CN220280816U - High-resistance embossing structure cup cover film - Google Patents
High-resistance embossing structure cup cover film Download PDFInfo
- Publication number
- CN220280816U CN220280816U CN202320788717.1U CN202320788717U CN220280816U CN 220280816 U CN220280816 U CN 220280816U CN 202320788717 U CN202320788717 U CN 202320788717U CN 220280816 U CN220280816 U CN 220280816U
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- CN
- China
- Prior art keywords
- cover film
- layer
- inner layer
- embossing structure
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000013039 cover film Substances 0.000 title claims abstract description 29
- 238000004049 embossing Methods 0.000 title claims abstract description 26
- 238000007639 printing Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 8
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 6
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 15
- 239000010408 film Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 6
- 229920006280 packaging film Polymers 0.000 abstract description 5
- 239000012785 packaging film Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000011084 recovery Methods 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 37
- 239000000047 product Substances 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 235000013361 beverage Nutrition 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000012611 container material Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 241001122767 Theaceae Species 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000012793 heat-sealing layer Substances 0.000 description 1
- 239000011022 opal Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 235000013618 yogurt Nutrition 0.000 description 1
Landscapes
- Packages (AREA)
Abstract
The utility model discloses a cup cover film with a high-resistance embossing structure, and relates to the technical field of packaging film materials. Comprising the following steps: and the inner side of the outer layer is used for printing, a glue layer is arranged between the inner layer and the outer layer, and an embossing structure is arranged on the other side of the inner layer. The cover film can realize similar melting temperature for material recovery, and is more beneficial to the environment protection; meanwhile, the inner layer is further provided with an embossing structure, so that the ornamental value of the cover film can be further improved, the better packaging effect is achieved, the glue can be a two-layer film adhesive, the isolation and protection of the ink and the inner layer are realized, and the ink halation phenomenon in the heat sealing process is avoided.
Description
Technical Field
The utility model relates to the technical field of packaging film materials, in particular to a cup cover film with a high-resistance embossing structure.
Background
In the prior market, products such as high-grade yoghurt, cup-packed coffee, high-grade cup-packed beverage or supplement, small-package tea, particle-packed beauty skin care products and the like are all provided with single-piece cover films with embossments when the cup-packed beverage is used. The single cover films are stacked together in a plurality, the mechanical arm of the packaging machine absorbs the cup quickly and then is heat-sealed by the heat-sealing die, the lower cover film can not be taken up when the upper cover film is absorbed in the process, otherwise, the smoothness of the quick packaging machine can be affected, the production accident is caused, the efficiency is affected, and the single cover film needs embossing, so that the upper cover film and the lower cover film are easily separated. The embossing film is three-dimensional, more high-grade and attractive, and is used for products with high added value.
The product structure is usually ink (containing outer gloss oil)/AL (40-60 um)/PE 50-70;
wherein: the printing ink is printed on the aluminum foil, and a layer of heat-resistant varnish is printed on the uppermost side of the aluminum foil; and PE or EVA of the inner layer is heat-sealed with the cup, most products need the function of easy uncovering. The process comprises the following steps: AL printing is firstly carried out, then the PE is dried and coated or dried and coated with PE, and then embossing and slicing are carried out on an embossing machine, so that the embossing process is complex, and the yield is low.
In the prior art, since AL is in the outer layer and is opaque, there are two risks that the ink must be printed on the surface layer of the film, one is that the ink may wear during use, and in addition, the ink is easily dropped at high temperature during heat sealing, and meanwhile, the packaging film composed of multiple materials is not beneficial to recycling.
Disclosure of Invention
The utility model relates to the technical field of packaging film materials, in particular to a high-resistance embossing structure cup cover film which is used for solving the problems that the existing packaging film material is not beneficial to material recovery and ink protection is not complete.
The utility model provides the following solutions:
a high resistance embossing structure cup cover film comprising:
an outer layer, the inner side of which is used for printing,
and a glue layer is arranged between the inner layer and the outer layer, and an embossing structure is arranged on the other side of the inner layer.
Preferably, the outer layer is high-resistance BOPP.
Preferably, the inner layer is a CPP.
Preferably, the thickness of the inner layer is 50-100um, and/or the inner layer is formed into an embossed structure by a casting process.
Preferably, the inner layer is white or transparent.
Preferably, the cover film is used to form a container closure, and the container material comprises one or more of PP, PS, or metal.
The technical scheme of the utility model has the following beneficial effects:
(1) The cover film structure can realize similar melting temperature for material recovery, and is more beneficial to the requirement of environmental protection; meanwhile, the inner layer is further provided with an embossing structure treated by a tape casting process, so that the packaging machine can be used for grabbing the cover film singly, the ornamental value of the cover film can be further improved, and a better packaging effect is achieved; the high-grade feel of the cover film is improved under the condition of not increasing the cost;
(2) The utility model is not only a single material environment-friendly recyclable structure, but also has simple production process; meanwhile, the structure of the inner printing ink is arranged, the ink material can be further packaged in the film, the problem of outside abrasion is avoided, and when the glue is arranged to heat seal between the outer layer and the inner layer, the inner ink is further protected, and high-temperature ink dropping is avoided.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
In the figure, an outer layer 1, an inner layer 2, ink 3 and a glue layer 4.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the mechanical connection can be welding, riveting, threaded connection or flange connection, etc.; can be directly connected or indirectly connected through an intermediate medium, and can be the communication between the two elements; the specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Embodiment one:
the utility model will be described in detail with reference to figure 1,
a high resistance embossing structure cup cover film comprising:
an outer layer 1, wherein the inner side of the outer layer 1 is used for printing, and the inner side of the printed outer layer is provided with ink 3;
an inner layer 2, a glue layer 4 is arranged between the inner layer 2 and the outer layer 1, and an embossing structure is arranged on the other side of the inner layer 2.
Preferably, the outer layer 1 is high-resistance BOPP.
Preferably, the inner layer 2 is CPP.
Preferably, the thickness of the inner layer 2 is 50-100um, and/or the inner layer 2 is formed into an embossed structure by a casting process.
Preferably, the inner layer 2 is white or transparent.
Preferably, the cover film is used to form a container closure, and the container material comprises one or more of PP, PS, or metal.
In particular, the method comprises the steps of,
the outer layer is the surface layer BOPP: the heat-resistant, printing and blocking functions are achieved;
the inner layer is a milky white embossed CPP: the heat-sealing layer has the functions of light blocking (combining with high-resistance BOPP to replace AL) and heat sealing, and can design a dead-sealing and easy-uncovering formula according to the requirement of a product.
For example: the novel structure can replace the INK/AL50/PE70 structure by the HBOPP19/INK/CPP100, is made of all PP materials, is matched with a PP cup in particular, and is made of single materials.
The production process comprises the following steps: printing in high-resistance BOPP, compounding with opal embossing CPP, and slicing. No separate embossing is needed, and the working procedures are reduced.
The technical scheme of the utility model has the following beneficial effects:
(1) The cover film structure can realize similar melting temperature for material recovery, and is more beneficial to the requirement of environmental protection; meanwhile, the inner layer 2 is further provided with an embossing structure realized in one step through a casting process, so that the embossing structure is used for replacing the existing embossing process of the aluminum film, not only can the single-piece grabbing of the cover film be realized by a packaging machine, but also the ornamental value of the cover film can be further improved, and the packaging effect is better; the high-grade feel of the cover film is improved under the condition of not increasing the cost;
(2) The utility model is not only a single material environment-friendly recyclable structure, but also has simple production process; meanwhile, the structure of the inner printing ink 3 can further encapsulate the material of the inner printing ink 3 in the film to avoid the problem of abrasion on the outer side, and the arrangement of the glue can further protect the inner printing ink 3 when the outer layer 1 and the inner layer 2 are subjected to heat sealing, so that the high-temperature ink drop is avoided.
While the present utility model has been described in considerable detail and with particularity with respect to several described embodiments, it is not intended to be limited to any such detail or embodiments or any particular embodiment, but is to be construed as providing broad interpretation of such claims by reference to the appended claims in view of the prior art so as to effectively encompass the intended scope of the utility model. Furthermore, the foregoing description of the utility model has been presented in its embodiments contemplated by the inventors for the purpose of providing a useful description, and for the purposes of providing a non-essential modification of the utility model that may not be presently contemplated, may represent an equivalent modification of the utility model.
The present utility model is not limited to the above embodiments, but is merely preferred embodiments of the present utility model, and the present utility model should be construed as being limited to the above embodiments as long as the technical effects of the present utility model are achieved by the same means. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the utility model.
Claims (5)
1. A high resistance embossing structure cup cover film, comprising:
an outer layer, the inner side of which is used for printing,
and a glue layer is arranged between the inner layer and the outer layer, and an embossing structure is arranged on the other side of the inner layer.
2. The high resistance embossed cup cover film of claim 1, wherein said outer layer is high resistance BOPP.
3. The high resistance embossed cup cover film according to claim 1, wherein the inner layer is CPP.
4. The high resistance embossing structure cup cover film of claim 1, wherein the thickness of the inner layer is 50-100um.
5. The high-resistance embossing structure cup cover film of claim 1, wherein the inner layer is white or transparent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320788717.1U CN220280816U (en) | 2023-04-10 | 2023-04-10 | High-resistance embossing structure cup cover film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320788717.1U CN220280816U (en) | 2023-04-10 | 2023-04-10 | High-resistance embossing structure cup cover film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220280816U true CN220280816U (en) | 2024-01-02 |
Family
ID=89328257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320788717.1U Active CN220280816U (en) | 2023-04-10 | 2023-04-10 | High-resistance embossing structure cup cover film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220280816U (en) |
-
2023
- 2023-04-10 CN CN202320788717.1U patent/CN220280816U/en active Active
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