CN220273928U - PCB structure for improving surface layer microstrip line crosstalk - Google Patents
PCB structure for improving surface layer microstrip line crosstalk Download PDFInfo
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- CN220273928U CN220273928U CN202321456985.XU CN202321456985U CN220273928U CN 220273928 U CN220273928 U CN 220273928U CN 202321456985 U CN202321456985 U CN 202321456985U CN 220273928 U CN220273928 U CN 220273928U
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- 239000002344 surface layer Substances 0.000 title claims abstract description 48
- 239000010410 layer Substances 0.000 claims abstract description 26
- 238000005192 partition Methods 0.000 claims abstract description 13
- 230000005672 electromagnetic field Effects 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 238000010992 reflux Methods 0.000 abstract description 8
- 230000008054 signal transmission Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000000638 solvent extraction Methods 0.000 description 1
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Abstract
The utility model discloses a PCB structure for improving crosstalk of a surface layer microstrip line, which comprises a surface layer and a reference layer arranged below the surface layer, wherein the surface layer is provided with the surface layer microstrip line, the surface layer microstrip line comprises a first microstrip line and a second microstrip line, the first microstrip line and the second microstrip line are mutually parallel, a reflux area is formed in a space between projections of the reference layer by the first microstrip line and the second microstrip line, and a hollowed partition belt is arranged in the reflux area, so that the reflux area is partitioned along the direction of the surface layer microstrip line. The utility model provides a PCB structure for improving surface layer microstrip line crosstalk, which enables a microstrip line to have a cut-out hollowed area in a projection area of a reference layer, enables a backflow ground of two parallel wires forming the microstrip line to have a cut-out space, and avoids the electromagnetic field generated by the two parallel wires in the backflow process from having complete intersection, thereby improving the signal crosstalk phenomenon of microstrip line transmission and improving the signal transmission quality.
Description
Technical Field
The utility model relates to the technical field, in particular to a PCB structure for improving surface layer microstrip line crosstalk.
Background
The microstrip line is a transmission line, which is composed of a conductor, a medium and ground, and is arranged on a printed circuit board for transmitting microwave signals. The microstrip line can be regarded as an evolution from a double-wire, usually a parallel double-wire extension, a metal conductive flat plate is placed on the center plane of the parallel double-wire, the metal conductive flat plate is perpendicular to all power lines, the original electromagnetic field structure is maintained, one of the wires is removed, the electromagnetic field structure of the other wire is unchanged, and the left wire and the metal conductive flat plate form the microstrip line.
Conventionally, microstrip lines are considered as flat running lines, i.e. surface running lines, provided on the surface of the PCB. Because the medium of the upper contact of the surface layer wiring is air, the medium of the lower contact is a plate, the dielectric constants of air and the plate are different, under the normal condition, the relative dielectric constant of air is 1, the relative dielectric constant of the plate is 4, under the condition, the transmission speeds of differential mode and common mode signals of the microstrip lines are different, if the interval between two parallel wirings forming the microstrip line is smaller, the signal crosstalk phenomenon of microstrip line transmission is serious, and the signal transmission quality is affected.
Disclosure of Invention
In order to solve the problem that the signal transmission quality is affected by smaller space between two parallel wires of the microstrip line, the utility model provides a PCB structure for improving the crosstalk of the surface microstrip line.
The technical scheme of the utility model is as follows:
the PCB structure comprises a surface layer and a reference layer arranged below the surface layer, wherein the surface layer is provided with surface layer microstrip lines, the surface layer microstrip lines comprise first microstrip lines and second microstrip lines, the first microstrip lines and the second microstrip lines are parallel to each other, a backflow area is formed in a space between projections of the reference layer by the first microstrip lines and the second microstrip lines, and a hollowed partition belt is arranged in the backflow area, so that the backflow area is partitioned along the direction of the surface layer microstrip lines.
The surface layer microstrip line needs to reflow through the reference layer, and in the reflow process of the first microstrip line and the second microstrip line, the first microstrip line and the second microstrip line respectively generate respective reflow electromagnetic fields, and the two reflow electromagnetic fields are not limited in the reference layer, so that the two reflow electromagnetic fields can realize complete intersection, thereby causing serious crosstalk phenomenon of transmission signals of the surface layer microstrip line. Therefore, in the utility model, in the reference layer for realizing reflow of the surface layer microstrip line, the reflow area shared by the first microstrip line and the second microstrip line, namely the area between the projections of the first microstrip line and the second microstrip line on the reference layer, is hollowed to form a banded hollowed partition band along the routing path of the first surface layer microstrip line, thereby partitioning the intersection between the respective reflow electromagnetic fields of the first microstrip line and the second microstrip line, and thus, the reflow intersection of the first microstrip line and the second microstrip line is relatively reduced, and the crosstalk phenomenon of transmission signals can be effectively improved.
In the PCB structure for improving the crosstalk of the surface layer microstrip line, the distance between the first microstrip line and the second microstrip line is less than or equal to 30 mils.
In the above-mentioned PCB structure for improving surface layer microstrip line crosstalk, the distance between the projection line of the reference layer and the hollowed-out partition band of the first microstrip line or the second microstrip line is at least three times the distance between the surface layer and the reference layer.
In order to ensure normal reference processing of the surface layer microstrip line, according to the radiation theory of an electromagnetic field, an area with the width three times of the distance between the surface layer and the reference layer is reserved in the reflow area, 97% of energy can be wrapped, and the signal quality of the surface layer microstrip line transmission is not affected basically.
According to the PCB structure for improving the crosstalk of the surface layer microstrip line, the reference layer below the surface layer arranged by the microstrip line and used as the microstrip line reference ground plane is hollowed, so that the microstrip line has a partitioned hollowed area in the projection area of the reference layer, a partition space exists in the reflux ground of two parallel wires forming the microstrip line, the electromagnetic field generated in the reflux process of the two parallel wires is prevented from having a complete intersection, the signal crosstalk phenomenon of microstrip line transmission is improved, and the signal transmission quality is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
Wherein, each reference sign in the figure:
1. a first microstrip line; 2. a second microstrip line; 3. a reflow region; 4. hollowing the partition belt; 5, a PCB board; 6. a surface layer; 7. a reference layer.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1, the PCB 5 includes a surface layer 6 and a reference layer 7 disposed below the surface layer 6, wherein the surface layer 6 is provided with surface microstrip lines, and the reference layer 7 is a laminate where the surface microstrip lines reflow, typically a reference plane layer.
The surface layer microstrip line comprises a first microstrip line 1 and a second microstrip line 2, the first microstrip line 1 and the second microstrip line 2 are parallel to each other and are of a parallel double-line structure, and as shown in fig. 1, the first microstrip line 1 and the second microstrip line 2 are of a strip-shaped structure.
In this embodiment, the interval between the first microstrip line 1 and the second microstrip line is 30 mils, and under this interval, the crosstalk phenomenon generated by the signal transmitted by the surface microstrip line is serious, which affects the signal transmission quality.
The first microstrip line 1 and the second microstrip line 2 are formed as first projection line and second projection line in the reference layer 7, and the reflow region 3 is formed between the first projection line and the second projection line. The reflow region 3 is a reflow ground shared by the first microstrip line 1 and the second microstrip line 2, and a reflow electromagnetic field formed by the first microstrip line 1 and the second microstrip line 2 has a complete intersection in the reflow region 3.
A hollowed-out partition strip 4 is arranged in the reflow region 3 so that the reflow region 3 is partitioned along the direction of the surface layer microstrip line. As shown in fig. 1, the hollowed-out partition strips 4 are distributed in a strip shape along the path of the surface layer microstrip line, so that partition spaces exist in the reflow region 3, the first projection lines and the second projection lines are respectively positioned at two sides of the hollowed-out partition strips 4, and the spaces where the first projection lines and the second projection lines are positioned are separated by the hollowed-out partition strips 4. In this way, the first microstrip line 1 and the second microstrip line 2 have a hollowed space in the same reflux ground through the hollowed partition belt 4, and the reflux of the first microstrip line 1 and the second microstrip line 2 in the reference layer 7 is disconnected by the hollowed space, so that the reflux intersection of the first microstrip line 1 and the second microstrip line 2 is reduced, and the crosstalk phenomenon of the surface layer microstrip line transmission signals is improved.
In order to ensure that the referencing process of the surface layer microstrip line is normal, according to the radiation theory of the electromagnetic field, a region with a width three times the distance between the surface layer 6 and the referencing layer 7 remains in the reflow region 3, i.e. the distance between the surface layer 6 and the referencing layer 7 is set to R, and the distance of the first projection line or the second projection line from the reflow region 3 is at least 3R. The strip-shaped region with the width of at least 3R separated in the reflow region 3 can wrap 97% of energy, and has no influence on the signal quality of surface microstrip line transmission.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (3)
1. The PCB structure is characterized by comprising a surface layer and a reference layer arranged below the surface layer, wherein the surface layer is provided with the surface layer microstrip line, the surface layer microstrip line comprises a first microstrip line and a second microstrip line, the first microstrip line and the second microstrip line are parallel to each other, a backflow area is formed in a space between projections of the reference layer, and a hollowed partition belt is arranged in the backflow area, so that the backflow area is partitioned along the direction of the surface layer microstrip line.
2. The PCB structure of claim 1, wherein a pitch between the first microstrip line and the second microstrip line is 30 mils or less.
3. The PCB structure of claim 1, wherein a distance between a projection line of the reference layer and the hollowed-out strip of the first microstrip line or the second microstrip line is at least three times a distance between the surface layer and the reference layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321456985.XU CN220273928U (en) | 2023-06-08 | 2023-06-08 | PCB structure for improving surface layer microstrip line crosstalk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321456985.XU CN220273928U (en) | 2023-06-08 | 2023-06-08 | PCB structure for improving surface layer microstrip line crosstalk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220273928U true CN220273928U (en) | 2023-12-29 |
Family
ID=89311467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321456985.XU Active CN220273928U (en) | 2023-06-08 | 2023-06-08 | PCB structure for improving surface layer microstrip line crosstalk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220273928U (en) |
-
2023
- 2023-06-08 CN CN202321456985.XU patent/CN220273928U/en active Active
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