CN216673383U - Wiring via hole structure for high-frequency and high-speed signals - Google Patents

Abstract

The utility model discloses a wiring via hole structure for high-frequency and high-speed signals, which comprises a circuit board body, a first differential signal layer-changing via hole and a second differential signal layer-changing via hole, wherein the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are arranged on the circuit board body at intervals; the circuit board body is further provided with at least two backflow ground through holes, and the at least two backflow ground through holes are in axial symmetry distribution along a perpendicular bisector of a center connecting line between the first differential signal layer changing through hole and the second differential signal layer changing through hole. Through the mode, the wiring via hole structure for the high-frequency high-speed signal can provide a good signal backflow path for the differential signal layer-changing via hole, and effective transmission of the high-frequency high-speed signal is guaranteed.

Description

Wiring via hole structure for high-frequency and high-speed signals

Technical Field

The utility model relates to the technical field of electronics, in particular to a wiring via hole structure for high-frequency and high-speed signals.

Background

Printed Circuit Boards (PCB), also known as PCB boards, are important components of physical support and signal transmission of electronic products. Differential signals need to be wired in coupling with equal length and equal spacing as much as possible in the transmission process, however, when layers are changed, the high-frequency high-speed signal punching and layer changing can change the backflow path of the signals, if the layers are changed, the backflow path is also required to be changed, if the return path at the position of the signal layer changing cannot be communicated, the area of a signal loop is increased, the impedance of a via hole of the differential signal layer changing is discontinuous, the signal reflection is increased, and the problem of EMC (electromagnetic compatibility) can also be caused.

SUMMERY OF THE UTILITY MODEL

The utility model mainly solves the technical problem of providing a routing via hole structure for high-frequency and high-speed signals so as to ensure that signal backflow paths are well communicated.

In order to solve the technical problems, one technical scheme adopted by the utility model is to provide a routing via hole structure for high-frequency and high-speed signals, wherein the routing via hole structure for the high-frequency and high-speed signals comprises a circuit board body, a first differential signal layer-changing via hole and a second differential signal layer-changing via hole, and the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are arranged on the circuit board body at intervals; the circuit board body is further provided with at least two backflow ground through holes, and the at least two backflow ground through holes are axially symmetrically distributed along a vertical bisector of a center connecting line between the first differential signal layer-changing through hole and the second differential signal layer-changing through hole.

The number of the ground return vias is four, and the ground return vias include a first ground return via, a second ground return via, a third ground return via, and a fourth ground return via, where the first ground return via and the third ground return via are disposed on a side of the first differential signal layer-changing via away from the second differential signal layer-changing via, and the second ground return via and the fourth ground return via are disposed on a side of the second differential signal layer-changing via away from the first differential signal layer-changing via; the first reflow ground via hole and the second reflow ground via hole are located on an extension line of a central connecting line between the first differential signal layer changing via hole and the second differential signal layer changing via hole, the third reflow ground via hole is arranged between the first reflow ground via hole and the first differential signal layer changing via hole, and the fourth reflow ground via hole is arranged between the second reflow ground via hole and the second differential signal layer changing via hole.

The third reflow ground via hole is located on a vertical bisector of a center connecting line between the first reflow ground via hole and the first differential signal switching layer via hole, and the fourth reflow ground via hole is located on a vertical bisector of a center connecting line between the second reflow ground via hole and the second differential signal switching layer via hole.

Wherein, the third backward flow ground via hole with the central connecting line of first differential signal trades the layer via hole, with the first backward flow ground via hole with the contained angle between the central connecting line between the first differential signal trades the layer via hole is 60, the fourth backward flow ground via hole with the central connecting line of second differential signal trades the layer via hole, with the second backward flow ground via hole with the contained angle between the central connecting line between the second differential signal trades the layer via hole is 60.

The center distance between the first reflow ground via hole and the first differential signal layer change via hole is equal to the center distance between the first differential signal layer change via hole and the second differential signal layer change via hole.

Wherein the center-to-center spacing of the first differential signal layer change via hole and the second differential signal layer change via hole is 0.8mm to 1.2 mm.

The center distance between the first differential signal layer-changing via hole and the second differential signal layer-changing via hole is 1.0 mm.

The sizes of the reflow ground via hole, the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are equal.

Wherein the diameter of the reflow ground via hole is 0.3-0.6 mm.

The circuit board comprises a circuit board body and is characterized in that a first differential signal line, a second differential signal line, a third differential signal line and a fourth differential signal line are arranged on the circuit board body, the first differential signal line and the second differential signal line are distributed on the same layer of the circuit board body in parallel, the third differential signal line and the fourth differential signal line are distributed on the same layer of the circuit board body in parallel, and the first differential signal line and the third differential signal line are distributed on different layers of the circuit board body.

The utility model has the beneficial effects that: different from the situation of the prior art, the routing via hole structure for the high-frequency and high-speed signals comprises a circuit board body, a first differential signal layer-changing via hole and a second differential signal layer-changing via hole, wherein the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are arranged on the circuit board body at intervals; the circuit board body is further provided with at least two backflow ground through holes, and the at least two backflow ground through holes are axially symmetrically distributed along a perpendicular bisector of a central connecting line between the first differential signal layer-changing through hole and the second differential signal layer-changing through hole. At least two backflow ground through holes are axially symmetrically distributed on a vertical bisector along a center connecting line between the first differential signal layer-changing through hole and the second differential signal layer-changing through hole, so that a good signal backflow passage is provided for the differential signal layer-changing through holes, the coupling of differential signals is optimized, the impedance continuity of high-frequency and high-speed signals is guaranteed, the electromagnetic field radiation interference of the signals is reduced, and the effective transmission of the high-frequency and high-speed signals is guaranteed.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of a trace via structure for high frequency and high speed signals according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a differential signal layer-changing trace according to an embodiment of the trace via structure for high-frequency and high-speed signals of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a trace via structure for high-frequency and high-speed signals according to an embodiment of the present invention. In the embodiment of the present application, the routing via structure 10 for high-frequency and high-speed signals includes a circuit board body 100, a first differential signal layer-changing via 101 and a second differential signal layer-changing via 102, where the first differential signal layer-changing via 101 and the second differential signal layer-changing via 102 are disposed on the circuit board body 100 at intervals; at least two reflow ground via holes 103 are further formed in the circuit board body 100, and the at least two reflow ground via holes 103 are axially symmetrically distributed along a perpendicular bisector a of a central connecting line between the first differential signal layer-changing via hole 101 and the second differential signal layer-changing via hole 102.

It can be understood that, because the signal density on the routing via structure 10 for high-frequency and high-speed signals is increased, more signal transmission layers are required, and therefore, it is inevitable to implement interlayer signal transmission through vias, for differential signals, when the differential transmission lines are routed on the routing via structure 10 for high-frequency and high-speed signals, problems of connection with vias are encountered, and a pair of vias connected to the differential transmission lines is usually made into differential signal layer-changing vias. In order to reduce the area surrounded by the return path of the signal, a plurality of return vias must be arranged around the differential signal layer-changing via hole to provide the shortest return path of the signal, and EMI (electromagnetic interference) radiation of the signal is reduced. In this embodiment, at least two backflow ground via holes 103 are axially symmetrically distributed on a perpendicular bisector a along a central connecting line between the first differential signal layer-changing via hole 101 and the second differential signal layer-changing via hole 102, so as to provide a good signal backflow path for the differential signal layer-changing via holes, optimize the coupling of differential signals, ensure the impedance continuity of high-frequency high-speed signals, reduce the electromagnetic field radiation interference of the signals, and ensure the effective transmission of the high-frequency high-speed signals.

In an embodiment, the number of the ground return vias 103 is four, and includes a first ground return via 1031, a second ground return via 1032, a third ground return via 1033, and a fourth ground return via 1034, where the first ground return via 1031 and the third ground return via 1033 are disposed on a side of the first differential signal layer change via 101 away from the second differential signal layer change via 102, and the second ground return via 1032 and the fourth ground return via 1034 are disposed on a side of the second differential signal layer change via 102 away from the first differential signal layer change via 101; the first reflow ground via 1031 and the second reflow ground via 1032 are located on an extension line of a central connection line between the first differential signal layer change via 101 and the second differential signal layer change via 102, so that the first reflow ground via 1031, the second reflow ground via 1032, the first differential signal layer change via 101 and the second differential signal layer change via 102 are located on the same straight line; a third reflow ground via 1033 is disposed between the first reflow ground via 1031 and the first differential signaling hierarchy via 101, and a fourth reflow ground via 1034 is disposed between the second reflow ground via 1032 and the second differential signaling hierarchy via 102.

Further, the third via 1033 is located on a vertical bisector of a center line between the first via 1031 and the first via 101, and the fourth via 1034 is located on a vertical bisector of a center line between the second via 1032 and the second via 102. Therefore, the first reflow ground via 1031, the third reflow ground via 1033, and the first differential signal layer-changing via 101 form an isosceles triangle structure, and the third reflow ground via 1033 is located at the vertex position of the isosceles triangle; the second reflow ground via 1032, the fourth reflow ground via 1034 and the second differential signal layer-changing via 102 form an isosceles triangle structure, and the fourth reflow ground via 1034 is located at the vertex of the isosceles triangle.

Further, an angle between a central connecting line of the third reflow ground via 1033 and the first differential signal layer changing via 101 and a central connecting line between the first reflow ground via 1031 and the first differential signal layer changing via 101 is 60 °, and an angle between a central connecting line of the fourth reflow ground via 1034 and the second differential signal layer changing via 102 and a central connecting line between the second reflow ground via 1032 and the second differential signal layer changing via 102 is 60 °. Therefore, the first reflow ground via 1031, the third reflow ground via 1033, and the first differential signal layer change via 101 form an equilateral triangle structure; the second reflow ground via 1032, the fourth reflow ground via 1034, and the second differential signal re-layer via 102 form an equilateral triangle structure.

In an embodiment, the center-to-center distance L1 between the first reflow ground via 1031 and the first differential signal swizzling via 101 is equal to the center-to-center distance D between the first differential signal swizzling via 101 and the second differential signal swizzling via 102, and the center-to-center distance L2 between the second reflow ground via 1032 and the second differential signal swizzling via 102.

Further, the center-to-center distance L1 between the first reflow ground via 1031 and the first differential signal swizzling via 101, the center-to-center distance D between the first differential signal swizzling via 101 and the second differential signal swizzling via 102, and the center-to-center distance L2 between the second reflow ground via 1032 and the second differential signal swizzling via 102 may be set to be between 0.8mm and 1.2 mm.

Further, the center-to-center distance D between the first differential signal layer change via hole 101 and the second differential signal layer change via hole 102 is 1.0 mm. That is, the center-to-center distance L1 between the first reflow ground via 1031 and the first differential signal layer change via 101, the center-to-center distance D between the first differential signal layer change via 101 and the second differential signal layer change via 102, and the center-to-center distance L2 between the second reflow ground via 1032 and the second differential signal layer change via 102 are all 1.0 mm.

In one embodiment, all of the reflowed ground vias 103, the first differential signal re-layer vias 101, and the second differential signal re-layer vias 102 are equal in size.

Further, all of the reflowed ground vias 103 have a diameter of 0.3-0.6 mm. I.e., the diameters of all of the reflow ground vias 103 and the first and second differential signal layer change vias 101 and 102, may be set to be between 0.3mm and 0.6mm, and specifically, may be 0.3mm, 0.4mm, 0.5mm, or 0.6 mm.

Please refer to fig. 1 and fig. 2, wherein fig. 2 is a schematic structural diagram of a differential signal layer-changing trace according to an embodiment of the trace via structure for high-frequency and high-speed signals. In an embodiment, the circuit board body 100 is provided with a first differential signal line 104, a second differential signal line 105, a third differential signal line 106 and a fourth differential signal line 107, the first differential signal line 104 and the second differential signal line 105 are distributed in parallel on the same layer of the circuit board body 100, the third differential signal line 106 and the fourth differential signal line 107 are distributed in parallel on the same layer of the circuit board body 100, and the first differential signal line 104 and the third differential signal line 106 are distributed on different layers of the circuit board body 100. It can be found that, the differential signal layer-changing routing of the routing via structure 10 for high-frequency and high-speed signals according to the embodiment of the present application enables the differential signals to be routed in the transmission process by coupling with equal length and equal spacing as much as possible, and according to the design of the present application, benefits can be brought to the performance of the high-frequency and high-speed channels. Because greater impedance discontinuity will bring poorer signal reflection, and the criterion for realizing a high-frequency high-speed serial channel is to maintain good impedance continuity, the routing via hole structure 10 for high-frequency high-speed signals of the embodiment of the present application provides a balanced structure of the first differential signal layer-changing via hole 101, the second differential signal layer-changing via hole 102 and the via hole 103 in the backflow ground, so as to provide a good signal backflow path, optimize the coupling of differential signals, ensure the impedance continuity of high-frequency high-speed signals, reduce the electromagnetic field radiation interference of signals, and ensure the effective transmission of high-frequency high-speed signals.

It is noted that, in the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications that can be made by using equivalent structures or equivalent principles in the contents of the specification and the drawings or directly or indirectly applied to other related technical fields are also included in the scope of the present application.

Claims (10)

1. A wiring via hole structure for high-frequency and high-speed signals is characterized by comprising a circuit board body, a first differential signal layer-changing via hole and a second differential signal layer-changing via hole, wherein the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are arranged on the circuit board body at intervals;

the circuit board body is further provided with at least two backflow ground through holes, and the at least two backflow ground through holes are axially symmetrically distributed along a vertical bisector of a center connecting line between the first differential signal layer-changing through hole and the second differential signal layer-changing through hole.

2. The trace via structure for high frequency high speed signals according to claim 1,

the number of the ground return vias is four, and the ground return vias include first ground return vias, second ground return vias, third ground return vias and fourth ground return vias, the first ground return vias and the third ground return vias are arranged on one sides of the first differential signal layer-changing vias, which are far away from the second differential signal layer-changing vias, and the second ground return vias and the fourth ground return vias are arranged on one sides of the second differential signal layer-changing vias, which are far away from the first differential signal layer-changing vias;

the first reflow ground via hole and the second reflow ground via hole are located on an extension line of a central connecting line between the first differential signal layer changing via hole and the second differential signal layer changing via hole, the third reflow ground via hole is arranged between the first reflow ground via hole and the first differential signal layer changing via hole, and the fourth reflow ground via hole is arranged between the second reflow ground via hole and the second differential signal layer changing via hole.

3. The trace via structure for high frequency high speed signals according to claim 2,

the third reflow ground via hole is located on a perpendicular bisector of a center connecting line between the first reflow ground via hole and the first differential signal switching layer via hole, and the fourth reflow ground via hole is located on a perpendicular bisector of a center connecting line between the second reflow ground via hole and the second differential signal switching layer via hole.

4. The trace via structure for high frequency high speed signals according to claim 3,

the third backward flow ground via hole with the center line of first differential signal trades the layer via hole, with first backward flow ground via hole with the contained angle between the center line between the first differential signal trades the layer via hole is 60, the fourth backward flow ground via hole with the center line of second differential signal trades the layer via hole, with the second backward flow ground via hole with the contained angle between the center line between the second differential signal trades the layer via hole is 60.

5. A trace via structure for high frequency high speed signals according to any one of claims 2 to 4,

the center distance between the first reflow ground via hole and the first differential signal layer changing via hole is equal to the center distance between the first differential signal layer changing via hole and the second differential signal layer changing via hole.

6. The trace via structure for high frequency high speed signals according to claim 5,

the center-to-center spacing of the first differential signal layer change via hole and the second differential signal layer change via hole is 0.8mm to 1.2 mm.

7. The trace via structure for high frequency high speed signals according to claim 6,

the center-to-center spacing between the first differential signal layer change via hole and the second differential signal layer change via hole is 1.0 mm.

8. The trace via structure for high frequency high speed signals according to claim 1,

the sizes of the reflow ground via hole, the first differential signal layer-changing via hole and the second differential signal layer-changing via hole are equal.

9. The trace via structure for high frequency high speed signals according to claim 8,

the diameter of the reflow ground through hole is 0.3-0.6 mm.

10. The trace via structure for high frequency high speed signals according to claim 1,

the circuit board comprises a circuit board body and is characterized in that a first differential signal line, a second differential signal line, a third differential signal line and a fourth differential signal line are arranged on the circuit board body, the first differential signal line and the second differential signal line are distributed on the same layer of the circuit board body in parallel, the third differential signal line and the fourth differential signal line are distributed on the same layer of the circuit board body in parallel, and the first differential signal line and the third differential signal line are distributed on different layers of the circuit board body.

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