CN220318028U - Plating bath temperature control system - Google Patents
Plating bath temperature control system Download PDFInfo
- Publication number
- CN220318028U CN220318028U CN202322204600.7U CN202322204600U CN220318028U CN 220318028 U CN220318028 U CN 220318028U CN 202322204600 U CN202322204600 U CN 202322204600U CN 220318028 U CN220318028 U CN 220318028U
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- plating bath
- plating
- electroplating
- heat exchanger
- pressure
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- 238000007747 plating Methods 0.000 title claims abstract description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000009713 electroplating Methods 0.000 claims description 47
- 230000003028 elevating effect Effects 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000007921 spray Substances 0.000 abstract description 6
- 239000000284 extract Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a plating bath temperature control system, which belongs to the technical field of plating equipment and comprises a plating box device, a lifting device and a water circulation device, wherein the plating box device comprises a plating bath and a snake-shaped heat exchanger, a hanging rod frame is symmetrically arranged at the upper end of the plating bath, the lifting device comprises a driving device and a moving tube, a plurality of groups of through holes are formed in the moving tube, a temperature sensor is arranged on the moving tube, the water circulation device comprises a water pump and pressure pipelines, a plurality of groups of pressure spray heads are arranged on each pressure pipeline, the moving tube is matched with the temperature sensor through the driving device and the pressure pipeline, moves to a water layer position lower than a set constant temperature value in plating solution, extracts the upper layer plating solution at the position of the moving tube through the water pump, outputs from the lower layer of the plating solution through the plurality of groups of pressure spray heads again, increases the mixed heated area of the plating solution, increases the disturbance of the upper layer and the lower layer of the plating solution, and improves the efficiency of the plating solution reaching a constant temperature set value.
Description
Technical Field
The utility model relates to the technical field of electroplating equipment, in particular to a plating bath temperature control system.
Background
Electroplating is a process of depositing a metal or alloy film on the surface of an object under the action of current, so that an electroplating solution, an electroplating bath, current, a hanger and the like are core elements of electroplating behaviors, the electroplating has become a relatively mature traditional industry through decades of development, and is an essential industry for economic development, the electroplating is a process of plating a thin layer of other metal or alloy on the surface of certain metal by utilizing the electrolysis principle, and a process of adhering a metal film on the surface made of the metal or other material by utilizing the electrolysis, thereby playing roles of preventing oxidation of the metal, improving wear resistance, conductivity, reflectivity, improving attractiveness and the like, and at present, the electroplating process is finished through the electroplating solution in the electroplating bath, and the electroplating solution is heated in the electroplating process in order to improve the electrolytic reaction rate and the current efficiency.
The prior art adopts a heating pipe to directly heat the electroplating liquid, and adopts local direct heating, so that the temperature of the electroplating liquid close to a heating source is high, the temperature far away from the heating source is low, the electroplating liquid is heated unevenly, and the upper port of the electroplating bath is in contact with the outside, so that the temperature of the upper layer of the electroplating liquid is faster than that of the lower layer of the electroplating liquid, the upper layer and the lower layer of the electroplating liquid have temperature difference, and the efficiency of the electroplating liquid when the electroplating liquid is heated to a constant temperature set value is lower.
Disclosure of Invention
The embodiment of the utility model provides a plating bath temperature control system, which aims to solve the problems in the background technology.
The embodiment of the utility model adopts the following technical scheme: including electroplating box device, elevating gear and water circulating device, electroplating box device includes plating bath and snakelike heat exchanger, elevating gear with water circulating device's work end is all installed in the plating bath, the upper end symmetry of plating bath is equipped with the peg frame, snakelike heat exchanger is fixed in on the inner wall of plating bath both sides, elevating gear includes drive arrangement and removal pipe, be equipped with multiunit through-hole on the removal pipe, install temperature-sensing ware on the removal pipe, water circulating device includes water pump and pressure pipeline, the outside at the plating bath is installed to the water pump, pressure pipeline symmetry is installed on the lateral wall of plating bath, and is located the lower extreme of plating bath, every all install multiunit pressure nozzle on the pressure pipeline, pressure nozzle's work end extends to the inside of plating bath, the one end of water pump is through hose connection removal pipe, the other end of water pump is through every pressure pipeline, temperature-sensing ware electric connection drive arrangement and water pump.
Further, drive arrangement includes servo motor, fixed plate, lead screw and slide bar, servo motor installs on the fixed plate, the upper end at the plating bath is installed to the fixed plate, servo motor's output is connected to the one end of lead screw, the bottom at the plating bath is installed through the bearing to the other end of lead screw, the cover is equipped with movable block one on the lead screw, the cover is equipped with movable block two on the slide bar, install the movable tube between movable block one and the movable block two.
Further, the contactor is installed at the both ends of snakelike heat exchanger, the inside of snakelike heat exchanger is twined and is had the electric heater strip, the contactor passes through electric connection electric heater strip.
Further, the outside of plating bath is equipped with the strengthening rib, the inner wall material of plating bath is the polyethylene.
Further, the pressure nozzle is located at the lower end of the serpentine heat exchanger, and the output end of the pressure nozzle faces upwards and is inclined relative to the inner wall of the electroplating tank.
The above at least one technical scheme adopted by the embodiment of the utility model can achieve the following beneficial effects:
according to the utility model, the movable pipe is matched with the temperature sensor through the driving device and moves to a water layer lower than a set constant temperature value in the electroplating liquid, the upper layer electroplating liquid at the position of the movable pipe is extracted through the water pump, and the upper layer electroplating liquid is output from the lower layer of the electroplating liquid through the plurality of groups of pressure spray heads, so that the heated area of the electroplating liquid is increased, the disturbance between the upper layer and the lower layer of the electroplating liquid is increased, and the efficiency of the electroplating liquid reaching the constant temperature set value is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the electroplating tank device of the present utility model;
FIG. 3 is a schematic view of a serpentine heat exchanger of the present utility model;
FIG. 4 is a schematic diagram of a driving apparatus according to the present utility model;
fig. 5 is a schematic diagram of the pressure pipeline structure of the present utility model.
Reference numerals
The electroplating tank body device 1, the electroplating tank 2, the reinforcing ribs 3, the hanging rod frame 4, the snakelike heat exchanger 5, the contactor 6, the lifting device 7, the driving device 8, the servo motor 9, the fixed plate 10, the screw rod 11, the first moving block 12, the sliding rod 13, the second moving block 14, the moving pipe 15, the through hole 16, the temperature sensor 17, the water circulation device 18, the water pump 19, the pressure pipeline 20 and the pressure nozzle 21.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments of the present utility model and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The following describes in detail the technical solutions provided by the embodiments of the present utility model with reference to the accompanying drawings.
Referring to fig. 1-5, an embodiment of the present utility model provides a plating tank temperature control system, including a plating tank device 1, a lifting device 7 and a water circulation device 18, where the plating tank device 1 includes a plating tank 2 and a serpentine heat exchanger 5, the lifting device 7 and the working ends of the water circulation device 18 are both installed in the plating tank 2, the upper end of the plating tank 2 is symmetrically provided with a hanging rod rack 4, the serpentine heat exchanger 5 is fixed on inner walls on two sides of the plating tank 2, the lifting device 7 includes a driving device 8 and a moving pipe 15, the moving pipe 15 is provided with a plurality of groups of through holes 16, the moving pipe 15 is installed with a temperature sensor 17, the water circulation device 18 includes a water pump 19 and a pressure pipe 20, the water pump 19 is installed on the outer side of the plating tank 2, the pressure pipe 20 is symmetrically installed on the outer side wall of the plating tank 2, and is located at the lower end of the plating tank 2, each pressure pipe 20 is installed with a plurality of groups of pressure spray heads 21, the working ends of the pressure spray heads 21 extend into the plating tank 2, one end of the water pump 19 is connected with the water pump 15 through a hose, and the other end of the water pump 19 is electrically connected with the water pump 19 through the water pump 17 and the water pump 17 through the pressure sensor 17;
the device is placed in the electroplating bath 2 through the hanging rod frame 4, the electroplating solution in the electroplating bath 2 is used for electroplating the device, at the moment, the serpentine heat exchanger 5 is used for heating the electroplating solution, meanwhile, the driving device 8 drives the moving tube 15 to reciprocate up and down in the electroplating bath 2, the temperature sensor 17 on the moving tube 15 is used for detecting the temperature of the upper layer and the lower layer in the electroplating solution, at the moment, if the detected temperature is lower than a set constant temperature value, the temperature sensor 17 is controlled by an electric signal to stop the driving device 8, the water pump 19 is started, the moving tube 15 stays in the detection layer, the water pump 19 is used for pumping the electroplating solution on the upper layer at the position through the through hole 16 on the moving tube 15, the plating solution is conveyed into each pressure pipeline 20 through the pipeline, when the water pump 19 enables the pressure pipelines 20 to reach a specified pressure value, the plating solution in the pressure pipelines 20 is simultaneously output into the plating solution at the lower layer of the plating tank 2 through a plurality of groups of pressure spray heads 21, the heat exchange area of the plating solution at the upper layer and the lower layer is increased, meanwhile, the water flow disturbance between the upper layer and the lower layer of the plating solution is increased, the heat exchange efficiency in the plating solution is improved, the purpose of rapid constant temperature is achieved, when the temperature sensor 17 detects that the temperature is higher than a set constant temperature value, the plating solution is conveyed to a control box through an electric signal, and the control box controls the serpentine heat exchanger 5 to stop heating the plating solution.
Preferably, the driving device 8 includes a servo motor 9, a fixed plate 10, a screw rod 11 and a sliding rod 13, the servo motor 9 is installed on the fixed plate 10, the fixed plate 10 is installed at the upper end of the plating tank 2, one end of the screw rod 11 is connected with the output end of the servo motor 9, the other end of the screw rod 11 is installed at the bottom end of the plating tank 2 through a bearing, a first moving block 12 is sleeved on the screw rod 11, a second moving block 14 is sleeved on the sliding rod 13, a moving pipe 15 is installed between the first moving block 12 and the second moving block 14, the output end of the servo motor 9 drives the screw rod 11 to rotate, and because the moving pipe 15 is installed between the first moving block 12 and the second moving block 14, the second moving block 14 is sleeved on the sliding rod 13 and is connected with the bottom end of the plating tank 2 in a sliding mode, the screw rod 11 drives the first moving block 12 to rotate in a limited mode, the first moving block 12 reciprocates on the screw rod 11, and the moving pipe 15 moves up and down in the plating tank 2 according to forward rotation or backward rotation of the servo motor 9, and controllability of the moving pipe 15 in plating solution is improved.
Preferably, the contactor 6 is installed at the both ends of snakelike heat exchanger 5, the inside winding of snakelike heat exchanger 5 has the electric heater strip, contactor 6 is through electric connection electric heater strip, and snakelike heat exchanger 5 is an integrated device, relates to two sets of accessory systems: the electric heating wire is wound inside the serpentine heat exchanger 5, and the contactor 6 is connected with an external power supply to heat the serpentine heat exchanger 5 and conduct cooling water to cool the serpentine heat exchanger 5.
Preferably, the outside of plating bath 2 is equipped with strengthening rib 3, the inner wall material of plating bath 2 is polyethylene, and strengthening rib 3 has strengthened the bearing load power of plating bath 2, improves plating bath 2's bulk strength, and the polyethylene material has anticorrosive, high temperature resistant characteristic, prevents the damage of plating bath 2 to the plating bath.
Preferably, the pressure nozzle 21 is located at the lower end of the serpentine heat exchanger 5, the direction of the output end of the pressure nozzle 21 faces upwards, and is inclined relative to the inner wall of the plating bath 2, and the pressure nozzle 21 is located at the lower end of the serpentine heat exchanger 5, because the temperature of the plating solution close to the serpentine heat exchanger 5 is higher, the temperature of the plating solution output through the pressure nozzle 21 is relatively lower, the efficiency of heat exchange of the plating solution is improved, the pressure nozzle 21 is obliquely installed relative to the inner wall of the plating bath 2, so that the plating solution is in an arc-shaped movement track when being output from the pressure nozzle 21, the plating solution disturbance is increased, and meanwhile, the plating solution close to the periphery of the serpentine heat exchanger 5 can be pushed to the middle position of the plating bath 2, so that rapid heat exchange is formed, and the constant temperature efficiency of the plating solution is improved.
The foregoing is merely exemplary of the present utility model and is not intended to limit the present utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are to be included in the scope of the claims of the present utility model.
Claims (5)
1. A plating bath temperature control system is characterized in that: including electroplating box device (1), elevating gear (7) and water circulating device (18), electroplating box device (1) includes plating bath (2) and snakelike heat exchanger (5), elevating gear (7) with the work end of water circulating device (18) is all installed in plating bath (2), the upper end symmetry of plating bath (2) is equipped with peg frame (4), snakelike heat exchanger (5) are fixed in on the inner wall of plating bath (2) both sides, elevating gear (7) include drive arrangement (8) and movable tube (15), be equipped with multiunit through-hole (16) on movable tube (15), install temperature-sensing ware (17) on movable tube (15), water circulating device (18) include water pump (19) and pressure pipeline (20), water pump (19) are installed in the outside of plating bath (2), pressure pipeline (20) symmetry are installed on the lateral wall of plating bath (2), and are located the lower extreme of plating bath (2), every pressure pipeline (20) are last to be equipped with multiunit through-hole (21), pressure pipe (21) are installed on movable tube (15) and are connected to one end hose (21), the other end of the water pump (19) is connected with each pressure pipeline (20) through a pipeline, and the temperature sensor (17) is electrically connected with the driving device (8) and the water pump (19).
2. The plating bath temperature control system according to claim 1, wherein: drive arrangement (8) are including servo motor (9), fixed plate (10), lead screw (11) and slide bar (13), servo motor (9) are installed on fixed plate (10), the upper end at plating bath (2) is installed to fixed plate (10), the output of servo motor (9) is connected to the one end of lead screw (11), the bottom at plating bath (2) is installed through the bearing to the other end of lead screw (11), the cover is equipped with movable block one (12) on lead screw (11), the cover is equipped with movable block two (14) on slide bar (13), install movable tube (15) between movable block one (12) and the movable block two (14).
3. The plating bath temperature control system according to claim 1, wherein: the electric heating device is characterized in that contactors (6) are arranged at two ends of the serpentine heat exchanger (5), electric heating wires are wound inside the serpentine heat exchanger (5), and the contactors (6) are electrically connected with the electric heating wires.
4. The plating bath temperature control system according to claim 1, wherein: the outer side of the electroplating bath (2) is provided with a reinforcing rib (3), and the inner wall of the electroplating bath (2) is made of polyethylene.
5. The plating bath temperature control system according to claim 1, wherein: the pressure nozzle (21) is positioned at the lower end of the serpentine heat exchanger (5), the output end of the pressure nozzle (21) faces upwards, and the pressure nozzle is inclined relative to the inner wall of the electroplating bath (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204600.7U CN220318028U (en) | 2023-08-16 | 2023-08-16 | Plating bath temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322204600.7U CN220318028U (en) | 2023-08-16 | 2023-08-16 | Plating bath temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220318028U true CN220318028U (en) | 2024-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322204600.7U Active CN220318028U (en) | 2023-08-16 | 2023-08-16 | Plating bath temperature control system |
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| Country | Link |
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| CN (1) | CN220318028U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117822083A (en) * | 2024-03-06 | 2024-04-05 | 苏州尊恒半导体科技有限公司 | Wafer plating solution circulation temperature control system |
-
2023
- 2023-08-16 CN CN202322204600.7U patent/CN220318028U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117822083A (en) * | 2024-03-06 | 2024-04-05 | 苏州尊恒半导体科技有限公司 | Wafer plating solution circulation temperature control system |
| CN117822083B (en) * | 2024-03-06 | 2024-05-07 | 苏州尊恒半导体科技有限公司 | Wafer plating solution circulation temperature control system |
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