CN220260573U - High-precision polishing device for parts of semiconductor detection equipment - Google Patents
High-precision polishing device for parts of semiconductor detection equipment Download PDFInfo
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- CN220260573U CN220260573U CN202321358600.6U CN202321358600U CN220260573U CN 220260573 U CN220260573 U CN 220260573U CN 202321358600 U CN202321358600 U CN 202321358600U CN 220260573 U CN220260573 U CN 220260573U
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- 238000005498 polishing Methods 0.000 title claims abstract description 77
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000001514 detection method Methods 0.000 title claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims description 70
- 238000009434 installation Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims 5
- 230000013011 mating Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to the technical field of machining, in particular to a high-precision polishing device for parts of semiconductor detection equipment, which improves the polishing precision of the device and increases the polishing interval of the device; including mounting base, location slide rail, containing box, back shaft, location chuck, driven bevel gear, actuating mechanism and operating mechanism, two sets of location slide rail cooperation are installed on mounting base, and the containing box is through location slide rail location slidable mounting on mounting base, and the back shaft rotates to be installed on the containing box, and location chuck coaxial arrangement is on the back shaft, and location chuck is located containing box groove intracavity portion, and driven bevel gear coaxial arrangement is on the back shaft, and actuating mechanism installs inside the mounting base cavity, and actuating mechanism is connected with driven bevel gear and containing box cooperation respectively, and operating mechanism installs on mounting base.
Description
Technical Field
The utility model relates to the technical field of machining, in particular to a high-precision polishing device for parts of semiconductor detection equipment.
Background
Polishing refers to a processing method for reducing the surface roughness of a workpiece by utilizing the action of machinery, chemistry or electrochemistry so as to obtain a bright and flat surface. Mechanical polishing is a finishing process of a surface of a workpiece with a polishing tool and abrasive particles or other polishing medium.
The conventional part polishing device usually only rotates the polishing wheel in one direction, the part is polished by the polishing wheel, the position of the part or the polishing wheel is required to be continuously adjusted to realize the integral polishing of the surface of the part, and the operation procedure is complex.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a high-precision polishing device for semiconductor detection equipment parts, which improves the polishing precision of the device and increases the polishing interval of the device.
The utility model discloses a high-precision polishing device for semiconductor detection equipment parts, which comprises a mounting base, positioning slide rails, a storage box, a supporting shaft, a positioning chuck, a driven bevel gear, a driving mechanism and a working mechanism, wherein the two groups of positioning slide rails are mounted on the mounting base in a matched manner, the storage box is mounted on the mounting base in a positioning sliding manner through the positioning slide rails, the supporting shaft is rotatably mounted on the storage box, the positioning chuck is coaxially mounted on the supporting shaft, the positioning chuck is positioned in a groove cavity of the storage box, the driven bevel gear is coaxially mounted on the supporting shaft, the driving mechanism is mounted in a cavity of the mounting base, the driving mechanism is respectively connected with the driven bevel gear and the storage box in a matched manner, and the working mechanism is mounted on the mounting base.
The utility model discloses a high-precision polishing device for parts of semiconductor detection equipment, which comprises a driving motor, a driving shaft, a mounting frame, a hollow shaft, a driving bevel gear and a transmission mechanism, wherein the driving motor is arranged in a cavity of a mounting base, one end of the driving shaft is coaxially arranged at the output end of the driving motor, the other end of the driving shaft is rotatably arranged on the mounting base, the mounting frame is cooperatively arranged on a storage box, the hollow shaft is rotatably arranged on the mounting frame, a polygonal inner cavity is arranged on the hollow shaft, the driving shaft is cooperatively and in transmission connection with the polygonal inner cavity of the hollow shaft, the driving bevel gear is coaxially arranged on the hollow shaft, the driving bevel gear is in meshing connection with a driven bevel gear, the transmission mechanism is arranged in the cavity of the mounting base, and the transmission mechanism is respectively cooperatively connected with the driving shaft and the storage box.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a transmission mechanism, a storage box, a transmission beam, a transmission crankshaft and a linkage mechanism, wherein the two groups of the transmission posts are arranged on the storage box in a matched mode, the transmission beam is arranged on the two groups of the transmission posts, the transmission crankshaft is rotatably arranged in a cavity of a mounting base, the transmission crankshaft is in matched sliding connection with a transmission Liang Nacao, the linkage mechanism is arranged in the cavity of the mounting base, and the linkage mechanism is respectively connected with the transmission crankshaft and a driving shaft in a matched mode.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a mounting shaft, a fixed seat, a worm wheel and a conducting mechanism, wherein the mounting shaft is rotatably mounted in a cavity of a mounting base, the fixed seat is mounted in the cavity of the mounting base, the mounting shaft is in matched rotary connection with the fixed seat, the worm is coaxially mounted on the mounting shaft, the worm wheel is coaxially mounted on a transmission crankshaft, the worm wheel is in meshed transmission connection with the worm, and the conducting mechanism is respectively in matched connection with the mounting shaft and a driving shaft.
The high-precision polishing device for the semiconductor detection equipment parts comprises a transmission mechanism, a driving chain wheel, a driven chain wheel and a chain, wherein the driving chain wheel is coaxially arranged on a driving shaft, the driven chain wheel is coaxially arranged on an installation shaft, and the chain is respectively in meshed transmission connection with the driving chain wheel and the driven chain wheel.
The utility model relates to a high-precision polishing device for a semiconductor detection equipment part, which comprises a working mechanism, a power motor, a power shaft, a nut, a polishing wheel and a supporting mechanism, wherein the power motor is arranged on the supporting mechanism, the power shaft is coaxially arranged at the output end of the power motor, the nut is in threaded connection with the power shaft in a matched manner, and the polishing wheel is coaxially arranged on the power shaft.
The utility model relates to a high-precision polishing device for a semiconductor detection equipment part, which comprises a supporting mechanism and a connecting seat, wherein the supporting mechanism comprises an air cylinder and a connecting seat, the air cylinder is arranged on a mounting base, the connecting seat is arranged at the output end of the air cylinder, a power motor is arranged on the connecting seat in a matched manner, and a power shaft is connected with the connecting seat in a matched manner in a rotating manner.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which also comprises a plurality of groups of adjusting support legs, wherein the groups of adjusting support legs are arranged on a mounting base in a matched manner.
Compared with the prior art, the utility model has the beneficial effects that: the storage box is located on the top end moving track of the installation base through the locating slide rail to limit, the locating chuck and the driven bevel gear are coaxially installed through the supporting shaft and rotatably supported on the storage box, the supporting shaft is connected with the driving mechanism through the driven bevel gear in a matched mode, the parts are located and clamped through the supporting shaft, the working mechanism is used for collecting polishing fragments of the parts and grinding fluid in a concentrated mode through the storage box, the supporting shaft is driven by the locating chuck to rotate through the driving mechanism and the driven bevel gear in a matched mode, the parts clamped on the locating chuck are moved in a position mode through the driving mechanism and the storage box to polish through the working mechanism, the polishing interval and stability of the device are increased through the rotation of the locating chuck in a matched mode, the polishing precision of the device is improved, and the polishing interval of the device is increased.
Drawings
FIG. 1 is a schematic elevational view of the present utility model;
FIG. 2 is a schematic illustration of an axially measured structure of the present utility model;
FIG. 3 is a schematic view of the internal structure of the present utility model;
FIG. 4 is a schematic view of another internal structure of the present utility model;
the reference numerals in the drawings: 1. a mounting base; 2. positioning a sliding rail; 3. a storage box; 4. a support shaft; 5. positioning a chuck; 6. a driven bevel gear; 7. a driving motor; 8. a drive shaft; 9. a mounting frame; 10. a hollow shaft; 11. a drive bevel gear; 12. a mounting column; 13. a drive beam; 14. a transmission crankshaft; 15. a mounting shaft; 16. a fixing seat; 17. a worm; 18. a worm wheel; 19. a drive sprocket; 20. a driven sprocket; 21. a chain; 22. a power motor; 23. a power shaft; 24. a nut; 25. a polishing wheel; 26. a cylinder; 27. a connecting seat; 28. the support legs are adjusted.
Detailed Description
The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 4, the high-precision polishing device for the semiconductor detection equipment parts comprises a mounting base 1, positioning slide rails 2, a storage box 3, a supporting shaft 4, a positioning chuck 5, a driven bevel gear 6, a driving mechanism and a working mechanism, wherein the two groups of positioning slide rails 2 are mounted on the mounting base 1 in a matched manner, the storage box 3 is mounted on the mounting base 1 in a positioning sliding manner through the positioning slide rails 2, the supporting shaft 4 is rotatably mounted on the storage box 3, the positioning chuck 5 is coaxially mounted on the supporting shaft 4, the positioning chuck 5 is positioned in the groove cavity of the storage box 3, the driven bevel gear 6 is coaxially mounted on the supporting shaft 4, the driving mechanism is mounted in the cavity of the mounting base 1, the driving mechanism is respectively connected with the driven bevel gear 6 and the storage box 3 in a matched manner, and the working mechanism is mounted on the mounting base 1; the storage box 3 is located on the top end moving track of the mounting base 1 through the positioning sliding rail 2, the positioning chuck 5 and the driven bevel gear 6 are coaxially installed through the supporting shaft 4 and rotatably supported on the storage box 3, the supporting shaft 4 is connected with the driving mechanism through the driven bevel gear 6 in a matched mode, the parts are positioned and clamped through the supporting shaft 4, the working mechanism is used for intensively collecting polishing scraps and grinding fluid of the parts through the storage box 3, the supporting shaft 4 is driven by the positioning chuck 5 to rotate through the driving mechanism and the driven bevel gear 6, the parts clamped on the positioning chuck 5 are moved in position through the driving mechanism and the storage box 3 in a matched mode to polish through the working mechanism, the polishing interval and stability of the device are increased through the rotation of the positioning chuck 5 in a matched mode, the polishing precision of the device is improved, and the polishing interval of the device is increased.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a driving motor 7, a driving shaft 8, a mounting frame 9, a hollow shaft 10, a driving bevel gear 11 and a transmission mechanism, wherein the driving motor 7 is arranged in a cavity of a mounting base 1, one end of the driving shaft 8 is coaxially arranged at the output end of the driving motor 7, the other end of the driving shaft 8 is rotatably arranged on the mounting base 1, the mounting frame 9 is cooperatively arranged on a storage box 3, the hollow shaft 10 is rotatably arranged on the mounting frame 9, a polygonal inner cavity is arranged on the hollow shaft 10, the driving shaft 8 is cooperatively and drivingly connected with the polygonal inner cavity of the hollow shaft 10, the driving bevel gear 11 is coaxially arranged on the hollow shaft 10, the driving bevel gear 11 is in meshed connection with a driven bevel gear 6, the transmission mechanism is arranged in the cavity of the mounting base 1, and the transmission mechanism is cooperatively and respectively connected with the driving shaft 8 and the storage box 3; the hollow shaft 10 is rotatably supported on the storage box 3 through the mounting frame 9, the hollow shaft 10 is in transmission connection with the support shaft 4 through the meshing of the driving bevel gear 11 and the driven bevel gear 6, the driving shaft 8 is used for providing rotary power through the driving motor 7, the driving shaft 8 is rotatably connected with the mounting base 1 through the driving shaft 8, the working stability of the driving shaft 8 is increased, the driving shaft 8 is used for driving the storage box 3 to move in position through the transmission mechanism, the driving bevel gear 11 and the driven bevel gear 6 are kept unchanged when the storage box 3 drives the position of the hollow shaft 10 to move through the transmission connection of the driving shaft 8 and the polygonal inner cavity of the hollow shaft 10, and the functional diversity of the device is increased.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a transmission mechanism, a storage box 3, a semiconductor detection device and a polishing device, wherein the transmission mechanism comprises mounting columns 12, a transmission beam 13, a transmission crankshaft 14 and a linkage mechanism, the two groups of mounting columns 12 are mounted on the storage box 3 in a matched manner, the transmission beam 13 is mounted on the two groups of mounting columns 12, the transmission crankshaft 14 is rotatably mounted in a cavity of the mounting base 1, the transmission crankshaft 14 is in matched sliding connection with an inner groove of the transmission beam 13, the linkage mechanism is mounted in the cavity of the mounting base 1, and the linkage mechanism is respectively connected with the transmission crankshaft 14 and a driving shaft 8 in a matched manner; the transmission beam 13 is arranged on the storage box 3 through the cooperation of the two groups of mounting columns 12, the driving shaft 8 drives the transmission crankshaft 14 to rotate through the linkage mechanism, and the storage box 3 drives parts to reciprocate on the mounting base 1 through the cooperation of the rotation of the transmission crankshaft 14 and the inner groove of the transmission beam 13, so that the polishing linkage of the parts is improved, and the working stability of the device is improved.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a mounting shaft 15, a fixed seat 16, a worm 17, a worm wheel 18 and a conducting mechanism, wherein the mounting shaft 15 is rotatably arranged in a cavity of a mounting base 1, the fixed seat 16 is arranged in the cavity of the mounting base 1, the mounting shaft 15 is in matched rotary connection with the fixed seat 16, the worm 17 is coaxially arranged on the mounting shaft 15, the worm wheel 18 is coaxially arranged on a transmission crankshaft 14, the worm wheel 18 is in meshed transmission connection with the worm 17, and the conducting mechanism is respectively matched and connected with the mounting shaft 15 and a driving shaft 8; the worm 17 is rotatably supported in the cavity of the mounting base 1 through the mounting shaft 15, the mounting shaft 15 drives the transmission crankshaft 14 to rotate through the engagement transmission connection of the worm 17 and the worm wheel 18, the engagement transmission precision and strength of the worm 17 and the worm wheel 18 are increased through the fixing seat 16, the transmission is slowed down when the transmission has a unidirectional self-locking function through the engagement of the worm wheel 18 and the worm 17, the driving shaft 8 drives the mounting shaft 15 to rotate through the transmission mechanism, and the device cooperation transmission synchronism is increased.
The utility model relates to a high-precision polishing device for parts of semiconductor detection equipment, which comprises a transmission mechanism, a polishing mechanism and a polishing mechanism, wherein the transmission mechanism comprises a driving sprocket 19, a driven sprocket 20 and a chain 21, the driving sprocket 19 is coaxially arranged on a driving shaft 8, the driven sprocket 20 is coaxially arranged on a mounting shaft 15, and the chain 21 is respectively meshed and in transmission connection with the driving sprocket 19 and the driven sprocket 20; the chain 21 is meshed with the driving chain wheel 19 and the driven chain wheel 20 respectively to enable the mounting shaft 15 to be in transmission connection with the driving shaft 8, so that the transmission fit synchronism of the device is improved, and the working stability of the device is improved.
The utility model relates to a high-precision polishing device for a semiconductor detection equipment part, which comprises a working mechanism, a polishing mechanism and a polishing mechanism, wherein the working mechanism comprises a power motor 22, a power shaft 23, a nut 24, a polishing wheel 25 and a supporting mechanism, the power motor 22 is arranged on the supporting mechanism, the power shaft 23 is coaxially arranged at the output end of the power motor 22, the nut 24 is in threaded connection with the power shaft 23 in a matched manner, and the polishing wheel 25 is coaxially arranged on the power shaft 23; the polishing wheel 25 is coaxially and fixedly arranged on the power shaft 23 through the nut 24, the polishing wheel 25 is convenient to assemble and disassemble through threaded connection of the nut 24 and the power shaft 23, the power motor 22 is used for enabling the polishing wheel 25 to provide rotary power, and the working height of the polishing wheel 25 is adjusted through the supporting mechanism, so that the polishing adaptability of the device is improved.
The utility model relates to a high-precision polishing device for a semiconductor detection equipment part, which comprises a supporting mechanism, wherein the supporting mechanism comprises an air cylinder 26 and a connecting seat 27, the air cylinder 26 is arranged on a mounting base 1, the connecting seat 27 is arranged at the output end of the air cylinder 26, a power motor 22 is arranged on the connecting seat 27 in a matched manner, and a power shaft 23 is connected with the connecting seat 27 in a matched manner in a rotating manner; the power motor 22 is stably supported at the output end of the air cylinder 26 through the connecting seat 27, the polishing intensity of the polishing wheel 25 is increased through the matching rotation connection of the power shaft 23 and the connecting seat 27, the polishing height of the polishing wheel 25 is adjusted through the air cylinder 26, and the use adaptability of the device is improved.
The high-precision polishing device for the semiconductor detection equipment parts further comprises a plurality of groups of adjusting support legs 28, wherein the groups of adjusting support legs 28 are mounted on the mounting base 1 in a matched manner; the mounting base 1 is stably supported through the cooperation of the multiple groups of adjusting support legs 28, so that the adaptability of the device placement site is improved, and the leveling convenience of the device is improved.
When the high-precision polishing device for the semiconductor detection equipment parts is operated, firstly, the parts are positioned and clamped on the positioning chuck 5, then the power motor 22 is started to drive the polishing wheel 25 to rotate by the power shaft 23, then the driving motor 7 is started to drive the driving shaft 8 to rotate, then the driving shaft 8 is matched with the hollow shaft 10 to drive the driving bevel gear 11 to rotate, then the driving bevel gear 11 is meshed with the driven bevel gear 6, the supporting shaft 4 drives the parts on the positioning chuck 5 to rotate, meanwhile, the chain 21 is meshed with the driving chain wheel 19 and the driven chain wheel 20 respectively to drive the mounting shaft 15 to rotate, then the mounting shaft 15 is meshed with the worm wheel 18 through the worm 17 to drive the transmission crankshaft 14 to rotate, then the transmission crankshaft 14 is matched with the inner groove of the transmission beam 13 to drive the positioning chuck 5 to reciprocate at the bottom end of the polishing wheel 25 by the storage box 3, then the air cylinder 26 is controlled to drive the position of the polishing wheel 25 to descend, and then the parts are polished by the polishing wheel 25.
The high-precision polishing device for the semiconductor detection equipment parts is a common mechanical mode in the installation mode, the connection mode or the setting mode, and can be implemented as long as the beneficial effects of the high-precision polishing device can be achieved.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that it will be apparent to those skilled in the art that modifications and variations can be made without departing from the technical principles of the present utility model, and these modifications and variations should also be regarded as the scope of the utility model.
Claims (6)
1. The high-precision polishing device for the semiconductor detection equipment parts is characterized by comprising a mounting base (1), a positioning slide rail (2), a storage box (3), a supporting shaft (4), a positioning chuck (5), a driven bevel gear (6), a driving mechanism and a working mechanism, wherein the two groups of positioning slide rails (2) are matched and mounted on the mounting base (1), the storage box (3) is positioned and slidingly mounted on the mounting base (1) through the positioning slide rail (2), the supporting shaft (4) is rotatably mounted on the storage box (3), the positioning chuck (5) is coaxially mounted on the supporting shaft (4), the positioning chuck (5) is positioned in a groove cavity of the storage box (3), the driven bevel gear (6) is coaxially mounted on the supporting shaft (4), the driving mechanism is mounted in a cavity of the mounting base (1), and the driving mechanism is respectively matched and connected with the driven bevel gear (6) and the storage box (3), and the working mechanism is mounted on the mounting base (1).
The driving mechanism comprises a driving motor (7), a driving shaft (8), a mounting frame (9), a hollow shaft (10), a driving bevel gear (11) and a transmission mechanism, wherein the driving motor (7) is mounted in a cavity of the mounting base (1), one end of the driving shaft (8) is coaxially mounted at the output end of the driving motor (7), the other end of the driving shaft (8) is rotatably mounted on the mounting base (1), the mounting frame (9) is mounted on the containing box (3) in a matched manner, the hollow shaft (10) is rotatably mounted on the mounting frame (9), a polygonal inner cavity is formed in the hollow shaft (10), the driving bevel gear (8) is connected with the polygonal inner cavity of the hollow shaft (10) in a matched transmission manner, the driving bevel gear (11) is coaxially mounted on the hollow shaft (10), the driving bevel gear (11) is in meshed connection with the driven bevel gear (6), and the transmission mechanism is mounted in the cavity of the mounting base (1) and is respectively connected with the driving shaft (8) and the containing box (3) in a matched manner.
The transmission mechanism comprises mounting columns (12), transmission beams (13), transmission crankshafts (14) and a linkage mechanism, wherein two groups of mounting columns (12) are matched and mounted on the storage box (3), the transmission beams (13) are mounted on the two groups of mounting columns (12), the transmission crankshafts (14) are rotationally mounted inside a cavity of the mounting base (1), the transmission crankshafts (14) are matched and slidingly connected with the inner grooves of the transmission beams (13), and the linkage mechanism is mounted inside the cavity of the mounting base (1) and is matched and connected with the transmission crankshafts (14) and the driving shaft (8) respectively.
2. The high-precision polishing device for parts of semiconductor inspection equipment according to claim 1, wherein the linkage mechanism comprises a mounting shaft (15), a fixed seat (16), a worm (17), a worm wheel (18) and a conduction mechanism, the mounting shaft (15) is rotatably mounted in a cavity of the mounting base (1), the fixed seat (16) is mounted in the cavity of the mounting base (1), the mounting shaft (15) is rotatably connected with the fixed seat (16) in a matched manner, the worm (17) is coaxially mounted on the mounting shaft (15), the worm wheel (18) is coaxially mounted on a transmission crankshaft (14), the worm wheel (18) is in meshed transmission connection with the worm (17), and the conduction mechanism is respectively connected with the mounting shaft (15) and the driving shaft (8) in a matched manner.
3. The high-precision polishing device for parts of semiconductor inspection equipment according to claim 2, wherein the transmission mechanism comprises a driving sprocket (19), a driven sprocket (20) and a chain (21), the driving sprocket (19) is coaxially mounted on the driving shaft (8), the driven sprocket (20) is coaxially mounted on the mounting shaft (15), and the chain (21) is respectively engaged with the driving sprocket (19) and the driven sprocket (20) for transmission connection.
4. The high-precision polishing device for parts of semiconductor inspection equipment according to claim 1, wherein the working mechanism comprises a power motor (22), a power shaft (23), a nut (24), a polishing wheel (25) and a supporting mechanism, the power motor (22) is installed on the supporting mechanism, the power shaft (23) is coaxially installed at the output end of the power motor (22), the nut (24) is in threaded connection with the power shaft (23) in a matched mode, and the polishing wheel (25) is coaxially installed on the power shaft (23).
5. The high-precision polishing device for parts of semiconductor inspection equipment according to claim 4, wherein the supporting mechanism comprises a cylinder (26) and a connecting seat (27), the cylinder (26) is installed on the installation base (1), the connecting seat (27) is installed at the output end of the cylinder (26), the power motor (22) is installed on the connecting seat (27) in a matched mode, and the power shaft (23) is connected with the connecting seat (27) in a matched mode in a rotating mode.
6. The high-precision polishing apparatus for parts of semiconductor inspection equipment according to claim 1, further comprising adjustment legs (28), wherein a plurality of sets of the adjustment legs (28) are mounted on the mounting base (1) in a mating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321358600.6U CN220260573U (en) | 2023-05-31 | 2023-05-31 | High-precision polishing device for parts of semiconductor detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321358600.6U CN220260573U (en) | 2023-05-31 | 2023-05-31 | High-precision polishing device for parts of semiconductor detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220260573U true CN220260573U (en) | 2023-12-29 |
Family
ID=89300544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321358600.6U Active CN220260573U (en) | 2023-05-31 | 2023-05-31 | High-precision polishing device for parts of semiconductor detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220260573U (en) |
-
2023
- 2023-05-31 CN CN202321358600.6U patent/CN220260573U/en active Active
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