CN220341677U - Packaging cavity structure and light-emitting device - Google Patents
Packaging cavity structure and light-emitting device Download PDFInfo
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- CN220341677U CN220341677U CN202321892731.2U CN202321892731U CN220341677U CN 220341677 U CN220341677 U CN 220341677U CN 202321892731 U CN202321892731 U CN 202321892731U CN 220341677 U CN220341677 U CN 220341677U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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Abstract
The utility model provides a packaging cavity structure and a light-emitting device, wherein the packaging cavity comprises: the dielectric layer comprises a first surface and a second surface opposite to the first surface; a metal box dam disposed on the first surface of the dielectric layer; the cavity is surrounded by the dielectric layer and the metal surrounding dam. The packaging of the optical device is completed by utilizing the cavity, so that the thermal resistance generated by the connection surface of the light-emitting window and the shell can be effectively avoided, the limitation of the traditional high-temperature welding on the selection of the light-emitting window material is avoided through the integrated arrangement, and the selection of the light-emitting window material and the application range of the light-emitting form are widened. The packaging cavity structure is applied to packaging of the light-emitting device, simplifies the assembly process, is easier to realize large-scale batch preparation, and improves the universality of the packaging structure. The utility model utilizes the metal surrounding dam to form the packaging cavity, realizes the height adjustment of the surrounding dam, and is easier to realize the packaging form of the miniature ultrathin packaging structure.
Description
Technical Field
The utility model relates to the technical field of semiconductor light source packaging, in particular to a packaging cavity structure and a light-emitting device.
Background
Light emitting device packaging is an important form of light emitting device application, and is as large as the packaging structure of an LED light source, as small as the packaging of a laser diode and a micro laser, and meanwhile, the application of simplified, light-weighted and ultra-thin laser packaging devices is increasingly paid attention to in the industry at present, and has become the future application development trend. The present light emitting device packaging structure, such as a laser packaging structure, generally adopts a structure that a laser is arranged on a substrate, a shell surrounding the laser is formed on the substrate around the laser, a light emitting window is connected and arranged at the top of the shell, the light emitting window is made of materials such as glass, and the shell is respectively connected with the substrate and the light emitting window and the shell in a bonding or welding mode. The following problems are common in the current packaging structure of light emitting devices:
1. the package structure is complex. The light-emitting window, the housing, the substrate, the light-emitting device and the like need a specific connection mode to realize package connection, and particularly, the connection between the light-emitting window and the housing generally needs to be realized by an interface bonding (usually, welding, bonding and the like). On one hand, holes are formed in the connecting surface in the conventional connecting process, heat resistance is formed in the connecting surface in the process that the light emergent window radiates heat through the shell, and particularly, for the light emergent form of laser emitted through the light emergent window, heat of the light emergent window needs to be conducted and radiated through the shell, a better heat conduction mode is needed, and the heat resistance generated in the conventional connecting mode can seriously influence the heat radiation efficiency, so that heat accumulation is caused, and the light emergent stability is further influenced; on the other hand, for some heat-sensitive light-emitting window materials, a hot zone is generated on a welding surface in the welding process, so that the stability of the light-emitting window material is damaged, and the stability and uniformity of light emission are further affected.
2. The assembly process is complicated. The light-emitting window, the shell, the light-emitting device, the substrate and the like are assembled and connected in pairs to realize the package molding of the whole package structure, and different package structures and connection forms are needed for different types of light-emitting devices, so that the package structure has poor universality.
3. At present, the miniature laser packaging device has the problems of complex packaging structure and complex assembly process, so that the miniature laser packaging device can rarely achieve micro-volume, and particularly has an ultrathin packaging structure.
Chinese patent CN202020460750.8 discloses a packaging structure of a semiconductor laser, which comprises a plurality of laser chips, a ceramic heat sink, a ceramic frame and a light window, wherein the plurality of laser chips are arranged in a closed space surrounded by the ceramic heat sink, the ceramic frame and the light window, and the light emitted by the plurality of laser chips is emitted through the light window; each laser chip comprises a ceramic base, the ceramic base is adhered to the ceramic heat sink, the ceramic frame is used for fixing the ceramic heat sink, and the optical window is linked with the ceramic frame through glass solder or metal solder. The patent adopts the full ceramic packaging technology to solve the problem of laser chip heat dissipation, but the packaging parts are more, the packaging process is complex, and the heat dissipation of the optical window can be greatly influenced due to the existence of thermal resistance of a connecting surface.
Disclosure of Invention
An object of the present utility model is to provide a light emitting device package structure for solving the above-described drawbacks of the related art.
The utility model aims to provide an integrated packaging structure of a light-emitting window and a shell, which avoids thermal resistance generated by a connecting surface of the light-emitting window and the shell, better realizes heat conduction and heat dissipation of the light-emitting window, avoids limitation of traditional high-temperature welding on selection of materials of the light-emitting window through integrated arrangement, and widens the application range of the selection of the materials of the light-emitting window and the light-emitting form.
The second purpose of the utility model is to simplify the assembly process by arranging the integrated packaging structure, so that the large-scale batch preparation is easier to realize, and the universality of the packaging structure is improved.
The third purpose of the utility model is to realize the height adjustment of the surrounding dam by integrally growing the surrounding dam around the light-emitting window, so that the packaging form of the miniature ultrathin packaging structure is easier to realize.
Specifically, the utility model provides the following technical scheme:
the utility model provides a packaging cavity structure, which comprises:
the dielectric layer comprises a first surface and a second surface opposite to the first surface;
a metal box dam disposed on the first surface of the dielectric layer;
the cavity is surrounded by the dielectric layer and the metal surrounding dam.
Further, the medium layer is a light-transmitting medium layer; and/or the light-transmitting medium layer comprises fluorescent ceramics, sapphire or glass.
Further, the dielectric layer further comprises a first adhesion conductive layer formed on the first surface of the dielectric layer, wherein the first adhesion conductive layer is used as a seed layer of the metal surrounding dam.
Further, the projection of the first adhesion conductive layer on the first surface of the dielectric layer protrudes the projection of the metal box dam on the first surface of the dielectric layer.
Further, the dielectric layer second surface comprises a planar, concave or convex shape.
The present utility model also proposes a light emitting device comprising:
a light source substrate;
a light emitting chip mounted on the light source substrate;
the packaging cavity is connected with the light source substrate to form a space for accommodating the light emitting chip; wherein, the encapsulation cavity includes:
the dielectric layer comprises a first surface and a second surface opposite to the first surface;
a metal box dam disposed on the first surface of the dielectric layer;
the cavity is surrounded by the dielectric layer and the metal surrounding dam.
Further, the medium layer is a light-transmitting medium layer; and/or the light-transmitting medium layer comprises fluorescent ceramics, sapphire or glass.
Further, the dielectric layer further comprises a first adhesion conductive layer formed on the first surface of the dielectric layer, wherein the first adhesion conductive layer is used as a seed layer of the metal surrounding dam.
Further, the projection of the first adhesion conductive layer on the first surface of the dielectric layer protrudes the projection of the metal box dam on the first surface of the dielectric layer.
Further, the dielectric layer second surface comprises a planar, concave or convex shape.
Further, the packaging structure also comprises a solder film arranged on the light source substrate, wherein the solder film is used for connecting the packaging cavity with the light source substrate.
Further, the solder film comprises a self-propagating solder film.
Further, the light emitting chip includes a laser chip or an LED chip.
Further, the laser chips comprise a plurality of laser chips, and the plurality of laser chips are arranged in the packaging cavity in an array mode.
Further, the laser chip packaging structure also comprises a mirror surface arranged on the light source substrate, wherein the mirror surface is used for emitting light of the laser chip out of the top surface of the packaging cavity.
Further, the packaging structure comprises a plurality of laser chips and a plurality of mirror surfaces, wherein the mirror surfaces are in one-to-one correspondence with the laser chips and are used for emitting light of the laser chips out of the top surface of the packaging cavity.
The utility model provides a packaging cavity structure and a light-emitting device; the light-emitting window and the shell of the optical device are integrated, so that thermal resistance generated by the connection surface of the light-emitting window and the shell is effectively avoided, heat conduction and heat dissipation of the light-emitting window are better realized, meanwhile, the limitation of traditional high-temperature welding on the selection of materials of the light-emitting window is avoided through the integrated arrangement, and the selection of materials of the light-emitting window and the application range of light-emitting forms are widened.
The packaging cavity structure provided by the utility model is applied to packaging of the light-emitting device, simplifies the assembly process, is easier to realize large-scale batch preparation, and improves the universality of the packaging structure.
The utility model utilizes the metal surrounding dam to form the packaging cavity, realizes the height adjustment of the surrounding dam, and is easier to realize the packaging form of the miniature ultrathin packaging structure.
Drawings
Fig. 1 to 8 are schematic views illustrating a method for manufacturing a package cavity structure according to an embodiment of the utility model;
fig. 9 is a schematic view of a package cavity according to an embodiment of the utility model;
fig. 10 to 17 are schematic views illustrating a method for manufacturing a light source substrate according to an embodiment of the utility model;
FIG. 18 is a schematic illustration of a self-propagating brazing film according to one embodiment of the present utility model;
fig. 19 is a schematic view of a light emitting device package according to an embodiment of the present utility model;
FIG. 20 is a schematic diagram showing a combination of a laser chip and a mirror according to an embodiment of the utility model;
FIG. 21 is a schematic diagram of an array of multiple laser chips and multiple mirrors according to one embodiment of the utility model.
The specific embodiment is as follows:
the present utility model will be described in further detail below with reference to the drawings and detailed description for the purpose of better understanding of the technical solution of the present utility model to those skilled in the art.
The utility model and the method of practicing the same may be better understood by reference to the following detailed description of exemplary embodiments and the accompanying drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Like reference numerals may refer to like elements throughout. In the drawings, the thickness of layers and regions may be exaggerated for clarity.
Example 1
As shown in fig. 1-6, the embodiment provides a method for preparing a packaging cavity structure, which includes the following steps:
selecting a dielectric layer 1, wherein the dielectric layer comprises a first surface 101 and a second surface 102 opposite to the first surface 101; in particular, the dielectric layer may be any suitable encapsulation material, preferably a material suitable for semiconductor conventional processes, such as silicon or glass; more specifically, when the package cavity structure is used in a light emitting device, a fluorescent ceramic, glass or sapphire dielectric layer may be selected for facilitating light projection, as shown in fig. 1.
Wherein the fluorescent ceramics are, for example, composite fluorescent ceramics, comprising a first fluorescent ceramic layer 1101 which emits at least one color of green, yellow-green or yellow light and a second fluorescent ceramic layer 1102 which emits red or yellow-red light and is provided on the first fluorescent ceramic layer; as shown in fig. 2.
Wherein the first fluorescent ceramic layer 1101 is for example LuAG: ce (Ce) 3+ Fluorescent ceramics or beta-Sialon: eu (Eu) 2+ The fluorescent ceramic, the second fluorescent ceramic layer 1102 may be CaAlSiN 3 ：Eu 2+ Fluorescent ceramics or LSN fluorescent ceramics.
In addition, the composite fluorescent ceramic may also be a sheet structure including a first fluorescent ceramic region 1201 in a plane and a second fluorescent ceramic region 1202 surrounding the first fluorescent ceramic region 1201; as shown in fig. 3.
Preparing a first adhesive conductive layer 2, wherein the first adhesive conductive layer 2 is formed on the first surface 101 of the dielectric layer 1; as shown in fig. 4. Specifically, the first adhesion conductive layer 2 is formed using, for example, a plating process, which may be magnetron sputtering PVD, chemical vapor deposition CVD, atomic layer deposition ALD, chemical deposition, or the like.
Alternatively, the first adhesion conductive layer 2 comprises forming an adhesion layer on the first surface 101 of the dielectric layer 1, forming a conductive layer on said adhesion layer. Wherein the adhesion layer material is titanium or tungsten or chromium, and has a thickness of 10-500nm; the conductive layer material can be copper metal or copper alloy, and the thickness is 0.5-5 μm.
As shown in fig. 5, a first photoresist layer 3 is coated on the first adhesive conductive layer 2; the photoresist layer 3 can be photoresist, polyester dry film and other materials;
the first photoresist layer 3 is patterned to form a first opening exposing the first adhesive conductive layer, which surrounds a central region of the first photoresist layer 3.
Electroplating a first metal layer 4 in the first opening, and flattening the surfaces of the first metal layer and the first photoresist layer; the first metal layer 4 may be electroplated copper, nickel and silver; as shown in fig. 6.
Coating a second photoresist layer 6; the second photoresist layer 6 can be photoresist, polyester dry film and other materials;
patterning the second photoresist layer 6 to form a second opening exposing the first metal layer 4;
electroplating a second metal layer 5 in said second opening 4; the second metal layer 5 may be electroplated copper, nickel, silver; the second metal layer 5 forms a metal dam, in particular, the metal dam has, for example, a thickness of 50-1000 μm and a thickness of 300-1000 μm; the thickness of the metal box dam is mainly determined according to the required accommodating space of the packaging cavity, and is designed according to the structure and the shape of the chip; as shown in fig. 7.
Removing the first photoresist layer 3 and the second photoresist layer 6 to form the packaging cavity structure 7; as shown in fig. 8.
Optionally, the projection of the first adhesive conductive layer 2 on the first surface 101 of the dielectric layer 1 projects the projection of the metal dam on the first surface of the dielectric layer.
Example 2
The embodiment also proposes a packaging cavity structure, as shown in fig. 8, including:
a dielectric layer 1, the dielectric layer including a first surface 101 and a second surface 102 opposite to the first surface;
a metal box dam 501, wherein the metal box dam 501 is arranged on the first surface 101 of the dielectric layer 1;
the cavity 701 is surrounded by the dielectric layer and the metal surrounding dam.
Optionally, when the packaging cavity structure is applied to packaging an optical device, the dielectric layer is a light-transmitting dielectric layer; the light-transmitting medium layer can be made of light-transmitting materials such as fluorescent ceramics, sapphire or glass, wherein the glass can also be fluorescent glass.
Optionally, the dielectric layer further comprises a first adhesion conductive layer 2 formed on the first surface of the dielectric layer, wherein the first adhesion conductive layer is used as a seed layer of the metal dam.
Optionally, the projection of the first adhesion conductive layer on the first surface of the dielectric layer protrudes from the projection of the metal dam on the first surface of the dielectric layer.
Alternatively, as shown in fig. 9, the second surface 102 of the dielectric layer 1 may be formed into a planar, concave or convex shape for better light transmission.
Optionally, the package cavity structure of the present embodiment is applied to laser illumination, and the light-emitting window is required to have both laser irradiation resistance and high temperature resistance, and also to have excellent heat conduction and heat dissipation properties. According to the embodiment, through the integrated arrangement of the light emitting window and the surrounding dam, the surrounding dam is directly formed by electroplating to form an integrated structure, the problem that the heat conduction and heat dissipation performance is improved due to the fact that uneven microstructures such as pits are formed on the surfaces of two materials of a welding surface in the conventional connecting mode such as welding and self-propagating is avoided, and further interface thermal resistance is formed.
Example 3
The present embodiment relates to an application of the encapsulation cavity prepared in embodiment 1, and proposes an encapsulation method of a light emitting device, which includes the following steps:
preparing a packaging cavity structure, wherein the packaging cavity structure is prepared according to the preparation method provided by the embodiment 1 of the utility model;
preparing a light source substrate structure;
mounting a chip on the light source substrate structure;
and aligning and connecting the packaging cavity structure with the light source substrate structure.
As shown in fig. 10-16, the preparing a light source substrate structure includes:
as shown in fig. 10, a substrate 7 is selected, and the substrate 7 may be a substrate material suitable for the semiconductor packaging field, in this embodiment, for example, a high heat conductive ceramic substrate, and may be a material such as aluminum nitride, aluminum oxide, silicon carbide, etc.;
as shown in fig. 11, a via structure 8 is formed on the surface of the substrate 7, for example, by a laser processing process;
as shown in fig. 12, a second adhesion conductive layer 9 is formed on the front and back sides of the substrate 7 by a film plating process, the second adhesion conductive layer 9 is generally at least a two-layer film system, the layer near the substrate 7 is an adhesion layer, and the layer far from the substrate 7 is a conductive layer;
as shown in fig. 13, the surface of the second adhesive conductive layer 9 is subjected to directional exposure, solidification and coverage through a photoresist pattern 10, and a specific pattern structure, such as a wiring area, is formed after development;
as shown in fig. 14, the basic thermoelectric separation conductive heat dissipation metal layer 11 is formed by electroplating in an uncovered area through a pattern electroplating process.
As shown in fig. 15-17, the directional exposure, solidification and coverage of the photoresist pattern 12 are continuously performed on the surface of the pattern electroplated metal layer 11, after development, the packaging solder film 13 is deposited on the surface of the conductive heat dissipation metal layer 11 through a film pattern deposition technology, and finally, the light source packaging heat dissipation bracket structure 14 is formed after a film stripping etching process.
Wherein the solder film 13 comprises a self-propagating brazing film; as shown in fig. 18, the self-propagating brazing film includes at least a stacked first brazing layer 1302, self-propagating film 1301, second brazing layer 1303, and optionally copper layers 1304, 1305 disposed on the bottom and top surfaces of the self-propagating brazing film.
Further, the connection mode comprises brazing, self-propagating or bonding.
Further, the chip includes a laser or an LED.
Example 4
The present embodiment relates to the application of the package cavity prepared in embodiment 1, and proposes a package structure of a light emitting device, and in particular, relates to a light emitting device, as shown in fig. 19, a light emitting device 16 includes:
a light source substrate 14;
a light emitting chip 15 mounted on the light source substrate;
and the packaging cavity 7 is connected with the light source substrate to form a space for accommodating the light emitting chip.
The package cavity is prepared by adopting the method of embodiment 1, and has the structure of embodiment 2, and is not described herein.
The light emitting chip 15 in the present embodiment includes a laser chip or an LED chip, among others.
Further, when the light emitting chip 15 is a laser chip, the laser chip may be disposed in a manner that the light emitting direction is perpendicular to the light emitting medium layer of the package cavity 7; the laser chip may be disposed in such a manner that the light emitting direction is parallel to the light emitting medium layer, and in this manner, as shown in fig. 20, a mirror 17 may be disposed on the light source substrate, and the mirror 17 forms an angle of 45 ° with the light source substrate 14, for example, so as to emit the laser light perpendicular to the light emitting medium layer of the package cavity 7.
Alternatively, a plurality of laser chips may be provided on the light source substrate 14 to form an array structure.
Alternatively, when the arrangement shown in fig. 20 is adopted, in order to form an array, a plurality of mirror surfaces may be arranged in a manner corresponding to a plurality of laser chips, respectively, which are arranged on the light source substrate 14 as shown in fig. 21, for example.
The utility model provides a packaging cavity structure, a preparation method and application thereof; the light-emitting window and the shell of the optical device are integrated, so that thermal resistance generated by the connection surface of the light-emitting window and the shell is effectively avoided, heat conduction and heat dissipation of the light-emitting window are better realized, meanwhile, the limitation of traditional high-temperature welding on the selection of materials of the light-emitting window is avoided through the integrated arrangement, and the selection of materials of the light-emitting window and the application range of light-emitting forms are widened.
The packaging cavity structure provided by the utility model is applied to packaging of the light-emitting device, simplifies the assembly process, is easier to realize large-scale batch preparation, and improves the universality of the packaging structure.
The utility model utilizes the metal surrounding dam to form the packaging cavity, realizes the height adjustment of the surrounding dam, and is easier to realize the packaging form of the miniature ultrathin packaging structure.
The above examples are merely illustrative of preferred embodiments of the utility model, which are not exhaustive of all details, nor are they intended to limit the utility model to the particular embodiments disclosed. Various modifications and improvements of the technical scheme of the present utility model will fall within the protection scope of the present utility model as defined in the claims without departing from the design spirit of the present utility model.
Claims (18)
1. A packaging cavity structure, wherein the packaging cavity comprises:
the dielectric layer comprises a first surface and a second surface opposite to the first surface;
a metal box dam disposed on the first surface of the dielectric layer;
the cavity is surrounded by the dielectric layer and the metal surrounding dam.
2. The package cavity structure of claim 1, wherein the dielectric layer is a light transmissive dielectric layer; and/or the light-transmitting medium layer comprises fluorescent ceramics, sapphire or glass; and/or the fluorescent ceramic is composite fluorescent ceramic, and comprises a first fluorescent ceramic layer which emits at least one color of green, yellow-green or yellow light and a second fluorescent ceramic layer which is arranged on the first fluorescent ceramic layer and emits red or yellow-red light.
3. The package cavity structure of claim 2, wherein the composite fluorescent ceramic is a sheet-like structure comprising a first fluorescent ceramic region in a plane and a second fluorescent ceramic region surrounding the first fluorescent ceramic region.
4. The package cavity structure of claim 2, further comprising a first adhesion conductive layer formed on the first surface of the dielectric layer, the first adhesion conductive layer acting as a seed layer for the metal dam.
5. The package cavity structure of claim 4, wherein a projection of the first adhesive conductive layer on the first surface of the dielectric layer projects a projection of the metal dam on the first surface of the dielectric layer.
6. The package cavity structure of claim 2, wherein the dielectric layer second surface comprises a planar, concave, or convex shape.
7. A light emitting device, the light emitting device comprising:
a light source substrate;
a light emitting chip mounted on the light source substrate;
the packaging cavity is connected with the light source substrate to form a space for accommodating the light emitting chip; wherein, the encapsulation cavity includes:
the dielectric layer comprises a first surface and a second surface opposite to the first surface;
a metal box dam disposed on the first surface of the dielectric layer;
the cavity is surrounded by the dielectric layer and the metal surrounding dam.
8. The light-emitting device of claim 7, wherein the dielectric layer is a light-transmissive dielectric layer; and/or the light-transmitting medium layer comprises fluorescent ceramics, sapphire or glass; and/or the fluorescent ceramic is composite fluorescent ceramic, and comprises a first fluorescent ceramic layer which emits at least one color of green, yellow-green or yellow light and a second fluorescent ceramic layer which is arranged on the first fluorescent ceramic layer and emits red or yellow-red light; and/or, the first fluorescent ceramic layer is LuAG: ce (Ce) 3+ Fluorescent ceramics or beta-Sialon: eu (Eu) 2+ The second fluorescent ceramic layer is CaAlSiN 3 ：Eu 2+ Fluorescent ceramics or LSN fluorescent ceramics.
9. The light emitting device of claim 8, wherein the composite fluorescent ceramic is a platelet structure comprising a first fluorescent ceramic region in a plane and a second fluorescent ceramic region surrounding the first fluorescent ceramic region.
10. The light emitting device of claim 7, further comprising a first adherent conductive layer formed on the first surface of the dielectric layer, the first adherent conductive layer acting as a seed layer for the metal dam.
11. The light emitting device of claim 10, wherein a projection of the first adherent conductive layer onto the first surface of the dielectric layer projects beyond a projection of the metal dam onto the first surface of the dielectric layer.
12. The light emitting device of claim 7, wherein the dielectric layer second surface comprises a planar, concave, or convex shape.
13. The light emitting device of claim 7, further comprising a solder film disposed on the light source substrate, the solder film being for connection of the package cavity to the light source substrate.
14. The light emitting device of claim 13, wherein the solder film comprises a self-propagating braze film.
15. The light-emitting device according to claim 7, wherein the light-emitting chip comprises a laser chip or an LED chip.
16. The light emitting device of claim 15, wherein the laser chip comprises a plurality of laser chips arranged in an array within the package cavity.
17. The light emitting device of claim 15, further comprising a mirror disposed on the light source substrate for emitting light of the laser chip out of a top surface of the package cavity.
18. The light emitting device of claim 17, comprising a plurality of laser chips and a plurality of mirrors in one-to-one correspondence with the plurality of laser chips for emitting light of the laser chips from a top surface of the package cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321892731.2U CN220341677U (en) | 2023-07-18 | 2023-07-18 | Packaging cavity structure and light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321892731.2U CN220341677U (en) | 2023-07-18 | 2023-07-18 | Packaging cavity structure and light-emitting device |
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| Publication Number | Publication Date |
|---|---|
| CN220341677U true CN220341677U (en) | 2024-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202321892731.2U Active CN220341677U (en) | 2023-07-18 | 2023-07-18 | Packaging cavity structure and light-emitting device |
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| CN (1) | CN220341677U (en) |
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2023
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