plate.
8. The plastic film mechanism for packaging silicon wafers according to any one of claims 1-2 and 4-7, wherein a film outlet unit and a film feeding unit are further arranged above the film making unit;
the film outlet unit, the film feeding unit and the film making unit are all connected to the same frame body; the film cutting unit is arranged at the outer side of the frame body, and one side, close to the film cutting unit, of the film making unit is connected with the frame body;
the film outlet unit and the film feeding unit are both positioned above the film making unit, and the film feeding unit is arranged close to one side of the film making unit.
9. The plastic film mechanism for packaging silicon chips as defined in claim 8, wherein the film outlet unit comprises a film rolling cylinder, a brush cylinder and a film feeding cylinder which are arranged in parallel with the film folding plate, wherein the film rolling cylinders are arranged in parallel and are used for supporting a film roll of a double-layer film, and the end parts of the film rolling cylinders are connected with a film outlet motor and are used for feeding out the double-layer film;
the brush cylinder is positioned below the film rolling cylinder and is a brush cylinder with a gap;
a plurality of punchers perpendicular to the axis of the brush cylinder are arranged along the axial direction of the brush cylinder, and are matched with the outer wall surface of the brush cylinder and used for punching the double-layer film;
the film feeding cylinder is arranged on the roller and positioned below the hairbrush cylinder.
10. The plastic film mechanism for packaging silicon chips as defined in claim 9, wherein the film feeding unit comprises a plurality of film guiding cylinders for guiding out the film and adjusting the film outlet position of the double-layer film, so that the film is positioned right above the film folding plate after being guided by the film guiding cylinders in sequence;
all the film guide cylinders are arranged on one side of the film feeding cylinder, which is close to the film folding plate;
one of the film guide cylinders is a tensioning cylinder wheel and is hinged with a swing arm capable of swinging reciprocally;
and a sensor is arranged above the swing arm, and the sensor recognizes the position of the swing arm to control the film roll to start or stop film discharging.
11. The plastic film mechanism for packaging silicon chips as defined in claim 10, wherein a film guiding cylinder is arranged between the film guiding cylinder hinged with the swing arm and the film feeding cylinder;
all film guiding cylinders are arranged on one side, close to the film folding plate, of the film guiding cylinder hinged with the swing arm except the film guiding cylinder hinged with the swing arm and the film guiding cylinder positioned between the film guiding cylinder and the film feeding cylinder hinged with the swing arm.
12. The plastic film mechanism for packaging silicon chips according to any one of claims 1-2, 4-7 and 9-11, wherein the film cutting unit further comprises a pressing cylinder for controlling the elevation of the hot melt knife and a film sealing plate in alignment contact with the hot melt knife,
the hot melt knife is perpendicular to the direction of the conveying belt and is suspended right above the film sealing plate through the lower air cylinder;
after the silicon chip group completely passes through the film sealing plate, the pressing cylinder controls the hot melt knife to press down to contact with the film sealing plate so as to cut off and seal the opening end of the packaging film to form a fluffy packaging film;
and closing the port of the next packaging film, which is close to one side of the hot melt knife.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320965205.8U CN220391704U (en) | 2023-04-26 | 2023-04-26 | Plastic film mechanism for silicon wafer packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320965205.8U CN220391704U (en) | 2023-04-26 | 2023-04-26 | Plastic film mechanism for silicon wafer packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118254998A (en) * | 2024-05-29 | 2024-06-28 | 山东亿嘉农化有限公司 | Pesticide equipment for packing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118254998A (en) * | 2024-05-29 | 2024-06-28 | 山东亿嘉农化有限公司 | Pesticide equipment for packing |
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