CN220341179U

CN220341179U - Multi-size automatic positioning detection device

Info

Publication number: CN220341179U
Application number: CN202321999926.7U
Authority: CN
Inventors: 李红
Original assignee: Tianjin Zhizao Future Technology Co ltd
Current assignee: Tianjin Zhizao Future Technology Co ltd
Priority date: 2023-07-27
Filing date: 2023-07-27
Publication date: 2024-01-12
Anticipated expiration: 2033-07-27

Abstract

The application provides a multi-size automatic positioning detection device, belongs to wafer detection technical field. The multi-size automatic positioning detection device comprises an electric control cabinet, an up-down moving mechanism, a camera, a first longitudinal moving mechanism, a second longitudinal moving mechanism, an eight-inch bearing mechanism, a twelve-inch bearing mechanism, a first locking mechanism and a second locking mechanism, wherein when the multi-size automatic positioning detection device is used, a first Y-direction linear module or a second Y-direction linear module works to drive a wafer to longitudinally move, photographing compensation is realized under the steps to determine the position and the number of residual DIEs, a control terminal performs image recognition after visual photographing, and then compares a wafer drawing, the used bad DIEs are marked, and the used bad DIEs are recovered according to marks.

Description

Multi-size automatic positioning detection device

Technical Field

The application relates to the technical field of wafer detection, in particular to a multi-size automatic positioning detection device.

Background

After the wafer processing process is completed, the wafer is usually cut along scribe lines (or referred to as dicing lines) to obtain individual chips (DIE) for facilitating subsequent packaging of the chips. The wafer is generally divided into eight inches and twelve inches in size, bad DIE (chips which cannot be used) is left on the wafer in the processing process of the wafer, but if a problem occurs in the production process, chips which cannot be used are also used, so that the remained bad DIE on the wafer is fewer, and defective products are easily caused, the wafer is required to be detected by using a bad DIE inspection machine, the bad DIE inspection machine is used for detecting the used bad DIE according to the detection result after alarming, the bad DIE is ensured not to be produced, and the bad DIE inspection machine with twelve inches are required to be used for the wafer at present, so that the detection cost of the wafer is increased, and bad use experience is brought to a user.

Disclosure of Invention

In order to make up for the defects, the application provides a multi-size automatic positioning detection device, and aims to solve the problem that the detection cost of wafers is increased because the wafers are divided into eight inches and twelve inches, so that an eight-inch bad DIE inspection machine and a twelve-inch bad DIE inspection machine are needed.

The application is realized in such a way that:

the application provides a multi-size automatic positioning detection device, which comprises an electric control cabinet, an up-and-down moving mechanism, a camera, a first longitudinal moving mechanism, a second longitudinal moving mechanism, an eight-inch bearing mechanism, a twelve-inch bearing mechanism, a first locking mechanism and a second locking mechanism, wherein the up-and-down moving mechanism, the first longitudinal moving mechanism and the second longitudinal moving mechanism are all arranged on the electric control cabinet;

the first mechanism that moves indulges realizes the last unloading to eight cun wafers, and the second is indulged and is moved the mechanism and realize the last unloading to twelve cun wafers, the camera is installed on the upper and lower moving mechanism, eight cun bearing mechanism sets up on the first mechanism that moves indulges, twelve cun bearing mechanism set up on the second is indulged and move the mechanism, first locking mechanism sets up on the first mechanism that moves indulges, the second locking mechanism sets up on the automatically controlled cabinet, second locking mechanism realizes the locking to twelve cun wafers, and first locking mechanism realizes the locking to eight cun wafers, be provided with visual light source on the automatically controlled cabinet.

In an embodiment of the application, the up-down moving mechanism comprises a Z-direction linear module and a first support, the Z-direction linear module is installed on the upper surface of the electric control cabinet, the first support is fixed on a sliding block of the Z-direction linear module, and the camera is fixed on the first support.

In an embodiment of the application, the first longitudinal moving mechanism comprises a second support, a first Y-direction linear module and a first support plate, wherein the second support is fixed on the upper surface of the electric control cabinet, the first Y-direction linear module is fixed on the second support, and the first support plate is fixed on a sliding block of the first Y-direction linear module.

In an embodiment of the application, the second longitudinal moving mechanism comprises a second Y-direction linear module and a second supporting plate, the second Y-direction linear module is fixed on the upper surface of the electric control cabinet, the second supporting plate is fixed on a sliding block of the second Y-direction linear module, and the twelve-inch bearing mechanism is arranged on the second supporting plate.

In one embodiment of the present application, the eight-inch bearing mechanism includes a carrier and a boss, the carrier is fixed on the first support plate, and the boss is disposed on the carrier.

In one embodiment of the present application, the first locking mechanism includes a first cylinder, a Z-shaped block and a first pressure head, the first cylinder is fixed on the upper surface of the second bracket, the upper end of a piston rod of the first cylinder is fixed on the lower surface of the Z-shaped block, the first pressure head is fixed on the Z-shaped block, and the first pressure head slides through the second bracket.

In an embodiment of the application, the second locking mechanism comprises a second cylinder, a third support, a second pressure head and a guide rod, wherein the second cylinder is fixed on the upper surface of the electric control cabinet, the end part of a piston rod of the second cylinder is fixed on the lower surface of the third support, the guide rod and the second pressure head are both fixed on the lower surface of the third support, and the guide rod is inserted on the electric control cabinet in a sliding mode.

The beneficial effects of this application are: the multi-dimension automatic positioning detection device obtained through the design, when in use, after the wafer processing process is finished, the code scanning gun on the electric control cabinet is picked up, the code scanning gun scans the two-dimension code on the bearing ring, the electric control cabinet rapidly identifies whether the wafer on the bearing ring is eight inches or twelve inches, when the wafer is eight inches, the electric control cabinet controls the first Y-direction linear module to work, the first Y-direction linear module drives the first supporting plate to stretch out, the eight inches wafer is placed on the carrier, the boss corresponds to the blue film ring part on the bearing ring, then the first Y-direction linear module controls the sliding block on the boss to return to the initial position, the first cylinder works to enable the first pressing head to press the bearing ring, the blue film is supported, the flatness of the DIE is ensured, when the wafer is twelve inches, the electric control cabinet controls the second Y-direction linear module to work, the second Y-direction linear module drives the second supporting plate to stretch out, according to the steps, the twelve-inch wafers are placed, then the second Y-direction linear module works to control the sliding blocks on the second Y-direction linear module to return to the initial positions, the second cylinder works to enable the second pressing head to be pressed on the twelve-inch bearing mechanism, the visual light source works to polish, the camera photographs the wafers, when the photo is out of focus, the Z-direction linear module works to drive the camera to move up and down, the first Y-direction linear module or the second Y-direction linear module works to drive the wafers to move longitudinally, photographing compensation is achieved in the steps, the positions and the number of the residual DIEs are determined by photographing, the control terminal performs image recognition again after the visual photographing, the used bad DIEs are marked according to the drawing of the wafers, the multi-dimension automatic positioning detection device can detect the eight-inch wafers and the twelve-inch wafers, the detection cost of the wafers is reduced, and better use experience is brought to the user.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present application and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a multi-dimensional automatic positioning detection device according to an embodiment of the present application;

FIG. 2 is an enlarged view of area A of FIG. 1 provided in an embodiment of the present application;

FIG. 3 is a diagram of a relationship between an eight inch load bearing mechanism and a twelve inch load bearing mechanism provided in an embodiment of the present application;

fig. 4 is a diagram of a relationship between a carrier and a boss according to an embodiment of the present application.

In the figure: 110-an electric control cabinet; 150-an up-down moving mechanism; 151-Z direction straight line module; 152-a first rack; 160-a camera; 170-a first longitudinal movement mechanism; 171-a second bracket; 172-a first Y-direction linear module; 173-a first support plate; 180-a second longitudinal movement mechanism; 181-a second Y-direction linear module; 182-a second support plate; 190-eight inches of bearing mechanism; 1901-a carrier; 1902-eight inch wafers; 1903-carrier ring; 1904-boss; 191-twelve inches of bearing mechanisms; 192-a first locking mechanism; 1921—a first cylinder; 1922-Z block; 1923-first ram; 193-second locking mechanism; 1931-second cylinder; 1932-third scaffold; 1933-second ram; 1934-guide bar.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some of the embodiments of the present application, but not all of the embodiments. All other embodiments, based on the embodiments herein, which would be apparent to one of ordinary skill in the art without undue burden are within the scope of the present application.

Examples

Referring to fig. 1-4, the present application provides a technical solution: the multi-size automatic positioning detection device comprises an electric control cabinet 110, an up-and-down moving mechanism 150, a camera 160, a first longitudinal moving mechanism 170, a second longitudinal moving mechanism 180, an eight-inch bearing mechanism 190, a twelve-inch bearing mechanism 191, a first locking mechanism 192 and a second locking mechanism 193, wherein the up-and-down moving mechanism 150, the first longitudinal moving mechanism 170 and the second longitudinal moving mechanism 180 are all arranged on the electric control cabinet 110, the up-and-down moving mechanism 150 comprises a Z-direction linear module 151 and a first bracket 152, the Z-direction linear module 151 is arranged on the upper surface of the electric control cabinet 110, the first bracket 152 is fixed on a sliding block of the Z-direction linear module 151, and the camera 160 is fixed on the first bracket 152;

the first vertical moving mechanism 170 realizes the feeding and discharging of eight inch wafers, the first vertical moving mechanism 170 comprises a second bracket 171, a first Y-direction linear module 172 and a first supporting plate 173, the second bracket 171 is fixed on the upper surface of the electric control cabinet 110, the first Y-direction linear module 172 is fixed on the second bracket 171, the first supporting plate 173 is fixed on a sliding block of the first Y-direction linear module 172, the second vertical moving mechanism 180 realizes the feeding and discharging of twelve inch wafers, the second vertical moving mechanism 180 comprises a second Y-direction linear module 181 and a second supporting plate 182, the second Y-direction linear module 181 is fixed on the upper surface of the electric control cabinet 110, the second supporting plate 182 is fixed on a sliding block of the second Y-direction linear module 181, the twelve-inch bearing mechanism 191 is arranged on the second supporting plate 182, the camera 160 is arranged on the up-down moving mechanism 150, and the eight-bearing mechanism 190 is arranged on the first vertical moving mechanism 170;

the eight-inch bearing mechanism 190 comprises a carrier 1901 and a boss 1904, the carrier 1901 is fixed on a first supporting plate 173, the boss 1904 is arranged on the carrier 1901, the twelve-inch bearing mechanism 191 is arranged on the second longitudinal moving mechanism 180, the first locking mechanism 192 is arranged on the first longitudinal moving mechanism 170, the first locking mechanism 192 comprises a first cylinder 1921, a Z-shaped block 1922 and a first pressure head 1923, the first cylinder 1921 is fixed on the upper surface of the second bracket 171, the upper end of a piston rod of the first cylinder 1921 is fixed on the lower surface of the Z-shaped block 1922, the first pressure head 1923 is fixed on the Z-shaped block 1922, and the first pressure head 1923 slides through the second bracket 171;

the second locking mechanism 193 is arranged on the electric control cabinet 110, the second locking mechanism 193 realizes locking of twelve inch wafers, the second locking mechanism 193 comprises a second air cylinder 1931, a third support 1932, a second pressure head 1933 and a guide rod 1934, the second air cylinder 1931 is fixed on the upper surface of the electric control cabinet 110, the end part of a piston rod of the second air cylinder 1931 is fixed on the lower surface of the third support 1932, the guide rod 1934 and the second pressure head 1933 are both fixed on the lower surface of the third support 1932, the guide rod 1934 is inserted on the electric control cabinet 110 in a sliding mode, the first locking mechanism 192 realizes locking of eight inch wafers, and a visual light source is arranged on the electric control cabinet 110.

Specifically, the working principle of the multi-size automatic positioning detection device is as follows: when in use, after the wafer processing process is completed, a code scanning gun on the electronic control cabinet 110 is picked up, the code scanning gun scans the two-dimensional code on the bearing ring 1903, the electronic control cabinet 110 rapidly identifies whether the wafer on the bearing ring 1903 is eight inches or twelve inches, when the wafer is eight inches, the electronic control cabinet 110 controls the first Y-direction linear module 172 to work, the first Y-direction linear module 172 drives the first supporting plate 173 to probe out, the eight inches of wafer is placed on the carrier 1901, the boss 1904 corresponds to the blue film ring part on the bearing ring 1903, then the first Y-direction linear module 172 works to control the sliding block on the boss to return to the initial position, the first cylinder 1921 works to press the first pressing head 1923 on the bearing ring 1903 to support the blue film, the DIE is ensured to be flat, when the wafer is twelve inches, the electronic control cabinet 110 controls the second Y-direction linear module 181 to work, the second Y-direction linear module 181 drives the second supporting plate 182 to probe out, the above steps are implemented to place twelve inch wafers, then the second Y-direction linear module 181 works to control the sliding block on the second Y-direction linear module to return to the initial position, the second cylinder 1931 works to enable the second pressing head 1933 to press on the twelve inch bearing mechanism 191, the vision light source works to polish, the camera 160 photographs the wafers, when the pictures are out of focus, the Z-direction linear module 151 works to drive the camera 160 to move up and down, the first Y-direction linear module 172 or the second Y-direction linear module 181 works to drive the wafers to move longitudinally, photographing compensation is implemented under the above steps, photographing is implemented to determine the positions and the quantity of the residual DIE, the control terminal performs image recognition again after visual photographing, then compares the wafer drawings, marks the used bad DIE, the eight inch wafers and twelve wafers can be detected by one machine of the multi-size automatic positioning detection device according to the marks, the detection cost of the wafer is reduced, and better use experience is brought to a user.

It should be noted that, specific model specifications of the electronic control cabinet 110, the visual light source, the Z-direction linear module 151, the camera 160, the first Y-direction linear module 172, the second Y-direction linear module 181, the first air cylinder 1921 and the second air cylinder 1931 need to be determined by selecting a model according to the actual specifications of the device, and the specific model selection calculation method adopts the prior art in the art, so that detailed descriptions thereof are omitted.

The power supply and the principle of the electric control cabinet 110, the vision light source, the Z-direction linear module 151, the camera 160, the first Y-direction linear module 172, the second Y-direction linear module 181, the first cylinder 1921 and the second cylinder 1931 will be apparent to those skilled in the art, and will not be described in detail herein.

The foregoing is merely exemplary embodiments of the present application and is not intended to limit the scope of the present application, and various modifications and variations may be suggested to one skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Claims

1. The multi-size automatic positioning detection device is characterized by comprising an electric control cabinet (110), an up-and-down movement mechanism (150), a camera (160), a first longitudinal movement mechanism (170), a second longitudinal movement mechanism (180), an eight-inch bearing mechanism (190), a twelve-inch bearing mechanism (191), a first locking mechanism (192) and a second locking mechanism (193), wherein the up-and-down movement mechanism (150), the first longitudinal movement mechanism (170) and the second longitudinal movement mechanism (180) are all arranged on the electric control cabinet (110);

the first vertical moving mechanism (170) is used for realizing the loading and unloading of eight-inch wafers, the second vertical moving mechanism (180) is used for realizing the loading and unloading of twelve-inch wafers, the camera (160) is installed on the vertical moving mechanism (150), the eight-inch bearing mechanism (190) is arranged on the first vertical moving mechanism (170), the twelve-inch bearing mechanism (191) is arranged on the second vertical moving mechanism (180), the first locking mechanism (192) is arranged on the first vertical moving mechanism (170), the second locking mechanism (193) is arranged on the electric control cabinet (110), the second locking mechanism (193) is used for realizing the locking of twelve-inch wafers, the first locking mechanism (192) is used for realizing the locking of eight-inch wafers, and the electric control cabinet (110) is provided with a visual light source.

2. The multi-size automatic positioning detection device according to claim 1, wherein the up-down moving mechanism (150) comprises a Z-direction linear module (151) and a first bracket (152), the Z-direction linear module (151) is mounted on the upper surface of the electric control cabinet (110), the first bracket (152) is fixed on a slider of the Z-direction linear module (151), and the camera (160) is fixed on the first bracket (152).

3. The multi-size automatic positioning detection device according to claim 1, wherein the first longitudinal moving mechanism (170) comprises a second bracket (171), a first Y-direction linear module (172) and a first support plate (173), the second bracket (171) is fixed on the upper surface of the electric control cabinet (110), the first Y-direction linear module (172) is fixed on the second bracket (171), and the first support plate (173) is fixed on a slider of the first Y-direction linear module (172).

4. The multi-size automatic positioning detection device according to claim 1, wherein the second longitudinal moving mechanism (180) comprises a second Y-direction linear module (181) and a second support plate (182), the second Y-direction linear module (181) is fixed on the upper surface of the electric control cabinet (110), the second support plate (182) is fixed on a sliding block of the second Y-direction linear module (181), and the twelve-inch bearing mechanism (191) is arranged on the second support plate (182).

5. A multi-size automatic positioning detection device according to claim 3, wherein the eight inch carrier (190) comprises a carrier (1901) and a boss (1904), the carrier (1901) is fixed on the first support plate (173), and the boss (1904) is arranged on the carrier (1901).

6. A multi-size automatic positioning detection device according to claim 3, wherein the first locking mechanism (192) comprises a first cylinder (1921), a Z-shaped block (1922) and a first pressing head (1923), the first cylinder (1921) is fixed on the upper surface of the second bracket (171), the upper end of a piston rod of the first cylinder (1921) is fixed on the lower surface of the Z-shaped block (1922), the first pressing head (1923) is fixed on the Z-shaped block (1922), and the first pressing head (1923) slides through the second bracket (171).

7. The multi-size automatic positioning detection device according to claim 1, wherein the second locking mechanism (193) comprises a second cylinder (1931), a third bracket (1932), a second ram (1933) and a guide rod (1934), the second cylinder (1931) is fixed on the upper surface of the electric control cabinet (110), the piston rod end of the second cylinder (1931) is fixed on the lower surface of the third bracket (1932), the guide rod (1934) and the second ram (1933) are both fixed on the lower surface of the third bracket (1932), and the guide rod (1934) is slidably inserted on the electric control cabinet (110).