CN220233119U - Diode packaging die bonding mechanism - Google Patents

Abstract

The utility model discloses a diode packaging die bonding mechanism in the field of packaging die bonding equipment, which comprises a processing table, wherein a transverse rod with fixed left and right sides is arranged above the processing table, the transverse rod is connected with at least two connecting blocks, the bottom of each connecting block is connected with a lifting shaft which stretches downwards, the tail end of each lifting shaft is connected with a lifting plate which moves synchronously, the bottom of each lifting plate is respectively connected with a dispensing gun and a telescopic compression rod, the telescopic compression rods are arranged on the rear side of each dispensing gun, and at least two jigs which slide forwards and backwards towards the lower part of the corresponding lifting plate are arranged on the surface of the processing table, and concave assembly grooves are formed on the surface of each jig. The device provides a plurality of stations operated synchronously or asynchronously, and repeatedly executes different processing operations on one station, so that the occupied space during equipment operation is reduced, and the die bonding and packaging operations are sequentially executed on the same station, thereby improving the overall working efficiency, facilitating the user to view the operation effect in real time and avoiding product errors.

Description

Diode packaging die bonding mechanism

Technical Field

The utility model relates to the technical field of packaging and die bonding equipment, in particular to a diode packaging and die bonding mechanism.

Background

In the packaging process of the diode, attaching the chip between the upper and lower sheets of the diode is a very important procedure. In the prior art, the implementation of the process is mostly realized by a manual or semi-manual mode, and the specific implementation modes are as follows: the first worker uses the dispensing machine to dispense glue on the blanking sheet, then moves the dispensing blanking sheet to the next worker, the worker performs the die bonding step at the moment, generally screens the crystal grains (namely chips) on the dispensing position of the blanking sheet through a shaking disc, the die bonding is completed, the semi-finished product after die bonding is moved to the next worker, the worker uses the dispensing machine to dispense glue on the blanking sheet, then attaches the blanking sheet to the finished product by himself or by other people, and the process of attaching the chips between the blanking sheet and the upper sheet of the diode is completed.

However, the equipment corresponding to the process adopts a pipeline mode, so that the occupied space is large during execution, and a great amount of manpower is required to be consumed to finish one-time processing operation, so that the overall working efficiency is low.

Disclosure of Invention

In order to overcome the defects of the prior art, the utility model provides a diode packaging die bonding mechanism, which can effectively solve the technical problem of low die bonding efficiency of the existing diode packaging.

The technical scheme adopted for solving the technical problems is as follows:

diode encapsulation die bonding mechanism, including the processing platform, the processing platform top is equipped with the horizontal pole of left and right sides fixing, the horizontal pole is connected with two at least connecting blocks, the lift axle of downwardly extending is connected to the connecting block bottom, lift axle end-to-end connection has synchronous movement's lifter plate, the lifter plate bottom is connected with point gum gun and flexible depression bar respectively, the flexible depression bar is located the point gum gun rear side, processing platform surface is equipped with two at least orientation and corresponds the gliding tool around the lifter plate below, the tool surface is equipped with sunken assembly groove.

Further, the top of the connecting block is connected with a lifting driving motor for driving and controlling a corresponding lifting shaft.

Further, the two sides of the lifting plate are respectively provided with a dispensing controller for controlling the dispensing gun and a telescopic driving motor for driving and controlling the telescopic compression bar.

Further, the tail end of the telescopic compression bar is provided with a pressing sheet.

Further, the surface of the processing table is provided with at least two groups of sliding rails which are fixed front and back, the jig is arranged above the sliding rails to slide front and back, and the surface of the processing table is also provided with at least two sliding rail driving motors which are used for driving and controlling the corresponding jig to slide.

Further, the processing table is also provided with a panel for operation and control.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model provides a plurality of stations operated synchronously or asynchronously, and different processing operations are repeatedly executed on one station, so that the occupied space during the operation of equipment is reduced, the die bonding and packaging operations are sequentially executed on the same station, the overall working efficiency is improved, the effect of the operation is conveniently observed in real time by a user, the product error is avoided, the overall structure is simple, the operation is convenient, and the practicability is strong.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a die bonding mechanism for diode package according to the present utility model;

FIG. 2 is an enlarged schematic view of a portion A of the die attach mechanism of the diode package of FIG. 1 according to the present utility model;

reference numerals in the drawings:

the device comprises a 1-processing table, a 2-cross rod, a 3-connecting block, a 4-lifting shaft, a 5-lifting plate, a 6-dispensing gun, a 7-telescopic compression rod, an 8-jig, a 9-assembly groove, a 10-lifting driving motor, an 11-dispensing controller, a 12-telescopic driving motor, a 13-tabletting, a 14-sliding rail, a 15-sliding rail driving motor and a 16-panel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1-2, the utility model provides a diode encapsulation die bonding mechanism, which mainly adopts a plurality of stations to synchronously or asynchronously carry out, so as to improve encapsulation efficiency, and mainly comprises a processing table 1, wherein a transverse rod 2 fixed at the left side and the right side is arranged above the processing table 1, the transverse rod 2 is connected with at least two connecting blocks 3, the bottom of each connecting block 3 is connected with a lifting shaft 4 which stretches downwards, the tail end of each lifting shaft 4 is connected with a lifting plate 5 which moves synchronously, the bottom of each lifting plate 5 is respectively connected with a dispensing gun 6 and a telescopic pressing rod 7, the telescopic pressing rods 7 are arranged at the rear side of each dispensing gun 6, each station is provided with a lifting driving motor 10 which drives and controls the corresponding lifting shaft 4, each lifting shaft 4 stretches downwards, the dispensing and pressing operation is performed by the dispensing gun 6, the pressing operation is performed by the telescopic pressing rods 7, the tail ends of each pressing rods 7 are provided with lifting plates 13 which increase the stress area, the two sides of each lifting plate 5 are respectively provided with a dispensing controller 11 which controls the dispensing gun 6, and a telescopic pressing rod 7 can be pressed down correspondingly to the pressing rods 7, and the pressing rods 7 can be pressed synchronously or synchronously, and the stations can be pressed and arranged correspondingly, and the die pressing operation can be pressed down and pressed synchronously.

The processing bench 1 surface is equipped with two at least towards corresponding elevating plate 5 below fore-and-aft sliding tool 8, tool 8 surface is equipped with sunken assembly groove 9, and assembly groove 9 on the tool 8 is the position that is used for loading and unloading flitch, and in order to accomplish the position of some glue operation and encapsulation operation, the bottom is equipped with the gliding slide rail 14 of forward motion, and the gliding slide rail driving motor 15 of drive control tool 8 has been assembled on processing bench 1 surface, slide rail driving motor 15 can control tool 8 slip through the mode that the telescopic link pulls the promotion, every tool 8 is equipped with a set of two altogether slide rail 14, the position that moves to the rear end is decided according to different operation steps, in addition, when fixed crystal after some glue, the user can borrow other appurtenance to place the position of crystal, avoid the deviation.

The processing table 1 is further provided with a panel 16 for operation and control, the panel 16 is provided for a user, and the user can adjust parameters corresponding to each processing station and states of each processing station through the panel 16.

Compared with the prior art, the technical scheme provides a plurality of stations operated synchronously or asynchronously, and different processing operations are repeatedly executed on one station, so that the occupied space for equipment operation is reduced, and the operations of die bonding and packaging are sequentially executed on the same station, so that the overall working efficiency is improved, the effect of the operation is conveniently observed by a user in real time, and the product error is avoided.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (6)

1. Diode encapsulation die bonding mechanism, including the processing platform, its characterized in that: the processing bench top is equipped with the fixed horizontal pole in left and right sides, the horizontal pole is connected with two at least connecting blocks, the downwardly extending's lift axle is connected to the connecting block bottom, lift axle end-to-end connection has synchronous motion's lifter plate, the lifter plate bottom is connected with dispensing gun and flexible depression bar respectively, flexible depression bar locates the dispensing gun rear side, processing bench surface is equipped with two at least orientation and corresponds the gliding tool around the lifter plate below, the tool surface is equipped with sunken assembly groove.

2. The diode package die attach mechanism of claim 1, wherein: and the top of the connecting block is connected with a lifting driving motor for driving and controlling a corresponding lifting shaft.

3. The diode package die attach mechanism of claim 1, wherein: and the two sides of the lifting plate are respectively provided with a dispensing controller for controlling the dispensing gun and a telescopic driving motor for driving and controlling the telescopic compression bar.

4. A diode package die attach mechanism as in claim 1 or 3 wherein: the tail end of the telescopic compression bar is provided with a pressing sheet.

5. The diode package die attach mechanism of claim 1, wherein: the surface of the processing table is provided with at least two groups of sliding rails which are fixed front and back, the jig is arranged above the sliding rails to slide front and back, and the surface of the processing table is also provided with at least two sliding rail driving motors which are used for driving and controlling the corresponding jig to slide.

6. The diode package die attach mechanism of claim 1, wherein: the processing table is also provided with a panel for controlling.