CN220235097U - Reusable high-precision circuit board patch packaging tool - Google Patents
Reusable high-precision circuit board patch packaging tool Download PDFInfo
- Publication number
- CN220235097U CN220235097U CN202321742040.4U CN202321742040U CN220235097U CN 220235097 U CN220235097 U CN 220235097U CN 202321742040 U CN202321742040 U CN 202321742040U CN 220235097 U CN220235097 U CN 220235097U
- Authority
- CN
- China
- Prior art keywords
- shell
- circuit board
- precision circuit
- reusable high
- fixedly arranged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 26
- 238000001125 extrusion Methods 0.000 claims abstract description 23
- 238000001179 sorption measurement Methods 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000013011 mating Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
Landscapes
- Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)
Abstract
The utility model provides a reusable high-precision circuit board patch packaging tool which comprises a shell, wherein an adsorption component is fixedly arranged at the upper end of the shell; the utility model discloses a circuit board, including shell, movable room, casing lower extreme fixed intercommunication is equipped with the burette, the lower extreme fixed intercommunication of burette is equipped with the mounting panel, the upper end is equipped with the movable room in the shell, the shell lower extreme is equipped with the glue room with the movable room intercommunication, the movable indoor activity is equipped with extrusion subassembly, and this structural design is simple can a plurality of repeated use the device accomplish the paster encapsulation to the circuit board, does not need to change multiple instrument, has consequently saved the time of changing the instrument to a certain extent to the efficiency of work has been improved.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to a reusable high-precision circuit board patch packaging tool.
Background
The manual patch packaging circuit board realizes patch packaging of the circuit board through repeated switching of different tools, so that the patch becomes complicated due to the fact that in the process of processing the circuit board, a repeated switching of different tools is needed, and therefore, a reusable high-precision patch packaging tool for the circuit board is needed to solve the problems.
Disclosure of Invention
In order to achieve the above purpose, the utility model provides a reusable high-precision circuit board patch packaging tool which comprises a shell, wherein an adsorption component is fixedly arranged at the upper end of the shell; the utility model discloses a circuit board, including shell, movable room, casing lower extreme fixed intercommunication is equipped with the burette, the lower extreme fixed intercommunication of burette is equipped with the mounting panel, the upper end is equipped with the movable room in the shell, the shell lower extreme is equipped with the glue room with the movable room intercommunication, the movable indoor activity is equipped with extrusion subassembly, and this structural design is simple can a plurality of repeated use the device accomplish the paster encapsulation to the circuit board, does not need to change multiple instrument, has consequently saved the time of changing the instrument to a certain extent to the efficiency of work has been improved.
Preferably, the extrusion assembly comprises a knob which is arranged on the surface of the shell through a bearing and a sliding column which is movably arranged in the movable chamber, wherein the inner wall of the knob is fixedly connected with a sliding block, the sliding block penetrates through the surface of the shell and slides on the surface of the shell, a sliding rail is fixedly arranged on the surface of the sliding column and is matched with the sliding block, a connecting rod is fixedly arranged at the lower end of the sliding column, an extrusion block is fixedly arranged at the lower end of the connecting rod, the sliding rail extends upwards around the sliding column, and the structure is simple and convenient in design, and can directly rotate to extrude glue from the glue chamber in the shell along a dropper.
Preferably, the diameter of the extrusion block is almost consistent with the diameter and the length of the movable chamber, and the rubber sealing ring is fixedly arranged on the side face of the extrusion block, so that the structural design is simple, when the extrusion block is used for extruding the glue chamber, the tightness is improved, and the pressure is improved to a certain extent, so that the glue is easier to extrude.
Preferably, the adsorption component comprises a fixed rod fixedly arranged on the surface of the upper end of the shell, and a sucker is fixedly arranged at the upper end of the fixed rod.
Preferably, the shell is close to the fixed screw thread structure that is equipped with of one end of dead lever, screw thread structure threaded connection has the visor, and this structural design is simple can play the effect of protection to a certain extent.
Preferably, the mounting plate is internally provided with a glue inlet chamber fixedly communicated with the dropper, the lower end of the glue inlet chamber is fixedly connected with a matching plate, a plurality of matching holes are formed in the surface of the matching plate, and the glue can be accurately dripped on the circuit board due to the simple structural design.
Compared with the prior art, the utility model has the beneficial effects that:
the time of repeatedly switching different tools can be saved in the manual patch packaging process by arranging the shell, the adsorption component, the extrusion component and the dropper in a matching manner, so that the working efficiency is improved to a certain extent, glue can be accurately dropped on the circuit board by arranging the mounting plate, the matching plate and the matching holes in a matching manner, and a certain protection effect can be achieved by arranging the protective cover and the thread structure.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic perspective view of the present utility model;
FIG. 3 is a schematic view of the extrusion assembly of the present utility model;
FIG. 4 is a schematic view of a mounting plate and mating plate structure of the present utility model.
In the figure: 1. a housing; 2. an extrusion assembly; 3. an adsorption assembly; 4. a protective cover; 11. a movable chamber; 12. a glue chamber; 13. a dropper; 14. a mounting plate; 141. matching plates; 142. a glue inlet chamber; 143. a mating hole; 21. a knob; 22. a slide block; 23. a sliding column; 231. a slide rail; 24. a connecting rod; 25. extruding a block; 31. a fixed rod; 32. a suction cup; 41. a thread structure.
Detailed Description
In order that the utility model may be more fully understood, a more particular description of the utility model will be rendered by reference to the appended drawings, in which several embodiments of the utility model are illustrated, but which may be embodied in different forms and are not limited to the embodiments described herein, which are, on the contrary, provided to provide a more thorough and complete disclosure of the utility model.
The present utility model will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-4, the device comprises a shell 1, wherein an adsorption component 3 is fixedly arranged at the upper end of the shell 1; the utility model discloses a circuit board packaging device, including shell 1, movable room 11, extrusion subassembly 2, the fixed intercommunication of shell 1 lower extreme is equipped with burette 13, the fixed intercommunication of lower extreme of burette 13 is equipped with mounting panel 14, the upper end is equipped with movable room 11 in the shell 1, shell 1 lower extreme and movable room 11 intercommunication are equipped with glue room 12, the activity is equipped with extrusion subassembly 2 in the movable room 11, and this structural design is simple can a plurality of repeated use the device accomplish the paster encapsulation to the circuit board, does not need to change multiple instrument, has consequently saved the time of changing the instrument to a certain extent to the efficiency of work has been improved.
Referring to fig. 3, the extruding assembly 2 includes a knob 21 rotatably disposed on the surface of the casing 1 through a bearing, and a sliding column 23 movably disposed in the movable chamber 11, a sliding block 22 fixedly connected with the inner wall of the knob 21, the sliding block 22 penetrating through the surface of the casing 1 and sliding on the surface of the casing 1, a sliding rail 231 fixedly disposed on the surface of the sliding column 23, the sliding rail 231 cooperates with the sliding block 22, a connecting rod 24 fixedly disposed at the lower end of the sliding column 23, a extruding block 25 fixedly disposed at the lower end of the connecting rod 24, and the sliding rail 231 extends upward around the sliding column 23.
With reference to fig. 2, the diameter of the extrusion block 25 is almost identical to the diameter of the movable chamber 11, and the rubber sealing ring is fixedly arranged on the side of the extrusion block, so that the structural design is simple, and when the extrusion block 25 is arranged in the extrusion glue chamber 12, the tightness is improved, and the pressure is improved to a certain extent, so that the extrusion of the glue is easier.
Referring to fig. 1, the adsorption assembly 3 includes a fixing rod 31 fixedly disposed on an upper end surface of the housing 1, and a suction cup 32 is fixedly disposed at an upper end of the fixing rod 31.
Please refer to fig. 1 and fig. 4, the end of the housing 1 near the fixing rod 31 is fixedly provided with a screw structure 41, the screw structure 41 is in screw connection with a protective cover 4, the structural design is simple, the protective effect can be achieved to a certain extent, a glue inlet chamber 142 is fixedly connected with the dropper 13 in the mounting plate 14, the lower end of the glue inlet chamber 142 is fixedly connected with a matching plate 141, the surface of the matching plate 141 is provided with a plurality of matching holes 143, and the structural design is simple, so that the glue in the glue chamber 12 can be precisely dripped on the circuit board.
Example 1:
when the circuit board needs to be manually packaged, the mounting plate 14 is aligned with the circuit board which needs to be mounted, then the matching plate 141 at the lower end of the mounting plate 14 is aligned and put down to be attached to the circuit board, then the knob 21 is rotated, the knob 21 drives the sliding block 22 to slide in the sliding rail 231 under the matching of the bearing, the sliding block 22 prescribes that the sliding block 22 is arranged on the inner wall of the knob 21 and can rotate around the shell 1, the sliding block 22 drives the sliding column 23 to move downwards while sliding the sliding column 23 drives the connecting rod 24 to move downwards in the movable chamber 11, the connecting rod 24 drives the extrusion block 25 to move downwards, then glue in the glue chamber 12 is extruded, the glue flows into the glue chamber 142 along the dropper 13, then precisely flows onto the circuit board through the matching hole 143 on the matching plate 141, the protective cover 4 is rotated and opened after the shell 1 is inverted, the sucker 32 at the upper end of the fixing rod 31 is sucked to be aligned with the circuit board through the threaded structure 41, and then the glue is pressed and attached.
Claims (6)
1. A reusable high-precision circuit board patch packaging tool is characterized in that: the device comprises a shell (1), wherein an adsorption component (3) is fixedly arranged at the upper end of the shell (1); the automatic plastic bottle cleaning device is characterized in that a dropper (13) is fixedly communicated with the lower end of the shell (1), a mounting plate (14) is fixedly communicated with the lower end of the dropper (13), a movable chamber (11) is arranged at the upper end in the shell (1), a plastic water chamber (12) is communicated with the lower end of the shell (1) and the movable chamber (11), and an extrusion assembly (2) is movably arranged in the movable chamber (11).
2. The reusable high precision circuit board patch package tool of claim 1, wherein: the extrusion assembly (2) comprises a knob (21) which is arranged on the surface of the shell (1) in a rotating mode through a bearing and a sliding column (23) which is movably arranged in the movable chamber (11), wherein a sliding block (22) is fixedly connected to the inner wall of the knob (21), the sliding block (22) penetrates through the surface of the shell (1) and slides on the surface of the shell (1), a sliding rail (231) is fixedly arranged on the surface of the sliding column (23), the sliding rail (231) is matched with the sliding block (22), a connecting rod (24) is fixedly arranged at the lower end of the sliding column (23), an extrusion block (25) is fixedly arranged at the lower end of the connecting rod (24), and the sliding rail (231) extends upwards around the sliding column (23).
3. The reusable high precision circuit board patch package tool of claim 2, wherein: the diameter of the extrusion block (25) is almost consistent with the diameter and the length of the movable chamber (11), and the extrusion fast side surface is fixedly provided with a rubber sealing ring.
4. The reusable high precision circuit board patch package tool of claim 1, wherein: the adsorption component (3) comprises a fixing rod (31) fixedly arranged on the upper end surface of the shell (1), and a sucker (32) is fixedly arranged at the upper end of the fixing rod (31).
5. A reusable high precision circuit board patch package tool as recited in claim 3, wherein: one end of the shell (1) close to the fixed rod (31) is fixedly provided with a thread structure (41), and the thread structure (41) is in threaded connection with a protective cover (4).
6. The reusable high precision circuit board patch package tool of claim 2, wherein: the mounting plate (14) is fixedly communicated with the dropper (13) and is internally provided with a glue inlet chamber (142), the lower end of the glue inlet chamber (142) is fixedly connected with a matching plate (141), and a plurality of matching holes (143) are formed in the surface of the matching plate (141).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321742040.4U CN220235097U (en) | 2023-07-05 | 2023-07-05 | Reusable high-precision circuit board patch packaging tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321742040.4U CN220235097U (en) | 2023-07-05 | 2023-07-05 | Reusable high-precision circuit board patch packaging tool |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220235097U true CN220235097U (en) | 2023-12-22 |
Family
ID=89182589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321742040.4U Active CN220235097U (en) | 2023-07-05 | 2023-07-05 | Reusable high-precision circuit board patch packaging tool |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220235097U (en) |
-
2023
- 2023-07-05 CN CN202321742040.4U patent/CN220235097U/en active Active
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