CN220261539U

CN220261539U - Surplus material collection device for wafer cutting

Info

Publication number: CN220261539U
Application number: CN202322157539.5U
Authority: CN
Inventors: 丁波; 李铁; 陈瀚; 侯金松; 杭海燕; 谷卫东
Original assignee: Shanghai Micro Semi World Co ltd
Current assignee: Shanghai Micro Semi World Co ltd
Priority date: 2023-08-11
Filing date: 2023-08-11
Publication date: 2023-12-29
Anticipated expiration: 2033-08-11

Abstract

The utility model discloses a surplus material collecting device for wafer cutting, which relates to the technical field of waste material recovery and comprises a bracket, wherein two left and right mechanical arms are fixed at the bottom of the bracket, a cutting head and a picking head are respectively arranged at the tail ends of the two mechanical arms, a spray head fixed with the mechanical arms is arranged at the left side of the cutting head, the spray head is connected with a water pump, and the water pump is connected with a water storage tank, and the surplus material collecting device is characterized in that: the support below is equipped with the base, and base top and bottom are fixed with respectively and connect silo and bottom plate, and support and connect silo fixed connection, and the base is cavity and top for the opening setting, is equipped with framework and crushing roller in the base, and receiving silo has been placed to base inner chamber bottom, and the storage water tank is fixed in the base left side. The cutting fluid and the residual materials can be completely collected through the receiving groove, the silicon powder is filtered out through the filter plate and the hairbrush and is swept into the receiving box, and the residual materials fall into the receiving groove after being crushed by the crushing roller, so that the silicon powder in the cutting fluid and the residual materials after cutting can be simultaneously collected.

Description

Surplus material collection device for wafer cutting

Technical Field

The utility model relates to the technical field of waste recovery, in particular to a waste collection device for wafer cutting.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed crystal, and then is slowly pulled out to form a cylindrical monocrystalline silicon rod, the silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer, various circuit element structures can be manufactured on the wafer, so that a product chip with specific electrical functions is manufactured, the wafer needs to be cut when being manufactured into the chip, silicon powder is generated in the cutting process, and surplus materials are left after cutting, and the silicon powder and the surplus materials can be recycled and reused in the production of the chip, so that a recycling device is needed for recycling the silicon powder and the surplus materials.

The utility model provides a chip wafer processing is with waste recovery device, includes the shell, the inside of shell is provided with reducing mechanism, reducing mechanism's top is provided with reducing mechanism, reducing mechanism is including the casing, the interior bottom wall fixed mounting of casing has the motor, the inside of shell is provided with crushing storehouse, the output shaft of motor runs through and extends to the inside axis of rotation in crushing storehouse through shaft coupling fixedly connected with one end, the surface fixed mounting of axis of rotation has vertical gear, the interior bottom wall movable mounting in crushing storehouse has the installation pole, the surface fixed mounting of installation pole has crushing wall, the surface fixed mounting of installation pole has transverse gear. This waste recycling device for chip wafer processing through being provided with reducing mechanism, has reached the mesh of grinding into powder with the waste material for chip wafer processing, conveniently retrieves the noble metal in the chip waste material, reduces the waste to the noble metal resource.

In the recovery device, only the surplus materials after cutting are recovered, and a recovery mechanism is not arranged for the silicon powder generated in the cutting process, so that the recovery is incomplete, and the material waste is caused.

Disclosure of Invention

The utility model solves the technical problems of incomplete collection and the like in the prior art, and provides a residual material collection device for wafer cutting. The wafer cutting residue collecting device has the characteristics of complete collection and the like.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a surplus material collection device for wafer cutting, includes the support, the support bottom is fixed with the arm that sets up about two, and cutting head and pick up the head are installed respectively to two arm ends, and the cutting head left side is equipped with the shower nozzle fixed with the arm, the shower nozzle is connected with the water pump, and the water pump is connected with the storage water tank, its characterized in that: a base is arranged below the support, a receiving groove and a bottom plate are respectively fixed at the top and the bottom of the base, the support is fixedly connected with the receiving groove, the base is hollow, the top of the base is provided with an opening, a frame body and a crushing roller are arranged in the base, a receiving groove is arranged at the bottom of an inner cavity of the base, and the water storage tank is fixed at the left side of the base;

the air cylinder is fixed in the receiving groove, the support frame is movably connected to the top of the air cylinder, an opening is formed in the bottom of the receiving groove, a distributing hopper is arranged in the base, the distributing hopper is fixed to the bottom of the receiving groove, a plurality of grooves are formed in the bottom of the distributing hopper, a water receiving groove is formed below the distributing hopper, the water receiving groove is fixedly connected with the inner wall of the base, the bottom of the distributing hopper penetrates through the bottom of the water receiving groove, the frame body is provided with an upper opening and a lower opening and is fixed to the bottom of the water receiving groove, and a water outlet is formed in the position, located at the opening, of the frame body, of the bottom of the water receiving groove;

the frame body is provided with a filter plate and a drainage groove which are arranged up and down, the filter plate and the drainage groove are fixed, the filter plate is fixedly connected with the inner wall of the frame body, and the drainage groove sequentially penetrates through the frame body, the base and the side wall of the water storage tank and extends into the water storage tank;

the crushing roller is located the hopper bottom opening below that divides, and the crushing roller is equipped with about two parallel, two all be fixed with the axis of rotation on the crushing roller, axis of rotation both ends all with base inner wall swing joint, and the rear end extends to the outside to be fixed with engaged with gear, the base right side is fixed with servo motor, servo motor is connected with the axis of rotation transmission.

Preferably, a baffle is fixed in the distributing hopper, and the baffle is in a herringbone shape.

Preferably, the frame body front and back both sides inner wall is located filter top department and all is equipped with synchronous set of group, the filter top is equipped with the brush, the brush is all fixed with two sets of synchronous set of group, two be fixed with the connecting rod between the synchronous set of group, and the connecting rod both ends all extend to frame body outside and base inner wall swing joint, and the rear end extends to the base outside to with axis of rotation transmission is connected.

Preferably, a receiving box is arranged in the receiving groove, the receiving box is positioned below the frame body, a scraping edge is arranged at the edge of the opening of the receiving box, and the receiving box is hung in the receiving groove through the scraping edge.

Compared with the prior art, the utility model has the beneficial effects that:

1. the cutting fluid and the residual materials can be completely collected through the receiving groove, the silicon powder is filtered out through the filter plate and the hairbrush and is swept into the receiving box, and the residual materials fall into the receiving groove after being crushed by the crushing roller, so that the silicon powder in the cutting fluid and the residual materials after cutting can be simultaneously collected.

2. The cutting fluid and the surplus materials are respectively treated through the filter plate and the crushing roller, the silicon powder and the crushed aggregates are collected together through the material collecting groove, the silicon powder and the crushed aggregates are conveniently taken out, and the silicon powder and the crushed aggregates are stored separately, so that confusion is avoided.

Drawings

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a schematic diagram of the structure of the present utility model;

fig. 3 is a top view of the base of the present utility model.

Reference numerals in the drawings: 1. a bracket; 2. a receiving groove; 3. a base; 4. a bottom plate; 5. a cutting head; 6. a mechanical arm; 7. a pick-up head; 8. a water pump; 9. a water storage tank; 10. a spray head; 11. a water receiving tank; 12. a synchronous band group; 13. a brush; 14. a filter plate; 15. a drainage channel; 16. a cylinder; 17. a distributing hopper; 18. a baffle; 19. a servo motor; 20. a crushing roller; 21. a support frame; 22. a material collecting groove; 23. a frame; 24. a receiving box; 25. a connecting rod; 26. a gear; 27. and (3) rotating the shaft.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a surplus material collection device for wafer cutting, which comprises a bracket 1, the support 1 bottom is fixed with two arms 6 that set up about, two arm 6 terminal are installed cutting head 5 and pick up head 7 respectively, and the shower nozzle 10 that is fixed with arm 6 is equipped with in cutting head 5 left side, shower nozzle 10 is connected with water pump 8, water pump 8 is connected with storage water tank 9, the storage water tank 9 stores the cutting fluid, the replenishment mouth has been seted up on the storage water tank 9, support 1 below is equipped with base 3, base 3 top and bottom are fixed with respectively and connect silo 2 and bottom plate 4, support 1 and connect silo 2 fixed connection, base 3 is cavity and the top is the opening setting, be equipped with framework 23 and crushing roller 20 in the base 3, receive silo 22 has been placed to base 3 inner chamber bottom, storage water tank 9 is fixed in base 3 left side;

the air cylinders 16 are fixed in the receiving groove 2, the top of each air cylinder 16 is movably connected with the corresponding supporting frame 21, two supporting frames 21 are arranged and arc-shaped, two air cylinders 16 are arranged at the bottoms of the two supporting frames 21, the top ends of the air cylinders 16 are movably connected with the corresponding supporting frames 21, connecting plates are arranged between the air cylinders 16 and the corresponding supporting frames 21, two ends of each connecting plate are respectively movably connected with the corresponding air cylinders 16 and the corresponding supporting frames 21, an opening is formed in the bottom of the receiving groove 2, a distributing hopper 17 is arranged in the base 3, the distributing hopper 17 is fixed at the bottom of the receiving groove 2, a plurality of grooves are formed in the bottom of the distributing hopper 17, a water receiving groove 11 is arranged below the distributing hopper 17, the water receiving groove 11 is fixedly connected with the inner wall of the base 3, the bottom of the distributing hopper 17 penetrates through the bottom of the water receiving groove 11, a baffle 18 is fixed in the distributing hopper 17, the baffle 18 is in a herringbone shape, so that cutting fluid can be completely deposited at the bottom of the distributing hopper 17 when the cutting fluid falls into the distributing hopper 17, and can be prevented from directly falling into the water receiving groove 11, the cutting fluid can be directly flowed away from the middle of the distributing hopper 17, the silicon powder can be mixed into the distributing hopper, the frame 23 is provided with an upper opening and a water outlet, the bottom of the water receiving groove 11 is fixed at the bottom of the water receiving groove 11, and the opening is arranged at the opening 23 of the bottom of the frame 23;

the frame body 23 is provided with a filter plate 14 and a drainage groove 15 which are arranged up and down, the filter plate 14 and the drainage groove 15 are fixed, the filter plate 14 is fixedly connected with the inner wall of the frame body 23, and the drainage groove 15 sequentially penetrates through the side walls of the frame body 23, the base 3 and the water storage tank 9 and extends into the water storage tank 9;

the crushing rollers 20 are positioned below the bottom opening of the distributing hopper 17, the crushing rollers 20 are provided with two left and right side by side, the two crushing rollers 20 are respectively fixed with a rotating shaft 27, the two ends of each rotating shaft 27 are movably connected with the inner wall of the base 3, the rear ends of the two crushing rollers extend to the outer side, meshed gears 26 are fixed on the two crushing rollers, a servo motor 19 is fixed on the right side of the base 3, the servo motor 19 is in transmission connection with the rotating shafts 27, belt pulleys are respectively fixed on the output shafts of the servo motor 19 and the rotating shafts 27, and the two belt pulleys are directly connected through belt transmission;

the front and rear side inner walls of the frame 23 are positioned above the filter plates 14 and are respectively provided with a synchronous belt group 12, each synchronous belt group 12 comprises two synchronous wheels which are arranged left and right, synchronous belts are sleeved outside the two synchronous wheels and are connected through the transmission of the synchronous belts, a hairbrush 13 is arranged at the top of the filter plates 14, the hairbrush 13 is fixed with the two synchronous belt groups 12, a connecting rod 25 is fixed between the two synchronous belt groups 12, two ends of the connecting rod 25 respectively penetrate through the synchronous wheels in the adjacent synchronous belt groups 12, two ends of the connecting rod 25 respectively penetrate through openings formed in the frame 23 and extend to the outer side of the frame 23 to be movably connected with the inner wall of the base 3, the rear end penetrates through holes formed in the base 3 to extend to the outer side of the base 3 and are in transmission connection with a rotating shaft 27, belt pulleys are fixed on the connecting rod 25 and the rotating shaft 27 and are directly connected through the transmission of the belt, and the movement of the synchronous belt groups 12 drives the hairbrush 13 to move, silicon powder on the filter plates 14 is swept into a collecting box 24, and the silicon powder is convenient to collect;

the receiving box 24 is arranged in the receiving groove 22, the receiving box 24 is positioned below the frame 23, the edge of the opening of the receiving box 24 is provided with a scraping edge, and the scraping edge is hung in the receiving groove 22 to store silicon powder and crushed aggregates separately, so that the silicon powder is prevented from being mixed into the crushed aggregates.

Working principle: when the device is used, the external power supply is connected, the servo motor 19 is started, the wafer is placed on the supporting frame 21, the wafer is fixed through the sucking disc, the wafer is cut through the cutting head 5, meanwhile, the water pump 8 pumps the cutting fluid in the water storage tank 9 to the spray head 10, the cutting fluid is sprayed at the cutting point, the powder generated during cutting is taken away through the cutting fluid, the cutting fluid sequentially flows into the receiving tank 2 and the distributing hopper 17, and flows into the receiving tank 11 through the grooves, and then flows into the frame 23, and falls on the filter plate 14, the powder in the cutting fluid is filtered out through the filter plate 14, the filtered cutting fluid flows back into the water storage tank 9 through the water drainage tank 15, the servo motor 19 drives the connecting rod 25 to rotate through the rotating shaft 27, so as to drive the synchronous belt group 12 to rotate, the brush 13 to move the powder filtered on the filter plate 14 to sweep into the collecting box 24, the cut separated chips are completely removed through the pick-up head 7, the cylinder 16 is started, the cylinder 16 is stretched to drive the supporting frame 21 to deflect, the wafer residues slide into the receiving tank 2 from the supporting frame 21, and then fall into the distributing hopper 2 from the opening of the bottom of the receiving tank 2 into the distributing hopper 17, the two distributing rollers 20 and the crushed aggregates 20 are simultaneously rotated into the two small crushing rollers 20, and the crushed aggregates 20 are simultaneously, and the crushed aggregates are conveniently processed into the small crushing blocks 20, and the crushed aggregates are simultaneously, and the crushed aggregates are rotated into the small aggregates 20 and the crushed aggregates are simultaneously.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a surplus material collection device for wafer cutting, includes support (1), arm (6) that set up about support (1) bottom is fixed with, and cutting head (5) and pick up head (7) are installed respectively to two arm (6) ends, and cutting head (5) left side be equipped with arm (6) fixed shower nozzle (10), shower nozzle (10) are connected with water pump (8), and water pump (8) are connected with storage water tank (9), its characterized in that: the novel energy-saving crushing machine is characterized in that a base (3) is arranged below the support (1), a receiving groove (2) and a bottom plate (4) are respectively fixed at the top and the bottom of the base (3), the support (1) is fixedly connected with the receiving groove (2), the base (3) is hollow, the top of the base is provided with an opening, a frame body (23) and a crushing roller (20) are arranged in the base (3), a receiving groove (22) is arranged at the bottom of an inner cavity of the base (3), and the water storage tank (9) is fixed at the left side of the base (3);

the novel water receiving device is characterized in that an air cylinder (16) is fixed in the material receiving groove (2), the top of the air cylinder (16) is movably connected with a supporting frame (21), an opening is formed in the bottom of the material receiving groove (2), a distributing hopper (17) is arranged in the base (3), the distributing hopper (17) is fixed at the bottom of the material receiving groove (2), a plurality of grooves are formed in the bottom of the distributing hopper (17), a water receiving groove (11) is formed below the distributing hopper (17), the water receiving groove (11) is fixedly connected with the inner wall of the base (3), the bottom of the distributing hopper (17) penetrates through the bottom of the water receiving groove (11), the frame (23) is provided with an upper opening and a lower opening, and is fixed at the bottom of the water receiving groove (11), and a water outlet is formed in the position of the opening of the frame (23) at the bottom of the water receiving groove (11).

The filter plate (14) and the drainage groove (15) are arranged up and down in the frame body (23), the filter plate (14) is fixed between the drainage groove (15), the filter plate (14) is fixedly connected with the inner wall of the frame body (23), and the drainage groove (15) sequentially penetrates through the side walls of the frame body (23), the base (3) and the water storage tank (9) and extends into the water storage tank (9);

the crushing roller (20) is located the hopper (17) bottom opening below, and crushing roller (20) are equipped with about two, two all be fixed with axis of rotation (27) on crushing roller (20), axis of rotation (27) both ends all with base (3) inner wall swing joint, and the rear end extends to the outside to be fixed with engaged with gear (26), base (3) right side is fixed with servo motor (19), servo motor (19) are connected with axis of rotation (27) transmission.

2. The excess material collecting device for wafer dicing according to claim 1, wherein: a baffle (18) is fixed in the distributing hopper (17), and the baffle (18) is in a herringbone shape.

3. The excess material collecting device for wafer dicing according to claim 1, wherein: the utility model discloses a synchronous machine, including framework (23), filter (14) top are equipped with synchronous band group (12), brush (13) are all fixed with two sets of synchronous band group (12), two be fixed with connecting rod (25) between synchronous band group (12), and connecting rod (25) both ends all extend to framework (23) outside and base (3) inner wall swing joint, and the rear end extends to the base (3) outside to with axis of rotation (27) transmission connection.

4. The excess material collecting device for wafer dicing according to claim 1, wherein: the material collecting groove (22) is internally provided with a material collecting box (24), the material collecting box (24) is positioned below the frame body (23), and the edge of an opening of the material collecting box (24) is provided with a scraping edge and is hung in the material collecting groove (22) through the scraping edge.