CN220367902U - Electrostatic chuck - Google Patents

Electrostatic chuck Download PDF

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Publication number
CN220367902U
CN220367902U CN202321450109.6U CN202321450109U CN220367902U CN 220367902 U CN220367902 U CN 220367902U CN 202321450109 U CN202321450109 U CN 202321450109U CN 220367902 U CN220367902 U CN 220367902U
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CN
China
Prior art keywords
electrode
electrostatic chuck
detection line
region
power supply
Prior art date
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Active
Application number
CN202321450109.6U
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Chinese (zh)
Inventor
李铉俊
金鎭煜
金孝胜
南相日
池宰求
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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Publication date
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15Devices for holding work using magnetic or electric force acting directly on the work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833Details of electrostatic chucks
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The electrostatic chuck includes: an adsorption region in which an electrode pattern is arranged, and an adsorbate is adsorbed; a contoured region located about a perimeter of the suction region; and a detection pattern located in the outline region surrounding at least a portion of the adsorption region.

Description

Electrostatic chuck
Technical Field
The present utility model relates to an electrostatic chuck, and more particularly, to an electrostatic chuck for fixing an object by electrostatic force in a manufacturing process of an electronic device.
Background
In a process for manufacturing a display device, a semiconductor device, or the like, an electrostatic chuck may be used for fixing or transferring an adherend such as a substrate or a wafer. The electrostatic chuck may be configured to generate a force (i.e., electrostatic force) that attracts each other by an electric potential that charges an electrode and an adsorbate provided therein. The electrostatic chuck may include an adsorption region configured with an electrode pattern inducing an electrostatic force and an outline region not configured with the electrode pattern.
Disclosure of Invention
The suction region of the electrostatic chuck may be in contact with the adsorbate, and when a problem occurs in the suction region, the electrostatic chuck may not be used due to disconnection of the electrode pattern or the like. Even if an abnormality occurs in the outer region of the electrostatic chuck, the region is not a region where the adsorbate is adsorbed, and therefore, a process using the electrostatic chuck can be performed. However, an abnormality generated in the outer contour region of the electrostatic chuck may affect the adsorbate, for example, may damage the adsorbate.
Embodiments are directed to providing an electrostatic chuck that can sense anomalies generated in a contoured region of the electrostatic chuck.
An embodiment relates to an electrostatic chuck comprising: an adsorption region in which an electrode pattern is arranged, and an adsorbate is adsorbed; a contoured region located about a perimeter of the suction region; and a detection pattern located in the outline region surrounding at least a portion of the adsorption region.
The electrode pattern may include an electrode, and the sensing pattern includes a sensing line connected to the electrode.
The detection line may be formed integrally with the electrode.
The electrostatic chuck may further include: and a power supply unit for applying a voltage to the electrodes. The detection line may be connected to the power supply unit.
The electrode pattern may include a first electrode and a second electrode, and the sensing pattern includes a first sensing line and a second sensing line. The first detection line may be connected to the first electrode, and the second detection line may be connected to the second electrode.
The first detection line may be formed integrally with the first electrode, and the second detection line may be formed integrally with the second electrode.
The electrostatic chuck may further include: and a power supply unit that applies a voltage to the first electrode and the second electrode. The first detection line and the second detection line may be connected to the power supply unit.
The first electrode may receive a voltage of a first polarity from the power supply unit through the first detection line, and the second electrode may receive a voltage of a second polarity opposite to the first polarity from the power supply unit through the second detection line.
The first detection line may surround at least a lower left side of the adsorption region, and the second detection line may surround at least a lower right side of the adsorption region.
The first detection line may surround an upper left side, a left side, and a lower left side of the adsorption region, and the second detection line surrounds an upper right side, a right side, and a lower right side of the adsorption region.
The electrostatic chuck may further include: a plurality of suction holes located in the suction area, providing a vacuum force.
An embodiment relates to an electrostatic chuck comprising: an adsorption region configured with an electrode pattern including a plurality of electrodes inducing an electrostatic force; a contoured region located about a perimeter of the suction region; and a detection pattern located in the outline region, including a detection line surrounding at least a portion of the adsorption region.
The detection line may be connected to at least one of the plurality of electrodes.
The detection line may be formed integrally with at least one of the plurality of electrodes.
The electrostatic chuck may further include: and a power supply unit that applies a voltage to the plurality of electrodes. The detection line may be connected to the power supply unit.
The plurality of electrodes may include a first electrode and a second electrode to which voltages having different polarities from each other are applied, and the detection line includes a first detection line and a second detection line. The first detection line may be connected to the first electrode, and the second detection line may be connected to the second electrode.
The electrostatic chuck may further include: and a power supply unit that applies a voltage to the first electrode and the second electrode. The first electrode may receive a positive voltage from the power supply portion through the first detection line, and the second electrode may receive a negative voltage from the power supply portion through the second detection line.
The first detection line may surround at least a lower left side of the adsorption region, and the second detection line may surround at least a lower right side of the adsorption region.
The portion of the inspection line located between the suction region and the edge position of the electrostatic chuck and extending parallel to the edge position may be distant from the edge position.
A portion of the inspection line that is located between the suction region and an edge position of the electrostatic chuck and that extends parallel to the edge position may be contiguous to the edge position.
(effects of the utility model)
According to the embodiment, the detection pattern is formed in the outline area of the electrostatic chuck, so that the occurrence of the abnormality can be confirmed in the outline area. Thus, even if an abnormality occurs in the outer region, damage to the adsorbate that may occur as the process of using the corresponding electrostatic chuck proceeds can be prevented. Furthermore, according to the embodiments, there are advantageous effects that can be recognized through the entire specification.
Drawings
Fig. 1 is a conceptual diagram schematically showing an example of use of an electrostatic chuck according to an embodiment.
Fig. 2 is a cross-sectional view schematically showing a display device according to an embodiment.
Fig. 3 is a cross-sectional view schematically showing an electrostatic chuck according to an embodiment.
Fig. 4 is a plan view of an electrostatic chuck according to an embodiment.
Fig. 5 and 6 are partial enlarged views of the lower end portions of the electrostatic chucks shown in fig. 4, respectively.
Fig. 7 and 8 are partial enlarged views of the upper end portions of the electrostatic chucks shown in fig. 4, respectively.
Fig. 9 (a) and (b) are conceptual diagrams showing connection of an electrode pattern and a power supply unit in the electrostatic chuck according to an embodiment.
Fig. 10 is a plan view of an electrostatic chuck according to an embodiment.
Fig. 11 is a partially enlarged view of a lower end portion of the electrostatic chuck shown in fig. 10.
Symbol description:
10: a display panel; 20: covering the window; 30: a flexible printed circuit substrate; 40: a driving integrated circuit chip; AA: an adsorption zone; BD: a main body; DL1: a first detection line; DL2: a second detection line; DP: detecting the pattern; ED1: a first electrode; ED2: a second electrode; EG1, EG2: edge position; EP: an electrode pattern; ESC, ESC': an electrostatic chuck; IL1: a first insulating layer; IL2: a second insulating layer; PA: a contoured region; PW (pseudo wire): a power supply section; SH: and a suction hole.
Detailed Description
The embodiments are described in detail with reference to the drawings so that those skilled in the art can easily implement them.
When a layer, film, region, plate, or the like is partially located on or over another structure, it includes not only the case of being directly located on the other structure but also the case of having the other structure therebetween. Conversely, when a certain constituent is directly located on another constituent, it means that no other constituent exists therebetween.
In the entire specification, when a certain component is included in a certain part, unless otherwise stated, it means that other components may be included.
In the present specification, "connected" does not mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, and includes a case where two or more components are electrically connected in addition to being physically connected, or a case where parts that are substantially integrated are connected to each other although they are referred to by different names according to location or function.
In the drawings, the symbols "X", "Y" and "Z" are used to indicate directions, where the symbol "X" is a first direction, the symbol "Y" is a second direction perpendicular to the first direction, and the symbol "Z" is a third direction perpendicular to the first and second directions.
Fig. 1 is a conceptual diagram schematically showing an example of use of an electrostatic chuck according to an embodiment, fig. 2 is a cross-sectional view schematically showing a display device according to an embodiment, and fig. 3 is a cross-sectional view schematically showing an electrostatic chuck according to an embodiment.
Referring to fig. 1, the electrostatic chucks ESC, ESC' may be used as a jig (sig) in a lamination (lamination) process of bonding the display panel 10 and the cover window 20. In a state where the display panel 10 is attracted to the electrostatic chuck ESC and the cover window 20 is attracted to the electrostatic chuck ESC', the electrostatic chuck ESC is raised or lowered in the third direction Z, so that the display panel 10 and the cover window 20 are closely adhered, whereby the display panel 10 and the cover window 20 can be adhered. In order to bond the display panel 10 and the cover window 20, an adhesive member such as an Optically Clear Adhesive (OCA) or an Optically Clear Resin (OCR) may be disposed between the display panel 10 and the cover window 20 (for example, on the back surface of the cover window 20). When bonding the display panel 10 and the cover window 20, a portion of the display panel 10 or a portion of the flexible printed circuit substrate 30 connected to the display panel 10 may be located outside the electrostatic chuck ESC, ESC'. If there is a stab at the edge position of the electrostatic chuck ESC, ESC ', deformation may occur at the stab position, so that burrs (burrs) may be formed at the edge position of the electrostatic chuck ESC, ESC'. In the case of adhesion, such burrs may cause the bending portion of the display panel 10 or the flexible printed circuit board 30 to be pressed or damaged, and defects such as cracks may occur in the wirings and the like located at the pressed portions.
Referring to fig. 2, the display device may include a display panel 10, a cover window 20, a flexible printed circuit substrate 30, a driving integrated circuit chip 40, and the like.
The display panel 10 may include a substrate 110, a display layer 120, an encapsulation layer 130, a touch layer 140, an anti-reflection layer 150, and a functional layer 160.
The substrate 110 may be a flexible substrate including a polymer such as polyimide (polyimide), polyamide (polyamide), or polyethylene terephthalate (polyethylene terephthalate). The substrate 110 may be a rigid (rib) substrate including glass, quartz, ceramic, or the like.
The display layer 120 may include a plurality of electrical elements (e.g., transistors, capacitors, light emitting diodes, wirings, etc.) constituting or driving a plurality of pixels. The display layer 120 may include a plurality of insulating layers that insulate or protect a plurality of electrical components.
The encapsulation layer 130 may seal the display layer 120 to prevent moisture, oxygen, etc. from penetrating into the display layer 120. The encapsulation layer 130 may be provided in the form of a substrate, and is adhered to the substrate 110 by a sealing material. The encapsulation layer 130 may be a thin film encapsulation layer formed on the display layer 120 and including at least one inorganic layer and at least one organic layer. For example, the thin film encapsulation layer may have a three-layer structure in which an organic layer is located between a first inorganic layer and a second inorganic layer.
The touch layer 140 may include a plurality of touch electrodes. The plurality of touch electrodes may sense a user's touch by way of mutual capacitance (mutual capacitance) and/or self-capacitance (self-capacitance). The touch layer 140 may include a plurality of insulating layers that insulate or protect the plurality of touch electrodes. The touch layer 140 may be formed on the encapsulation layer 130. The touch layer 140 may be attached to the encapsulation layer 130 through an adhesive member such as an optically transparent adhesive (OCA), optically transparent resin (OCR) after being separately formed.
The anti-reflection layer 150 may reduce light reflected by the touch layer 140 and/or the display layer 120. The anti-reflection layer 150 may include a combination of a polarizing layer and a phase retardation layer. The anti-reflection layer 150 may include a combination of a light shielding member and a color filter, or the anti-reflection layer 150 may also include a combination of a plurality of reflection layers that cause destructive interference.
A functional layer 160 may be disposed on the back surface of the substrate 110. The functional layer 160 may include at least one of a cushion layer (cushionlayer) absorbing external impact, a light absorbing layer absorbing external light, a heat dissipating layer dissipating heat, and a shielding layer shielding electromagnetic waves.
The cover window 20 may protect the display panel 10 from the external environment while transmitting an image displayed by the display layer 120 of the display panel 10. The cover window 20 may comprise a transparent material such as glass or plastic. The cover window 20 may be attached to the anti-reflection layer 150 by an adhesive member such as an Optically Clear Adhesive (OCA) or Optically Clear Resin (OCR).
In addition to the adhesion of the display panel 10 to the cover window 20, electrostatic chucks ESC, ESC' may be used when the lamination process of adhering the touch layer 140 or the anti-reflection layer 150 to the display panel 10 is performed.
The flexible printed circuit substrate 30 may be bonded (bonded) to the display panel 10 at a lower end edge position. The flexible printed circuit substrate 30 may transmit a signal for operating the display panel 10 to the display panel 10. The flexible printed circuit substrate 30 may be bent while surrounding the lower end edge position of the display panel 10. Thus, the flexible printed circuit substrate 30 may be mostly located at the rear surface of the display panel 10, a portion protruding from the display panel 10 may be minimized, and the size of the display device may be reduced. In order to maintain the state in which the flexible printed circuit substrate 30 is bent, the flexible printed circuit substrate 30 may be attached to the rear surface of the display panel 10 by an adhesive member.
The driving integrated circuit chip 40 may be located at a lower end portion of the display panel 10. The driving integrated circuit chip 40 may output a data voltage to be applied to the pixel. The driving integrated circuit chip 40 may also be located on the flexible printed circuit substrate 30.
Since the electrostatic chuck ESC and the electrostatic chuck ESC' have the same configuration, the electrostatic chuck ESC will be mainly described below.
Referring to fig. 3, the electrostatic chuck ESC may include a body (body) BD, a first insulating layer IL1, a second insulating layer IL2, an electrode pattern EP, and a sensing pattern DP. The electrostatic chuck ESC may be a Coulomb type (Coulomb) electrostatic chuck or a Johnsen-Rahbek type (Johnsen-Rahbek) electrostatic chuck, but is not limited thereto.
The body BD may include a metal such as aluminum, iron, titanium, copper, stainless steel, or the like. The body BD may also comprise ceramic. The body BD may have a substantially hexahedral shape.
The first insulating layer IL1 may be disposed on the body BD. The first insulating layer IL1 may be in the form of a substrate including a polymer such as polyimide, polyamide, or polyethylene terephthalate. As an example, the first insulating layer IL1 may be a polyimide substrate.
An electrode layer capable of including an electrode pattern EP and a detection pattern DP may be disposed on the first insulating layer IL1. The electrode pattern EP may be located in an adsorption region AA where an adsorbate (e.g., the display panel 10 (refer to fig. 1)) is adsorbed, and the detection pattern DP may be located in the outline region PA.
The electrode pattern EP may include a first electrode ED1 and a second electrode ED2. In the case where the electrostatic chuck ESC is of a bipolar type (bi-polar type), one of the first electrode ED1 and the second electrode ED2 may be an anode to which a positive voltage is applied, and the other of the first electrode ED1 and the second electrode ED2 may be a cathode to which a negative voltage is applied. The first electrode ED1 and the second electrode ED2 may be electrically connected to a power supply portion (not shown in fig. 3) of the electrostatic chuck ESC to receive a voltage. When a positive voltage and a negative voltage are applied to the anode and the cathode, respectively, in a state where the adsorbate is provided in association with the chucking region AA of the electrostatic chuck ESC, the regions of the adsorbate corresponding to the anode and the cathode are charged with opposite potentials, whereby an electrostatic force can be generated, and the adsorbate can be adsorbed to the chucking region AA. The electrostatic chuck ESC may also be a monopolar type (mono-pole type), in which case the first electrode ED1 and the second electrode ED2 may receive voltages of the same polarity.
The detection pattern DP may include more than one detection lines DL1, DL2. The detection pattern DP may be used to detect defects such as a puncture that may occur in the outline area PA. The detection pattern DP may be electrically connected to a power supply portion of the electrostatic chuck ESC to receive a voltage. The detection pattern DP may be formed of the same material as the electrode pattern EP in the same process as the electrode pattern EP. The detection pattern DP may be formed separately from the electrode pattern EP and may be provided on the side of the outline area PA or the main body BD.
The electrode pattern EP and the detection pattern DP may include metals such as copper, aluminum, gold, silver, platinum, titanium, tungsten, molybdenum, but are not limited thereto, and may include various conductive materials.
The second insulating layer IL2 may cover the electrode pattern EP and the sensing pattern DP. The second insulating layer IL2 may constitute a dielectric layer of the electrostatic chuck ESC. The second insulating layer IL2 may be an organic insulating layer including a polymer such as polyimide, polyamide, polyethylene terephthalate, or the like. The second insulating layer IL2 may also include an inorganic insulating layer.
The first insulating layer IL1, the electrode layer including the electrode pattern EP and the detection pattern DP, and the second insulating layer IL2 may be in the form of a film. For example, a film including the first insulating layer IL1, the electrode layer, and the second insulating layer IL2 may be attached to the body BD by an adhesive member. A connection portion (not shown) for connecting the electrode pattern EP and the detection pattern DP to the power supply portion may be provided at one end of the film. The connection portion may extend along a side surface of the main body BD toward a lower surface of the main body BD.
Fig. 4 is a plan view of an electrostatic chuck according to an embodiment, fig. 5 and 6 are respectively enlarged partial views of a lower end portion of the electrostatic chuck shown in fig. 4, and fig. 7 and 8 are respectively enlarged partial views of an upper end portion of the electrostatic chuck shown in fig. 4.
Fig. 4 to 8 show the surfaces of the electrostatic chuck ESC that attract the adsorbate. The electrostatic chuck ESC may include a chucking region AA inside a boundary line BL of a quadrangle represented as a corner circle and a contour region PA outside the boundary line BL. The adsorption region AA is a region where an adsorbate is adsorbed, and a first electrode ED1 and a second electrode ED2 that induce electrostatic force may be disposed in the adsorption region AA. The boundary line BL may correspond to an edge position of the electrode pattern EP. Fig. 4 shows the electrode pattern EP appearing to mesh with one first electrode ED1 and one second electrode ED2, but the number of electrodes and the electrode pattern EP may be changed in various ways.
The adsorption region AA may have a shape corresponding to a planar shape of an adsorbate (for example, the display panel 10 (refer to fig. 1)), but is not limited thereto. A plurality of suction holes SH may be formed in the suction area AA, and a vacuum force may be provided through the plurality of suction holes SH, so that the suction force may be enhanced. In the case where the electrostatic chuck ESC has the cross-sectional structure shown in fig. 3, the suction hole SH may be formed to penetrate the body BD, the first insulating layer IL1, and the second insulating layer IL2. A plurality of suction holes SH for providing a vacuum force may not be formed in the suction area AA.
The detection lines DL1, DL2 may be arranged in the outline area PA. In particular, the detection lines DL1, DL2 may be disposed adjacent to the adsorption area AA so as to be able to sense an abnormality generated in the vicinity of the adsorption area AA. The detection lines DL1, DL2 may be disposed along the adsorption area AA. The detection lines DL1 and DL2 may be electrically connected to the power supply unit (or driving unit) PW, and may receive a voltage from the power supply unit PW. If an abnormality such as a puncture wound occurs at a position where the detection lines DL1, DL2 are arranged, a crack (ack) may occur in the detection lines DL1, DL2, and a break or an increase in resistance may occur. Therefore, if the power supply unit PW cannot receive the output signals of the detection lines DL1 and DL2 or receives a weak output signal, it can detect that an abnormality has occurred in the region where the detection lines DL1 and DL2 are arranged.
The detection lines DL1, DL2 may include a first detection line DL1 located on the left side and a second detection line DL2 located on the right side with respect to a center line in the second direction Y of the adsorption area AA. The first detection line DL1 may surround the upper left, and lower left sides of the adsorption area AA. The second detection line DL2 may surround the upper right side, the right side, and the lower right side of the adsorption area AA. As described above, if the detection lines DL1 and DL2 are arranged on the left and right sides, respectively, it can be confirmed whether an abnormality occurs on the left or right side of the adsorption area AA. At a substantially central portion of the upper end of the adsorption area AA, the first detection line DL1 may be connected to the first electrode ED1, and the second detection line DL2 may be connected to the second electrode ED2. The first detection line DL1 may be formed integrally with the first electrode ED1, and the second detection line DL2 may be formed integrally with the second electrode ED2. One end and the other end of the first detection line DL1 may be connected to the power supply PW and the first electrode ED1, respectively, and one end and the other end of the second detection line DL2 may be connected to the power supply PW and the second electrode ED2, respectively. Thus, the first electrode ED1 may be connected to the power supply PW through the first detection line DL1, and the second electrode ED2 may be connected to the power supply PW through the second detection line DL2. The first electrode ED1 may receive a voltage of a first polarity (e.g., positive polarity) from the power supply portion PW through the first detection line DL1, and the second electrode ED2 may receive a voltage of a second polarity (e.g., negative polarity) opposite to the first polarity from the power supply portion PW through the second detection line DL2.
Unlike the drawing, two detection lines may be disposed on the upper and lower sides, respectively, with respect to the center line in the first direction X of the adsorption area AA. One detection line may be provided in the outline area PA, and three or more detection lines may be provided. Each of the detection lines DL1 and DL2 may be closed-loop connected to the power supply PW at both ends.
Since the electrode pattern generating the electrostatic force for adsorbing the adsorbate is not arranged in the outline area PA, adsorption of the adsorbate by the adsorption area AA may not be affected even if an abnormality is generated in the outline area PA. Therefore, the process such as lamination may be continued by using the electrostatic chuck ESC without awareness of the abnormality of the outline area PA. However, the abnormality generated in the outline area PA may damage or degrade a portion of the adsorbate located outside the adsorption area AA. As shown in the embodiment, by disposing the detection lines DL1, DL2 in the outline area PA, the abnormality generated in the outline area PA can be quantitatively and instantly confirmed. If the abnormality of the outline area PA includes a protruding portion such as a burr (burr), the adsorbate may be damaged by the protruding portion being pricked at the time of performing the lamination process, and thus the process may be stopped until the problem is solved, and occurrence of defects may be prevented.
A plurality of fastening connection holes FH for coupling the electrostatic chuck ESC to a table (not shown) may be formed in the profile area PA. For example, a fastening member such as a screw may be inserted through the fastening hole FH to be fixed to the table, and the electrostatic chuck ESC fixed to the table may be moved by moving the table.
The detection lines DL1, DL2 may be spaced apart from edge positions EG1, EG2 of the electrostatic chuck ESC by a predetermined interval as shown in fig. 5 and 7, or the detection lines DL1, DL2 may meet the edge positions EG1, EG2 of the electrostatic chuck ESC as shown in fig. 6 and 8. Since defects such as stabs are likely to occur at the edge positions EG1 and EG2 of the electrostatic chuck ESC, it is advantageous to locate the detection lines DL1 and DL2 within a predetermined distance from the edge positions EG1 and EG2 of the electrostatic chuck ESC to detect the defects. For example, the portion of the inspection lines DL1, DL2 extending parallel to the edge locations EG1, EG2 of the electrostatic chuck ESC may be spaced from the edge locations EG1, EG2 by less than about 1mm, less than about 0.7mm, or less than about 0.5 mm. The widths of the detection lines DL1 and DL2 may be about 0.1mm or more, and may be about 0.5mm, for example, but are not limited thereto.
Fig. 9 (a) and (b) are conceptual diagrams showing connection of an electrode pattern and a power supply unit in the electrostatic chuck according to an embodiment.
Referring to fig. 9 (a), the first electrode ED1 and the second electrode ED2 of the electrode pattern EP may be connected to the power supply PW through detection lines DL1 and DL2, respectively. In this case, if the detection lines DL1 and DL2 are damaged due to an abnormality generated in the outline area PA, a voltage cannot be normally applied to the electrode pattern EP. Therefore, if an abnormality occurs in the outline area PA, the adsorbing area AA cannot operate normally, and the process can be interrupted, so that occurrence of defects in the adsorbate can be prevented. Although the progress of the process may be interrupted by the abnormal operation of the adsorption area AA even without separately detecting the abnormality generated in the outline area PA, it may be difficult to distinguish whether the abnormality is generated in the outline area PA or the electrode pattern EP.
Referring to fig. 9 (b), the first electrode ED1 and the second electrode ED2 of the electrode pattern EP may be connected to the power supply PW without passing through the detection lines DL1, DL2. Therefore, even if an abnormality occurs in the outline area PA such that the detection lines DL1, DL2 are damaged, the electrode pattern EP can normally receive a voltage. Each of the detection lines DL1 and DL2 may be in a closed loop configuration in which both ends are electrically connected to the power supply PW. Since the damage of the detection lines DL1, DL2 does not affect the operation of the adsorption area AA, the power supply section PW may include a detection circuit section capable of detecting the damage of the detection lines DL1, DL2.
Fig. 10 is a plan view of an electrostatic chuck according to an embodiment, and fig. 11 is a partially enlarged view of a lower end portion of the electrostatic chuck shown in fig. 10.
Referring to fig. 1 cross, when the display panel 10 and the cover window 20 are bonded using the electrostatic chuck ESC, the flexible printed circuit substrate 30 or the bent portion of the display panel 10 may overlap at a lower side edge position EG1 of the electrostatic chuck ESC. Even if an abnormality occurs in the outline area PA of the electrostatic chuck ESC, the area where the adsorbate is damaged such as a display device may be mainly the lower side edge position EG1 of the electrostatic chuck ESC. Therefore, the detection lines DL1, DL2 may not surround the entire adsorption area AA, but be formed to be located only at a part of the outline area PA (i.e., near the lower side edge position EG 1). The detection lines DL1, DL2 may be mainly located between the lower end portion of the adsorption area AA and the lower side edge position EG1.
The detection lines DL1, DL2 may include a first detection line DL1 located on the left side and a second detection line DL2 located on the right side with respect to a center line in the second direction Y of the adsorption area AA. One end of the first detection line DL1 may be connected to the power supply portion PW. The first detection line DL1 may extend to surround a part or all of the lower left corner of the adsorption area AA, and the other end of the first detection line DL1 may be connected to the first electrode ED 1. One end of the second detection line DL2 may be connected to the power supply portion PW. The second detection line DL2 may extend to surround a part or all of the right lower corner of the adsorption area AA, and the other end of the second detection line DL2 may be connected to the second electrode ED2. If the detection lines DL1 and DL2 are broken or a crack is generated due to an abnormality such as a puncture in the outline area PA where the detection lines DL1 and DL2 are arranged, a voltage may not be normally applied to the first electrode ED1 and the second electrode ED2. This can interrupt the process such as lamination, and prevent the adsorbate from being damaged by an abnormality occurring in the vicinity of the lower edge position EG1.
Unlike the illustration, each of the detection lines DL1 and DL2 may be in a closed loop configuration in which both ends are connected to the power supply unit PW, and the first electrode ED1 and the second electrode ED2 may be connected to the power supply unit PW without passing through the detection lines DL1 and DL2.
While the embodiments of the present utility model have been described in detail, the scope of the present utility model is not limited thereto, and various modifications and improvements of the basic concept of the present utility model defined in the claims will be within the scope of the present utility model.

Claims (10)

1. An electrostatic chuck, comprising:
an adsorption region in which an electrode pattern is arranged, and an adsorbate is adsorbed;
a contoured region located about a perimeter of the suction region; and
a detection pattern located in the contoured region surrounding at least a portion of the adsorption region.
2. The electrostatic chuck according to claim 1, wherein,
the electrode pattern includes an electrode, and the sensing pattern includes a sensing line connected to the electrode.
3. The electrostatic chuck according to claim 2, wherein,
the detection line is formed integrally with the electrode.
4. The electrostatic chuck of claim 2, further comprising:
a power supply unit for applying a voltage to the electrodes,
the detection line is connected with the power supply portion.
5. The electrostatic chuck according to claim 1, wherein,
the electrode pattern includes a first electrode and a second electrode, the sensing pattern includes a first sensing line and a second sensing line,
the first detection line is connected with the first electrode, and the second detection line is connected with the second electrode.
6. The electrostatic chuck according to claim 5, wherein,
the first detection line is formed integrally with the first electrode, and the second detection line is formed integrally with the second electrode.
7. The electrostatic chuck of claim 5, further comprising:
a power supply unit that applies a voltage to the first electrode and the second electrode,
the first detection line and the second detection line are connected to the power supply section.
8. The electrostatic chuck according to claim 7, wherein,
the first electrode receives a voltage of a first polarity from the power supply section through the first detection line, and the second electrode receives a voltage of a second polarity opposite to the first polarity from the power supply section through the second detection line.
9. The electrostatic chuck according to claim 5, wherein,
the first detection line surrounds at least a lower left side of the adsorption region, and the second detection line surrounds at least a lower right side of the adsorption region.
10. The electrostatic chuck according to claim 5, wherein,
the first detection line surrounds the upper left side, the left side, and the lower left side of the adsorption region, and the second detection line surrounds the upper right side, the right side, and the lower right side of the adsorption region.
CN202321450109.6U 2022-06-10 2023-06-08 Electrostatic chuck Active CN220367902U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0070995 2022-06-10
KR1020220070995A KR20230171077A (en) 2022-06-10 2022-06-10 Electrostatic chuck

Publications (1)

Publication Number Publication Date
CN220367902U true CN220367902U (en) 2024-01-19

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ID=89076975

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321450109.6U Active CN220367902U (en) 2022-06-10 2023-06-08 Electrostatic chuck

Country Status (3)

Country Link
US (1) US20230402943A1 (en)
KR (1) KR20230171077A (en)
CN (1) CN220367902U (en)

Also Published As

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KR20230171077A (en) 2023-12-20
US20230402943A1 (en) 2023-12-14

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