CN219265493U

CN219265493U - Spectrum module

Info

Publication number: CN219265493U
Application number: CN202320219439.8U
Authority: CN
Inventors: 杨昆; 范威娜; 黄志雷; 余宁; 黄乾友
Original assignee: Beijing Heguang Technology Co ltd
Current assignee: Beijing Heguang Technology Co ltd
Priority date: 2023-02-15
Filing date: 2023-02-15
Publication date: 2023-06-27
Anticipated expiration: 2033-02-15

Abstract

The utility model relates to a spectrum module, its include the circuit board, the electricity connect in the spectrum chip of circuit board, be located the optical subassembly on the sensitization route of spectrum chip, the spectrum chip includes modulation region and non-modulation region, optical subassembly includes optical lens and dodging piece, dodging piece include transparent flat board and attach to the dodging structure of transparent flat board, transparent flat board is including corresponding to modulation region's first region and corresponding to non-modulation region's second region, dodging structure is located first region, dodging structure place formation dodging piece's dodging region.

Description

Spectrum module

Technical Field

The present application relates to the field of spectral imaging technology, and more particularly, to a spectral module.

Background

With the development of spectroscopic techniques, spectroscopic analysis is widely used in life and industry; for example, the method is used for non-invasive examination in the fields of medical treatment, cosmetology and the like, food detection of fruits, vegetables and the like, water quality monitoring and the like. The principle of operation is that light interacts with substances, such as absorption, scattering, fluorescence, raman, etc., to produce a specific spectrum, and the spectrum of each substance is unique. Thus, the spectral information can be said to be a "fingerprint" of everything.

However, the existing imaging chip can only acquire the image information of the photographed object, but cannot acquire the spectrum information of the photographed object. That is, the imaging chip and the imaging device in the prior art cannot acquire the spectrum information of the object, so that the obtained image information cannot be widely applied to the scenes of intelligent AI identification, qualitative and quantitative analysis of the material composition and the like which need the spectrum information of the object as data support. Therefore, when it is required to obtain the spectrum information and the image information of the subject at the same time, it is often required that a plurality of camera modules and/or devices cooperate, and the obtained image information and the spectrum information are integrated by an algorithm. Multiple modules undoubtedly increase cost and occupy more space.

It is therefore desirable to provide an improved spectral module that has both spectral information and image information acquisition capabilities.

Disclosure of Invention

An advantage of the present application is that it provides a spectrum module, wherein, spectrum module is equipped with even light structure, just even light structure accessible multiple mode forms, has improved even light structure's variety and flexibility.

An advantage of the present application is that a spectrum module is provided, wherein the spectrum module is provided with a limiting structure, which is used for limiting the homogenized light passing through the homogenizing element to the photosensitive path of the modulating area, so as to avoid the fusion of the homogenized light and the non-homogenized light. Therefore, the effective utilization area of the spectrum chip of the spectrum module can be increased, and the accuracy of spectrum information and image information acquired by the spectrum module is improved.

An advantage of the present application is that a spectrum module is provided, where a microlens array of the spectrum module may not only perform a light homogenizing function, but also perform a function of restricting light, and restricting the light homogenized by the light homogenizing element to a photosensitive path of the modulation region.

According to one aspect of the present application, there is provided a spectrum module comprising:

the spectrum chip comprises a modulation area and a non-modulation area; and

the optical component is positioned on the photosensitive path of the spectrum chip and comprises an optical lens and a light homogenizing piece;

the light homogenizing component comprises a transparent flat plate and a light homogenizing structure attached to the transparent flat plate, the transparent flat plate comprises a first area corresponding to the modulation area and a second area corresponding to the non-modulation area, the light homogenizing structure is located in the first area, and a light homogenizing area of the light homogenizing component is formed at the position where the light homogenizing structure is located.

In the spectrum module according to the application, the dodging piece is located between the optical lens and the spectrum chip.

In the spectrum module according to the present application, the light homogenizing structure is a light homogenizing sheet.

In the spectrum module according to the present application, the light homogenizing sheet is a polytetrafluoroethylene plate or a polyethylene terephthalate plate.

In the spectrum module according to the application, the transparent flat plate is provided with a light filtering structure.

In the spectrum module according to the application, the optical component further comprises a filter film arranged on the surface of the transparent flat plate.

In the spectrum module according to the present application, the light homogenizing structure is a microlens array, and the microlens array includes a plurality of repeating structures.

In the spectrum module according to the application, the micro lens array comprises an array first area and an array second area, the array second area surrounds the outside of the array first area, and the light diffusion capacity of the array second area is smaller than that of the array first area.

In the spectrum module according to the application, the micro lens array comprises an array first area and an array second area, the array second area surrounds the array first area, and the array second area has a light condensing structure for light.

In the spectrum module according to the application, the spectrum module further comprises a limiting structure for limiting the light homogenized by the light homogenizing element to the photosensitive path of the modulation area.

In the spectrum module according to the present application, the spectrum module further includes a light shielding member extending between the modulation region of the spectrum chip and the light homogenizing region of the light homogenizing member, the light shielding member has a cylindrical structure, and the limiting structure is formed.

In the spectrum module according to the application, the light homogenizing component further comprises a bracket mounted on the circuit board, the optical component is supported on the bracket, the bracket is provided with at least one accommodating cavity, and the spectrum chip and the light homogenizing piece are accommodated in the accommodating cavity.

Drawings

Various other advantages and benefits of the present application will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. It is apparent that the drawings described below are only some embodiments of the present application and that other drawings may be obtained from these drawings by those of ordinary skill in the art without inventive effort. Also, like reference numerals are used to designate like parts throughout the figures.

Fig. 1 illustrates a schematic diagram of a spectrum chip of a spectrum module according to an embodiment of the application.

Fig. 2 illustrates a schematic diagram of modulated and non-modulated regions of a spectral chip according to an embodiment of the present application.

Fig. 3 illustrates a cross-sectional view of one example of a spectral chip according to an embodiment of the present application.

Fig. 4 illustrates a cross-sectional view of another example of a spectral chip according to an embodiment of the present application.

Fig. 5 illustrates a first corresponding example of physical pixels and structural units of a spectrum chip according to an embodiment of the present application.

Fig. 6 illustrates a second corresponding example of physical pixels and structural units of a spectrum chip according to an embodiment of the present application.

Fig. 7 illustrates a modified example of a modulation region of a spectrum chip according to an embodiment of the present application.

Fig. 8 illustrates a schematic diagram of one example of a spectrum module according to an embodiment of the present application.

Fig. 9 illustrates a light ray distribution schematic.

Fig. 10 illustrates a schematic diagram of another example of a spectrum module according to an embodiment of the present application.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application and not all of the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Based on the fact that the existing imaging chip cannot obtain spectrum information, in some scenes requiring spectrum information and image information, the imaging module and the spectrum module 100 must work together to meet the requirements, which necessarily results in more complex overall systems and increased cost. The embodiment of the application provides a spectrum module 100 capable of simultaneously acquiring spectrum information and image information, which solves the existing technical problems.

Fig. 1 illustrates a schematic diagram of a spectrum chip 10 of a spectrum module 100 according to an embodiment of the present application. As shown in fig. 1, a spectrum chip 10 in a spectrum module 100 of the embodiment of the present application includes a filtering structure 11 and an image sensor 12, where the filtering structure 11 is located on a photosensitive path of the image sensor 12, and the filtering structure 11 is a broadband filtering structure 11 on a frequency domain or a wavelength domain. The transmittance of the filter structure 11 is not exactly the same for different wavelengths throughout. The filter structure 11 may be a structure or a material having a filter property such as a super surface, a photonic crystal, a nano-pillar, a multilayer film, a dye, a quantum dot, a MEMS (micro electro mechanical system), an FP etalon, a cavity layer, a waveguide layer, a diffraction element, or the like. For example, in the embodiment of the present application, the optical filtering structure 11 may be a light modulation layer in chinese patent CN 201921223201.2.

The image sensor 12 may be a CMOS Image Sensor (CIS), CCD, array photodetector, or the like. The spectroscopic device further includes a data processing unit 13, and the data processing unit 13 may be a processing unit such as MCU, CPU, GPU, FPGA, NPU, ASIC, which can export data generated by the image sensor 12 to the outside for processing.

Fig. 2 illustrates a schematic diagram of a modulated region 110 and a non-modulated region 120 of a spectral chip 10 according to an embodiment of the present application. As shown in fig. 2, the spectrum chip 10 in the embodiment of the present application includes a modulation area 110 and a non-modulation area 120, where the modulation area 110 is provided with the optical filtering structure 11, the optical filtering structure 11 is used to implement spectrum modulation on incident light, and the non-modulation area 120 is not provided with the optical filtering structure 11. Taking a CMOS sensor as an example, for the modulation region 110, the incident light enters the optical filtering structure 11 to be modulated, and then enters the CMOS physical pixel 121 corresponding to the modulation region 110 to obtain light intensity information, thereby obtaining spectrum information; for the non-modulation region 120, the incident light is not modulated, and directly enters the corresponding physical pixel 121 to obtain the corresponding light intensity information, so as to obtain image information and the like; the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as blank, bayer array (regular or irregular array), micro-lenses, etc., for example, blank, i.e., the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as black-and-white pixels; for example, bayer array, and the physical pixels 121 corresponding to the non-modulated regions 120 are implemented as RGGB array or the like. As shown in fig. 2, 5 and 6, the modulation region 110 of the spectrum chip 10 according to the embodiment of the present application is formed in a central region of the spectrum chip 10, the non-modulation region 120 is formed around the spectrum chip 10, and the non-modulation region 120 at least partially surrounds the modulation region 110.

Fig. 3 illustrates a cross-sectional view of one example of a spectral chip 10 according to an embodiment of the present application. At least one modulation layer is formed on the image sensor 12, and at least one modulation layer forms the light filtering structure 11. Specifically, at first, at least one base layer may be formed on the image sensor 12; and etching or nanoimprinting is performed on a preset modulation area of the base layer to form a micro-nano structure 61, as shown in fig. 3, and the base layer with the micro-nano structure 61 is formed to form the modulation layer. At least one micro-nano structure 61 constitutes a set of structural units 60, which micro-nano structure 61 may be implemented as holes, pillars, wires, etc. That is, the optical filtering structure 11 includes at least one modulation layer, and each modulation layer includes at least one group of structural units 60, and each group of structural units 60 includes at least one micro-nano structure 61. The non-modulation region 120 may optionally remove or not process the material of the modulation layer, so that the physical pixels 121 on the image sensor 12 may directly receive the non-modulated incident light, i.e., the physical pixels 121 of the non-modulation region 120 may have no structural units 60 on the optical path.

Fig. 4 illustrates a cross-sectional view of another example of a spectral chip 10 according to an embodiment of the present application. As shown in fig. 4, the modulation layer may be implemented as at least two modulation layers, where the micro-nano structures 61 of the at least two modulation layers have different structural parameters (e.g., manufacturing materials, dimensions, structure types (e.g., holes, pillars, etc.), gaps) and/or shape parameters, so that each mutually corresponding region of the at least two modulation layers has micro-nano structures 61 with different modulation effects, and the combination of the different micro-nano structures 61 of the at least two modulation layers makes the modulation effect better. It should be understood that the micro-nano structures 61 of all the modulation layers may also have the same structural parameters. That is, the spectrum chip 10 may include a first modulation layer 111 and a second modulation layer 112, the first modulation layer 111 and the second modulation layer 112 being sequentially formed on the photosensitive path of the image sensor 12.

Further, explaining the broad spectrum modulation theory, the intensity signal of the incident light at different wavelengths λ is denoted as f (λ), the transmission spectrum curve of the filter structure 11 is denoted as T (λ), the spectrum chip 10 has m groups of structural units 60, the transmission spectrums of each group of structural units 60 are different from each other, and the whole can be denoted as Ti (λ) (i=1, 2,3, …, m). Under each group of structural units 60 there is a corresponding physical pixel 121 for detecting the light intensity information Ii modulated by the structural units 60. In the specific embodiment of the present application, a physical pixel 121 is taken as an example and a group of structural units 60 is taken as an illustration, as shown in fig. 5. However, the embodiment of the present application is not limited thereto, and in other embodiments, the plurality of physical pixels 121 may be a group corresponding to a group of structural units 60, as shown in fig. 6, 2×2 physical pixels 121 may be a group corresponding to a group of structural units 60, or n×m physical pixels 121 may be a group corresponding to a group of structural units 60, where n≡m.

The relationship between the spectral distribution of the incident light and the measured value of the image sensor 12 can be expressed by the following equation:

Ii＝Σ(f(λ)·Ti(λ)·R(λ))

where R (λ) is the response of the image sensor 12, denoted as:

Si(λ)＝Ti(λ)·R(λ)

the above equation can be extended to a matrix form:

wherein I is _i (i=1, 2,3, …, m) is the response of the image sensor 12 after the light to be measured passes through the broadband filter structure 11, and corresponds to the light intensity information of the m image sensors 12, which is also called as m "physical pixels 121", and is a vector with a length of m. S is the optical response of the system to different wavelengths, and is determined by two factors, the transmittance of the filter structure 11 and the quantum efficiency of the response of the image sensor 12. S is a matrix, each row vector corresponding to the response of one of the building blocks 60 to incident light of a different wavelength, where the incident light is sampled discretely and uniformly, for a total of n sampling points. The number of columns of S is the same as the number of samples of the incident light. Here, f (λ) is the intensity of the incident light at different wavelengths λ, i.e. to be measuredThe amount of incident light spectrum.

In practical applications, the response parameter S of the system is known, and the spectrum f (can be understood as spectrum recovery) of the input light can be obtained by using algorithm to back-calculate through the light intensity reading I of the image sensor 12, and the process can adopt different data processing modes according to the situation, including but not limited to: least squares, pseudo-inverses, equalizations, least squares, artificial neural networks, etc.

Taking one physical pixel 121 corresponding to one set of structural units 60 as an example, it is described how to recover one spectrum information, also called "spectrum pixel", by using m sets of physical pixels 121 (i.e., pixel points on the image sensor 12) and their corresponding m sets of structural units 60 (the same structure on the modulation layer is defined as structural units 60). It should be noted that, in the embodiment of the present application, a plurality of physical pixels 121 may correspond to a set of structural units 60. It may be further defined that a group of structural elements 60 and corresponding at least one physical pixel 121 constitute a unit pixel, in principle at least one unit pixel constitutes one of said spectral pixels.

Further, in an embodiment, the logic circuit layer of the image sensor 12 may be correspondingly configured according to the spectrum pixel and the physical pixel 121, that is, the logic circuit layer of the modulation region 110 is designed by taking the structural unit 60 as a unit, that is, when the structural unit 60 corresponds to n×m physical pixels 121, the n×m physical pixels 121 may share a spectrum pixel circuit, and the non-modulation region 120 is designed by taking the physical pixels 121 as a unit, where the physical pixels 121 are all basically configured with independent physical pixel 121 circuits.

That is, the spectrum sensor may acquire light intensity information (including spectrum information and image information), which may be used for imaging or for spectrum recovery; the light intensity information can also be directly used as a matter identification or judgment, etc., namely, the light intensity information can be used for some applications without imaging or spectrum recovery.

In a variant embodiment of the present application, as shown in fig. 7, at least one calibration area 130 is present in the modulation area 110 of the spectrum chip 10. The calibration area 130 is implemented as a non-modulation area 120, i.e. no filter structure 11 is provided, and the calibration area 130 is preferably implemented as a black-and-white physical pixel 121, so that when the corresponding spectral information of the modulation area 110 can be calibrated according to the light intensity information of the surrounding calibration area 130. Fig. 7 illustrates a modified example of the modulation region 110 of the spectrum chip 10 according to the embodiment of the present application.

In other embodiments, the non-modulated regions 120 are spaced apart from the modulated regions 110. The arrangement may be performed at regular intervals or may be performed irregularly, i.e. the positions, the number, etc. of the modulated regions 110 and the non-modulated regions 120 may be arranged according to the needs.

Fig. 8 illustrates a schematic diagram of one example of a spectrum module 100 according to an embodiment of the present application. As shown in fig. 8, the spectrum module 100 provided in the embodiment of the present application includes the spectrum chip 10, the circuit board 20 and the optical component 30. The spectrum chip 10 is disposed on the circuit board 20 and electrically connected to the circuit board 20, and the optical component 30 is located on the photosensitive path of the spectrum chip 10.

Specifically, the spectrum chip 10 may be disposed on the circuit board 20 by being attached to the circuit board 20. Further, the spectrum chip 10 may be attached to the circuit board 20 by conductive adhesive, so that the spectrum chip 10 is electrically connected to the spectrum chip 10 while being attached to the circuit board 20.

The optical assembly 30 includes an optical lens 31 and a light homogenizing member 32. In this embodiment, the light homogenizing element 32 is located between the optical lens 31 and the spectrum chip 10, so that the incident light enters the light homogenizing element 32 after passing through the optical lens 31, and then enters the spectrum chip 10. In a variant embodiment of the present application, the light homogenizing element 32 may be disposed on the light incident side of the optical lens 31, and the optical lens 31 is located between the light homogenizing element 32 and the spectrum chip 10.

The light homogenizing element 32 comprises a light homogenizing region 310 corresponding to the modulation region 110 and a non-light homogenizing region 320 corresponding to the non-modulation region 120. The incident light enters the optical lens 31 and enters the light homogenizing element 32 after being adjusted, wherein a part of the incident light reaches a homogenizing area 310 of the light homogenizing element 32, the homogenizing area 310 of the light homogenizing element 32 homogenizes the incident light, the homogenized incident light reaches a modulating area 110 of the spectrum chip 10, and reaches physical pixels 121 of the image sensor 12 corresponding to the modulating area 110 after being subjected to broad spectrum modulation of a filtering structure 11 of the modulating area 110, and the spectrum module 100 can acquire spectrum information; another portion of the incident light reaches the non-uniformizing region 320 of the light homogenizing element 32, enters the non-modulating region 120 of the spectral chip 10, and is then passed to the physical pixels 121 of the image sensor 12, whereby the spectral module 100 can obtain image information. The spectrum information obtained by the spectrum module 100 through the modulation region 110 may be used to obtain the spectrum characteristic corresponding to the incident light, and the image information obtained by the non-modulation region 120 may be used to recover the image.

The light homogenizing element 32 includes a transparent flat plate 321 and a light homogenizing structure attached to the transparent flat plate 321, where the light homogenizing structure is located, a light homogenizing area 310 of the light homogenizing element 32 is formed. The transparent plate 321 may be implemented as glass or transparent plastic, for example, a filter. That is, the transparent plate 321 itself may have a filtering structure, which is implemented as a filter, for example, a filtering film is coated on the transparent plate, to implement a filtering function. In particular, if the wavelength range in which the spectrum is required to be acquired is smaller than the response wavelength range of the spectrum chip 10, a film may be coated on the surface of the transparent flat plate 321, a filter film may be formed on the surface of the transparent flat plate 321, and the transparent flat plate 321 and the filter film may form a filter.

In this example of the present application, the light homogenizing structure is implemented as a light homogenizing sheet 322. That is, the light uniforming member 32 includes a transparent flat plate 321 and a light uniforming sheet 322 attached to the transparent flat plate 321. The light homogenizing sheet 322 may be implemented as a polytetrafluoroethylene plate, a polyethylene terephthalate plate (i.e., a PET plate), or other elements having a light homogenizing effect.

The transparent flat plate 321 includes a first area corresponding to the modulation area and a second area corresponding to the non-modulation area, the light homogenizing sheet 322 is located in the first area of the transparent flat plate 321, and the light homogenizing sheet 322 is located to form the light homogenizing area 310 of the light homogenizing element 32.

In a variant embodiment of this example, the light homogenizing structure can be obtained by changing the structure of the transparent flat plate 321 itself. Specifically, a first area of the transparent flat plate 321 may be frosted, the first area of the transparent flat plate 321 has a rough surface, the surface roughness of the first area is greater than that of the second area, the first area has a light homogenizing effect, and the first area of the transparent flat plate 321 forms the light homogenizing area 310 of the light homogenizing member 32.

In this example, the spectrum module 100 further includes a bracket 40, and the bracket 40 is fixedly mounted on the circuit board 20. The optical lens 31 is supported on the support 40, the support 40 has at least one accommodating cavity 401, and the spectrum chip 10 and the light homogenizing member 32 are accommodated in the accommodating cavity 401. The bracket 40 has a light-passing hole 402 formed on the light-incident side, and the light-passing hole 402 is on the light-sensing path of the spectrum chip 10 to allow the incident light to enter the light-homogenizing element 32 in the accommodating cavity 401 after passing through the optical lens 31.

Because of the spread angle of the optical path, the homogenized light may enter the non-modulated region 120, and the non-homogenized light may also enter the modulated region 110, thereby affecting the accuracy of the acquired spectral information and image information.

Based on this, the spectrum module 100 of the present application provides a limiting structure for limiting the optical path of the incident light, and the limiting structure has a specific structural configuration, so that the light homogenized by the light homogenizing element 32 is limited in the photosensitive path of the modulation area 110. In this example, the spectrum module 100 further includes a shielding member 50, and the shielding member 50 is disposed between the spectrum chip 10 and the transparent plate 321. Specifically, the shutter 50 extends from the spectrum chip 10 to the lower surface of the transparent flat plate 321 in the optical axis direction. More specifically, the light shielding member 50 has a cylindrical structure extending between the modulation region 110 of the spectrum chip 10 and the light homogenizing region 310 of the transparent plate 321, and distinguishes the light homogenizing region 310 from the non-light homogenizing region 320 in such a manner that the homogenized incident light is separated from the non-homogenized incident light. In this way, the light shielding member 50 forms a limiting structure for limiting the incident light, so that the incident light homogenized by the light homogenizing member 32 is limited in the light shielding member 50 and reaches the modulation region 110 of the spectrum chip 10, and the incident light not homogenized by the light homogenizing member 32 is isolated outside the light shielding member 50 and reaches the non-modulation region 120 of the spectrum chip 10. In this way, the accuracy of the spectrum information and the image information acquired by the spectrum module 100 can be improved.

Fig. 10 illustrates a schematic diagram of another example of a spectrum module 100 according to an embodiment of the present application. As shown in fig. 10, the spectrum module 100 provided in the embodiment of the present application includes the spectrum chip 10, the circuit board 20 and the optical component 30. The spectrum chip 10 is disposed on the circuit board 20 and electrically connected to the circuit board 20, and the optical component 30 is located on the photosensitive path of the spectrum chip 10.

The light homogenizing element 32 includes a transparent flat plate 321 and a light homogenizing structure attached to the transparent flat plate 321. The transparent plate 321 may be implemented as glass or transparent plastic, for example, a filter. That is, the transparent plate 321 itself may have a filter structure, which is implemented as a filter. In particular, if the wavelength range in which the spectrum is required to be acquired is smaller than the response wavelength range of the spectrum chip 10, a film may be coated on the surface of the transparent flat plate 321, a filter film may be formed on the surface of the transparent flat plate 321, and the transparent flat plate 321 and the filter film may form a filter.

In this example of the present application, the light homogenizing structure is implemented as a microlens array 324, i.e., an array formed by a plurality of microlens arrangements. That is, the dodging member 32 includes a transparent flat plate 321 and a microlens array 324 attached to the transparent flat plate 321. The light homogenizing region 310 is formed at the position of the microlens array 324, and may be designed into a repeating structure with a certain scattering angle according to the illumination requirement of the modulation region 110 of the spectrum chip 10, so as to perform a light homogenizing function. That is, the microlens array 324 includes a plurality of repeating structures arranged in a predetermined arrangement. The plurality of repeating structures means a plurality of structures having the same structure and morphology. The number of the two or more.

It should be noted that, due to the diffusion angle of the optical path, when the incident light reaches the interface between the modulation region 110 and the non-modulation region 120 of the spectrum chip 10, there is an unavoidable case that the homogenized light (i.e., the incident light homogenized by the light homogenizing element 32) and the non-homogenized light (i.e., the incident light not homogenized by the light homogenizing element 32) are fused. Fig. 9 illustrates a schematic light distribution diagram, as shown in fig. 9, a light homogenizing region a is formed when a portion homogenized by the light homogenizing element 32 in incident light reaches the spectrum chip 10, a non-light homogenizing region C is formed when a portion not homogenized by the light homogenizing element 32 reaches the spectrum chip 10, wherein the light homogenizing region a and the non-light homogenizing region C are partially overlapped and fused at the juncture of the modulation region 110 and the non-modulation region 120 of the spectrum chip 10, and the fused portion forms a transition light region B. In principle, the light of the transition light region B is not suitable for imaging or for recovering the spectrum, so that the portion of the spectral chip 10 corresponding to the transition light region cannot be effectively utilized, i.e. the presence of the transition light region B wastes the effective utilization area of the spectral chip 10. It is therefore desirable to reduce the footprint of the transition light region B.

Based on this, in this example, the microlens array 324 includes an array one region 3241 and an array two region 3242, the array one region 3241 is located inside the array two region 3242, and the array two region 3242 surrounds the array one region 3241, corresponding to a region of the modulation region 110 of the spectral chip 10 adjacent to its interface with the non-modulation region 120.

The light diffusing capacity of the second array region 3242 is less than the light diffusing capacity of the first array region 3242. Accordingly, the diffusion angle of the light from the second array region 3242 is smaller than the diffusion angle of the light from the first array region 3242, so that the diffusion area of the homogenized light is reduced, the light homogenizing region a is reduced, the overlapping, fusion portion between the light homogenizing region a and the non-light homogenizing region C is reduced or even eliminated, i.e., the transition light region B is reduced.

It should be noted that, in this example, the microlens array 324 not only homogenizes the incident light to form the light homogenizing structure of the light homogenizing member 32, but also the array two region 3242 can limit the divergence angle of the incident light, and further limit the distribution of the incident light to form the limiting structure for limiting the incident light. The microlens array 324 allows almost all of the incident light homogenized by the homogenizer 32 to enter the modulation region 110 when reaching the spectral chip 10, and prevents the incident light homogenized by the homogenizer 32 from exceeding the modulation region 110 when reaching the spectral chip 10, so that part of the incident light homogenized by the homogenizer 32 enters the non-modulation region 120, thereby preventing the incident light homogenized by the homogenizer 32 from merging with the non-homogenized light that is not homogenized by the homogenizer 32. In this way, the effective utilization area of the spectrum chip 10 can be increased, and the accuracy of the spectrum information and the image information acquired by the spectrum module 100 can be improved.

It is further noted that the concentration or diffusion degree of the light in the different regions can be controlled by setting the structural configuration of the different regions of the microlens array 324. For example, a portion of the second array region 3242 has a structure of up-and-down focusing, i.e., an upper portion has a diverging structure (e.g., a micro concave lens structure), and a lower portion has a converging structure (e.g., a micro convex lens structure), so that when the incident light enters the region, the incident light is first diverged and then focused, and the overall focusing or diffusing degree of the light can be adjusted by adjusting the converging structure and the light diffusing capability. It should be understood that the partial area of the second array area 3242 may be arranged in other manners, for example, the upper, middle and lower portions thereof may be provided with light focusing structures and light scattering structures according to requirements.

In this exemplary variant embodiment, the second array region 3242 of the microlens array 324 has a light-condensing structure, for example, a convex lens structure, so that the homogenized light is not diffused to the outside but is condensed to the optical axis set by the spectrum module 100. On the one hand, the size of the transition light zone B can be effectively reduced; on the other hand, since the incident light is at least partially concentrated toward the optical axis, so that the light energy is more concentrated in the modulation region 110 of the spectrum chip 10, the intensity of the spectrum information is improved, which is more beneficial to the recovery or identification of the spectrum information.

Optionally, the spectrum module 100 further includes a shielding member 50, and the shielding member 50 is used to further divide the incident light, so as to limit the homogenized incident light from entering the modulating area 110, and the non-homogenized incident light from entering the non-modulating area 120. In this way, the shutter 50 and the microlens array 324 doubly restrict incident light such that homogenized light and non-homogenized light after being homogenized are separated and enter the modulation region 110 and the non-modulation region 120, respectively, specifically, the shutter 50 is disposed between the spectrum chip 10 and the transparent flat plate 321, and the shutter 50 extends from the spectrum chip 10 to the lower surface of the transparent flat plate 321 in the optical axis direction. More specifically, the light shielding member 50 has a cylindrical structure extending between the modulation region 110 of the spectrum chip 10 and the light homogenizing region 310 of the transparent plate 321, and distinguishes the light homogenizing region 310 from the non-light homogenizing region 320 in such a manner that the homogenized incident light is separated from the non-homogenized incident light. In this way, the light shielding member 50 forms a limiting structure for limiting the incident light, so that the homogenized incident light is limited in the light shielding member 50 and reaches the modulation region 110 of the spectrum chip 10, and the non-homogenized incident light is isolated outside the light shielding member 50 and reaches the non-modulation region 120 of the spectrum chip 10. In this way, the accuracy of the spectrum information and the image information acquired by the spectrum module 100 can be improved.

The basic principles of the present application have been described in connection with specific embodiments, however, it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not intended to be limited to the details disclosed herein as such.

The block diagrams of the devices, apparatuses, devices, systems referred to in this application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.

It is also noted that in the apparatus, devices and methods of the present application, the components or steps may be disassembled and/or assembled. Such decomposition and/or recombination should be considered as equivalent to the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the form disclosed herein. Although a number of example aspects and embodiments have been discussed above, a person of ordinary skill in the art will recognize certain variations, modifications, alterations, additions, and subcombinations thereof.

Claims

1. A spectrum module, comprising:

the spectrum chip comprises a modulation area and a non-modulation area; and

2. The spectrum module of claim 1, wherein the light homogenizing element is located between the optical lens and the spectrum chip.

3. The spectroscopic module of claim 1, wherein the light homogenizing structure is a light homogenizing sheet.

4. A spectrum module according to claim 3, wherein the light homogenizing sheet is a polytetrafluoroethylene sheet or a polyethylene terephthalate sheet.

5. The spectrum module of claim 1, wherein the transparent plate has a filter structure.

6. The spectroscopic module of claim 1, wherein the optical assembly further comprises a filter film disposed on a surface of the transparent plate.

7. The spectroscopic module of claim 1, wherein the light homogenizing structure is a microlens array comprising a plurality of repeating structures.

8. The spectroscopic module of claim 7, wherein the microlens array comprises an array one region and an array two region, the array two region surrounding the array one region, the array two region having a smaller light diffusing capacity than the array one region.

9. The spectrum module of claim 7, wherein the microlens array comprises an array one region and an array two region, the array two region surrounds the array one region, and the array two region has a light condensing structure.

10. The spectroscopy module of claim 1, further comprising a confinement structure for confining light homogenized through the light homogenizing element within a photosensitive path of the modulation zone.

11. The spectrum module of claim 10, wherein the spectrum module further comprises a light shielding member extending between the modulation region of the spectrum chip and the light homogenizing region of the light homogenizing member, the light shielding member having a cylindrical structure forming the confinement structure.

12. The spectroscopy module of claim 1 wherein the light homogenizing member further comprises a support to which the optical assembly is supported, the support having at least one receiving cavity within which the spectroscopy chip and the light homogenizing member are received.