CN220252529U

CN220252529U - Computer heat abstractor

Info

Publication number: CN220252529U
Application number: CN202321439104.3U
Authority: CN
Inventors: 江东坡; 江政国
Original assignee: Yichang Haizhuang Electronic Technology Co ltd
Current assignee: Yichang Haizhuang Electronic Technology Co ltd
Priority date: 2023-06-07
Filing date: 2023-06-07
Publication date: 2023-12-26
Anticipated expiration: 2033-06-07

Abstract

The utility model discloses a computer heat dissipation device, comprising: the computer case comprises a case body, wherein a side radiating net is fixedly connected with the left surface of the case body, a large switch button is connected with the front surface of the case body in a sliding manner, an air supply device comprises a radiating fan, a rotating motor and a safety net, the outer surface of the rotating motor is rotationally connected with the radiating fan, one side, close to the rotating motor, of the safety net is fixedly connected with the side radiating net, and is of a heat absorption structure, the heat absorption structure comprises a semiconductor refrigerating sheet, a water tank and a water inlet pipe, one side, far away from the radiating fan, of the water tank is fixedly connected with the water inlet pipe, the upper surface of the water inlet pipe is connected with a cover in a sliding manner, and through the structure, the large-scale rapid cooling of the computer case can be realized, dust accumulation in the case body is difficult, and a large amount of space is saved at the rear side of the case body.

Description

Computer heat abstractor

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a computer heat dissipation device.

Background

The chassis is used as a part of computer accessories and mainly plays a role in placing and fixing the accessories of each computer, and generally comprises a shell, various switches, a bracket and the like, so that the chassis plays a role in supporting and protecting, and can also play a role in shielding electromagnetic radiation, dissipating heat and the like.

In the prior art, the cooling fan is used for blowing and radiating, the cooling fan is placed between the conveniently-detachable baffle nets, the baffle nets are designed into a detachable structure, so that the cleaning and replacement of the cooling device are facilitated, however, the number and the power of internal devices of a computer are greatly improved, the cooling fan outside the case cannot be used for cooling the inside of the case effectively, dust is easy to deposit in the case and the inside of the case is not easy to clean, and meanwhile, the rear side of the case occupies a large amount of space.

Disclosure of Invention

The utility model aims at solving at least one of the technical problems in the prior art, and provides a computer heat dissipation device, wherein one side of a case is connected with a heat absorption adsorption protrusion and a heat absorption column through a semiconductor refrigeration sheet to greatly absorb heat generated in the case, and the other side of the case is used together with a side heat dissipation net, so that the safe use of a heat dissipation fan is ensured, external air and internal air are subjected to heat exchange, the case is further cooled and dissipated, meanwhile, the fan can directly blow internal dust impurities to the outside of the case, the cleaning times of the case are reduced, the protrusion can adsorb adhered water drops, and the water drops volatilize through the heat dissipation fan.

In order to achieve the above object, the present utility model further provides a heat dissipation device for a computer, including: the device comprises a case, wherein a side heat dissipation net is fixedly connected to the left surface of the case, a large switch button is connected to the front surface of the case in a sliding manner, and an electric wire is connected to the right surface of the side heat dissipation net in the middle in a sliding manner;

the air supply device comprises a cooling fan, a rotating motor and a safety net, wherein the outer surface of the rotating motor is rotationally connected with the cooling fan, and one side, close to the rotating motor, of the safety net is fixedly connected with the lateral cooling net;

the heat absorption structure comprises a semiconductor refrigerating sheet, a water tank and a water inlet pipe, wherein one side, far away from a cooling fan, of the water tank is fixedly connected with the water inlet pipe, the upper surface of the water inlet pipe is connected with a cover in a sliding manner, and one side, far away from a switch big button, of the water tank is fixedly connected with a water outlet pipe.

In a preferred scheme, the number of the side heat dissipation networks is multiple and the side heat dissipation networks are distributed up and down, and the length of the side heat dissipation networks is the same as that of the chassis.

In the preferred scheme, one side of the electric wire far away from the rotating motor is fixedly connected with the case, and the cooling fan is positioned in the safety net.

In the preferred scheme, one side of the electric wire far away from the lateral heat dissipation net is fixedly connected with the rotating motor.

In a preferred scheme, one side of the semiconductor refrigeration sheet close to the side heat dissipation net is fixedly connected with heat absorption adsorption protrusions, and the number of the heat absorption adsorption protrusions is a plurality of rectangular arrays.

In a preferred scheme, one side of the semiconductor refrigeration sheet, which is close to the cooling fan, is fixedly connected with heat absorption columns, and the number of the heat absorption columns is a plurality of rectangular arrays.

In the preferred scheme, the right surface of machine case and semiconductor refrigeration piece fixed connection, the side that keeps away from side heat dissipation net of semiconductor refrigeration piece and water tank sliding connection.

In the preferred scheme, one side of the water outlet pipe far away from the water tank is in sliding connection with the cover, and the length of the water tank is the same as that of the case.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described below with reference to the drawings and examples;

FIG. 1 is a schematic diagram of the whole structure of a heat dissipating device of a computer according to the present utility model;

FIG. 2 is a front view of the whole structure of a heat dissipating device of a computer according to the present utility model;

FIG. 3 is a schematic diagram of a blower of a heat dissipating device of a computer according to the present utility model;

fig. 4 is a schematic diagram of a heat absorption structure of a heat dissipation device of a computer according to the present utility model.

Legend description:

1. a chassis; 2. a side heat dissipation net; 3. a heat absorbing adsorption protrusion; 4. a heat absorption column; 5. a heat radiation fan; 6. a water tank; 7. a water inlet pipe; 8. a cover; 9. a water outlet pipe; 10. a large button is opened and closed; 11. a rotating motor; 12. a safety net; 13. an electric wire; 14. semiconductor refrigerating sheet.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

Referring to fig. 1 to 4, a heat dissipating device for a computer according to an embodiment of the present utility model includes: the case 1, the left surface fixedly connected with side heat dissipation net 2 of case 1, the quantity of side heat dissipation net 2 is a plurality of and distributes from top to bottom, and the length of side heat dissipation net 2 is the same with case 1 length, and the front surface sliding connection of case 1 has switch big button 10, and the right surface sliding connection of middle part side heat dissipation net 2 has electric wire 13.

The air supply device comprises a cooling fan 5, a rotating motor 11 and a safety net 12, wherein one side, far away from the rotating motor 11, of an electric wire 13 is fixedly connected with the chassis 1, one side, far away from the side cooling net 2, of the electric wire 13 is fixedly connected with the rotating motor 11, the outer surface of the rotating motor 11 is rotationally connected with the cooling fan 5, one side, close to the rotating motor 11, of the safety net 12 is fixedly connected with the side cooling net 2, and the cooling fan 5 is located inside the safety net 12.

The heat absorption structure comprises a semiconductor refrigerating sheet 14, a water tank 6 and a water inlet pipe 7, wherein the right surface of the case 1 is fixedly connected with the semiconductor refrigerating sheet 14, one side, close to the side radiating net 2, of the semiconductor refrigerating sheet 14 is fixedly connected with a heat absorption adsorption protrusion 3, the number of the heat absorption adsorption protrusions 3 is multiple and rectangular arrays, one side, close to the radiating fan 5, of the semiconductor refrigerating sheet 14 is fixedly connected with a heat absorption column 4, the number of the heat absorption columns 4 is multiple and rectangular arrays, one side, far away from the side radiating net 2, of the semiconductor refrigerating sheet 14 is in sliding connection with the water tank 6, one side, far away from the radiating fan 5, of the water tank 6 is fixedly connected with the water inlet pipe 7, the upper surface of the water inlet pipe 7 is in sliding connection with a cover 8, one side, far away from the switch big button 10, of the water outlet pipe 9 is in sliding connection with the cover 8, and the length of the water tank 6 is identical to the case 1.

Working principle: when the switch big button 10 is opened, the whole heat radiation system is started simultaneously, the air supply device blows air into the box body, the heat radiation fan 5 is arranged in the lateral heat radiation net 2 and the safety net 12, the use safety of the heat radiation fan 5 is ensured, the heat absorption structure works simultaneously, the heat absorption column 4 connected with the semiconductor refrigerating sheet 14 is directly close to the main heating device in the box body 1, the heat is greatly absorbed, meanwhile, the heat absorption adsorption protrusion 3 and the semiconductor refrigerating sheet 14 further absorb the heat of the box body 1, one side, far away from the box body 1, of the semiconductor refrigerating sheet 14 is connected with the water tank 6, and the semiconductor refrigerating sheet 14 is cooled by water in the water tank 6.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims

1. A computer heat sink, comprising: the intelligent power supply device comprises a case (1), wherein a side heat dissipation net (2) is fixedly connected to the left surface of the case (1), a large switch button (10) is connected to the front surface of the case (1) in a sliding manner, and an electric wire (13) is connected to the right surface of the side heat dissipation net (2) in the middle in a sliding manner;

the air supply device comprises a cooling fan (5), a rotating motor (11) and a safety net (12), wherein the outer surface of the rotating motor (11) is rotationally connected with the cooling fan (5), and one side, close to the rotating motor (11), of the safety net (12) is fixedly connected with the side cooling net (2);

the heat absorption structure comprises a semiconductor refrigerating sheet (14), a water tank (6) and a water inlet pipe (7), wherein the water inlet pipe (7) is fixedly connected to one side, far away from a cooling fan (5), of the water tank (6), a cover (8) is slidably connected to the upper surface of the water inlet pipe (7), and a water outlet pipe (9) is fixedly connected to one side, far away from a large switch button (10), of the water tank (6).

2. The heat dissipation device for computer according to claim 1, wherein the number of the side heat dissipation net (2) is plural and distributed vertically, and the length of the side heat dissipation net (2) is the same as the length of the chassis (1).

3. A computer heat sink according to claim 1, wherein the side of the wire (13) remote from the rotary motor (11) is fixedly connected to the chassis (1), and the heat dissipating fan (5) is located inside the safety net (12).

4. A computer heat sink according to claim 1, characterized in that the side of the wire (13) remote from the lateral heat sink (2) is fixedly connected to the rotating motor (11).

5. A heat dissipation device for a computer according to claim 1, wherein a side of the semiconductor refrigeration sheet (14) close to the lateral heat dissipation net (2) is fixedly connected with heat absorption protrusions (3), and the number of the heat absorption protrusions (3) is a plurality of rectangular arrays.

6. A heat dissipation device for a computer according to claim 1, wherein a side of the semiconductor refrigeration sheet (14) close to the heat dissipation fan (5) is fixedly connected with heat absorption columns (4), and the number of the heat absorption columns (4) is a plurality of rectangular arrays.

7. The computer heat dissipation device according to claim 1, wherein the right surface of the chassis (1) is fixedly connected with a semiconductor refrigeration piece (14), and one side of the semiconductor refrigeration piece (14) far away from the side heat dissipation net (2) is slidably connected with the water tank (6).

8. A computer radiator according to claim 1, characterized in that the side of the outlet pipe (9) remote from the water tank (6) is slidingly connected to the cover (8), the length of the water tank (6) being the same as the length of the cabinet (1).