CN220341224U - Plastic package power supply - Google Patents
Plastic package power supply Download PDFInfo
- Publication number
- CN220341224U CN220341224U CN202321352804.9U CN202321352804U CN220341224U CN 220341224 U CN220341224 U CN 220341224U CN 202321352804 U CN202321352804 U CN 202321352804U CN 220341224 U CN220341224 U CN 220341224U
- Authority
- CN
- China
- Prior art keywords
- plastic package
- package body
- power supply
- bearing plate
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000002650 laminated plastic Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 239000000047 product Substances 0.000 description 11
- 230000035945 sensitivity Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 101001014562 Homo sapiens Male-specific lethal 3 homolog Proteins 0.000 description 1
- 102100032515 Male-specific lethal 3 homolog Human genes 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to the field of power supplies, and provides a laminated plastic package power supply product which is formed by assembling 2 parts of laminated layers. The first part comprises a bearing plate, a plastic package body, elements or wafers, wherein metal columns are arranged on the bearing plate and are exposed out of the top of the plastic package body to serve as electric contacts, and the main components of the bearing plate and the plastic package body of the first part are epoxy plastic package materials. The second part is an inductor or a transformer. The first portion and the second portion are electrically and mechanically connected by electrical contacts. The utility model stacks the bulky device over the first portion, reducing the molding volume. The main components of the bearing plate and the plastic package body of the first part are epoxy plastic package materials, so that the binding force between the plastic package materials and the bearing plate is increased, the layering risk is reduced, and the product reliability is enhanced.
Description
Technical Field
The utility model relates to the field of power supplies, in particular to a plastic package power supply.
Technical Field
The conventional single-sided plastic packaging type product has the common scheme that a PCB, an element and a wafer are all plastic packaged together.
On the one hand, the general PCB is a resin laminated substrate, the material of the plastic package body is epoxy plastic package material, the expansion coefficients of the 2 materials are different, and when the product passes reflow soldering or the product is subjected to a temperature cycle test, the delamination of the resin substrate and the epoxy plastic package material is easy to occur. The moisture sensitivity rating of the resin substrate type of molded product is typically at most MSL3.
On the other hand, if a large-volume device is included in the electronic device, the volume of the plastic package becomes large. Because the plastic package is non-airtight, the larger the volume of the plastic package body is, the poorer the moisture resistance of the product is. When the product is subjected to a moisture sensitivity experiment, delamination is easy to occur due to the expansion force of moisture.
Disclosure of Invention
The utility model aims to solve the technical problems that when a plastic package product contains a large-volume device, the product has large volume and low moisture resistance, and when a moisture sensitivity experiment is carried out, the product is layered due to the expansion force of moisture. In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a plastic package power supply, which comprises a first part and a second part arranged on the upper surface of the first part, wherein the first part and the second part are electrically connected through an electric contact; the first part comprises a bearing plate, a first electronic device welded on the bearing plate, a first plastic package body wrapped on the periphery of the first electronic device and an electric contact exposing the upper surface of the first plastic package body, wherein the bearing plate comprises a second plastic package body and a conductive circuit arranged in the second plastic package body; the second part is an inductor, a transformer or a PCB soldered with a second electronic device.
Preferably, the height of the first portion is less than 2.0mm.
Preferably, the first part is further provided with a metal column wrapped in the first plastic package body, and part of metal of the metal column is exposed out of the upper surface of the first plastic package body to form an electric contact.
Preferably, the first plastic package body is a plastic package body composed of epoxy plastic package materials, and the second plastic package body is a plastic package body composed of epoxy plastic package materials.
The utility model also provides a plastic package power supply, which comprises a first part and a second part arranged on the lower surface of the first part, wherein the first part and the second part are electrically connected through an electric contact; the first part comprises a bearing plate, a first electronic device welded on the bearing plate and a first plastic package body wrapped on the periphery of the first electronic device, wherein the bearing plate comprises a second plastic package body, a conductive circuit arranged in the second plastic package body and an electric contact exposing the lower surface of the second plastic package body; the second portion is a PCB soldered with the second electronic device.
Preferably, the conductive circuit portion leaks out of the surface of the second plastic package body to form an electrical contact.
Preferably, the PCB includes a resin laminated substrate and a second electronic device soldered on the resin laminated substrate.
The scheme of the utility model has the following beneficial effects:
1. the first plastic package body in the first part and the second plastic package body in the bearing plate are plastic package bodies, and are made of the same material, and the bonding force of the first plastic package body and the second plastic package body is strong, so that the bonding force of the bearing plate and the first plastic package body is improved;
2. the large-volume devices (such as an inductor, a transformer and a PCB welded with a second electronic device) are moved outside the first plastic package body, so that the volume of the plastic package power supply is reduced and the moisture resistance of the plastic package power supply is improved;
3. the moved large-volume device is designed into a patch package or is connected with the first part through PCB in a switching mode, and then the package of the final product is still the patch package, so that the customer is facilitated to use the patch package.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of a plastic package power supply of the present utility model;
FIG. 2 is a cross-sectional view of a second embodiment of the plastic package power supply of the present utility model;
FIG. 3 is a cross-sectional view of another assembly scheme of a second embodiment of the plastic packaged power supply of the present utility model;
wherein, the reference numerals in the above figures are as follows:
1. the carrier plate, 2, the first plastic package body, 3, the device, 4, the solder, 5, the chip, 6, the first electronic device, 7, the PCB,201, the metal post
Detailed Description
First embodiment
Referring to fig. 1, the plastic package power supply includes a first portion and a second portion disposed on an upper surface of the first portion. The first part comprises a bearing plate 1, a first plastic package body 2, a chip 5, an electronic device 6 and an electric contact exposing the upper surface of the first plastic package body 2; the carrier plate includes a second plastic package body and a conductive circuit disposed in the second plastic package body, the chip 5 and the electronic device 6 are both wrapped in the first plastic package body 2, the main component of the first plastic package body 2 is an epoxy plastic package material, and the first plastic package body 2 and the second plastic package body in the carrier plate 1 are both made of the same material, so that the bonding force between the first plastic package body 2 and the carrier plate 1 is strong and are not easy to delaminate. The metal column 201 is wrapped in the first plastic package 2, and a part of metal is exposed out of the upper surface of the first plastic package 2 to form an electrical contact.
The first part is electrically connected to the second part by means of electrical contacts and the second part is a bulky device 3, such as an inductor or a transformer. The device 3 is a chip device, and the bottom of the chip device is exposed with a bonding pad. The pads of the device 3 are connected to the electrical contacts of the metal pillars 201 on the upper surface of the second plastic package 2 by solder 4. Thereby forming a complete product.
Since the first part only contains the chip 5 and the electronic device 6, and the heights of the first part are relatively low, the thickness of the first plastic package body 2 of the first part can be small, thereby being beneficial to reducing the volume of the plastic package power supply. According to the rule that the smaller the packaged device is, the stronger the moisture resistance of the plastic package power supply is according to the moisture sensitivity characteristic of the non-airtight device, the scheme increases the moisture resistance of the plastic package power supply, so that the plastic package power supply can pass higher moisture sensitivity level experiments without layering, such as MSL2a.
Second embodiment
Referring to fig. 2, a second embodiment provides a plastic package power supply including a first portion and a second portion disposed on an upper surface of the first portion; the first part comprises a bearing plate 1, a first plastic package body 2, a first electronic device 5 and a metal column 201; the second part comprises a PCB7, the PCB7 is composed of a resin laminated substrate and a second electronic device 6 welded on the resin laminated substrate, the second electronic device 6 can be distributed outside the first plastic package body 2 through the PCB7, so that the number of the first electronic devices 5 in the first plastic package body 2 is reduced, the height of the first plastic package body 2 is reduced, the size of the first plastic package body 2 is reduced, and finally the moisture resistance of a product is enhanced.
In the second embodiment, the second portion is disposed on the upper surface of the first portion, in other embodiments, the second portion may also be disposed on the lower surface of the first portion, as shown in fig. 3, and the plastic package power supply shown in fig. 3, where the first portion includes a carrier board 1, a first electronic device 5 welded on the carrier board 1, and a first plastic package 2 wrapped around the first electronic device 5, where the carrier board 1 includes a second plastic package, conductive circuits disposed in the second plastic package, and electrical contacts exposing the lower surface of the second plastic package, and the electrical contacts are formed by partially leaking out of the surface of the second plastic package through the conductive circuits. The advantage of this scheme is that the PCB7 can be used as a side wall bonding pad, which is helpful for bonding the bonding pad, forming side surface tin climbing and increasing the mechanical strength of bonding.
The above description is only of a preferred embodiment of the present utility model, and it should be noted that the above description should not be construed as limiting the utility model, and that it is possible for a person skilled in the art to make several improvements and modifications without departing from the spirit and scope of the utility model, which should also be construed as being limited by the scope of the utility model as defined in the appended claims.
Claims (7)
1. A plastic package power supply, characterized in that the plastic package power supply comprises:
the first part comprises a bearing plate, a first electronic device welded on the bearing plate, a first plastic package body wrapped on the periphery of the first electronic device and an electric contact exposing the upper surface of the first plastic package body, wherein the bearing plate comprises a second plastic package body and a conductive circuit arranged in the second plastic package body;
the second part is arranged on the upper surface of the first part, the second part is electrically connected with the first part through the electric contact, and the second part is an inductor, a transformer or a PCB welded with a second electronic device.
2. The plastic packaged power supply of claim 1, wherein: the height of the first portion is less than 2.0mm.
3. The plastic packaged power supply of claim 1, wherein: the first part is also provided with a metal column wrapped in the first plastic package body, and part of metal of the metal column is exposed out of the upper surface of the first plastic package body to form the electric contact.
4. The plastic packaged power supply of claim 1, wherein: the first plastic package body is a plastic package body composed of epoxy plastic package materials, and the second plastic package body is a plastic package body composed of epoxy plastic package materials.
5. A plastic package power supply, characterized in that the plastic package power supply comprises:
the first part comprises a bearing plate, a first electronic device welded on the bearing plate and a first plastic package body wrapped on the periphery of the first electronic device, wherein the bearing plate comprises a second plastic package body, a conductive circuit arranged in the second plastic package body and an electric contact exposing the lower surface of the second plastic package body;
and the second part is arranged on the lower surface of the first part, is electrically connected with the first part through the electric contact, and is a PCB welded with a second electronic device.
6. The plastic packaged power supply of claim 5, wherein: and the conductive circuit part leaks out of the surface of the second plastic package body to form the electric contact.
7. The plastic packaged power supply of claim 5, wherein: the PCB includes a resin laminated substrate and the second electronic device soldered on the resin laminated substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321352804.9U CN220341224U (en) | 2023-05-31 | 2023-05-31 | Plastic package power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321352804.9U CN220341224U (en) | 2023-05-31 | 2023-05-31 | Plastic package power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220341224U true CN220341224U (en) | 2024-01-12 |
Family
ID=89446166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321352804.9U Active CN220341224U (en) | 2023-05-31 | 2023-05-31 | Plastic package power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220341224U (en) |
-
2023
- 2023-05-31 CN CN202321352804.9U patent/CN220341224U/en active Active
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| GR01 | Patent grant | ||
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