CN220382076U - Auxiliary device - Google Patents

Abstract

The utility model provides an auxiliary device, comprising: the support comprises a support body, a support rod and a driving mechanism, wherein the size of the support body in at least a first direction is smaller than the size of an inner cavity of Yu Jingzhou in the first direction, and the support body is provided with a support surface; the support rod extends along a first direction and is movably arranged on the support main body along a second direction above the support surface; one end of the supporting rod is connected with the driving mechanism, and moves towards a direction approaching or separating from the supporting surface under the action of the driving mechanism. The auxiliary device is matched with the vacuum suction pen to be used, the scratch caused by the fact that the vacuum suction pen touches the front surface of the adjacent wafer when the target wafer is adsorbed can be avoided, in addition, the supporting rod is movably arranged in the second direction, and the supporting rod can act on any target wafer by moving the supporting rod.

Description

Auxiliary device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to an auxiliary device matched with a vacuum suction pen.

Background

In semiconductor manufacturing processes, wafer boats (cassettes) are often used as tools for carrying wafers to more efficiently perform wafer processing. Generally, wafers are placed in a wafer boat in a horizontal stack to complete the corresponding process.

In the process of executing the corresponding process, the surface of the wafer may be scratched, and the wafer needs to be manually operated to take out the wafer from the wafer boat to check the surface abnormality of the wafer,

in the prior art, a vacuum suction pen is generally used to suck the back surface of a wafer so as to take the wafer out of a wafer boat, however, when the back surface of a target wafer is sucked, the vacuum pen easily touches the front surface of an adjacent wafer to scratch the front surface of the adjacent wafer.

Disclosure of Invention

The utility model aims to provide an auxiliary device for solving the problem that when a vacuum pen is used for sucking the back surface of a wafer in a wafer boat, the vacuum pen is easy to touch the front surface of an adjacent wafer to cause scratching.

In order to solve the above-mentioned technical problems, the present utility model provides an auxiliary device for ejecting up wafers in a wafer boat, the wafer boat having a plurality of wafer placement areas, wherein a direction in which each wafer placement area loads wafers is a first direction, the plurality of wafer placement areas are sequentially arranged along a second direction, the second direction and the first direction are at an angle, the auxiliary device comprising:

the size of the supporting body at least in the first direction is smaller than that of the inner cavity of the wafer boat in the first direction, and the supporting body is provided with a supporting surface;

a support bar extending in the first direction and movably provided to the support body in the second direction above the support surface; the method comprises the steps of,

and one end of the supporting rod is connected with the driving mechanism, and moves towards the direction approaching or separating from the supporting surface under the action of the driving mechanism.

Optionally, in the auxiliary device, a dimension of the support rod in the second direction is not greater than a dimension of each of the wafer placement areas in the second direction.

Optionally, in the auxiliary device, the supporting surface has a plurality of positioning areas, and the plurality of positioning areas are obtained by dividing the supporting surface along the second direction according to the size of the wafer placement area in the second direction, so that the positions of the plurality of wafer placement areas can be distinguished based on the arrangement positions of the plurality of positioning areas.

Optionally, in the auxiliary device, the supporting body is provided with a plurality of first positioning grooves arranged on the supporting surface, each first positioning groove is divided into a positioning area, and an outer contour of the supporting rod is matched with an inner contour of the first positioning groove.

Optionally, in the auxiliary device, the supporting rod is provided with a limiting groove arranged along the first direction, and an opening direction of the limiting groove is away from the supporting surface.

Optionally, in the auxiliary device, the auxiliary device further includes a base, and the base has a bearing surface and a positioning structure disposed on the bearing surface; the supporting main body is arranged on the bearing surface, and the two supporting feet of the wafer boat are fixed on the bearing surface through the positioning structure.

Optionally, in the auxiliary device, the positioning structure includes two second positioning grooves, the two second positioning grooves extend along the second direction, and the supporting feet of the wafer boat are fixed on the bearing surface by being respectively inserted into the two second positioning grooves.

Optionally, in the auxiliary device, one end of the support rod connected with the driving mechanism keeps the relative position with the support main body unchanged under the action of the driving mechanism, and the other end rotates towards a direction approaching or separating from the support surface.

Optionally, in the auxiliary device, the driving mechanism includes a handle drawing portion and a handle operating portion, one end of the handle drawing portion is connected to the support rod, and the other end is connected to the handle operating portion; the handle operation part drives the handle drawing part to drive the support rod to rotate towards the direction approaching to or away from the support surface; the handle drawing portion has a length variation degree of freedom in the second direction, and the support rod is driven to move in the second direction by the variation of the length.

Optionally, in the auxiliary device, the rotation angle of the support rod does not exceed 90 °.

Optionally, in the auxiliary device, the supporting rod moves up and down relative to the supporting surface under the action of the driving mechanism.

Optionally, in the auxiliary device, the auxiliary device further includes a guide rail, the guide rail extends along the second direction, and one end of the support rod, which is used for being connected with the driving mechanism, is movably disposed on the guide rail along the second direction.

In summary, the present utility model provides an auxiliary device for ejecting wafers in a wafer boat upwards, the wafer boat having a plurality of wafer placement areas, wherein a direction in which the wafers are loaded in the wafer placement areas is a first direction, and the plurality of wafer placement areas are sequentially arranged along a second direction, and the second direction is at an angle to the first direction, the auxiliary device comprising: the support device comprises a support main body, a support rod and a driving mechanism, wherein the support main body is provided with a support surface; the support rod extends along the first direction and is movably arranged on the support main body along the second direction above the support surface, and the dimension of the support rod in the second direction is not larger than the dimension of each wafer placement area in the second direction; one end of the supporting rod is connected with the driving mechanism, and moves towards a direction approaching or separating from the supporting surface under the action of the driving mechanism. Before the vacuum suction pen is used for adsorbing the target wafer, the auxiliary device is used for ejecting the target wafer upwards, so that the target wafer and other wafers are misplaced, and the vacuum suction pen is used for adsorbing the back surface of the target wafer on the basis, so that the vacuum suction pen can be prevented from being scratched due to the fact that the vacuum suction pen touches the front surface of the adjacent wafer when the target wafer is adsorbed. In addition, the support bar is movably disposed in the second direction, and the support bar may be moved so that the support bar can act on any target wafer.

Drawings

Those of ordinary skill in the art will appreciate that the figures are provided for a better understanding of the present utility model and do not constitute any limitation on the scope of the present utility model. Wherein:

FIG. 1 is a schematic view of a wafer boat;

FIG. 2 is a schematic diagram of an auxiliary device according to an embodiment of the present utility model;

FIG. 3 is a schematic view showing a state of the auxiliary device and the boat matching arrangement in the embodiment of the utility model;

FIG. 4 is a schematic perspective view of a support bar supporting a wafer in accordance with an embodiment of the present utility model;

FIG. 5 is a schematic cross-sectional view of a support bar supporting a wafer according to an embodiment of the present utility model;

in the accompanying drawings:

1-an auxiliary device; 2-a wafer boat;

21-plate-like portion; 22-supporting feet; 201-loading slot;

11-a support body; 12-supporting rods; 13-a drive mechanism; 14-a base;

111-a first positioning groove;

121-block; 122-limit grooves;

131-a handle pull portion; 132-a handle operating portion;

141-a second positioning groove;

15-slide bar.

Detailed Description

The utility model will be described in detail with reference to the drawings and the embodiments, in order to make the objects, advantages and features of the utility model more apparent. It should be noted that the drawings are in a very simplified form and are not drawn to scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model. Furthermore, the structures shown in the drawings are often part of actual structures. In particular, the drawings are shown with different emphasis instead being placed upon illustrating the various embodiments. It should be further understood that the terms "first," "second," "third," and the like in this specification are used merely for distinguishing between various components, elements, steps, etc. in the specification and not for indicating a logical or sequential relationship between the various components, elements, steps, etc., unless otherwise indicated.

The embodiment of the utility model provides an auxiliary device, which is used for ejecting wafers in a wafer boat upwards to be matched with a vacuum suction pen for use, wherein the wafer boat is generally provided with a plurality of wafer placement areas, the direction of loading the wafers in each wafer placement area is a first direction, the plurality of wafer placement areas are sequentially arranged along a second direction, and the second direction and the first direction are two directions which are mutually angled.

As shown in fig. 1, the wafer boat 1 has two oppositely disposed plate-shaped portions 21, wherein a direction in which one of the two plate-shaped portions 21 points to the other is the first direction, and a plurality of loading grooves 201 are sequentially provided on the inner side of each plate-shaped portion 21 along the second direction, the loading grooves 201 of the two plate-shaped portions 21 are in one-to-one correspondence, so that the two loading grooves 201 located in the same first direction and an inner cavity region between the two loading grooves 201 together form one wafer placement region, and each wafer placement region is capable of loading a wafer along the first direction. Typically, the first direction is perpendicular to the second direction, which is illustrated in fig. 1 as being perpendicular to the first direction. It should be understood that the first direction being perpendicular to the second direction does not constitute a limitation of the present application, and in other cases the first direction and the second direction may intersect at other angles, for example, at 85 °, 70 °, etc.

Referring to fig. 2 in combination with fig. 3, the auxiliary device 1 provided in the embodiment of the utility model includes: a support body 11, a support rod 12, and a driving mechanism 13.

The support body 11 has a support surface; the dimension of the supporting body 11 in at least the first direction is smaller than the dimension of the inner cavity of the wafer boat 2 in the first direction, that is, the dimension of the supporting body 11 in the first direction is smaller than the distance between the two plate-shaped portions 21 of the wafer boat 2, so that the supporting body 11 can extend into the bottom of the inner cavity of the wafer boat 2 along the second direction, and the supporting surface can be located below the wafer placement area of the wafer boat 2. As shown in fig. 3, the dimension of the support body 11 in the second direction is larger than the dimension of the wafer boat 2 in the second direction, so that the support body 11 is partially located outside the wafer boat 2, and in other examples, the dimension of the support body 11 in the second direction may be equal to or smaller than the dimension of the wafer boat 2 in the second direction.

The support bar 12 extends in the first direction and is movably provided to the support body 11 in the second direction above the support surface. In addition, one end of the supporting rod 12 is connected to the driving mechanism 13, and moves in a direction approaching or separating from the supporting surface under the action of the driving mechanism 13, so that the wafers in the wafer boat 2 are lifted up.

As described above, the wafers are generally placed in the wafer boat 2 in a stacked manner, and when the vacuum suction pen is used to suck the back surface of the target wafer, the vacuum suction pen easily touches the front surface of the adjacent wafer, and the front surface of the adjacent wafer is scratched. If the auxiliary device provided by the embodiment of the utility model is used for matching, after the wafer boat 2 is positioned, the supporting body 11 and the supporting rod 12 are positioned below the wafer placement area of the wafer boat 2, and the arrangement direction of the supporting rod 12 is consistent with the arrangement direction of the wafer placement area, so that before the target wafer is absorbed by the vacuum suction pen, the auxiliary device can be operated first, so that the supporting rod 12 moves in a direction away from the supporting surface (i.e. moves in a direction close to the wafer) to push the target wafer above the supporting rod upwards, at this time, the target wafer and other wafers are not completely overlapped, but are partially misplaced, and the vacuum suction pen is used for absorbing the back surface of the target wafer on the basis, so that the front surface of the adjacent wafer is prevented from being scratched due to the fact that the vacuum suction pen touches the front surface of the adjacent wafer when absorbing the target wafer. In addition, in the auxiliary device provided by the embodiment of the utility model, since the support rod 12 is movably arranged in the second direction, the support rod 12 can be enabled to act on any target wafer by moving the support rod 12.

Preferably, the dimension of the support rod 12 in the second direction is not greater than the dimension of each wafer placement area in the second direction, so that it is ensured that the support rod 12 only lifts up the target wafer and does not touch other wafers when moving in a direction away from the support surface.

Preferably, the supporting surface has a plurality of positioning areas, and the plurality of positioning areas are obtained by dividing the supporting surface along the second direction according to the size of the wafer placement area in the second direction, so that the positions of the plurality of wafer placement areas can be distinguished based on the arrangement positions of the plurality of positioning areas. In a preferred embodiment, the size of each positioning area in the second direction may be set to be equal to the size of the wafer placement area in the second direction, but other matching arrangements may be made, so long as the positions of the wafer placement areas can be distinguished by the arrangement positions of the positioning areas.

By dividing a plurality of positioning areas according to the arrangement and matching of the wafers, the support rods 12 can accurately move to the lower part of the target wafer, and the situation that adjacent wafers are ejected out due to inaccurate movement is avoided. In practical application, a plurality of positioning areas may be numbered, for example, the positioning areas are numbered in sequence along the second direction: 1. 2, 3, 4, …, etc., when the surface of the fourth wafer needs to be inspected, the supporting rod 12 is moved to the positioning area with the number of 4, and then the driving mechanism 13 is used to drive the supporting rod 12 to move, so that the supporting rod 12 jacks up the fourth wafer.

Further preferably, as shown in fig. 2, the supporting body 11 has a plurality of first positioning grooves 111 disposed on the supporting surface, each first positioning groove 111 defines a positioning area, an inner contour of the first positioning groove 111 is matched with an outer contour of the supporting rod 12, so that the supporting rod 12 can be at least partially accommodated in the positioning groove 111, where "matched" is understood as that an inner contour shape of the first positioning groove 111 and an outer contour shape of the supporting rod 12 are both circular arcs, and the inner contour shape of the first positioning groove 111 is equal to or slightly larger than the outer contour shape of the supporting rod 12. Since the support rod 12 has a certain degree of freedom of movement in the second direction, after moving to the target positioning area, there is a high possibility that the support rod 12 is not completely located in the target positioning area due to inertia, visual deviation, or the like, in this embodiment, a positioning area is formed by providing the first positioning groove 111, and since the first positioning groove 111 generates a certain resistance when the support rod 12 moves in the second direction, the influence of inertia, visual deviation, or the like on the moving position accuracy of the support rod 12 can be reduced by the first positioning groove 111.

In addition, as shown in fig. 4 and 5, the supporting rod 12 preferably has a limiting groove 122 disposed along the first direction, and the opening direction of the limiting groove 122 is away from the supporting surface, so that the bottom of the wafer can extend into the limiting groove 122, and the supporting rod 12 can avoid the wafer from being separated from the wafer placement area when the wafer is lifted up.

As shown in fig. 1, the wafer boat 2 generally has two symmetrically disposed support legs 22. In application, the boat 2 may be directly placed on a carrying surface that also carries the supporting body 11, and the two supporting feet 22 of the boat 2 are respectively located at two sides of the supporting body 11, but in order to avoid a change in the position of the boat 2 during operation, in this embodiment, preferably, the auxiliary device further includes a base 14, where the base 14 has a carrying surface and a positioning structure disposed on the carrying surface; the supporting body 11 is disposed on the carrying surface, and the supporting feet 22 of the wafer boat 2 are fixed on the carrying surface through the positioning structure. The two support legs 22 of the wafer boat 2 are fixed by the positioning structure, so that the position of the wafer boat 2 is prevented from changing during operation, and alignment between the support rods 12 and the target wafer is facilitated.

In other embodiments, the two positioning structures may be clamping structures protruding from the bearing surface, or the like. In this embodiment, as shown in fig. 2, the positioning structure includes two second positioning grooves 141, the two second positioning grooves 141 are respectively disposed along the second direction, and the two supporting feet 22 of the wafer boat 2 are respectively inserted into the two second positioning grooves 141 to be fixed on the carrying surface, so that the convenience of operation is improved as only the two supporting feet 22 of the wafer boat 2 are respectively inserted into the two second positioning grooves 141 to be fixed. In addition, the second positioning groove 141 may be provided to have an extension length greater than the size of the wafer boat 2 in the second direction, so that alignment between each of the second positioning grooves 141 and each of the wafers may be achieved by adjusting the position of the wafer boat 2 within the second positioning groove 141 in the second direction, and then the support bar 12 may be enabled to act on a target wafer by driving the support bar 12 to move in the second direction.

As described above, the support rod 12 moves in a direction approaching or moving away from the support surface by the driving mechanism 13. In this embodiment, the support rod 12 is driven by the driving mechanism 13, and one end connected to the driving mechanism 13 maintains a constant relative position with the support body 11, and the other end rotates in a direction approaching or separating from the support surface. That is, in the operating state, when the support rod 12 is driven by the driving mechanism 13, one end is used as a fulcrum, and the other end is rotated in the vertical direction to lift up the wafer. Although the limiting groove 122 of the supporting rod 12 performs a certain limiting function on the wafer, further, in order to avoid the wafer from falling off, it is preferable to limit the rotation angle of the supporting rod 12 to not more than 90 °.

Preferably, as shown in fig. 2, the driving mechanism 13 includes a handle drawing portion 131 and a handle operation portion 132, wherein one end of the handle drawing portion 131 is connected to the support bar 12, and the other end is connected to the handle operation portion 132; the handle operation part 132 drives the handle drawing part 131 to drive the support rod 12 to rotate in a direction approaching or separating from the support surface; the handle drawing portion 131 has a degree of freedom of length change in the second direction, and the support rod 12 is driven to move in the second direction by the change in length. With the driving mechanism 13 provided in this embodiment, the handle operating portion 132 does not move along with the movement of the support rod 12, and can be kept outside the inner cavity of the boat 2, which is convenient for operation.

In addition, in order to enable the support rod 12 to be movable along the second direction, the auxiliary device further includes a guide rail extending along the second direction, and an end of the support rod 12 for connecting with the driving mechanism 13 is movably disposed on the guide rail along the second direction. Specifically, as shown in fig. 2, the guide rail may be a sliding rod 15 extending along the second direction, one end of the supporting rod 12 for connecting the driving mechanism 13 has a block portion 121, and the block portion 121 is movably sleeved on the sliding rod 15 along the second direction. The handle drawing portion 131 is connected to the block 121, and applies a force to the block 121 by a change in length so that the support rod 12 can move in the second direction. In other embodiments, the guide rail 152 may be a guide groove provided on the support body 11 along the second direction, and the block 121 extends into the guide groove.

In addition, in other embodiments, the supporting rod 12 can also move up and down relative to the bearing surface under the action of the driving mechanism 13. That is, the driving mechanism 13 includes a lifting mechanism, the supporting rod 12 is driven to move up and down by lifting, the specific structure of the lifting mechanism is not limited in the present application, and all structures capable of lifting are within the scope of protection of the present application.

By using the auxiliary device provided by the embodiment of the utility model as shown in fig. 2, the working steps of adsorbing the wafer by matching with the vacuum suction pen include:

step S1, two supporting feet 22 of a wafer boat 2 are correspondingly inserted into a positioning groove;

step S2, moving the wafer boat 2 along a second direction so that a plurality of wafers correspond to the positions of the positioning grooves below the wafers one by one;

step S3, moving the support rod 12 along a second direction so that the support rod 12 is positioned right below the target wafer;

step S4, controlling the driving mechanism 13 to enable the supporting rod 12 to rotate in a direction away from the supporting surface, and enabling the target wafer and the adjacent wafer to be misplaced;

and S5, adsorbing the back surface of the target wafer by using a vacuum suction pen.

Thus, the above steps complete the adsorption of the target wafer.

In summary, in the auxiliary device provided by the embodiment of the utility model, the wafer in the wafer boat is ejected upwards, the wafer boat has a plurality of wafer placement areas, each wafer placement area extends along a first direction, the plurality of wafer placement areas are sequentially arranged along a second direction, the second direction and the first direction form an angle with each other, the support main body, the support rod and the driving mechanism, the size of the support main body at least in the first direction is smaller than the size of the inner cavity of the wafer boat in the first direction, and the support main body has a support surface; the support rod extends along the first direction and is movably arranged on the support main body along the second direction above the support surface; one end of the supporting rod is connected with the driving mechanism, and moves towards a direction approaching or separating from the supporting surface under the action of the driving mechanism. Before the vacuum suction pen is used for adsorbing the target wafer, the auxiliary device is used for ejecting the target wafer upwards, so that the target wafer and other wafers are misplaced, and the vacuum suction pen is used for adsorbing the back surface of the target wafer on the basis, so that the vacuum suction pen can be prevented from being scratched due to the fact that the vacuum suction pen touches the front surface of the adjacent wafer when the target wafer is adsorbed. In addition, the support bar is movably disposed in the second direction, and the support bar may be moved so that the support bar can act on any target wafer.

It should be noted that, although the structural features of the boat are defined in the first direction and the second direction, and then the structural features of the auxiliary device provided in the embodiment of the present utility model are described by means of the first direction and the second direction, it is understood that, for the auxiliary device, the extending direction and the movable direction of the support rod also independently form the relationship between the first direction and the second direction, and the two have the same first direction and the second direction because the two are described in a state after the two are matched when the structural features are defined.

It should also be appreciated that while the present utility model has been disclosed in the context of a preferred embodiment, the above embodiments are not intended to limit the utility model. Many possible variations and modifications of the disclosed technology can be made by anyone skilled in the art without departing from the scope of the technology, or the technology can be modified to be equivalent. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims (12)

1. An auxiliary device for ejecting wafers in a wafer boat upward, the wafer boat having a plurality of wafer placement areas, each wafer placement area having a first direction along which a wafer is loaded, the plurality of wafer placement areas being arranged in sequence along a second direction, the second direction being at an angle to the first direction, the auxiliary device comprising:

the size of the supporting body at least in the first direction is smaller than that of the inner cavity of the wafer boat in the first direction, and the supporting body is provided with a supporting surface;

a support bar extending in the first direction and movably provided to the support body in the second direction above the support surface; the method comprises the steps of,

and one end of the supporting rod is connected with the driving mechanism, and moves towards the direction approaching or separating from the supporting surface under the action of the driving mechanism.

2. The assist device of claim 1 wherein the dimension of the support bar in the second direction is no greater than the dimension of each of the wafer placement areas in the second direction.

3. The assist device according to claim 1, wherein the support surface has a plurality of positioning areas, the plurality of positioning areas being obtained by dividing the support surface in the second direction according to a size of the wafer placement area in the second direction so that the positions of the plurality of wafer placement areas can be distinguished based on an arrangement position of the plurality of positioning areas.

4. An auxiliary device according to claim 3, wherein the support body has a plurality of first positioning grooves formed in the support surface, each of the first positioning grooves dividing the positioning area, and an outer contour of the support rod is matched with an inner contour of the first positioning groove.

5. The auxiliary device according to claim 1, wherein the support bar has a limit groove arranged in the first direction, an opening direction of the limit groove facing away from the support surface.

6. The auxiliary device according to claim 1, further comprising a base having a bearing surface and a positioning structure disposed on the bearing surface; the supporting main body is arranged on the bearing surface, and the supporting feet of the wafer boat are fixed on the bearing surface through the positioning structure.

7. The apparatus of claim 6, wherein the positioning structure comprises two second positioning grooves, the two second positioning grooves extend along the second direction, and the two supporting feet of the wafer boat are fixed on the carrying surface by being respectively inserted into the two second positioning grooves.

8. The auxiliary device according to claim 1, wherein one end of the support rod connected to the driving mechanism is kept unchanged relative to the support body under the action of the driving mechanism, and the other end is rotated in a direction approaching or separating from the support surface.

9. The assist device according to claim 8, wherein the drive mechanism includes a handle drawing portion and a handle operation portion, one end of the handle drawing portion being connected to the support rod, the other end being connected to the handle operation portion; the handle operation part drives the handle drawing part to drive the support rod to rotate towards the direction approaching to or away from the support surface; the handle drawing portion has a length variation degree of freedom in the second direction, and the support rod is driven to move in the second direction by the variation of the length.

10. Auxiliary device according to claim 8, wherein the support rod is rotated by not more than 90 °.

11. The auxiliary device according to claim 1, wherein the support bar is moved up and down relative to the support surface by the drive mechanism.

12. The auxiliary device according to claim 1, further comprising a guide rail extending in the second direction, wherein an end of the support rod for connection with the driving mechanism is movably disposed on the guide rail.