CN220253224U

CN220253224U - A moulding-die tool for semiconductor production and processing

Info

Publication number: CN220253224U
Application number: CN202321235912.8U
Authority: CN
Inventors: 孙帅伟
Original assignee: Suzhou Greeming Electronic Technology Co ltd
Current assignee: Suzhou Greeming Electronic Technology Co ltd
Priority date: 2023-05-22
Filing date: 2023-05-22
Publication date: 2023-12-26
Anticipated expiration: 2033-05-22

Abstract

The utility model discloses a die pressing jig for semiconductor production and processing, which relates to the technical field of semiconductor production and processing jigs and comprises an L-shaped processing seat, wherein a semiconductor chip is clamped and fixed on a table top of the L-shaped processing seat through a clamping assembly, a sliding block b is slidably connected in a sliding groove b of the front side wall of the L-shaped processing seat, the front end of the sliding block b is fixedly connected with a movable plate, the middle part of the top end of the L-shaped processing seat is fixedly provided with an electric push rod, the telescopic end of the electric push rod extends into the sliding groove b and is connected with the top end of the sliding block b, the movable plate is fixedly connected to the outer side of a U-shaped rod, and two symmetrically arranged mounting plates are movably sleeved on the outer side of the U-shaped rod.

Description

A moulding-die tool for semiconductor production and processing

Technical Field

The utility model relates to the technical field of semiconductor production and processing tools, in particular to a compression mold tool for semiconductor production and processing.

Background

In the testing process of a semiconductor, a die jig is required to shape a chip pin, however, when a pressure head is damaged or deformed, the shaping effect of the pin can be affected, so that the chip pin needs to be replaced in time. However, the existing pressing mold jig has a non-detachable structure between the pressing head and the mounting main body, so that when the pressing head is damaged, the pressing head is inconvenient to replace, secondly, only a single pressing head is adopted to press and shape pins of a chip, the pressing and shaping can be carried out on different positions of pins at two ends of the chip through adjustment, and further the application range is limited.

Disclosure of Invention

The present utility model is directed to a pressing mold for semiconductor manufacturing process, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a die jig for semiconductor production and processing, includes L shape processing seat, carry out the centre gripping fixedly through clamping assembly on the mesa of L shape processing seat to semiconductor chip, sliding connection's slider b is slided in the preceding lateral wall spout b of L shape processing seat, slider b's front end rigid coupling has the movable plate, the top middle part of L shape processing seat is fixed with electric putter, electric putter's flexible end extends to spout b in and links to each other with slider b's top, the movable plate rigid coupling is in the outside of U-shaped pole, the outside movable sleeve of U-shaped pole is equipped with the mounting panel of two symmetry settings, all there is the pressure head through the clamping assembly joint in the bottom slot of mounting panel, be connected with adjusting part between two mounting panels and the movable plate.

Preferably, the clamping assembly comprises clamping plates which are arranged symmetrically on the surface of the L-shaped processing seat in a sliding mode, sliding blocks a with vertical sections in inverted T-shaped structures are fixed at the bottom ends of the clamping plates, and the two sliding blocks a are connected in sliding grooves a formed in the surface of the L-shaped processing seat in a sliding mode.

Preferably, two sliding blocks a are connected with two bidirectional screws in a spiral transmission manner, the bidirectional screws are rotationally connected in the sliding groove a, one ends of the bidirectional screws extend to the outer side of the L-shaped processing seat and are fixedly connected with handles, and hand-screwed nuts a which are in spiral connection with the outer sides of the bidirectional screws are arranged between the handles and the L-shaped processing seat.

Preferably, the clamping assembly comprises inverted L-shaped clamping rods which are movably inserted on two side walls of the mounting plate, one ends of opposite inclined planes of the two inverted L-shaped clamping rods are movably clamped in outer clamping grooves of the pressure head, and the two side walls of the mounting plate are connected with the inverted L-shaped clamping rods through springs.

Preferably, the adjusting component comprises hinge rods hinged to the top ends of the mounting plates, and the top ends of the two hinge rods are hinged to the outer sides of the same movable block.

Preferably, the movable block is connected with a hand screw rod in a spiral transmission manner, the bottom end of the hand screw rod is rotationally connected to the movable plate, and the outer side of the hand screw rod is further connected with a hand screw nut b in a spiral manner.

Compared with the prior art, the utility model has the beneficial effects that:

1. the clamping assembly is utilized, so that the semiconductor chip can be clamped and fixed conveniently and quickly, and the semiconductor chip with different sizes can be clamped and fixed, and the application range is wide;

2. the clamping assembly is utilized, so that the disassembly and assembly operation between the pressure head and the mounting plate can be conveniently and rapidly carried out, the disassembly and assembly efficiency is greatly improved, and convenience is brought to the replacement of the pressure head;

3. utilize adjusting part, can conveniently adjust the distance between two mounting panels, and then can exert pressure the plastic in the different positions of semiconductor chip's both ends pin department, improve the application range of this moulding-die tool greatly.

Drawings

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic view of the components of the clamping assembly machine of the present utility model;

fig. 3 is a schematic view of the structure of each part of the clamping assembly of the present utility model.

In the figure: 1. an L-shaped processing seat; 2. a clamping assembly; 21. a clamping plate; 22. a sliding block a; 23. a bidirectional screw; 24. a handle; 25. a nut a is screwed by hand; 3. a sliding block b; 31. a moving plate; 32. an electric push rod; 33. a U-shaped rod; 34. a mounting plate; 35. a pressure head; 4. a clamping assembly; 41. an inverted L-shaped clamping rod; 42. a spring; 5. an adjustment assembly; 51. a hinge rod; 52. a movable block; 53. screwing the screw rod by hand; 54. and (5) manually screwing the nut b.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1-3, the present utility model provides a technical solution: a die jig for semiconductor production and processing comprises an L-shaped processing seat 1, a sliding block b3 which is in sliding connection with a sliding groove b on the front side wall of the L-shaped processing seat 1, a moving plate 31 is fixedly connected to the front end of the sliding block b3, an electric push rod 32 is fixed to the middle of the top end of the L-shaped processing seat 1, the telescopic end of the electric push rod 32 extends into the sliding groove b and is connected with the top end of the sliding block b3, the moving plate 31 is fixedly connected to the outer side of a U-shaped rod 33, two symmetrically arranged mounting plates 34 are movably sleeved on the outer side of the U-shaped rod 33, and the sliding block b3 plays a role in enabling the moving plate 31 to stably drive two pressure heads 35 to move downwards so as to press and shape pins at two ends of a semiconductor chip.

The clamping assembly 2 is used for clamping and fixing the semiconductor chip on the table top of the L-shaped processing seat 1, the clamping assembly 2 comprises clamping plates 21 which are arranged symmetrically on the table top of the L-shaped processing seat 1 in a sliding mode, sliding blocks a22 with vertical sections in inverted T-shaped structures are fixed at the bottom ends of the clamping plates 21, the two sliding blocks a22 are in sliding connection with sliding grooves a formed in the table top of the L-shaped processing seat 1, a bidirectional screw 23 is connected to the two sliding blocks a22 in a spiral transmission mode, the bidirectional screw 23 is rotationally connected in the sliding grooves a, one end of the bidirectional screw 23 extends to the outer side of the L-shaped processing seat 1 and is fixedly connected with a handle 24, a hand-screwed nut a25 which is in spiral connection with the outer side of the bidirectional screw 23 is arranged between the handle 24 and the L-shaped processing seat 1, a protection pad can be arranged on the clamping surface of the clamping plates 21, and meanwhile the two clamping plates 21 can move relatively, so that the chip can be clamped and fixed.

In this embodiment, the nut a25 is screwed by loosening the hand, and the bidirectional screw 23 is rotated by the handle 24, so that the two clamping plates 21 relatively move to each other due to the screw transmission connection between the bidirectional screw 23 and the two sliding blocks a22, and the chips can be clamped and fixed, and meanwhile, the chips with different sizes can be clamped and fixed.

Example two

In this embodiment two, referring to fig. 3, the bottom slot of the mounting plate 34 in the illustration is clamped with the pressure head 35 by the clamping assembly 4, the clamping assembly 4 includes two inverted L-shaped clamping rods 41 movably inserted on two side walls of the mounting plate 34, one ends of opposite inclined surfaces of the two inverted L-shaped clamping rods 41 are movably clamped in the outer clamping slots of the pressure head 35, two side walls of the mounting plate 34 are connected with the inverted L-shaped clamping rods 41 by springs 42, one ends of the inclined surfaces of the inverted L-shaped clamping rods 41 are not completely clamped in the clamping slots, and are protruded, so that the pressure head 35 can abut against the two inclined surfaces when the pressure head 35 is inserted from the slot, and the inverted L-shaped clamping rods 41 clamp the pressure head 35 under the action of the springs 42.

In this embodiment, when installing the pressure head 35, the pressure head 35 can be inserted into the bottom slot of the mounting plate 34, so that the top end of the pressure head 35 can extrude the two inverted-L-shaped clamping rods 41, and the inclined surface one end of the inverted-L-shaped clamping rods 41 can be clamped in the clamping groove of the pressure head 35 under the action of the matching spring 42, and the quick installation and fixation of the pressure head 35 are realized.

Example III

In the third embodiment, referring to fig. 3, an adjusting component 5 is connected between two mounting plates 34 and a moving plate 31 in the first embodiment, the adjusting component 5 includes hinge rods 51 hinged at the top ends of the mounting plates 34, the top ends of the two hinge rods 51 are hinged at the outer side of the same movable block 52, a hand screw 53 is connected to the movable block 52 in a screw driving manner, the bottom end of the hand screw 53 is rotatably connected to the moving plate 31, a hand screw nut b54 is further connected to the outer side of the hand screw 53 in a screw driving manner, and after the hand screw nut b54 is locked, the hand screw 53 is effectively prevented from loosening and rotating.

In this embodiment, the hand screw 53 can be further rotated by loosening the hand screw nut b54, and the movable block 52 is in screw transmission connection with the hand screw 53, so as to cooperate with the functions of the two hinge rods 51, so that the two mounting plates 34 can drive the distance between the two pressure heads 35 to adjust, and further, the pressure can be applied to different positions of the pins at the two ends of the semiconductor chip for shaping, thereby greatly improving the application range of the compression mold jig.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A moulding-die tool for semiconductor production processing, includes L shape processing seat (1), its characterized in that: the table top of the L-shaped processing seat (1) is clamped and fixed with a semiconductor chip through a clamping component (2), a sliding block b (3) is slidably connected in a sliding groove b on the front side wall of the L-shaped processing seat (1), a moving plate (31) is fixedly connected at the front end of the sliding block b (3), an electric push rod (32) is fixed in the middle of the top end of the L-shaped processing seat (1), the telescopic end of the electric push rod (32) extends into the sliding groove b and is connected with the top end of the sliding block b (3), the movable plate (31) is fixedly connected to the outer side of the U-shaped rod (33), two symmetrically arranged mounting plates (34) are movably sleeved on the outer side of the U-shaped rod (33), pressure heads (35) are clamped in bottom end slots of the mounting plates (34) through clamping assemblies (4), and an adjusting assembly (5) is connected between the two mounting plates (34) and the movable plate (31).

2. The die jig for semiconductor manufacturing process according to claim 1, wherein: the clamping assembly (2) comprises clamping plates (21) which are arranged on the table top of the L-shaped processing seat (1) in a sliding mode, sliding blocks a (22) with vertical sections of inverted T-shaped structures are fixed at the bottom ends of the clamping plates (21), and the two sliding blocks a (22) are in sliding connection with sliding grooves a formed in the table top of the L-shaped processing seat (1).

3. The die jig for semiconductor manufacturing process according to claim 2, wherein: the two sliding blocks a (22) are connected with a bidirectional screw rod (23) in a spiral transmission manner, the bidirectional screw rod (23) is rotationally connected in the sliding groove a, one end of the bidirectional screw rod (23) extends to the outer side of the L-shaped processing seat (1) and is fixedly connected with a handle (24), and a hand-screwed nut a (25) which is in spiral connection with the outer side of the bidirectional screw rod (23) is arranged between the handle (24) and the L-shaped processing seat (1).

4. The die jig for semiconductor manufacturing process according to claim 1, wherein: the clamping assembly (4) comprises inverted L-shaped clamping rods (41) which are movably inserted into two side walls of the mounting plate (34), one ends of opposite inclined planes of the two inverted L-shaped clamping rods (41) are movably clamped in outer clamping grooves of the pressure head (35), and two side walls of the mounting plate (34) are connected with the inverted L-shaped clamping rods (41) through springs (42).

5. The die jig for semiconductor manufacturing process according to claim 1, wherein: the adjusting assembly (5) comprises hinge rods (51) hinged to the top ends of the mounting plates (34), and the top ends of the two hinge rods (51) are hinged to the outer sides of the same movable block (52).

6. The die jig for semiconductor manufacturing process according to claim 5, wherein: the movable block (52) is connected with a hand screw rod (53) in a spiral transmission manner, the bottom end of the hand screw rod (53) is rotatably connected to the movable plate (31), and the outer side of the hand screw rod (53) is further connected with a hand screw nut b (54) in a spiral manner.