CN220217006U - Punching capacitor tin-plating device - Google Patents
Punching capacitor tin-plating device Download PDFInfo
- Publication number
- CN220217006U CN220217006U CN202321823821.6U CN202321823821U CN220217006U CN 220217006 U CN220217006 U CN 220217006U CN 202321823821 U CN202321823821 U CN 202321823821U CN 220217006 U CN220217006 U CN 220217006U
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- China
- Prior art keywords
- switching
- tin
- moving mechanism
- capacitor
- solder
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- 239000003990 capacitor Substances 0.000 title claims abstract description 57
- 238000007747 plating Methods 0.000 title claims abstract description 34
- 238000004080 punching Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 47
- 238000005476 soldering Methods 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 39
- 238000000034 method Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
According to the through capacitor tin-plating device provided by the utility model, two switching ends of a switching mechanism are respectively connected with a solder paste adding mechanism and a tin-plating pen, a moving end of a moving mechanism is connected with the switching mechanism, and the moving mechanism sequentially moves the switching mechanism to the positions above all mounting grooves; by adopting the technical scheme, the punching capacitors to be punched with tin are placed in the mounting grooves of the capacitor clamps one by one, the tin paste adding mechanism is moved to the processing stations by the switching mechanism, under the cooperation of the X-axis moving mechanism, the Y-axis moving mechanism and the Z-axis moving mechanism, the tin paste adding mechanism can be sequentially moved to the upper parts of the punching capacitors to be punched with tin, tin paste is sequentially added to each punching capacitor, after tin paste is added, the punching pen is moved to the processing stations by the switching mechanism, and the punching pen is matched with the moving mechanism again to realize punching of the punching capacitors.
Description
Technical Field
The utility model relates to the field of punching capacitance tin plating, in particular to a punching capacitance tin plating device.
Background
The feedthrough capacitor is a three-terminal capacitor, but compared with the common three-terminal capacitor, the feedthrough capacitor is directly arranged on a metal panel, so that the grounding inductance is smaller, the influence of lead inductance is almost avoided, in addition, the input end and the output end of the feedthrough capacitor are isolated by a metal plate, high-frequency coupling is eliminated, the two characteristics determine that the feedthrough capacitor has a filtering effect close to an ideal capacitor, the feedthrough capacitor consists of a ceramic tube and a contact pin, and the contact pin is inserted into the feedthrough capacitor to form a capacitor loop.
After the contact pins are arranged in the ceramic tubes, the contact pins are required to be plated, the contact pins are fixed first, the plating method is divided into two steps, the solder paste is added in the first step, the solder paste is melted through the plating pen in the second step, the plating fixation of the first contact pins is realized, the solder paste is added in the ceramic tubes one by one in the traditional plating method in a manual mode, and then the plating pen is matched for plating the punching capacitors one by one, but the manual plating method is labor-consuming and low in efficiency.
Disclosure of Invention
First, the technical problem to be solved
In order to solve the above problems in the prior art, the present utility model provides a punching capacitor tin plating device.
(II) technical scheme
In order to achieve the above purpose, the main technical scheme adopted by the utility model comprises the following steps:
a punching capacitance tin-plating device comprises a capacitance clamp, a moving mechanism, a solder paste adding mechanism, a tin-plating pen and a switching mechanism;
the upper surface of the capacitor clamp is provided with a plurality of mounting grooves for accommodating the through capacitors;
two switching ends of the switching mechanism are respectively connected with the solder paste adding mechanism and the solder pen;
the moving end of the moving mechanism is connected with the switching mechanism, and the moving mechanism sequentially moves the switching mechanism to the position above each mounting groove.
Preferably, the moving mechanism comprises a workbench, an X-axis moving mechanism, a Y-axis moving mechanism and a Z-axis moving mechanism;
the longitudinal section of the workbench is of an L-shaped structure;
the Y-axis moving mechanism is arranged on the surface of the horizontal part of the workbench and is connected with the capacitor clamp;
the X-axis moving mechanism is arranged at the top of the vertical part of the workbench;
the Z-axis moving mechanism is arranged on the moving end of the X-axis moving mechanism, and the switching mechanism is arranged on the moving end of the Z-axis moving mechanism.
Preferably, the switching mechanism comprises a servo motor and a switching disc, wherein the servo motor is connected with the circle center of the switching disc, and the solder paste adding mechanism and the solder pen are respectively arranged at the eccentric point position on the surface of the switching disc.
Preferably, the solder paste adding mechanism and the solder pen form an included angle of 90 degrees.
Preferably, the solder paste adding mechanism comprises a clamping seat, a solder tube and a pneumatic component, wherein the clamping seat is fixedly arranged at one switching end of the switching mechanism, the solder tube is fixed in the clamping seat, and the pneumatic component is connected with the solder tube and is used for inputting gas to extrude solder paste in the solder tube.
(III) beneficial effects
The utility model has the beneficial effects that: by adopting the technical scheme, the punching capacitors to be punched with tin are placed in the mounting grooves of the capacitor clamps one by one, the tin paste adding mechanism is moved to the processing stations by the switching mechanism, under the cooperation of the X-axis moving mechanism, the Y-axis moving mechanism and the Z-axis moving mechanism, the tin paste adding mechanism can be sequentially moved to the upper parts of the punching capacitors to be punched with tin, tin paste is sequentially added to each punching capacitor, after tin paste is added, the punching pen is moved to the processing stations by the switching mechanism, and the punching pen is matched with the moving mechanism again to realize punching of the punching capacitors.
Drawings
FIG. 1 is a schematic diagram of a through-hole capacitor tin plating apparatus;
FIG. 2 is a schematic diagram of a second embodiment of a feedthrough capacitor tin-plating apparatus;
FIG. 3 is a schematic side view of a through-hole capacitor tin plating apparatus;
fig. 4 is a schematic diagram of a front view of a through-hole capacitor tin plating device.
[ reference numerals description ]
1. A moving mechanism;
11. a work table; 12. a Y-axis moving mechanism; 13. an X-axis moving mechanism; 14. a Z-axis moving mechanism;
2. a capacitive clamp; 21. a mounting groove;
3. a switching mechanism;
31. a servo motor; 32. a switching disc;
4. a solder paste adding mechanism;
41. a clamping seat; 42. a tin tube;
5. and (5) a tin-plating pen.
Detailed Description
The utility model will be better explained by the following detailed description of the embodiments with reference to the drawings.
Referring to fig. 1 to 4, the present utility model provides a through-hole capacitor tin-plating device, which comprises a capacitor clamp 2, a moving mechanism 1, a solder paste adding mechanism 4, a tin-plating pen 5 and a switching mechanism 3;
the upper surface of the capacitor clamp 2 is provided with a plurality of mounting grooves 21 for accommodating the through capacitors;
two switching ends of the switching mechanism 3 are respectively connected with a solder paste adding mechanism 4 and a solder pen 5;
the moving end of the moving mechanism 1 is connected with the switching mechanism 3, and the moving mechanism 1 sequentially moves the switching mechanism 3 to the position above each mounting groove 21.
When the automatic tin plating device is used, the penetrating capacitors to be plated are placed into the mounting grooves 21 of the capacitor clamp 2 one by one, the tin paste adding mechanism 4 is moved to the processing stations by the switching mechanism 3, the tin paste adding mechanism 4 can be sequentially moved to the upper parts of the penetrating capacitors to be plated under the cooperation of the X-axis moving mechanism 13, the Y-axis moving mechanism 12 and the Z-axis moving mechanism 14, tin paste is sequentially added to the penetrating capacitors, after tin paste is added, the tin plating pen 5 is moved to the processing stations by the switching mechanism 3, tin plating is realized by utilizing the tin plating pen 5 and the moving mechanism 1, full-automatic tin plating can be realized, and the production efficiency of the penetrating capacitors is greatly improved.
It should be noted that, under the action of electric heating, the pen point of the tin point pen 5 generates a heat source for heating the solder paste.
In the present embodiment, the moving mechanism 1 includes a table 11, an X-axis moving mechanism 13, a Y-axis moving mechanism 12, and a Z-axis moving mechanism 14;
the longitudinal section of the workbench 11 is of an L-shaped structure;
the Y-axis moving mechanism 12 is arranged on the surface of the horizontal part of the workbench 11 and is connected with the capacitor clamp 2;
the X-axis moving mechanism 13 is arranged at the top of the vertical part of the workbench 11;
the Z-axis moving mechanism 14 is arranged on the moving end of the X-axis moving mechanism 13, and the switching mechanism 3 is arranged on the moving end of the Z-axis moving mechanism 14; when the device is used, the X-axis moving mechanism 13, the Y-axis moving mechanism 12 and the Z-axis moving mechanism 14 can realize the transfer motion of the switching mechanism 3 in the three-dimensional space, so that the processing stations of the switching mechanism 3 are sequentially moved above the punching capacitor to be punched.
In this embodiment, the switching mechanism 3 includes a servo motor 31 and a switching disc 32, the servo motor 31 is connected with the center of the switching disc 32, and the solder paste adding mechanism 4 and the solder pen 5 are respectively disposed at the eccentric points on the surface of the switching disc 32; the servo motor 31 drives the motor to drive the switching disc 32 to rotate, so that the use switching of the solder paste adding mechanism 4 and the solder pen 5 on the surface of the switching disc 32 is realized.
In this embodiment, the angle between the solder paste adding mechanism 4 and the solder pen 5 is 90 degrees.
In this embodiment, the solder paste adding mechanism 4 includes a holder 41, a solder tube 42, and a pneumatic member, where the holder 41 is fixedly disposed at one switching end of the switching mechanism 3, the solder tube 42 is fixed in the holder 41, and the pneumatic member is connected to the solder tube 42 and is used for inputting gas to extrude solder paste in the solder tube 42; the solder paste in the solder tube 42 is forced into the feedthrough capacitor by a pneumatic element.
The working principle of the utility model is as follows:
the lead-through capacitors to be plated with tin are placed into the mounting groove 21 of the capacitor clamp 2 one by one, the tin paste adding mechanism 4 is moved to the processing station by the switching mechanism 3, under the cooperation of the X-axis moving mechanism 13, the Y-axis moving mechanism 12 and the Z-axis moving mechanism 14, the tin paste adding mechanism 4 can be sequentially moved to the upper parts of the lead-through capacitors to be plated with tin, tin paste is sequentially added to each lead-through capacitor, after tin paste is added, the tin plating pen 5 is moved to the processing station by the switching mechanism 3, tin plating is realized by utilizing the tin plating pen 5 to be matched with the moving mechanism 1 again for each lead-through capacitor, and the full-automatic tin plating can be realized, so that the production efficiency of the lead-through capacitors is greatly improved.
The circuit, the electronic components and the modules are all in the prior art, and can be completely realized by a person skilled in the art, and needless to say, the protection of the utility model does not relate to the improvement of software and a method.
The foregoing is only illustrative of the present utility model and is not to be construed as limiting the scope of the utility model, and all equivalent changes made by the description of the utility model and the accompanying drawings, or direct or indirect application in the relevant art, are intended to be included within the scope of the utility model.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (5)
1. The punching capacitor tin-plating device is characterized by comprising a capacitor clamp, a moving mechanism, a solder paste adding mechanism, a tin-plating pen and a switching mechanism;
the upper surface of the capacitor clamp is provided with a plurality of mounting grooves for accommodating the through capacitors;
two switching ends of the switching mechanism are respectively connected with the solder paste adding mechanism and the solder pen;
the moving end of the moving mechanism is connected with the switching mechanism, and the moving mechanism sequentially moves the switching mechanism to the position above each mounting groove.
2. The feedthrough capacitor tinning device of claim 1, wherein the movement mechanism comprises a table, an X-axis movement mechanism, a Y-axis movement mechanism, and a Z-axis movement mechanism;
the longitudinal section of the workbench is of an L-shaped structure;
the Y-axis moving mechanism is arranged on the surface of the horizontal part of the workbench and is connected with the capacitor clamp;
the X-axis moving mechanism is arranged at the top of the vertical part of the workbench;
the Z-axis moving mechanism is arranged on the moving end of the X-axis moving mechanism, and the switching mechanism is arranged on the moving end of the Z-axis moving mechanism.
3. The device for soldering the through capacitor of claim 1, wherein the switching mechanism comprises a servo motor and a switching disc, the servo motor is connected with the center of the switching disc, and the solder paste adding mechanism and the soldering pen are respectively arranged at the eccentric point positions on the surface of the switching disc.
4. The device of claim 3, wherein the solder paste adding mechanism and the solder pen form an angle of 90 degrees.
5. The device according to claim 1, wherein the solder paste adding mechanism comprises a holder fixedly arranged at one switching end of the switching mechanism, a solder tube fixedly arranged in the holder, and a pneumatic member connected with the solder tube for inputting gas to extrude the solder paste in the solder tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321823821.6U CN220217006U (en) | 2023-07-12 | 2023-07-12 | Punching capacitor tin-plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321823821.6U CN220217006U (en) | 2023-07-12 | 2023-07-12 | Punching capacitor tin-plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220217006U true CN220217006U (en) | 2023-12-22 |
Family
ID=89173178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321823821.6U Active CN220217006U (en) | 2023-07-12 | 2023-07-12 | Punching capacitor tin-plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220217006U (en) |
-
2023
- 2023-07-12 CN CN202321823821.6U patent/CN220217006U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |