CN220358533U

CN220358533U - Laser module packaging structure

Info

Publication number: CN220358533U
Application number: CN202321934971.4U
Authority: CN
Inventors: 肖岩; 肖伟新; 陈水生; 王元会
Original assignee: Shenzhen Lemon Photon Technology Co ltd
Current assignee: Shenzhen Lemon Photon Technology Co ltd
Priority date: 2023-07-21
Filing date: 2023-07-21
Publication date: 2024-01-16
Anticipated expiration: 2033-07-21

Abstract

A laser module package structure, a laser module package body, wherein the laser module package body includes: base, laser chip and connecting wire. The base includes main part and pin, and one terminal surface of main part is provided with laser instrument negative pole and laser instrument positive pole, and another terminal surface of main part sets up the pin. The laser chip is arranged on one end face of the main body, which is far away from the pin, and is contacted with the main body, and the laser chip is connected with any one of the anode and the cathode of the laser. The connection line connects the laser chip with the other of the laser anode and the laser cathode. The structural design of the laser module packaging structure is effectively simplified, the processing procedure of the laser module packaging structure is saved, and the cost of the laser module packaging structure is reduced.

Description

Laser module packaging structure

Technical Field

The application relates to the technical field of laser sensors, in particular to a laser module packaging structure.

Background

Following nuclear energy, computers, semiconductors, laser light has been another significant utility model for humans since the 20 th century, called the "fastest knife", "brightest light". The laser module is widely applied in various fields, such as communication field, sweeping robot field, etc.

As shown in fig. 1, in the conventional laser module package structure, a ceramic substrate 30 is disposed between a base 10 and a laser chip 20, that is, the ceramic substrate 30 needs to be fixed on the base 10 before the laser chip 20 is mounted, and after the ceramic substrate 30 is fixed, the base 10 and the laser chip 20 are separated, which requires that two leads are specially disposed to connect the laser chip 20 with a laser anode 13 and a laser cathode 40 on the base 10, respectively. In addition, a capping process is generally performed to protect the lead wires and the like on the base 10 and prevent touch damage, so that although the laser module packaging structure can be effectively protected, the whole process of fixing the cap body on the base 10 can provide requirements for subsequent assembly components of the laser module packaging structure, and the cost of the laser module packaging structure is inevitably increased.

Disclosure of Invention

The application provides a laser module packaging structure, its main aim at reduces the cost of laser module packaging structure.

The utility model provides a laser module packaging structure in one embodiment, including laser module packaging main part, laser module packaging main part includes:

the base comprises a main body and pins, wherein a laser cathode and a laser anode are arranged on one end face of the main body, and the pins are arranged on the other end face of the main body;

the laser chip is arranged on one end face, far away from the pin, of the main body, and is in contact with the main body, and the laser chip is connected with any one of the positive electrode and the negative electrode of the laser; and

and the connecting wire is used for connecting the laser chip with the other of the laser anode and the laser cathode.

According to the laser module packaging structure in the embodiment, the laser chip is directly arranged on the end face of the main body, and the laser chip is directly contacted with the main body of the base, so that the laser chip can be directly electrically connected with any one of the anode and the cathode of the laser on the base, and the corresponding electrical connection is realized through the pin on the base, and at the moment, the laser chip can be connected with the other one of the anode and the cathode of the laser only by one connecting wire, so that stable electrical connection between the laser chip and the base is realized. By adopting the structure, the structural design of the laser module packaging structure is effectively simplified, the processing procedure of the laser module packaging structure is saved, and the cost of the laser module packaging structure is reduced.

In one embodiment, the main body includes an assembly portion and a support portion, the assembly portion is disposed on one end surface of the support portion, the pin is disposed on the other end surface of the support portion, and the assembly portion is disposed away from one end surface of the support portion, where the laser anode and the laser cathode are disposed. The support part can provide support for the equipment part and can mount pins, and meanwhile, the assembly part and the pins are arranged at intervals and do not interfere with each other.

In one embodiment, the radial dimension of the mounting portion is smaller than the radial dimension of the support portion. The radial dimension of the supporting part is relatively larger, so that the supporting part is convenient to provide support for the assembling part on the supporting part, and meanwhile, the processing or process transportation of the laser module packaging structure is also convenient.

In one embodiment, the mounting portion has a mounting position on an end surface thereof, and the laser chip is disposed on the mounting portion at the mounting position. The laser chip positions arranged on the assembly part are limited through the assembly position, so that the consistency of a batch of laser module packaging structures can be guaranteed.

In one embodiment, the laser module packaging device further comprises a pipe cap, wherein the pipe cap is detachably fixed on the periphery of the main body and covers the structure on the main body, and the pipe cap is used for achieving a structural protection effect in the process of transporting the laser module packaging main body. The laser module packaging main body in the transportation process is effectively protected through the pipe cap, and the laser module packaging main body is prevented from being damaged in the transportation process.

In one embodiment, the radial dimension of the cap is progressively smaller from the side closer to the body to the side further from the body. Radial size gradual change of pipe cap always blocks main part through a certain position of pipe cap inner wall like this, restricts the activity space of main part in pipe cap internal portion, avoids structure in the main part simultaneously, for example connecting wire, and the inner wall of pipe cap takes place contact extrusion, buckling, fracture even, effectively carries out the guard action to the structure in the main part.

In one embodiment, the packaging box further comprises a packaging shell and an end cover; a plurality of butt joint holes are formed in the end face of the packaging shell, and the butt joint holes are used for placing the laser module packaging main body; the end cover is detachably connected with the packaging shell, a plurality of pipe caps are arranged on the end cover, and the pipe caps are used for covering the structure on the main body. The laser module packaging main body on the packaging shell is effectively loaded through the butt joint holes, a plurality of butt joint holes are formed in the packaging shell, and the laser module packaging main bodies can be put into the packaging shell at one time, so that the batch transportation protection of the laser module packaging main bodies is realized, the processing efficiency of the laser module packaging structure is improved, and the processing cost is reduced. The packaging box mainly plays a role in limiting and protecting the laser module packaging main body in the packaging box through the buckling of the end cover and the packaging shell, and the end cover and the packaging shell are detachably connected, so that the designed packaging box can be reused, is not a disposable product, and reduces the material cost.

In one embodiment, a plurality of butt-joint holes distributed in an array are formed in the packaging shell, a plurality of caps distributed in an array are arranged on the end cover, and the plurality of butt-joint holes and the plurality of caps are distributed in a one-to-one correspondence; the radial dimension of the pipe cap is gradually reduced from the side close to the main body to the side far away from the main body. The plurality of butt joint holes and the plurality of tube caps distributed in the array are uniformly distributed, so that the space is fully utilized or the volume of the packaging box is reduced. The radial dimension of pipe cap is from being close to main part one side and keeping away from main part one side and constantly becoming small, helps the main part butt of inner wall and the base of pipe cap, blocks laser module encapsulation main part promptly, prevents to keeping away from butt joint hole one side and removes, avoids structure in the main part and the inner wall contact of pipe cap to take place the extrusion, effectively carries out the guard action to structure in the main part.

In one embodiment, a plurality of docking rings are arranged on the inner wall of the packaging shell provided with the docking holes, the docking holes and the docking rings are distributed in one-to-one correspondence, the inner diameter of each docking ring is smaller than the aperture of each docking hole, and the end face of each docking ring in each docking hole is used for being abutted against the laser module packaging main body. The place that sets up the docking collar effectively increases the thickness to the packaging shell, and both be convenient for place laser module encapsulation main part, be convenient for again provide sufficient support strength for the laser module encapsulation main part on it, need not increase the thickness of whole packing carton simultaneously, save material cost.

In one embodiment, the package shell is in a cylindrical structure, a plurality of butt joint holes are formed in the bottom of the package shell, a bottom cover is arranged at the nozzle of the package shell, and the bottom cover is detachably connected with the package shell. When the bottom cover is detachably connected with the cylindrical packing box, the use flexibility of the packing box is improved, and the laser module packaging structure on the packing box is convenient to adjust.

Drawings

FIG. 1 is a schematic diagram of a conventional laser module;

FIG. 2 is a schematic diagram of a laser module according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a laser module according to another embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded view of a laser module according to one embodiment of the present disclosure;

FIG. 5 is an exploded view of the laser module of FIG. 4;

fig. 6 is a schematic cross-sectional view of a laser module according to an embodiment of the present application.

Reference numerals illustrate: 10. base, 11, main body, 111, assembly, 112, support, 12, pin, 13, laser anode, 14, laser cathode, 20, laser chip, 30, ceramic substrate, 40, connecting wire, 50, packing box, 51, packing shell, 511, butt hole, 512, butt ring, 52, end cap, 521, pipe cap, 53, bottom cap.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings by way of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present application. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, some operations associated with the present application have not been shown or described in the specification to avoid obscuring the core portions of the present application, and may not be necessary for a person skilled in the art to describe in detail the relevant operations based on the description herein and the general knowledge of one skilled in the art.

Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.

The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated.

As shown in fig. 2-6, a laser module package structure includes a laser module package body, the laser module package body including: a submount 10, a laser chip 20, and connection lines 40. The base 10 comprises a main body 11 and pins 12, wherein a laser cathode 14 and a laser anode 13 are arranged on one end face of the main body 11, and the pins 12 are arranged on the other end face of the main body 11. For example, three pins 12 are provided on the other end face of the main body 11. The laser chip 20 is disposed at an end face of the main body 11 away from the pins 12, and the laser chip 20 is in contact with the main body 11, and the laser chip 20 is connected to any one of the laser positive electrode 13 and the laser negative electrode 14. The connection line 40 connects the laser chip 20 with the other of the laser positive electrode 13 and the laser negative electrode 14. The laser module packaging structure can be manufactured by adopting a TO packaging process.

By adopting the laser module packaging structure in the above embodiment, the laser chip 20 (for example, vcsel chip, vertical cavity surface laser chip) is directly disposed on the end face of the main body 11, and the laser chip 20 is directly contacted with the main body 11 of the base 10, so that the laser chip 20 can be directly electrically connected with any one of the laser anode 13 and the laser cathode 14 on the base 10, and then the corresponding electrical connection is realized through the pin 12 on the base 10, and at this time, only one connecting wire 40 is required to connect the laser chip 20 with the other one of the laser anode 13 and the laser cathode 14, so as to realize stable electrical connection between the laser chip 20 and the base 10. By adopting the structure, the structural design of the laser module packaging structure is effectively simplified, the processing procedure of the laser module packaging structure is saved, and the cost of the laser module packaging structure is reduced.

As shown in fig. 2, the main body 11 includes an assembly portion 111 and a support portion 112, the assembly portion 111 is disposed on one end surface of the support portion 112, the pin 12 is disposed on the other end surface of the support portion 112, and the end surface of the assembly portion 111 remote from the support portion 112 is provided with a laser anode 13 and a laser cathode 14.

Specifically, the radial dimension of the fitting portion 111 is smaller than the radial dimension of the supporting portion 112. Taking the cylindrical assembly portion 111 and the cylindrical support portion 112 as an example, the radial dimension of the support portion 112 is relatively larger, so that the support is conveniently provided for the assembly portion 111 thereon, and meanwhile, the processing or process transportation of the laser module packaging structure is also conveniently performed. The shapes mentioned herein are only examples, and should not be construed as limiting the present application, wherein the shape of the fitting portion 111 and the shape of the supporting portion 112 may be the same or different.

More preferably, the mounting portion 111 has a mounting portion provided on an end surface thereof, and the laser chip 20 is provided on the mounting portion 111 at the mounting portion. The laser chip 20 provided on the mounting portion 111 is limited in position by the mounting position, which helps to ensure the consistency of the package structure of the laser module for producing a lot. The mounting position is, for example, a region outlined or drawn on the end face of the mounting portion 111. As shown in fig. 3-6, the laser module package structure further includes a package box 50, wherein a plurality of laser module package bodies are arranged in the package box 50, and the package box 50 can be removed after the package box 50 is transported. After the packaging box 50 is adopted, the capping operation of the laser module packaging main body can be canceled, and after the packaging box 50 is used, the laser module packaging main body can be assembled on a copper pipe, and the components or structures on the laser module packaging main body are protected through the copper pipe. The laser module package body in the package box 50 is shown in fig. 2, that is, the laser module package body includes a base 10, a laser chip 20 and a connecting wire 40.

As shown in fig. 4-6, package 50 includes a package shell 51 and an end cap 52. The end face of the package shell 51 is provided with a plurality of butt-joint holes 511, and the butt-joint holes 511 are used for placing the laser module package main body. The end cap 52 and the package 51 are detachably connected, and a plurality of caps 521 are provided on the end cap 52, the caps 521 being used to cover the structure on the main body 11. The laser module packaging main body on the packaging shell is effectively loaded through the butt joint holes 511, a plurality of butt joint holes 511 are formed in the packaging shell 51, and the laser module packaging main bodies can be placed in the packaging shell at one time, so that the batch transportation protection of the laser module packaging main bodies is realized, the processing efficiency of the laser module packaging structure is improved, and the processing cost is reduced. The packaging box 50 plays a role in limiting and protecting the laser module packaging main body in the packaging box mainly through the buckling of the end cover 52 and the packaging shell 51, and the designed packaging box 50 can be reused, is not a disposable product and reduces the material cost because the end cover 52 and the packaging shell 51 are detachably connected.

As shown in fig. 4-5, the packaging shell 51 is provided with a plurality of butt-joint holes 511 distributed in an array, the end cover 52 is provided with a plurality of caps 521 distributed in an array, and the plurality of butt-joint holes 511 and the plurality of caps 521 are distributed in a one-to-one correspondence. For example, 3*3 butt holes 511 are formed in the end face of the package 51, and 3*3 caps 521 are correspondingly provided on the end cap 52. The plurality of butt holes 511 and the plurality of caps 521 distributed in an array are uniformly distributed, which is advantageous in fully utilizing space or reducing the volume of the packing box 50. The radial dimension of the pipe cap 521 is gradually reduced from the side close to the main body 11 to the side far away from the main body 11, so as to facilitate the contact between the inner wall of the pipe cap 521 and the main body 11 (the assembly part 111) of the base 10, i.e. clamp the laser module package main body, prevent the movement to the side far away from the butt hole 511, avoid the extrusion of the contact between the structure (such as the connecting wire 40) on the main body 11 and the inner wall of the pipe cap 521, and effectively protect the structure on the main body 11, as shown in fig. 6. Generally, products of laser module packaging structure need to be wire-bonded, and since the wire diameter of the connecting wire 40 is small, the connecting wire is easy to bend/break after being touched, and the subsequent power-up or appearance is affected. If the pipe cap 521 is not arranged, the normal use of the product is not facilitated. Meanwhile, if the radial dimension of the cap 521 is not limited, the main body 11 of the laser module package structure can still perform a certain range of movement in the cap 521 due to the installation margin, so that the connection wire 40 and the inner wall of the cap 521 are in contact and extrusion. After the pipe cap 521 designed by the application is adopted, the main body 11 in the pipe cap can be clamped due to the change of the radial dimension, the moving range of the pipe cap is limited, or even if the pipe cap is randomly swayed/inverted in the limited moving range, the product position is not influenced, the connecting wire 40 (such as the connecting wire 40 in a gold wire form) is not damaged, and the structure on the main body 11 is effectively protected. Wherein the radial dimension of the cap opening of the cap 521 is relatively slightly larger than the radial dimension of the fitting 111 on the main body 11 so as to cover the main body 11 and the structure thereon. The radial dimension of the cap bottom of the cap 521 is relatively smaller than the radial dimension of the fitting portion 111 on the main body 11, so as to ensure that the cap 521 can clamp the fitting portion 111 on the main body 11 and limit the movable range of the fitting portion 111.

As shown in fig. 5, a plurality of docking rings 512 are disposed on the inner wall of the package shell 51 with the docking holes 511, the plurality of docking holes 511 and the plurality of docking rings 512 are distributed in one-to-one correspondence, the inner diameter of the docking rings 512 is smaller than the aperture of the docking holes 511, and the end surface of the docking ring 512 located in the docking holes 511 is used for abutting against the laser module package body. The docking ring 512 is integrally formed with the end surface of the package 51 for easy processing. The butt-joint ring 512 is arranged, so that the thickness of the package shell 51 is effectively increased, the laser module package main body is convenient to place, the laser module package main body is convenient to provide enough supporting strength for the laser module package main body, and meanwhile, the thickness of the whole package box 50 is not increased, and the material cost is saved.

As shown in fig. 5, the package shell 51 has a cylindrical structure, a plurality of butt-joint holes 511 are formed in the bottom of the package shell 51, a bottom cover 53 is arranged at the nozzle of the package shell 51, and the bottom cover 53 is detachably connected with the package shell 51. When the bottom cover 53 is detachably connected with the tubular packing box 50, the flexibility of use of the packing box 50 is increased, and the laser module package structure thereon is also facilitated to be adjusted.

In other embodiments, the package box 50 may not be provided, and the corresponding cap 521 may be provided directly according to the laser module package body. The laser module packaging structure further comprises a pipe cap 521, wherein the pipe cap 521 is detachably fixed on the outer periphery of the main body 11 (for example, the end of the pipe cap 521 is tightly sleeved and matched with the outer periphery of the main body 11 to realize detachable connection), and covers the structure on the main body 11, and the pipe cap 521 is used for playing a structural protection role in the process of transporting the laser module packaging main body.

The radial dimension of the pipe cap 521 becomes smaller from the side closer to the main body 11 to the side farther from the main body 11. In order to facilitate the mounting of the pipe cap 521, the size of the opening of the pipe cap 521 is adapted to the outer circumferential size of the main body 11 (upper support 112). The radial dimension of the pipe cap 521 is gradually changed, so that the main body 11 is always clamped at a certain position on the inner wall of the pipe cap 521, the movable space of part of the main body 11 in the pipe cap 521 is limited, and meanwhile, the structure on the main body 11, such as the connecting wire 40, is prevented from being contacted, extruded, bent and even broken, so that the structure on the main body 11 is effectively protected. One cap 521 corresponds to one laser module package body. In actual use, the number of the corresponding pipe caps 521 is determined according to the number of the laser module packaging main bodies, and the unnecessary pipe caps 521 are not required to be arranged, so that the pipe caps 521 are more flexible to use.

The foregoing description of specific examples has been presented only to aid in the understanding of the present application and is not intended to limit the present application. Several simple deductions, modifications or substitutions may also be made by the person skilled in the art to which the present application pertains, according to the idea of the present application.

Claims

1. The utility model provides a laser module packaging structure which characterized in that, includes laser module packaging main part, laser module packaging main part includes:

2. The laser module package structure of claim 1, wherein the main body includes an assembly portion and a support portion, the assembly portion is disposed on one end surface of the support portion, the pin is disposed on the other end surface of the support portion, and the assembly portion is disposed away from the one end surface of the support portion to form the laser anode and the laser cathode.

3. The laser module package structure of claim 2, wherein a radial dimension of the mounting portion is smaller than a radial dimension of the supporting portion.

4. The laser module package structure according to claim 2, wherein an assembling bit is provided on an end face of the assembling portion, and the laser chip is provided on the assembling portion at the assembling position.

5. The laser module package structure of claim 1, further comprising a cap removably secured to the outer periphery of the body and covering the structure on the body, the cap being configured to provide structural protection during transportation of the laser module package body.

6. The laser module package structure of claim 5, wherein the radial dimension of the cap is continuously smaller from a side closer to the main body to a side farther from the main body.

7. The laser module package structure of claim 1, further comprising a package box comprising a package shell and an end cap; a plurality of butt joint holes are formed in the end face of the packaging shell, and the butt joint holes are used for placing the laser module packaging main body; the end cover is detachably connected with the packaging shell, a plurality of pipe caps are arranged on the end cover, and the pipe caps are used for covering the structure on the main body.

8. The laser module packaging structure of claim 7, wherein a plurality of butt-joint holes distributed in an array are formed in the packaging shell, a plurality of caps distributed in an array are arranged on the end cover, and the plurality of butt-joint holes and the plurality of caps are distributed in a one-to-one correspondence manner; the radial dimension of the pipe cap is gradually reduced from the side close to the main body to the side far away from the main body.

9. The laser module packaging structure of claim 7, wherein a plurality of docking rings are arranged on the inner wall of the packaging shell provided with the docking holes, the docking holes and the docking rings are distributed in one-to-one correspondence, the inner diameter of each docking ring is smaller than the aperture of each docking hole, and the end face of each docking ring in each docking hole is used for being abutted against the packaging main body of the laser module.

10. The laser module packaging structure of claim 8, wherein the packaging shell is of a cylindrical structure, a plurality of butt joint holes are formed in the bottom of the packaging shell, a bottom cover is arranged at the barrel opening of the packaging shell, and the bottom cover is detachably connected with the packaging shell.