CN220357607U

CN220357607U - Patch type memory chip

Info

Publication number: CN220357607U
Application number: CN202321889519.0U
Authority: CN
Inventors: 林周明; 林钟涛
Original assignee: Guangdong Huaguan Semiconductor Co ltd
Current assignee: Guangdong Huaguan Semiconductor Co ltd
Priority date: 2023-07-18
Filing date: 2023-07-18
Publication date: 2024-01-16
Anticipated expiration: 2033-07-18

Abstract

The utility model relates to the technical field of chips, in particular to a patch type storage chip, which comprises a chip body, pins are fixedly arranged on two sides of the outer surface of the chip body, a protective sleeve is sleeved on the outer surface of each pin, a storage groove is formed in one side of the outer surface of each pin, an insulating sleeve is fixedly arranged at one end of the inner surface of each storage groove, a spring is fixedly arranged at one end of the inner surface of each insulating sleeve, and a push rod is fixedly arranged at one end of the outer surface of each spring.

Description

Patch type memory chip

Technical Field

The utility model relates to the technical field of chips, in particular to a patch type memory chip.

Background

The memory chip is a specific application of the concept of an embedded system chip in the memory industry, so that the system chip and the memory chip realize multifunction and high performance by embedding software in a single chip and support for various protocols, various hardware and different applications, and the patch type memory chip is installed and connected by adopting a patch type packaging technology and is widely applied to various electronic devices such as computers, smart phones, tablet computers, embedded systems and the like.

Publication number CN211207373U discloses a patch type memory chip comprising: the chip comprises a chip body and SDIO pins arranged on the side edge of the chip body, wherein the SDIO pins at least comprise eight SDIO data interface pins, a patch type memory chip in the prior art is usually only provided with a single SDIO data interface pin or four SDIO data interface pins, and the number of the SDIO data interface pins determines the read-write bandwidth of the patch type memory chip. Although the device expands the number of the SDIO data interface pins in the SDIO pins of the patch type memory chip to 8, compared with the patch type memory chip bandwidth of a single SDIO data interface pin in the prior art, the device expands the bandwidth of the patch type memory chip of 4 SDIO data interface pins by 8 times, compared with the patch type memory chip bandwidth of 4 SDIO data interface pins in the prior art, the device does not protect the pins, and the pins on the chip are easy to bend or break in the process of installing the chip, so that the normal use of the chip is influenced, the use cost of the chip is increased, and improvement is needed.

Disclosure of Invention

The present utility model is directed to solving the technical problems set forth in the background art.

The utility model adopts the following technical scheme: the utility model provides a paster type memory chip, includes the chip body, the equal fixed mounting in surface both sides of chip body has the pin, the surface cover of pin is equipped with the lag, accomodate the groove has been seted up to surface one side of pin, accomodate the internal surface one end fixed mounting in groove has the insulating cover, the internal surface one end fixed mounting of insulating cover has the spring, the surface one end fixed mounting of spring has the ejector pin.

Preferably, the bottom end of the protective sleeve is provided with a contact port. Here, the pins are connected with other electronic components through the contact openings.

Preferably, a limit groove is formed in one side of the outer surface of the protective sleeve. Here, the ejector rod can be limited by the limiting groove.

Preferably, the diameter of the insulating sleeve is larger than the diameter of the top rod. Here, the movement of the ejector pin is facilitated by the insulating sleeve.

Preferably, an aluminum alloy plate is fixedly arranged at the top end of the chip body, and a heat conducting fin is fixedly arranged at the top end of the aluminum alloy plate. Here, the conduction of heat is facilitated by the heat conductive sheet.

Preferably, the bottom fixed mounting of chip body has insulating guard layer, the bottom fixed mounting of insulating guard layer has the copper alloy board, the louvre has been seted up to the bottom of copper alloy board. Here, the heat discharge rate can be increased by the heat radiation holes.

Compared with the prior art, the utility model has the advantages and positive effects that,

1. according to the utility model, the chip body, the pins, the protective sleeves, the contact ports, the storage grooves, the insulating sleeves, the springs and the ejector rods are arranged, so that the pins can be connected with other electronic elements through the contact ports, the storage grooves are used for realizing the function of placing the insulating sleeves, the springs are used for realizing the function of moving the ejector rods, the ejector rods are used for conveniently replacing the protective sleeves, the structural stability is high, the pins on the chip can be prevented from bending or even breaking through the protective sleeves, the use cost of the chip is reduced, and the chip is convenient to use.

2. According to the utility model, the aluminum alloy plate, the heat conducting fin, the insulating protective layer, the copper alloy plate and the heat radiating hole are arranged, so that the heat emission function of the top end of the chip body can be realized through the aluminum alloy plate and the heat conducting fin, the protection function of the chip body can be realized through the insulating protective layer, the heat emission function of the bottom end of the chip body can be realized through the copper alloy plate and the heat radiating hole, the device has a simple structure, convenience is provided for heat radiation of the chip through the heat conducting fin and the heat radiating hole, the service life of the chip is prolonged, and the heat radiation efficiency of the chip is improved.

Drawings

Fig. 1 is a schematic diagram of a chip-mounted memory chip according to the present utility model;

FIG. 2 is an exploded view of a chip-mounted memory chip according to the present utility model;

FIG. 3 is an enlarged view of the portion A in FIG. 2 showing a chip-mounted memory chip according to the present utility model;

fig. 4 is a partial exploded view of a chip-mounted memory chip according to the present utility model.

Legend description:

1. a chip body; 2. pins; 3. a protective sleeve; 4. a contact port; 5. a storage groove; 6. an insulating sleeve; 7. a spring; 8. a push rod; 9. aluminum alloy plate; 10. a heat conductive sheet; 11. an insulating protective layer; 12. a copper alloy plate; 13. and the heat dissipation holes.

Detailed Description

In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.

Example 1

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a paster type memory chip, includes chip body 1, and the equal fixed mounting in surface both sides of chip body 1 has pin 2, and the surface cover of pin 2 is equipped with lag 3, and contact 4 has been seted up to the bottom of lag 3, makes things convenient for pin 2 to be connected with other electronic component through contact 4, and spacing groove has been seted up on surface one side of lag 3, can carry out spacingly to ejector pin 8 through the spacing groove, and storage groove 5 has been seted up on surface one side of pin 2.

Referring to fig. 2-3, an insulating sleeve 6 is fixedly arranged at one end of the inner surface of the accommodating groove 5, a spring 7 is fixedly arranged at one end of the inner surface of the insulating sleeve 6, the ejector rod 8 can be driven to move by the spring 7, the ejector rod 8 is fixedly arranged at one end of the outer surface of the spring 7, the diameter of the insulating sleeve 6 is larger than that of the ejector rod 8, the movement of the ejector rod 8 is facilitated by the insulating sleeve 6, pins 2 on a chip can be prevented from being bent or broken by the protective sleeve 3, the use cost of the chip is reduced, and the use of the chip is facilitated.

Example two

Referring to fig. 4, an aluminum alloy plate 9 is fixedly installed at the top end of a chip body 1, a heat conducting fin 10 is fixedly installed at the top end of the aluminum alloy plate 9, heat conduction is facilitated through the heat conducting fin 10, an insulating protective layer 11 is fixedly installed at the bottom end of the chip body 1, a copper alloy plate 12 is fixedly installed at the bottom end of the insulating protective layer 11, a heat dissipation hole 13 is formed in the bottom end of the copper alloy plate 12, the heat emission speed can be increased through the heat dissipation hole 13, convenience is brought to heat dissipation of a chip through the heat conducting fin 10 and the heat dissipation hole 13, the service life of the chip is prolonged, and the heat dissipation efficiency of the chip is improved.

Working principle: in the installation of chip, can prevent through lag 3 that pin 2 on the chip body 1 from producing buckling even rupture, and make pin 2 can be connected with other electronic component through contact 4, the use cost of chip body 1 has been reduced, the use of chip body 1 has been made things convenient for, when need change lag 3, just need press ejector pin 8, then drive spring 7 through ejector pin 8 and compress in the inboard of insulating sleeve 6, then alright take down lag 3 and change it, then put back the lag 3 that will change, then drive ejector pin 8 through the reset of spring 7 and remove limit groove department, then just can carry out spacingly to ejector pin 8 through the limit groove, then just accomplished the fixing to lag 3 positions, the change work of lag 3 has been made things convenient for, in-process that uses chip body 1, just can conduct the heat on the chip body 1 top through aluminium alloy plate 9, and accelerate the derivation of heat through the conducting strip 10, then conduct the heat on the chip body 1 bottom through copper alloy plate 12, and through the louvre 13 has been accelerated, can be through the heat release rate of heat dissipation plate 10, chip body 1 has been increased through the life-span of chip body 1, 1 has been used for the chip 1.

The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.

Claims

1. The utility model provides a paster type memory chip, includes chip body (1), its characterized in that: the chip comprises a chip body (1), wherein pins (2) are fixedly installed on two sides of the outer surface of the chip body (1), a protecting sleeve (3) is sleeved on the outer surface of the pins (2), a containing groove (5) is formed in one side of the outer surface of the pins (2), an insulating sleeve (6) is fixedly installed on one end of the inner surface of the containing groove (5), a spring (7) is fixedly installed on one end of the inner surface of the insulating sleeve (6), and a push rod (8) is fixedly installed on one end of the outer surface of the spring (7).

2. The chip of claim 1, wherein: the bottom end of the protective sleeve (3) is provided with a contact port (4).

3. The chip of claim 1, wherein: and a limit groove is formed in one side of the outer surface of the protective sleeve (3).

4. The chip of claim 1, wherein: the diameter of the insulating sleeve (6) is larger than that of the ejector rod (8).

5. The chip of claim 1, wherein: the chip is characterized in that an aluminum alloy plate (9) is fixedly arranged at the top end of the chip body (1), and a heat conducting sheet (10) is fixedly arranged at the top end of the aluminum alloy plate (9).

6. The chip as claimed in claim 5, wherein: the chip comprises a chip body (1), wherein an insulating protective layer (11) is fixedly arranged at the bottom end of the chip body, a copper alloy plate (12) is fixedly arranged at the bottom end of the insulating protective layer (11), and a heat dissipation hole (13) is formed in the bottom end of the copper alloy plate (12).