CN220380613U

CN220380613U - Spectrum module

Info

Publication number: CN220380613U
Application number: CN202320813982.0U
Authority: CN
Inventors: 杨昆; 范威娜; 黄志雷
Original assignee: Beijing Heguang Technology Co ltd
Current assignee: Beijing Heguang Technology Co ltd
Priority date: 2023-04-13
Filing date: 2023-04-13
Publication date: 2024-01-23
Anticipated expiration: 2033-04-13

Abstract

The application relates to a spectrum module, which comprises a circuit board, a spectrum chip and an optical assembly, wherein the spectrum chip is electrically connected to the circuit board, and the optical assembly is positioned on a photosensitive path of the spectrum chip, and the spectrum chip comprises a modulation area and a non-modulation area; the optical assembly comprises a light splitting element and a reflecting element; the light splitting element is used for splitting incident light into two beams of incident light, the light splitting element and the reflecting element are arranged according to a preset arrangement mode, so that one beam of incident light reaches a non-modulation area of the spectrum chip after passing through the light splitting element, and the other beam of incident light reaches the reflecting element after passing through the light splitting element and is reflected to a modulation area of the spectrum chip by the reflecting element.

Description

Spectrum module

Technical Field

The present application relates to the field of spectral imaging technology, and more particularly, to a spectral module.

Background

With the development of spectroscopic techniques, spectroscopic analysis is widely used in life and industry; for example, the method is used for non-invasive examination in the fields of medical treatment, cosmetology and the like, food detection of fruits, vegetables and the like, water quality monitoring and the like. The principle of operation is that light interacts with substances, such as absorption, scattering, fluorescence, raman, etc., to produce a specific spectrum, and the spectrum of each substance is unique. Thus, the spectral information can be said to be a "fingerprint" of everything.

However, the existing imaging chip can only acquire the image information of the photographed object, but cannot acquire the spectrum information of the photographed object. That is, the imaging chip and the imaging device in the prior art cannot acquire the spectrum information of the object, so that the obtained image information cannot be widely applied to the scenes of intelligent AI identification, qualitative and quantitative analysis of the material composition and the like which need the spectrum information of the object as data support. Therefore, when it is required to obtain the spectrum information and the image information of the subject at the same time, it is often required that a plurality of camera modules and/or devices cooperate, and the obtained image information and the spectrum information are integrated by an algorithm. Multiple modules undoubtedly increase cost and occupy more space.

It is therefore desirable to provide an improved spectral module that has both spectral information and image information acquisition capabilities.

Disclosure of Invention

An advantage of the present disclosure is to provide a spectrum module, where the spectrum module may divide an incident light into at least two beams of incident light, and construct optical paths that respectively lead to a modulation region and a non-modulation region of a spectrum chip, so that the two beams of incident light respectively reach the modulation region and the non-modulation region of the spectrum chip.

According to one aspect of the present application, there is provided a spectrum module comprising:

a circuit board;

the spectrum chip is electrically connected to the circuit board and comprises a modulation area and a non-modulation area, and the modulation area and the non-modulation area are adjacently arranged; and

an optical component positioned on the photosensitive path of the spectrum chip and comprising a light splitting element and a reflecting element;

the light splitting element is used for splitting incident light into first incident light and second incident light, the light splitting element and the reflecting element are arranged according to a preset arrangement mode, so that the first incident light reaches the spectrum chip after passing through the light splitting element, the second incident light reaches the reflecting element after passing through the light splitting element and is reflected to the spectrum chip by the reflecting element, and the first incident light and the second incident light respectively reach different areas of the spectrum chip.

In the spectrum module according to the application, the light splitting element allows part of incident light to pass through to form the first incident light and reflects the other part of the incident light to form the second incident light, and the reflecting element is arranged on the light reflecting path of the light splitting element.

In the spectrum module according to the application, the first incident light passes through the light splitting element and then reaches the non-modulation area of the spectrum chip, and the second incident light is reflected by the light splitting element to the reflecting element and is reflected by the reflecting element to the modulation area of the spectrum chip.

In the spectrum module according to the present application, the ratio of the intensity of the transmitted light to the intensity of the reflected light of the light splitting element is 1:1 or less.

In the spectrum module according to the application, the spectrum module further comprises a bracket mounted on the circuit board, wherein the bracket is provided with at least one accommodating cavity inside the bracket and a light through hole penetrating through the outer surface of the top wall and the inner surface of the top wall, and the light through hole corresponds to and only corresponds to the non-modulation area of the spectrum chip.

In the spectrum module according to the application, the optical assembly further comprises a dodging piece, a diaphragm and a filter piece which are positioned between the reflecting element and the spectrum chip.

In the spectrum module according to the application, the first incident light reaches the modulation area of the spectrum chip after passing through the light splitting element, and the second incident light is reflected to the reflecting element by the light splitting element and is reflected to the non-modulation area of the spectrum chip by the reflecting element.

In the spectrum module according to the application, the spectrum module further comprises a bracket mounted on the circuit board, the bracket is provided with at least one accommodating cavity positioned in the bracket and a light through hole penetrating through the outer surface of the top wall and the inner surface of the top wall, and the light through hole corresponds to the modulation area of the spectrum chip and only corresponds to the modulation area of the spectrum chip.

In the spectrum module according to the application, the optical assembly further comprises a light homogenizing piece, a diaphragm and a light filtering piece, wherein the light homogenizing piece, the diaphragm and the light filtering piece are positioned between the light splitting element and the spectrum chip.

In the spectrum module according to the present application, the light splitting element is installed in the light passing hole.

In the spectrum module according to the application, the light splitting element and the reflecting element have consistent reflectivity and consistent transmittance for light with different wavelengths.

In the spectrum module according to the present application, the light splitting element is the beam splitter, and the reflecting element is a reflecting mirror.

In the spectrum module according to the application, the optical assembly further comprises a lens group, and the lens group is located on the object side of the light splitting element.

In the spectrum module according to the application, the spectrum module further comprises a light shielding piece, and at least one side wall of the light shielding piece is positioned between the modulation area and the non-modulation area.

In the spectrum module according to the application, the spectrum module further comprises a support mounted on the circuit board, the support is provided with a top wall opposite to the spectrum chip in the direction of the optical axis set by the spectrum chip, at least one side wall of the light shielding piece extends between the top walls of the support, and the light shielding piece and the support are of an integrated structure.

In the spectrum module according to the present application, the dodging member, the diaphragm and the filter have an integral structure.

In the spectrum module according to the application, the reflecting element is a prism, and the prism, the dodging piece, the diaphragm and the filter are integrated together to form an integrated optical module.

In the spectrum module according to the application, the light homogenizing element comprises a micro lens array, the micro lens array comprises an array first area and an array second area, the array second area surrounds outside the array first area, the light diffusing capacity of the array second area is smaller than that of the array first area, and the light diffusing capacity of the array second area at least partially corresponds to an area adjacent to the junction of the modulating area and the non-modulating area of the spectrum chip.

Drawings

Various other advantages and benefits of the present application will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. It is apparent that the drawings described below are only some embodiments of the present application and that other drawings may be obtained from these drawings by those of ordinary skill in the art without inventive effort. Also, like reference numerals are used to designate like parts throughout the figures.

Fig. 1 illustrates a schematic diagram of a spectrum chip of a spectrum module according to an embodiment of the application.

Fig. 2 illustrates a schematic diagram of modulated and non-modulated regions of a spectral chip according to an embodiment of the present application.

Fig. 3 illustrates a cross-sectional view of one example of a spectral chip according to an embodiment of the present application.

Fig. 4 illustrates a cross-sectional view of another example of a spectral chip according to an embodiment of the present application.

Fig. 5 illustrates a cross-sectional view of yet another example of a spectral chip according to an embodiment of the present application.

Fig. 6 illustrates a schematic diagram of one example of a spectrum module according to an embodiment of the present application.

Fig. 7 illustrates a schematic diagram of another example of a spectrum module according to an embodiment of the present application.

Fig. 8 illustrates a schematic diagram of yet another example of a spectrum module according to an embodiment of the present application.

Fig. 9 illustrates a schematic diagram of yet another example of a spectrum module according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application and not all of the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Based on the fact that the existing imaging chip cannot obtain spectrum information, in some scenes requiring spectrum information and image information, the imaging module and the spectrum module 100 must work together to meet the requirements, which necessarily results in more complex overall systems and increased cost. The embodiment of the application provides a spectrum module 100 capable of simultaneously acquiring spectrum information and image information, which solves the existing technical problems.

Fig. 1 illustrates a schematic diagram of a spectrum chip 10 of a spectrum module 100 according to an embodiment of the present application. As shown in fig. 1, a spectrum chip 10 in a spectrum module 100 of the embodiment of the present application includes a filtering structure 11 and an image sensor 12, where the filtering structure 11 is located on a photosensitive path of the image sensor 12, and the filtering structure 11 is a broadband filtering structure 11 on a frequency domain or a wavelength domain. The transmittance of the filter structure 11 is not exactly the same for different wavelengths throughout. The filter structure 11 may be a structure or a material having a filter property such as a super surface, a photonic crystal, a nano-pillar, a multilayer film, a dye, a quantum dot, a MEMS (micro electro mechanical system), an FP etalon, a cavity layer, a waveguide layer, a diffraction element, or the like. For example, in the embodiment of the present application, the optical filtering structure 11 may be a light modulation layer in chinese patent CN 201921223201.2.

The image sensor 12 may be a CMOS Image Sensor (CIS), CCD, array photodetector, or the like. The spectroscopic device further includes a data processing unit 13, and the data processing unit 13 may be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, which can export data generated by the image sensor 12 to the outside for processing.

Fig. 2 illustrates a schematic diagram of a modulated region 110 and a non-modulated region 120 of a spectral chip 10 according to an embodiment of the present application. As shown in fig. 2, the spectrum chip 10 in the embodiment of the present application includes a modulation area 110 and a non-modulation area 120, where the modulation area 110 is provided with the optical filtering structure 11, the optical filtering structure 11 is used to implement spectrum modulation on incident light, and the non-modulation area 120 is not provided with the optical filtering structure 11. Taking a CMOS sensor as an example, for the modulation region 110, the incident light enters the optical filtering structure 11 to be modulated, and then enters the CMOS physical pixel 121 corresponding to the modulation region 110 to obtain light intensity information, thereby obtaining spectrum information; for the non-modulation region 120, the incident light is not modulated, and directly enters the corresponding physical pixel 121 to obtain the corresponding light intensity information, so as to obtain image information and the like; the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as blank, bayer array (regular or irregular array), micro-lenses, etc., for example, blank, i.e., the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as black-and-white pixels; for example, bayer array, and the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as RGGB array or the like. As shown in fig. 2 to 5, the modulation region 110 and the non-modulation region 120 of the spectrum chip 10 in the embodiment of the present application are disposed adjacently, and the modulation region 110 and the non-modulation region 120 are located at two opposite side regions of the spectrum chip 10, respectively, and the non-modulation region 120 is located at one side of the modulation region 110. For example, the modulation region 110 is located in a left region of the spectrum chip 10, the non-modulation region 120 is located in a right region of the spectrum chip 10, or the modulation region 110 is located in a right region of the spectrum chip 10, and the non-modulation region 120 is located in a left region of the spectrum chip 10.

Fig. 3 illustrates a cross-sectional view of one example of a spectral chip 10 according to an embodiment of the present application. At least one modulation layer is formed on the image sensor 12, and at least one modulation layer forms the light filtering structure 11. Specifically, at first, at least one base layer may be formed on the image sensor 12; and etching or nanoimprinting is performed on a preset modulation area of the base layer to form a micro-nano structure 61, as shown in fig. 3, and the base layer with the micro-nano structure 61 is formed to form the modulation layer. At least one micro-nano structure 61 constitutes a set of structural units 60, which micro-nano structure 61 may be implemented as holes, pillars, wires, etc. That is, the optical filtering structure 11 includes at least one modulation layer, and each modulation layer includes at least one group of structural units 60, and each group of structural units 60 includes at least one micro-nano structure 61. The non-modulation region 120 may be selected to remove the material of the modulation layer, so as to expose the physical pixels 121 on the image sensor 12, i.e., the optical path of the physical pixels 121 corresponding to the non-modulation region 120 is free of the structural units 60.

Fig. 4 illustrates a cross-sectional view of another example of a spectral chip 10 according to an embodiment of the present application. As shown in fig. 4, the modulation layer may be implemented as at least two modulation layers, where the micro-nano structures 61 of the at least two modulation layers have different structural parameters (e.g., manufacturing materials, dimensions, structure types (e.g., holes, pillars, etc.), gaps) and/or shape parameters, so that each mutually corresponding region of the at least two modulation layers has micro-nano structures 61 with different modulation effects, and the combination of the different micro-nano structures 61 of the at least two modulation layers makes the modulation effect better. It should be understood that the micro-nano structures 61 of all the modulation layers may also have the same structural parameters. That is, the spectrum chip 10 may include a first modulation layer 111 and a second modulation layer 112, the first modulation layer 111 and the second modulation layer 112 being sequentially formed on the photosensitive path of the image sensor 12.

Further, explaining the broad spectrum modulation theory, the intensity signal of the incident light at different wavelengths λ is denoted as f (λ), the transmission spectrum curve of the filter structure 11 is denoted as T (λ), the spectrum chip 10 has m groups of structural units 60, the transmission spectrums of each group of structural units 60 are different from each other, and the whole can be denoted as Ti (λ) (i=1, 2,3, …, m). Under each group of structural units 60 there is a corresponding physical pixel 121 for detecting the light intensity information Ii modulated by the structural units 60. In the specific embodiment of the present application, a physical pixel 121 is taken as an example and a group of structural units 60 is taken as an illustration, as shown in fig. 5. However, the embodiment of the present application is not limited thereto, and in other embodiments, the plurality of physical pixels 121 may be a group corresponding to a group of structural units 60, as shown in fig. 6, 2×2 physical pixels 121 may be a group corresponding to a group of structural units 60, or n×m physical pixels 121 may be a group corresponding to a group of structural units 60, where n≡m.

The relationship between the spectral distribution of the incident light and the measured value of the image sensor 12 can be expressed by the following equation:

Ii＝Σ(f(λ)·Ti(λ)·R(λ))

where R (λ) is the response of the image sensor 12, denoted as:

Si(λ)＝Ti(λ)·R(λ)

the above equation can be extended to a matrix form:

wherein I is _i (i=1, 2,3, …, m) is the response of the image sensor 12 after the light to be measured passes through the broadband filter structure 11, and corresponds to the light intensity information of the m image sensors 12, which is also called as m "physical pixels 121", and is a vector with a length of m. S is the optical response of the system to different wavelengths, and is determined by two factors, the transmittance of the filter structure 11 and the quantum efficiency of the response of the image sensor 12. S is a matrix, each row vector corresponding to the response of one of the building blocks 60 to incident light of a different wavelength, where the incident light is sampled discretely and uniformly, for a total of n sampling points. The number of columns of S is the same as the number of samples of the incident light. Here, f (λ) is the intensity of the incident light at different wavelengths λ, i.e. the spectrum of the incident light to be measured.

In practical applications, the response parameter S of the system is known, and the spectrum f (can be understood as spectrum recovery) of the input light can be obtained by using algorithm to back-calculate through the light intensity reading I of the image sensor 12, and the process can adopt different data processing modes according to the situation, including but not limited to: least squares, pseudo-inverses, equalizations, least squares, artificial neural networks, etc.

Taking one physical pixel 121 corresponding to one set of structural units 60 as an example, it is described how to recover one spectrum information, also called "spectrum pixel", by using m sets of physical pixels 121 (i.e., pixel points on the image sensor 12) and their corresponding m sets of structural units 60 (the same structure on the modulation layer is defined as structural units 60). It should be noted that, in the embodiment of the present application, a plurality of physical pixels 121 may correspond to a set of structural units 60. It may be further defined that a group of structural elements 60 and corresponding at least one physical pixel 121 constitute a unit pixel, in principle at least one unit pixel constitutes one of said spectral pixels.

Further, in an embodiment, the logic circuit layer of the image sensor 12 may be correspondingly configured according to the spectrum pixel and the physical pixel 121, that is, the logic circuit layer of the modulation region 110 is designed by taking the structural unit 60 as a unit, that is, when the structural unit 60 corresponds to n×m physical pixels 121, the n×m physical pixels 121 may share a spectrum pixel circuit, and the non-modulation region 120 is designed by taking the physical pixels 121 as a unit, where the physical pixels 121 are all basically configured with independent physical pixel 121 circuits.

That is, the spectrum sensor may acquire light intensity information (including spectrum information and image information), which may be used for imaging or for spectrum recovery; the light intensity information can also be directly used as a matter identification or judgment, etc., namely, the light intensity information can be used for some applications without imaging or spectrum recovery.

In a variant embodiment of the present application, as shown in fig. 5, at least one calibration area 130 is present in the modulation area 110 of the spectrum chip 10. The calibration area 130 is implemented as a non-modulation area 120, i.e. no filter structure 11 is provided, and the calibration area 130 is preferably implemented as a black-and-white physical pixel 121, so that when the corresponding spectral information of the modulation area 110 can be calibrated according to the light intensity information of the surrounding calibration area 130. Fig. 5 illustrates a modified example of the modulation region 110 of the spectrum chip 10 according to the embodiment of the present application.

The spectrum module 100 provided in the embodiment of the present application includes the spectrum chip 10, the circuit board 20 and the optical component 30. The spectrum chip 10 is electrically conductively provided to the wiring board 20. The optical component 30 is located on the photosensitive path of the spectrum chip 10, and includes a light splitting element 33 and a reflecting element 34.

The light splitting element 33 is configured to split the incident light to form two incident light beams, where the light splitting element 33 and the reflecting element 34 are arranged according to a preset arrangement manner, so that one incident light beam passes through the light splitting element 33 and reaches the non-modulation region 120 of the spectrum chip 10, and the other incident light beam passes through the light splitting element 33 and reaches the reflecting element 34 and is reflected by the reflecting element 34 to the modulation region 110 of the spectrum chip 10.

For example, the light-splitting element 33 is configured to split incident light to form a first incident light transmitted through the light-splitting element 33 and a second incident light reflected by the light-splitting element 33, and in this way, the incident light is split into the first incident light and the second incident light containing the same information. The same information means that the light intensity ratio of the first incident light and the second incident light in different wave bands is consistent with that of the incident light, i.e. the spectrum signal carried by the incident light is not changed.

In some embodiments, the light-splitting element 33 and the reflecting element 34 are arranged in a preset arrangement manner, so that the first incident light reaches the non-modulation region 120 of the spectrum chip 10 after passing through the light-splitting element 33, and forms a first optical path between the light-splitting element 33 and the non-modulation region 120 of the spectrum chip 10, so as to obtain image information. That is, in the first optical path, the first incident light passes through the spectroscopic element 33 and reaches the non-modulation region 120 of the spectrum chip 10. The second incident light reaches the reflecting element 34 after passing through the light splitting element 33 and is reflected by the reflecting element 34 to the modulation region 110 of the spectrum chip 10, so as to form a second light path between the light splitting element 33 and the modulation region 110 of the spectrum chip 10, so as to obtain spectrum information. That is, in the second optical path, the second incident light is reflected by the spectroscopic element 33 to the reflection element 34, and then reflected by the reflection element 34 to the modulation region 110 of the spectrum chip 10. Thus, the first incident light and the second incident light containing the same information are incident to the spectrum chip 10, and since the spectrum chip 10 has the modulation region 110 and the non-modulation region 120, the spectrum information and the image information can be acquired at the same time; so that the present utility model can acquire corresponding image information and spectrum information using one spectrum chip 10.

In this embodiment, the spectroscopic element 33 is located in front of the non-modulation region 120 of the spectroscopic chip 10. Preferably, the light-splitting element 33 corresponds completely to the non-modulation region 120 of the spectral chip 10, i.e. the orthographic projection of the light-splitting element 33 in the direction of extension of the optical axis L1 of the non-modulation region 120 is completely within the range of the non-modulation region 120. The optical axis L1 of the non-modulation region 120 may be a central axis of a portion of the image sensor 12 corresponding to the non-modulation region 120 that can sense light (i.e., a photosensitive region). Alternatively, the extending direction of the central optical axis of the light transmission path of the spectroscopic element 33 coincides with the extending direction of the optical axis L1 of the non-modulation region 120 of the spectroscopic chip 10. Further alternatively, the central optical axis of the light transmission path of the spectroscopic element 33 coincides with the optical axis L1 of the non-modulation region 120 of the spectroscopic chip 10, i.e., the spectroscopic element 33 is disposed coaxially with the non-modulation region 120.

The reflecting element 34 is located at one side of the spectroscopic element 33 and in front of the modulation region 110. Preferably, the reflection element 34 corresponds completely to the modulation region 110 of the spectral chip 10, i.e. the orthographic projection of the reflection element 34 in the direction of extension of the optical axis L2 of the modulation region 110 is completely within the range of the modulation region 110. The optical axis L2 of the modulation region 110 may be a central axis of a portion of the image sensor 12 corresponding to the modulation region 110 that can sense light (i.e., a photosensitive region). Optionally, the direction of extension of the central optical axis of the reflection path of the reflection element 34 coincides with the direction of extension of the optical axis L2 of the modulation region 110 of the spectral chip 10. Further alternatively, the central optical axis of the reflection path of the reflection element 34 coincides with the optical axis L2 of the modulation region 110 of the spectral chip 10, i.e. the reflection element 34 is arranged coaxially with the modulation region 110.

It should be understood that the light splitting element 33 and the reflecting element 34 may be arranged in other manners, which are not limited to the present application. In the embodiment of the present application, the object side direction is taken as the front.

In this embodiment, the light splitting element 33 may be a beam splitter, which allows a part of incident light to transmit, forms the first incident light, and reflects another part of incident light to form the second incident light, where the transmission/reflection ratio of the beam splitter may be 1:1, or may be adjusted to be 4:6, 3:7, 2:8, etc. according to the exposure requirement, for example, the second optical path may have a loss on energy due to the presence of an optical device such as a reflection element after the incident light passes, and the energy entering the second optical path is higher than that of the first optical path through the adjustment of the beam splitter. That is, the ratio of the intensity of the transmitted light to the intensity of the reflected light of the spectroscopic element 33 is 1:1 or less. The reflecting element 34 is located on the light reflecting path of the light splitting element 33, and may be a mirror, a prism, or the like, and turns the light path.

Further, the spectrum module 100 may further include a lens group 35, where the lens group 35 is located at a front side, i.e., an object side, of the light splitting element 33, so that the incident light enters the light splitting element 33 to be split after being adjusted by the lens group 35. The spectrum module 100 may further include a light homogenizing element 36 and a light filtering element 38, where the light homogenizing element 36 and the light filtering element 38 are located on the light path between the light splitting element 33 and the modulation area 110 of the spectrum chip 10, for example, the second light path. The spectrum module 100 homogenizes the second incident light formed by the light splitting through the light homogenizing component 36, and filters the homogenized second incident light through the light filtering component 38, so that the filtered second incident light reaches the modulation region 110 of the spectrum chip 10 to obtain spectrum information.

In other embodiments, the light-splitting element 33 and the reflecting element 34 are arranged in a preset arrangement manner, so that the first incident light reaches the modulation region 110 of the spectrum chip 10 after passing through the light-splitting element 33, and a third light path between the light-splitting element 33 and the modulation region 110 of the spectrum chip 10 is formed for acquiring image information. That is, in the third optical path, the first incident light passes through the spectroscopic element 33 and reaches the modulation region 110 of the spectroscopic chip 10. The second incident light reaches the reflecting element 34 after passing through the light splitting element 33 and is reflected by the reflecting element 34 to the non-modulation region 120 of the spectrum chip 10, so as to form a fourth optical path between the light splitting element 33 and the modulation region 110 of the spectrum chip 10, so as to obtain spectrum information. That is, in the fourth optical path, the second incident light is reflected by the spectroscopic element 33 to the reflection element 34, and then reflected by the reflection element 34 to the non-modulation region 120 of the spectrum chip 10. Thus, the first incident light and the second incident light containing the same information are incident to the spectrum chip 10, and since the spectrum chip 10 has the modulation region 110 and the non-modulation region 120, the spectrum information and the image information can be acquired at the same time; so that the present utility model can acquire corresponding image information and spectrum information using one spectrum chip 10.

In this embodiment, the spectroscopic element 33 is located in front of the modulation region 110 of the spectroscopic chip 10. Preferably, the light-splitting element 33 corresponds completely to the modulation region 110 of the spectral chip 10, i.e. the orthographic projection of the light-splitting element 33 in the direction of extension of the optical axis L2 of the modulation region 110 is completely within the range of the modulation region 110. The optical axis L2 of the modulation region 110 may be a central axis of a portion of the image sensor 12 corresponding to the modulation region 110 that can sense light (i.e., a photosensitive region). Alternatively, the extending direction of the central optical axis of the light transmission path of the spectroscopic element 33 coincides with the extending direction of the optical axis L2 of the modulation region 110 of the spectroscopic chip 10. Further alternatively, the central optical axis of the light transmission path of the spectroscopic element 33 coincides with the optical axis L2 of the modulation region 110 of the spectroscopic chip 10, i.e., the spectroscopic element 33 is disposed coaxially with the modulation region 110.

The reflecting element 34 is located at one side of the spectroscopic element 33 and in front of the non-modulation region 120. Preferably, the reflection element 34 corresponds completely to the non-modulation region 120 of the spectral chip 10, i.e. the orthographic projection of the reflection element 34 in the direction of extension of the optical axis L1 of the non-modulation region 120 is completely within the range of the non-modulation region 120. The optical axis L1 of the non-modulation region 120 may be a central axis of a portion of the image sensor 12 corresponding to the non-modulation region 120 that can sense light (i.e., a photosensitive region). Optionally, the direction of extension of the central optical axis of the reflection path of the reflection element 34 coincides with the direction of extension of the optical axis L1 of the non-modulation region 120 of the spectral chip 10. Further alternatively, the central optical axis of the reflection path of the reflection element 34 coincides with the optical axis L1 of the non-modulation region 120 of the spectral chip 10, i.e. the reflection element 34 is arranged coaxially with the non-modulation region 120.

In the above embodiment, the light splitting element 33 may be a beam splitter, which allows a part of incident light to pass through, forms the first incident light, and reflects another part of incident light to form the second incident light, where the transmission/reflection ratio of the beam splitter may be 1:1, or may be adjusted to be 6:4, 7:3, 8 according to the exposure requirement: 2, etc. That is, the ratio of the intensity of the transmitted light to the intensity of the reflected light of the spectroscopic element 33 is 1:1 or more. The reflecting element 34 is located on the light reflecting path of the light splitting element 33, and may be a mirror, a prism, or the like, and turns the light path.

Further, the spectrum module 100 may further include a lens group 35, where the lens group 35 is located at a front side, i.e., an object side, of the light splitting element 33, so that the incident light enters the light splitting element 33 to be split after being adjusted by the lens group 35. The spectrum module 100 may further include a light homogenizing element 36 and a light filtering element 38, where the light homogenizing element 36 and the light filtering element 38 are located on an optical path between the light splitting element 33 and the modulation area 110 of the spectrum chip 10, for example, the third optical path. The spectrum module 100 homogenizes the first incident light formed by the light splitting through the light homogenizing component 36, and filters the homogenized first incident light through the light filtering component 38, so that the filtered first incident light reaches the modulation region 110 of the spectrum chip 10 to obtain spectrum information.

Detailed description of the preferred embodiments

As shown in fig. 6, the spectrum module 100 includes a spectrum chip 10, a circuit board 20, a light splitting element 33, a reflecting element 34, and a bracket 50. The spectrum chip 10 may be attached to the circuit board 20, and may be disposed on the circuit board 20. Further, the spectrum chip 10 may be attached to the circuit board 20 by a conductive adhesive, so that the spectrum chip 10 is electrically connected to the spectrum chip 10 while being attached to the circuit board 20. The bracket 50 is mounted on the circuit board 20, the bracket 50 has at least one housing cavity 501 therein, and a top wall 510 opposite to the spectrum chip 10 in the optical axis direction set by the spectrum chip 10, and the top wall 510 has an opposite top wall outer surface 511 and a top wall inner surface 512. The optical axis set by the spectrum chip 10 may be set as a central axis of a portion (i.e., a photosensitive area) of the image sensor 12 capable of sensing light. The holder 50 also has a light passing hole 502 extending through its top wall outer surface 511 and top wall inner surface 512. Preferably, the light-passing apertures 502 correspond to and only correspond to the non-modulated regions 120 of the spectral chip 10. Optionally, the central axis of the light-transmitting aperture 502 coincides with the optical axis L1 of the non-modulation region 120 of the spectrum chip 10. Here, the light-passing hole 502 corresponds to the non-modulation region 120 of the spectrum chip 10 means that the orthographic projection of the light-passing hole 502 in the direction of the optical axis L1 of the non-modulation region 120 is completely within the non-modulation region 120.

The light splitting element 33 is located in the light passing hole 502, and the incident light is split into a first incident light and a second incident light by the light splitting element 33 after entering the light passing hole 502, where the first incident light passes through the light splitting element and enters the non-modulation region 120 of the spectrum chip 10, so as to obtain image information. The second incident light is reflected by the light splitting element 33, enters the reflecting element 34, and then is reflected by the reflecting element 34 to enter the modulation region 110 of the spectrum chip 10, so as to obtain spectrum information.

The light splitting element 33 may be implemented as a beam splitter, and the incident light may be partially transmitted and partially reflected, where the intensities of the first incident light and the second incident light may be adjusted as required, for example, the ratio of the first incident light to the second incident light is 1:1 design. In a specific embodiment, since the first incident light directly reaches the spectrum chip 10 through the beam splitter, and the second incident light needs to reach the spectrum chip 10 through other devices, there is a light energy loss, so that the light intensities of the spectrum information and the image information are at different intensities, which is not beneficial to the subsequent signal processing. Therefore, in this embodiment, the ratio of the transmitted light intensity to the reflected light intensity of the beam splitter may be adjusted to be 4:6, 3:7, or even 2:8. That is, the ratio of the intensity of the transmitted light to the intensity of the reflected light of the spectroscopic element 33 is 1:1 or less. The reflecting element 34 may be implemented as a mirror so that incident light may be reflected. Note that, the present invention is not limited to the above-described embodiments. In this embodiment, the beam splitter and the reflecting mirror need to have uniform reflectivity and transmittance for light with different wavelengths, so as to prevent the spectrum of the incident light from being changed, and in particular, the constituent materials of the beam splitter and the reflecting mirror are the same or similar. Wherein the reflective element 34 is fixed to the bracket 50.

Further, the spectrum module 100 further includes a light homogenizing member 36, a diaphragm 37 and a filter member 38 between the reflecting element 34 and the spectrum chip 10, where the light homogenizing member 36, the diaphragm 37 and the filter member 38 are fixed to the support 50 and arranged in sequence, and the light homogenizing member 36 is located between the reflecting element 34 and the diaphragm 37. The second incident light enters the light homogenizing element 36, is homogenized, modulated by the diaphragm 37, enters the filter element 38, filtered, and reaches the modulation region 110 of the spectrum chip 10. The light homogenizing element 36 may be implemented as a light homogenizing sheet, which may be made of a material with cosine characteristic, such as polytetrafluoroethylene, PET, etc., or may be coated with a certain scattering paint to reduce the thickness, or may be a microlens array 326. That is, the light uniformizing member 36 is any one of a light uniformizing sheet, a light uniformizing coating, and a microlens array 326. The diaphragm 37 may be made of an opaque material with a circular through hole in between for light transmission. The diaphragm 37 may also be an opaque chromium film plated on the optical filter to reduce the thickness of the diaphragm 37, i.e. a small hole is reserved as the diaphragm 37 in the process of plating.

In this embodiment, the light uniforming member 36, the diaphragm 37, and the filter 38 are integrally combined, and have an integral structure. For example, the light homogenizing member 36 and the diaphragm 37 are sequentially coated on the filter member 38, specifically, the diaphragm 37 may be formed on the filter member 38 by a process such as a plating film, and then a light homogenizing material is coated on the filter member 38 formed with the diaphragm 37, or a light homogenizing sheet is attached on the filter member 38 formed with the diaphragm 37, so as to form the light homogenizing member 36.

The optical assembly 30 may further include a lens group 39, and the lens group 39 includes a plurality of lenses, which are fixed to the holder 50, on a front side, i.e., an object side, of the spectroscopic element 33.

The spectrum module 100 may further include a light shielding member 70, where the light shielding member 70 extends between the top wall 510 of the bracket 50 and the spectrum chip 10, and includes at least one sidewall extending between the top wall 510 of the bracket 50 and the spectrum chip 10. At least one side wall of the light shielding member 70 is located between the modulating region 110 and the non-modulating region 120, and isolates the first incident light and the second incident light, so as to prevent the first incident light and the second incident light from mixing and reaching the spectrum chip 10, and influence the acquisition of spectrum information or image information. The light shielding member 70 is preferably integrally formed with the holder 50, that is, the light shielding member 70 and the holder 50 have an integral structure, or the light shielding member 70 and the holder 50 are integrally formed. The light shielding member 70 preferably has light absorbing properties, such as a light absorbing paint applied to the surface.

Optionally, the light shielding member 70 includes a plurality of sidewalls surrounding the modulation region 110, or a plurality of sidewalls surrounding the non-modulation region 120, or a sidewall between the modulation region 110 and the non-modulation region 120, i.e., a partition between the modulation region 110 and the non-modulation region 120.

It should be noted that it should be understood that the first incident light and the second incident light may be isolated in other manners.

For example, in a variant embodiment, the light homogenizing element 36 is implemented as a microlens array 326, and the microlens array 326 is formed by arranging a plurality of microlenses in a preset manner. The microlens array 326 includes an array one region 3261 and an array two region 3262, the array one region 3261 is located inside the array two region 3262, the array two region 3262 surrounds the array one region 3261, and at least partially corresponds to a region of the modulation region 110 of the spectrum chip 10 adjacent to the interface with the non-modulation region 120.

As shown in fig. 7, the light diffusing capacity of the second array region 3262 is smaller than the light diffusing capacity of the first array region 3261. Accordingly, the diffusion angle of the light from the second array region 3262 is smaller than the diffusion angle of the light from the first array region 3261, in such a way as to avoid that the light homogenized by the microlens array 326 reaches the spectral chip 10 beyond the boundary between the modulated region 110 and the non-modulated region 120, and enters the non-modulated region 120.

It should be appreciated that the direction of diffusion of the second array region 3262 may also be adjusted so that light exiting the second array region 3262 diffuses toward the modulation region 110, in such a way as to avoid light homogenized by the microlens array 326 from reaching the spectral chip 10 beyond the boundary between the modulation region 110 and the non-modulation region 120, entering the non-modulation region 120, and thus avoiding affecting imaging. In particular, in the second array region 3262, at least the optical axis of the microlens in the modulation region 110 corresponding to the spectrum chip 10 adjacent to the junction with the non-modulation region 120 is deviated from the optical axis of the modulation region 110.

Second embodiment

As shown in fig. 8, the second embodiment is different from the first embodiment in that the reflecting element 34 is implemented as a prism, so that the light homogenizing element 36, the diaphragm 37 and the filter 38 can be sequentially attached to the exit surface of the prism. For example, the prism, the light homogenizing member 36, the diaphragm 37 and the filter 38 may be assembled into an optical device, and then the optical device is integrally assembled to the bracket 50, which is beneficial to improving the assembly accuracy and reducing the assembly difficulty. That is, the prism, the light homogenizing member 36, the diaphragm 37 and the filter member 38 are integrated together to form an integrated optical module, for example, the prism, the light homogenizing member 36, the diaphragm 37 and the filter member 38 are integrally connected and have an integral structure, or the prism, the light homogenizing member 36, the diaphragm 37 and the filter member 38 are commonly mounted in a mounting frame having a prism mounting position, a light homogenizing member mounting position, a diaphragm mounting position and a filter member mounting position, which are respectively mounted for the prism, the light homogenizing member 36, the diaphragm 37 and the filter member 38.

It should be noted that, since the prism has a larger loss of light, so as to enhance the intensity of the reflected second incident light, for example, the ratio of the second incident light to the first incident light is 8:2. an antireflection film can also be coated on the surface of the prism, so that the loss of incident light is reduced.

Detailed description of the preferred embodiments

As shown in fig. 9, the third embodiment is different from the first and second embodiments in that the light-passing hole 502 is disposed corresponding to the modulation region 110 of the spectrum chip 10, so that the transmitted first incident light can directly reach the modulation region 110 of the spectrum chip 10 through the light-homogenizing element 36, the diaphragm 37 and the light-filtering structure 11 to obtain spectrum information. The second incident light is reflected by the reflecting element 34 to reach the non-modulation region 120 of the spectrum chip 10, and the image information is obtained. It should be understood that in this embodiment, the ratio of the first incident light intensity to the second incident light intensity corresponding to the beam splitter may be 1:1, may also be 6:4, or 7:3, etc.

Specifically, the light-passing holes 502 of the holder 50 correspond to and only to the modulation regions 110 of the spectral chip 10. Optionally, the central axis of the light-transmitting aperture 502 coincides with the optical axis L2 of the modulation region 110 of the spectrum chip 10. Here, the light-transmitting aperture 502 corresponds to the modulation region 110 of the spectrum chip 10 means that the orthographic projection of the light-transmitting aperture 502 in the direction of the optical axis L2 of the modulation region 110 is completely within the modulation region 110.

The light splitting element 33 is located in the light passing hole 502, and the incident light is split into a first incident light and a second incident light by the light splitting element 33 after entering the light passing hole 502, where the first incident light passes through the light splitting element and enters the modulation region 110 of the spectrum chip 10, so as to obtain image information. The second incident light is reflected by the light splitting element 33, enters the reflecting element 34, and then is reflected by the reflecting element 34 to enter the non-modulation region 120 of the spectrum chip 10, so as to obtain spectrum information.

The light splitting element 33 may be implemented as a beam splitter, and the incident light may be partially transmitted and partially reflected, where the intensities of the first incident light and the second incident light may be adjusted as required, for example, the ratio of the first incident light to the second incident light is 1:1 design. In various embodiments, the ratio of the transmitted and reflected light intensities of the beam splitter may be adjusted to 6:4, or 7:3, etc. That is, the ratio of the intensity of the transmitted light to the intensity of the reflected light of the spectroscopic element 33 is 1:1 or more. The reflecting element 34 may be implemented as a mirror so that incident light may be reflected.

Further, the spectrum module 100 further includes a light homogenizing member 36, a diaphragm 37 and a filter member 38 between the light splitting element 33 and the spectrum chip 10, where the light homogenizing member 36, the diaphragm 37 and the filter member 38 are fixed to the support 50 and are sequentially arranged, and the light homogenizing member 36 is located between the light splitting element 33 and the diaphragm 37. The first incident light enters the light homogenizing element 36, is homogenized, modulated by the diaphragm 37, enters the filter element 38, filtered, and reaches the modulation region 110 of the spectrum chip 10.

The basic principles of the present application have been described in connection with specific embodiments, however, it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not intended to be limited to the details disclosed herein as such.

The block diagrams of the devices, apparatuses, devices, systems referred to in this application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.

It is also noted that in the apparatus, devices and methods of the present application, the components or steps may be disassembled and/or assembled. Such decomposition and/or recombination should be considered as equivalent to the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the form disclosed herein. Although a number of example aspects and embodiments have been discussed above, a person of ordinary skill in the art will recognize certain variations, modifications, alterations, additions, and subcombinations thereof.

Claims

1. A spectrum module, comprising:

a circuit board;

2. The spectroscopic module of claim 1, wherein the light splitting element allows a portion of the incident light to pass therethrough, forming the first incident light, and reflects another portion of the incident light, forming the second incident light, the reflecting element being on a light reflecting path of the light splitting element.

3. The spectrum module of claim 2, wherein the first incident light passes through the light splitting element and reaches a non-modulation region of the spectrum chip, and the second incident light is reflected by the light splitting element to the reflection element and is reflected by the reflection element to a modulation region of the spectrum chip.

4. A spectrum module according to claim 3, wherein the ratio of the intensity of the transmitted light to the intensity of the reflected light of the light splitting element is 1:1 or less.

5. A spectrum module according to claim 3, wherein the spectrum module further comprises a bracket mounted to the circuit board, the bracket having at least one receiving cavity therein and a light-passing hole extending through an outer surface of the top wall and an inner surface of the top wall thereof, the light-passing hole corresponding to and corresponding to only the non-modulation region of the spectrum chip.

6. A spectrum module as claimed in claim 3, wherein the optical assembly further comprises a light homogenizing member, a diaphragm and a filter between the reflecting element and the spectrum chip.

7. The spectrum module of claim 2, wherein the first incident light passes through the light splitting element and reaches a modulation region of the spectrum chip, and the second incident light is reflected by the light splitting element to the reflection element and is reflected by the reflection element to a non-modulation region of the spectrum chip.

8. The spectrum module of claim 7, further comprising a bracket mounted to the circuit board, the bracket having at least one receiving cavity therein and a light-passing hole extending through an outer surface of the top wall and an inner surface of the top wall thereof, the light-passing hole corresponding to and corresponding to only the modulation region of the spectrum chip.

9. The spectroscopy module of claim 7, wherein the optical assembly further comprises a light homogenizing member, a diaphragm, and a filter between the light splitting element and the spectroscopy chip.

10. A spectrum module according to claim 5 or 8, wherein the light splitting element is mounted within the light passing aperture.

11. The spectroscopic module of claim 2, wherein the spectroscopic element and the reflective element have uniform reflectivity and uniform transmissivity to light of different wavelengths.

12. The spectrum module of claim 2, wherein the light splitting element is a beam splitter and the reflecting element is a reflecting mirror.

13. The spectrum module of claim 1, wherein the optical assembly further comprises a lens group, the lens group being located on an object side of the light splitting element.

14. The spectroscopic module of claim 1, wherein the spectroscopic module further comprises a light shield, at least one sidewall of the light shield being located at least one sidewall between the modulated region and the non-modulated region.

15. The spectrum module of claim 14, wherein the spectrum module further comprises a bracket mounted to the circuit board, the bracket having a top wall opposite to the spectrum chip in a direction of an optical axis set by the spectrum chip, at least one side wall of the light shielding member extending between the top walls of the bracket, the light shielding member and the bracket having an integral structure.

16. The spectrum module of claim 6 or 9, wherein the light homogenizing member, the diaphragm, and the filter have a unitary structure.

17. The spectroscopic module of claim 6 wherein the reflective element is a prism, the light homogenizing member, the diaphragm and the filter being integrated together to form an integrated optical module.

18. The spectroscopic module of claim 6 wherein the light homogenizing element comprises a microlens array comprising an array one region and an array two region surrounding the array one region, the array two region having a light diffusing capacity less than that of the array one region and corresponding at least in part to an area of the modulation region of the spectroscopic chip adjacent to its interface with the non-modulation region.