CN220235272U - Radio frequency power supply - Google Patents

Abstract

The utility model provides a radio frequency power supply, which relates to the technical field of semiconductors and comprises the following components: the cooling shell is arranged inside the radio frequency power supply; the cold source component is arranged in the cooling shell, and a vacuum chamber can be formed between the inner wall of the cooling shell and the outer wall of the cold source component; the circuit board is arranged on one side of the cold source component facing the vacuum chamber; the problem of in prior art in order to the cooling of radio frequency power supply lead to the inside condensation of radio frequency power supply to appear easily and damage is solved.

Description

Radio frequency power supply

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a radio frequency power supply.

Background

The rf power supply is a core component of semiconductor processing equipment that is used primarily to generate and sustain a plasma. The output power of the radio frequency power supply is generally larger, a large amount of heat can be generated in the working process, therefore, the radio frequency power supply is generally required to be cooled by water, and therefore, higher requirements are put forward on the temperature and humidity of the power supply using environment and the temperature of cooling water.

Currently, some manufacturers perform waterproof treatment on internal key circuits of a radio frequency power supply, and passively protect the internal key circuits of the radio frequency power supply. However, the practical application effect is poor, the accident of burning the radio frequency power supply due to condensation still occurs, and the waterproof treatment influences the heat dissipation effect of key devices of the radio frequency power supply, so that the overheat is easy to cause and the service life of the devices is directly influenced.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art, provides a radio frequency power supply, and solves the problem that the inside of the radio frequency power supply is easy to be condensed and damaged due to cooling of the radio frequency power supply in the prior art.

In order to achieve the above object, the present utility model provides a radio frequency power supply comprising:

the cooling shell is arranged inside the radio frequency power supply;

the cold source component is arranged in the shell, and a vacuum chamber can be formed between the inner wall of the cooling shell and the outer wall of the cold source component;

and the circuit board is arranged on one side of the cold source component, which faces the vacuum chamber.

Optionally, the radio frequency power supply further comprises a heating component, wherein the heating component is connected with the cold source component and is used for heating the cold source component.

Optionally, the cold source part includes the liquid cooling board, the inside of liquid cooling board is provided with the liquid cooling chamber, be connected with on the liquid cooling board with feed liquor pipe and the drain pipe of liquid cooling chamber intercommunication, the feed liquor pipe with the drain pipe runs through the cooling casing and outwards extends.

Optionally, the heating component is located outside the cooling shell and is used for heating the cooling medium in the liquid inlet pipe.

Optionally, the heating component includes a vortex heating wire, the vortex heating wire surrounds the periphery of the liquid inlet pipe, and forms a gap with the liquid inlet pipe, and the liquid inlet pipe is a metal pipe, so that the vortex heating wire performs vortex heating on the cooling medium in the liquid inlet pipe.

Optionally, a radio frequency module and a DC/DC power module are arranged on the circuit board, the circuit board is in contact with the surface of the cold source component, a cable is connected to the circuit board, and the cable penetrates through a vacuum penetrating sealing piece arranged on the outer wall of the shell and extends outwards.

Optionally, a heat conducting layer is arranged between the circuit board and the cold source component.

Optionally, a vacuum air suction hole is arranged on the cooling shell, and a supporting component is connected between the inner wall of the cooling shell and the outer wall of the cold source component.

Optionally, a plurality of temperature and humidity sensors and a processing module are arranged in the radio frequency power supply, the temperature and humidity sensors are respectively used for detecting temperature information and humidity information of a plurality of positions in the radio frequency power supply, and the processing module is used for controlling the temperature of the cold source component according to the temperature information and the humidity information.

Optionally, the processing module is further configured to control the temperature of the cold source component according to the radio frequency power of the radio frequency power source, so that the larger the radio frequency power is, the lower the temperature of the cold source component is.

The utility model provides a radio frequency power supply, which has the beneficial effects that: the inside of this radio frequency power supply provides the cold source for radio frequency power supply's circuit board through the cold source part, realize the cooling to radio frequency power supply's key device, be provided with the casing in the outside of cold source part, can form vacuum chamber between the inner wall of cooling casing and the outer wall of cold source part, utilize vacuum chamber to get rid of the air of cold source part periphery, make cold source part periphery do not have vapor, the medium of condensation obtains effectual getting rid of, solve the condensation problem from the root, also can avoid the air to cause the casing internal pressure too big because of the thermal expansion, and the vacuum environment in the vacuum chamber can effectively restrain heat transfer, prevent heat to the sealing layer diffusion, the risk of condensation on the sealing layer has been reduced.

Additional features and advantages of the utility model will be set forth in the detailed description which follows.

Drawings

The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular descriptions of exemplary embodiments of the utility model as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the utility model.

Fig. 1 shows a schematic diagram of a cooling housing and its internal structure of a radio frequency power supply according to an embodiment of the present utility model.

Fig. 2 shows a schematic structural diagram of a heating assembly of a radio frequency power supply according to an embodiment of the present utility model.

Fig. 3 shows a schematic diagram of a cooling process of a radio frequency power supply according to an embodiment of the utility model.

Fig. 4 shows a schematic diagram of the overall structure of a radio frequency power supply according to an embodiment of the utility model.

Reference numerals illustrate:

1. cooling the housing; 2. a cold source component; 3. a vacuum chamber; 4. a liquid inlet pipe; 5. a liquid outlet pipe; 6. a heating assembly; 7. a vortex heating wire; 8. a power frequency power supply; 9. a circuit board; 10. a cable; 11. vacuum penetration seals; 12. a heat conducting layer; 13. a vacuum pumping hole; 14. a support member; 15. a temperature and humidity sensor; 16. a radio frequency module; 17. a DC/DC power supply module; 18. a measurement module; 19. a processing module; 20. a communication module; 21. a housing.

Detailed Description

Preferred embodiments of the present utility model will be described in more detail below. While the preferred embodiments of the present utility model are described below, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

As shown in fig. 1, the present utility model provides a radio frequency power supply, including:

a cooling housing 1 disposed inside the radio frequency power supply;

a cold source component 2 arranged inside the cooling shell 1, wherein a vacuum chamber 3 can be formed between the inner wall of the cooling shell 1 and the outer wall of the cold source component 2;

and a circuit board 9 arranged on one side of the cold source component 2 facing the vacuum chamber.

Specifically, in the prior art, in order to prevent the radio frequency power supply from being damaged due to condensation caused by cooling the radio frequency power supply, a mode of performing waterproof treatment on a key circuit in the radio frequency power supply is adopted, so that not only is the effect poor, but also the heat dissipation of key devices of the radio frequency power supply can be influenced; in order to solve the technical problems, the inside of the radio frequency power supply provided by the utility model provides a cold source for the circuit board 9 of the radio frequency power supply through the cold source component 2, so that the cooling of key devices of the radio frequency power supply is realized, the cooling shell 1 is arranged at the outer side of the cold source component 2, a vacuum chamber 3 can be formed between the inner wall of the cooling shell 1 and the outer wall of the cold source component 2, the air at the periphery of the cold source component 2 is removed by utilizing the vacuum chamber 3, so that the periphery of the cold source component 2 is free from water vapor, condensed medium is effectively removed, the condensation problem is fundamentally solved, the excessive pressure in the cooling shell 1 caused by thermal expansion of the air can be avoided, the heat transfer can be effectively restrained by the vacuum environment in the vacuum chamber 3, the diffusion of the heat to the cooling shell 1 is prevented, and the condensation risk on the cooling shell 1 is reduced.

Optionally, the radio frequency power supply further comprises a heating component 6, and the heating component 6 is connected with the cold source component 2 and is used for heating the cold source component 2.

Specifically, the cold source component 2 is contacted with the circuit board, so that the circuit board and key components connected with the circuit board are cooled, and the internal temperature of the radio frequency power supply is prevented from being too high; the heating assembly 6 is used for heating the cold source component 2, avoiding the temperature of the cold source component 2 and the cooling shell 1 from being too low, and further preventing the gas from condensing around the cooling shell 1.

Optionally, the cold source component 2 includes the liquid cooling board, and the inside of liquid cooling board is provided with the liquid cooling chamber, is connected with on the liquid cooling board with liquid cooling chamber intercommunication feed liquor pipe 4 and drain pipe 5, and feed liquor pipe 4 and drain pipe 5 run through cooling shell 1 and outwards extend.

Specifically, the liquid inlet pipe 4 and the liquid outlet pipe 5 are communicated with the liquid cooling cavity and are respectively used for inputting and outputting a cooling medium, the liquid inlet pipe 4 and the liquid outlet pipe 5 penetrate through the cooling shell 1, and the periphery is welded with the outer wall of the cooling shell 1, so that sealing connection is realized.

In this embodiment, the liquid cooling plate is a water cooling plate, and the cooling medium is water.

Optionally, a heating assembly 6 is located outside the cooling housing 1 and is used to heat the cooling medium in the feed pipe 4.

Specifically, the heating component 6 is arranged on the outer side of the cooling shell 1, so that the temperature in the cooling shell 1 is prevented from being influenced during operation, the cooling effect is further influenced, the heating component heats the cooling medium in the liquid inlet pipe 4, the temperature of the cooling medium is controlled, and the condition that the cooling medium temperature is too low to cause too low temperature of the cold source component 2 and the cooling shell 1 is favorable for condensation is avoided.

Further, the heating component 6 can be heated by contact with the liquid inlet pipe 4 or non-contact heating.

Optionally, the heating component 6 includes a vortex heating wire 7, where the vortex heating wire 7 surrounds the periphery of the liquid inlet pipe 4 and forms a gap with the liquid inlet pipe 4, and the liquid inlet pipe 4 is a metal pipe, so that the vortex heating wire 7 performs vortex heating on the cooling medium in the liquid inlet pipe 4.

Specifically, as shown in fig. 2, the vortex heating wire 7 is spirally wound around the periphery of the liquid inlet pipe 4 and is not in contact with the liquid inlet pipe 4, so that vortex heating of the cooling medium in the liquid inlet pipe 4 is realized, the vortex heating mode belongs to non-contact heating, the cooling medium can be heated through the liquid inlet pipe 4, the electric heating wire does not need to be embedded in the pipe wall of the liquid inlet pipe 4 to increase the processing difficulty and the manufacturing cost, the non-contact heating of the vortex heating can reduce the temperature rise of the liquid inlet pipe 4, and the normal use of other components, sensors and the like connected on the electric heating wire is avoided, and the temperature of the liquid inlet pipe 4 is influenced by overhigh temperature.

In this embodiment, the liquid inlet pipe 4 and the liquid outlet pipe 5 are all copper pipes, the vortex heating wire 7 is a low-resistance coil, two ends of the vortex heating wire 7 are connected with vortex power supplies, and the vortex power supplies are all power frequency power supplies 8, so that a circuit can be simplified.

Optionally, a radio frequency module and a DC/DC power module are arranged on the circuit board, the circuit board is in contact with the surface of the cold source component, and a cable is connected to the circuit board, penetrates through a vacuum through sealing piece arranged on the outer wall of the cooling shell and extends outwards.

Specifically, the radio frequency module 16 is used for generating radio frequency power, the DC/DC power module 17 is used for converting input voltage into energy usable by the radio frequency module 16, the radio frequency module 16 and the DC/DC power module 17 are integrated on a circuit board as key heating devices, the circuit board 9 integrated with the radio frequency module 16 and the DC/DC power module 17 of the radio frequency power is a main heating structure of the radio frequency power, the circuit board 9 is in contact with the surface of the cold source component 2, and the cold source component 2 cools the cold source component to avoid the overhigh temperature; the cable 10 includes a signal wire, and the cable 10 passes through a vacuum feedthrough 11 (i.e., a vacuum feed through) mounted on the outer wall of the cooling case 1 and extends to the outside of the cooling case 1, ensuring the sealability of the cooling case 1.

As shown in fig. 4, optionally, the radio frequency power supply further includes:

a housing 21, wherein a measurement module 18, a processing module 19 and a communication module 20 are arranged inside the housing 21;

the measurement module 18 is configured to detect an output power of the radio frequency module 16;

the processing module 19 is configured to receive the measurement information of the measurement module 18 and control the output power of the radio frequency module 16;

the communication module 20 is used for transmitting control information to the processing module 19.

In particular, the measuring module 18, the processing module 19 and the communication module 20 may or may not be integrated on the circuit board 9.

In this embodiment, the measurement module 18 is configured to detect the output power of the rf power supply, i.e. the output power of the rf module 16; the processing module 19 processes the information acquired by the measuring module 18, controls the output power of the radio frequency module 16, stores the temperature and humidity conditions for generating condensation, and is used for judging whether condensation is generated or not so as to control the power of the heating assembly 6; the communication module 20 transmits control information to the processing module 19 through various interfaces, controls the output power of the radio frequency module 16 of the radio frequency power supply through the processing module 19, and also controls the heating assembly 6 to control the temperature of the cooling medium; the rf module 16 mainly generates rf power; the DC/DC power module 17 mainly performs rectifying filtering and the like on the input voltage, and converts the alternating voltage into energy usable by the radio frequency module 16; of these modules, the rf module 16 and the DC module are the portions where the heat generation amount is the greatest, and thus the cold source part 2 (shown as a dotted line box) is required to be cooled in real time; the temperature and humidity sensors 15 are arranged in the radio frequency power supply shell 21, and the temperature and humidity sensors 15 are connected to the processing module 19, so that the air environment parameters in the whole radio frequency power supply can be monitored in detail.

Optionally, a heat conducting layer 12 is arranged between the circuit board 9 and the heat sink member 2.

Specifically, the heat conduction layer 12 can improve the heat conduction efficiency between the circuit board 9 and the cold source component 2, and improve the cooling effect.

In this embodiment, the material of the heat conducting layer 12 is silicone grease, and the setting of the silicone grease increases the contact area between the cold source component 2 and the circuit board 9, thereby improving the heat conducting efficiency and the cooling effect.

In the present embodiment, the circuit board 9 is provided with mounting holes for fixing and positioning, and can be fastened to the surface of the heat sink member 2 by screws.

Optionally, a vacuum pumping hole 13 is provided on the cooling housing 1, and a supporting member 14 is connected between the inner wall of the cooling housing 1 and the outer wall of the cold source member 2.

Specifically, the vacuum pumping hole 13 is used for performing vacuum pumping operation on the cooling shell 1, and a vacuum chamber 3 is formed between the inner wall of the cooling shell 1 and the outer wall of the cold source component 2; the supporting parts 14 are arranged between the inner wall of the cooling shell 1 and the outer wall of the cold source part 2, play a role in supporting the cooling shell 1 and fixing the cold source part 2, the supporting parts 14 can be distributed on two sides of the cold source part 2, the number of the supporting parts 14 can be set according to actual needs, the supporting parts 14 are plate-shaped, two ends of one supporting part 14 are respectively provided with a first connecting lug and a second connecting lug, and the first connecting lug and the second connecting lug can be respectively fastened on the inner wall of the cooling shell 1 and the outer wall of the cold source part 2 through screws; the material of the supporting member 14 is a material having a larger specific heat capacity, so that the heat conduction performance between the heat sink member 2 and the cooling casing 1 due to the supporting member 14 is reduced as much as possible.

Optionally, a plurality of temperature and humidity sensors 15 and a processing module are arranged in the radio frequency power supply, the temperature and humidity sensors 15 are respectively used for detecting temperature information and humidity information of a plurality of positions in the radio frequency power supply, and the processing module is used for controlling the temperature of the cold source component 2 according to the temperature information and the humidity information.

Specifically, those skilled in the art know that under certain conditions of atmospheric pressure, the condition of condensing the water vapor is that the humidity of the air is high enough, the temperature difference between the condensation surface and the air is large enough, and only if the two conditions are satisfied at the same time, the condensation can be performed; the temperature of the cooling water of the radio frequency power supply is generally 20 ℃, and condensation occurs as long as the air humidity exceeds a certain value at the temperature; then, according to the temperature information and the humidity information of a plurality of positions in the radio frequency power supply, the temperature and humidity conditions for condensation in the radio frequency power supply can be conveniently calculated; the temperature information and the humidity information of a plurality of positions in the radio frequency power supply are monitored in real time through a plurality of temperature and humidity sensors 15, whether the temperature and humidity information reaches the temperature and humidity condition for generating condensation or not is judged according to the temperature information and the humidity information, the temperature of the cooling source component 2 is controlled when the temperature and humidity information reaches the temperature and humidity condition for generating condensation, the temperature of the cooling source component 2 is improved while the cooling effect is ensured, the temperature and humidity condition for generating condensation is damaged, and further the condensation in the radio frequency power supply is avoided.

Further, for the water cooling plate of the cold source component 2 in this embodiment, condensation will only occur when the temperature difference between the water cooling plate and the cooling housing 1 and the air is large, even if the temperature of the factory building environment in summer is less than 40 ℃, so the heating component 6 only needs to control the water cooling plate to be close to the temperature, condensation will not occur on the water cooling plate or the cooling housing 1, the temperature of the power interruption caused by the over-temperature alarm of the radio frequency power supply is generally above 50 ℃ and even reaches 65 ℃, so when the temperature and humidity information is judged to reach the temperature and humidity condition for generating condensation, the temperature of the cooling water can be completely increased through the heating component 6, and the condition that the over-temperature alarm of the radio frequency power supply and the condensation will not occur in the radio frequency power supply due to the over-temperature alarm of the water cooling component can not occur.

In this embodiment, the temperature and humidity sensors 15 are respectively disposed at a position in the rf power supply close to the housing 21 of the rf power supply, a position in the rf power supply close to each module thereof, an upstream of the heating element 6 on the liquid inlet pipe 4, a downstream of the heating element 6 on the liquid inlet pipe 4, and on the liquid outlet pipe 5; the arrangement of the temperature and humidity sensors 15 can monitor the air environment parameters inside the whole radio frequency power supply in detail, and is beneficial to improving the control precision of the control module.

Further, the temperature control of the radio frequency power supply is abnormal due to the damage of the temperature and humidity sensor 15, so that the temperature and humidity sensor 15 is arranged at a plurality of positions in the radio frequency power supply, the control precision is ensured, at least 2 identical temperature and humidity sensors 15 are arranged at each position, all the temperature and humidity sensors 15 are numbered, each position only uses the monitoring data of one temperature and humidity sensor 15, the other temperature and humidity sensor 15 at each position is used as a standby, and once the temperature and humidity sensor 15 in current use is abnormal, an alarm is sent out in time to warn a user to replace or maintain in time, and meanwhile, the standby temperature and humidity sensor 15 is switched to ensure the transmission of the monitoring data; the standby configuration mode of the temperature and humidity sensor 15 can greatly reduce temperature and humidity runaway caused by abnormality of the temperature and humidity sensor 15, such as burst of a radio frequency power supply, overheating of the heating component 6 and the like caused by temperature surge due to uncontrolled and continuous output of radio frequency power.

Optionally, the processing module is further configured to control the temperature of the cold source component 2 according to the radio frequency power of the radio frequency power source, so that the higher the radio frequency power is, the lower the temperature of the cold source component 2 is.

Specifically, from the perspective of preventing the over-temperature of the radio frequency power supply, the lower the temperature of cooling water is, the higher the cooling efficiency is, but the condition that the over-low water temperature can cause condensation is more easily achieved, so that the water temperature needs to be adjusted in real time, on one hand, the sufficient cooling effect of the radio frequency power supply is ensured, and on the other hand, the condensation is prevented; the processing module controls the temperature of the cold source component 2 according to the radio frequency power of the radio frequency power supply, in this embodiment, the heating component 6 heats the cooling water to control the temperature of the cold source component 2, under the control of the processing module, the heating component 6 adjusts the heating power according to the magnitude of the radio frequency power, the larger the radio frequency power is, the more the radio frequency power supply generates heat, at this time, the processing module controls the heating component 6 to reduce the heating power, and the specific regulation relationship can be calculated based on the following formula:

wherein,is the maximum power of the heating assembly 6, P _RF Is the actual output radio frequency power of the radio frequency power supply, +.>Is the maximum rf power of the rf power supply.

The regulation relation formula describes the relation of the heating power of the heating component 6 and the radio frequency power, and the regulation relation formula are inversely proportional regulation relation, so that the regulation relation formula is used for considering that the radio frequency power output by the radio frequency power supply can generate a large amount of heat, and is an equivalent heating source, and the regulation relation formula is used for regulating the power of the heating component 6 according to the magnitude of the radio frequency power.

As shown in fig. 3, the working procedure of the cooling system is as follows: starting the cooling system from the step 1, entering the step 2 for checking the state of the temperature and humidity sensor 15, and if the current temperature and humidity sensor 15 has abnormal data (no data, too large data or too small data), entering the step 3 for switching the standby temperature and humidity sensor 15 on one hand, and entering the step 4 on the other hand, giving an alarm for the abnormality of the temperature and humidity sensor 15 to a user to prompt the user to check and replace; the temperature and humidity sensor 15 collects the temperature of the cooling water of the liquid inlet pipe 4 at the upstream and downstream of the heating component 6, the temperature of the cooling water of the liquid outlet pipe 5, the temperature of the water cooling plate, the temperature and humidity of the air and the like in real time, the temperature information and the humidity information are transmitted to the processing module, the step 5 is carried out, whether the temperature information and the humidity information reach the temperature and humidity condition generating condensation is calculated according to the temperature information and the humidity information, if the temperature information and the humidity information do not reach the temperature and humidity condition generating condensation, the step 6 is carried out, the heating component 6 is closed, otherwise the step 7 is carried out, the heating component 6 begins to work, the temperature and humidity sensor 15 continues to detect in real time to obtain the temperature information and the humidity information, and therefore the intensity of the action of the heating component 6 can be tracked, namely the heating power of the heating component is regulated; then detecting the magnitude of the radio frequency power in step 8, and adjusting the heating power of the heating component 6 according to the magnitude of the radio frequency power in step 9; then, step 10 is carried out to judge whether the water temperature of the cooling water exceeds a set value, if so, the heating of the heating assembly 6 is stopped to prevent the over-temperature of the radio frequency power supply, otherwise, step 5 is carried out again to judge whether the temperature and humidity condition for generating condensation is reached, and then step 5 is carried out continuously.

Furthermore, the semiconductor process equipment can utilize the radio frequency power supply to generate and maintain plasma, the radio frequency power supply performs sealing surrounding and vacuum treatment on the cold source component 2 through the cooling shell 1, so as to remove a condensing medium, prevent heat transfer, avoid condensation and further protect the radio frequency power supply; the cooling system can control the temperature and humidity relationship inside the radio frequency power supply by controlling the temperature of the cold source component 2, so as to destroy the temperature and humidity condition for condensation, prevent the radio frequency power supply from condensation and protect the radio frequency power supply; and, the cooling system associates the radio frequency power of the radio frequency power supply with the temperature control of the cold source component 2, namely the heating power of the heating component 6, so that the accuracy of regulation and control is improved.

The foregoing description of embodiments of the utility model has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described.

Claims (10)

1. A radio frequency power supply, comprising:

the cooling shell is arranged inside the radio frequency power supply;

the cold source component is arranged in the cooling shell, and a vacuum chamber can be formed between the inner wall of the cooling shell and the outer wall of the cold source component;

and the circuit board is arranged on one side of the cold source component, which faces the vacuum chamber.

2. The rf power source of claim 1, further comprising a heating assembly coupled to the cold source component and configured to heat the cold source component.

3. The radio frequency power supply according to claim 2, wherein the cold source component comprises a liquid cooling plate, a liquid cooling cavity is arranged in the liquid cooling plate, a liquid inlet pipe and a liquid outlet pipe which are communicated with the liquid cooling cavity are connected to the liquid cooling plate, and the liquid inlet pipe and the liquid outlet pipe penetrate through the cooling shell and extend outwards.

4. A radio frequency power supply according to claim 3, wherein the heating assembly is located outside the cooling housing and is adapted to heat the cooling medium in the feed pipe.

5. The rf power supply of claim 4, wherein the heating assembly comprises a vortex heating wire surrounding the outer periphery of the liquid inlet tube and forming a gap with the liquid inlet tube, the liquid inlet tube being a metal tube such that the vortex heating wire performs vortex heating on the cooling medium in the liquid inlet tube.

6. The rf power supply of claim 1, wherein the circuit board is provided with an rf module and a DC/DC power module, the circuit board is in contact with the surface of the cold source component, and a cable is connected to the circuit board, and the cable penetrates through a vacuum penetration seal provided on the outer wall of the housing and extends outward.

7. The rf power supply of claim 6, wherein a thermally conductive layer is disposed between the circuit board and the cold source component.

8. The radio frequency power supply according to claim 1, wherein a vacuum pumping hole is provided on the cooling housing, and a supporting member is connected between an inner wall of the cooling housing and an outer wall of the cold source member.

9. The radio frequency power supply according to claim 1, wherein a plurality of temperature and humidity sensors and a processing module are arranged in the radio frequency power supply, the temperature and humidity sensors are respectively used for detecting temperature information and humidity information of a plurality of positions in the radio frequency power supply, and the processing module is used for controlling the temperature of the cold source component according to the temperature information and the humidity information.

10. The rf power source of claim 9, wherein the processing module is further configured to control the temperature of the cold source component based on the rf power of the rf power source such that the greater the rf power, the lower the temperature of the cold source component.