CN220207672U - Die assembly pressing component for chip test - Google Patents
Die assembly pressing component for chip test Download PDFInfo
- Publication number
- CN220207672U CN220207672U CN202321421413.8U CN202321421413U CN220207672U CN 220207672 U CN220207672 U CN 220207672U CN 202321421413 U CN202321421413 U CN 202321421413U CN 220207672 U CN220207672 U CN 220207672U
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- Prior art keywords
- strip
- raised
- gasket
- pressing block
- pressed
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- 238000003825 pressing Methods 0.000 title claims abstract description 71
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 239000004576 sand Substances 0.000 abstract description 13
- 238000003475 lamination Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a die assembly pressing component for chip test, which comprises: the support frame that can remove in vertical orientation and install the lower briquetting on the support frame, be provided with under the briquetting and wait to pressfitting spare, under the briquetting be connected with the support frame through a mounting panel, a bar through-hole has been seted up to the upper surface of support frame, and two relative inner wall lower parts of this bar through-hole respectively have a first sand grip, two relative side surface upper portions of mounting panel respectively have one and correspond the second sand grip that extends to directly over the first sand grip, and the opposite side extends to directly over the second sand grip and is connected with the second sand grip through two at least springs, 2 the respective below of second sand grip all is provided with a gasket. The utility model can pre-adjust the distance between the lower pressing block and the workpiece to be pressed and the parallelism of the lower pressing block before die assembly, thereby ensuring the smooth lamination between the lower pressing block and the workpiece to be pressed.
Description
Technical Field
The utility model relates to a die assembly pressing component for chip testing, and belongs to the technical field of semiconductor chip testing.
Background
The chip is an important component of electronic equipment such as a computer, and the chip can be tested and screened through test equipment before packaging manufacture and delivery, and the chip with defects is screened out or classified according to performance difference, so that the chip is prevented from being faulty due to various reasons when in use, and qualified chips with small performance difference are conveniently assembled into the same module.
Currently, in chip testing, as an indispensable tool for testing a chip, a chip test socket is generally contacted with the chip through a spring probe to realize electrical connection to the chip, thereby completing relevant test screening. However, in the process of die assembly, the upper and lower components of the chip test seat cannot ensure the flatness of die assembly, so that the accuracy of test and the consistency of test data are affected.
Disclosure of Invention
The utility model aims to provide a die assembly pressing component for chip testing, which can be used for pre-adjusting the distance between a pressing block and a workpiece to be pressed and the parallelism of the pressing block before die assembly, converting the horizontal plane reference of the pressing block onto the workpiece to be pressed after the pressing block and the workpiece to be pressed are clamped, continuously providing die assembly pressure through a spring and absorbing a tiny offset, so that the smooth fit between the pressing block and the workpiece to be pressed is ensured.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a die-hold-down assembly for chip testing, comprising: the device comprises a supporting frame capable of moving in the vertical direction and a lower pressing block arranged on the supporting frame, wherein a piece to be pressed is arranged right below the lower pressing block, the lower pressing block is connected with the supporting frame through a mounting plate, a strip-shaped through hole is formed in the upper surface of the supporting frame, a first raised strip is respectively arranged at the lower parts of two opposite inner walls of the strip-shaped through hole, a second raised strip correspondingly extending to the position right above the first raised strip is respectively arranged at the upper parts of two opposite side surfaces of the mounting plate, a strip-shaped block is respectively arranged above the 2 second raised strips, one side of the strip-shaped block is fixedly connected with the upper surface of the supporting frame, and the other side of the strip-shaped block extends to the position right above the second raised strip and is connected with the second raised strip through at least two springs;
the 2 the respective below of second sand grip all is provided with a gasket, and a plurality of is followed the screw that second sand grip length direction interval set up and is passed second sand grip and gasket in proper order, will gasket detachably installs in the lower surface of second sand grip, works as down the briquetting sets up with waiting to pressfitting spare interval, the lower surface of gasket is connected with the upper surface overlap joint of first sand grip, and when the lower surface of briquetting closely pastes with the upper surface of waiting to pressfitting spare down, form a clearance between the lower surface of gasket and the upper surface of first sand grip.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the upper end face of the screw is lower than the upper surface of the second raised strip.
2. In the above scheme, the gasket is a strip gasket.
3. In the above scheme, every the second sand grip is connected through 4~8 spring that set up along its length direction equidistant between the bar piece.
4. In the above scheme, the upper surface of the second raised strip and/or the lower surface of the strip-shaped block are provided with mounting grooves for embedding the ends of the springs.
5. In the scheme, the lower pressing block is connected with the to-be-pressed piece in a matched mode through at least two groups of pins and pin holes.
6. In the scheme, the lower pressing block is fixedly arranged on the lower surface of the mounting plate.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
the utility model discloses a die assembly pressing component for chip testing, which is characterized in that a strip-shaped through hole is formed in the upper surface of a supporting frame, a first convex strip is arranged at the lower parts of two opposite inner walls of the strip-shaped through hole, a second convex strip correspondingly extending to the position right above the first convex strip is arranged at the upper parts of two opposite side surfaces of a mounting plate, a strip-shaped block is arranged above each of the 2 second convex strips, one side of the strip-shaped block is fixedly connected with the upper surface of the supporting frame, the other side of the strip-shaped block extends to the position right above the second convex strip and is connected with the second convex strip through at least two springs, a gasket is arranged below each of the 2 second convex strips, a plurality of screws arranged at intervals along the length direction of the second convex strip sequentially penetrate through the second convex strip and the gasket, the gasket is detachably mounted on the lower surface of the second convex strip, when the lower pressing block is arranged at intervals with a piece to be pressed, a gap is formed between the lower surface of the gasket and the upper surface of the first convex strip, when the lower surface of the lower pressing block is adhered with the upper surface of the piece to be pressed, a gap is formed between the lower surface of the gasket and the upper surface of the first convex strip, the lower surface of the gasket can be increased, reduced or changed in thickness, the lower thickness of the gasket can be kept parallel to the pressing piece and the lower pressing piece can be adjusted, and the die assembly pressing can be continuously pressed by the distance between the pressing piece and the lower pressing piece and the base after the pressing piece is kept, and the pressing level is adjusted.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a die-closing hold-down assembly for chip testing according to the present utility model;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
FIG. 3 is a schematic cross-sectional view taken along line B-B of FIG. 1;
FIG. 4 is an enlarged schematic view of FIG. 3 at C;
FIG. 5 is a schematic view of a partial structure of a mold clamping and pressing assembly for chip testing according to the present utility model;
FIG. 6 is a schematic diagram of the die closing state of the die closing hold-down assembly for chip testing according to the present utility model;
fig. 7 is an enlarged schematic view at D in fig. 6.
In the above figures: 1. a support frame; 3. pressing the block; 4. pressing the piece to be pressed; 5. a mounting plate; 6. a bar-shaped through hole; 71. a first protruding strip; 72. a second protruding strip; 8. a bar block; 9. a spring; 10. a gap; 11. a mounting groove; 12. a gasket; 13. and (5) a screw.
Description of the embodiments
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a die-hold-down assembly for chip testing, comprising: the device comprises a support frame 1 capable of moving in the vertical direction and a lower pressing block 3 arranged on the support frame 1, wherein a piece 4 to be pressed is arranged under the lower pressing block 3, a containing groove for embedding a chip to be tested is formed in the piece 4 to be pressed, the lower pressing block 3 is connected with the support frame 1 through a mounting plate 5, a strip-shaped through hole 6 is formed in the upper surface of the support frame 1, a first raised strip 71 is respectively arranged at the lower parts of two opposite inner walls of the strip-shaped through hole 6, a strip-shaped block 8 is respectively arranged above each of two opposite side surfaces of the mounting plate 5, the second raised strips 72,2 correspondingly extend to the positions right above the first raised strips 71, one side of the strip-shaped block 8 is fixedly connected with the upper surface of the support frame 1, and the other side of the strip-shaped block 8 extends to the position right above the second raised strips 72 and is connected with the second raised strips 72 through at least two springs 9;
a gasket 12 is arranged below each of the 2 second raised strips 72, a plurality of screws 13 which are arranged at intervals along the length direction of the second raised strips 72 sequentially penetrate through the second raised strips 72 and the gasket 12, the gasket 12 is detachably arranged on the lower surface of the second raised strips 72, when the lower pressing block 3 is arranged at intervals with the to-be-pressed piece 4, the lower surface of the gasket 12 is in lap joint with the upper surface of the first raised strip 71, and when the lower surface of the lower pressing block 3 is tightly adhered with the upper surface of the to-be-pressed piece 4, a gap 10 is formed between the lower surface of the gasket 12 and the upper surface of the first raised strip 71;
before the downward movement of the support frame, 2 second convex strips on the mounting plate are connected with the first convex strips on the support frame in a lap joint manner through the gaskets, and the lower pressing block can be used for carrying out self-adjustment on the levelness of the lower pressing block before die assembly, so that the lower pressing block is in smooth fit with a piece to be pressed when film assembly is ensured.
The upper end surface of the screw 13 is lower than the upper surface of the second ridge 72.
The gasket 12 is a strip gasket.
Each of the second protruding strips 72 is connected to the bar-shaped block 8 by 5 springs 9 disposed at equal intervals along the length direction thereof.
The upper surface of the second ridge 72 and the lower surface of the bar 8 are each provided with a mounting groove 11 into which the end portion of the spring 9 is fitted.
Example 2: a mold clamping hold-down assembly comprising: the device comprises a support frame 1 capable of moving in the vertical direction and a lower pressing block 3 arranged on the support frame 1, wherein a piece to be pressed 4 is arranged right below the lower pressing block 3, the lower pressing block 3 is connected with the support frame 1 through a mounting plate 5, a strip-shaped through hole 6 is formed in the upper surface of the support frame 1, a first raised strip 71 is respectively arranged at the lower parts of two opposite inner walls of the strip-shaped through hole 6, a strip-shaped block 8 is respectively arranged above each of second raised strips 72,2 which correspondingly extend to the right above the first raised strips 71 on the upper parts of two opposite side surfaces of the mounting plate 5, one side of the strip-shaped block 8 is fixedly connected with the upper surface of the support frame 1, and the other side of the strip-shaped block 8 extends to the right above the second raised strips 72 and is connected with the second raised strips 72 through at least two springs 9;
a gasket 12 is arranged below each of the 2 second raised strips 72, a plurality of screws 13 which are arranged at intervals along the length direction of the second raised strips 72 sequentially penetrate through the second raised strips 72 and the gasket 12, the gasket 12 is detachably arranged on the lower surface of the second raised strips 72, when the lower pressing block 3 is arranged at intervals with the to-be-pressed piece 4, the lower surface of the gasket 12 is in lap joint with the upper surface of the first raised strip 71, and when the lower surface of the lower pressing block 3 is tightly adhered with the upper surface of the to-be-pressed piece 4, a gap 10 is formed between the lower surface of the gasket 12 and the upper surface of the first raised strip 71;
along with the downward movement of the support frame, the lower pressing block is pressed to the workpiece to be pressed, the lower pressing block continuously moves downward after contacting with the workpiece to be pressed, the workpiece to be pressed gives the upward reaction force to the lower pressing block, under the reaction force, the 2 second convex strips on the mounting plate are separated from the first convex strips on the support frame upward, so that a gap is formed between the second convex strips and the first convex strips, the spring continuously applies downward pressure to the 2 second convex strips on the mounting plate as mold closing pressure, at the moment, the lower pressing block arranged on the mounting plate is in a floating state, the conversion from the lower pressing block to the workpiece to be pressed is realized, and tiny deviation on a horizontal plane is absorbed and balanced through the spring, so that the tight and smooth lamination between the lower pressing block and the workpiece to be pressed is realized.
The upper end surface of the screw 13 is lower than the upper surface of the second ridge 72.
Each of the second protruding strips 72 is connected to the bar-shaped block 8 by 7 springs 9 disposed at equal intervals along the length direction thereof.
The second protruding strip 72 has an installation groove 11 formed in the upper surface thereof into which the end of the spring 9 is fitted.
The lower pressing block 3 is connected with the to-be-pressed piece 4 in a matched manner through at least two groups of pins and pin holes.
The lower pressing block 3 is fixedly installed on the lower surface of the installation plate 5.
The working principle of the utility model is as follows:
before the support frame moves downwards, 2 second raised strips on the mounting plate are connected with the first raised strips on the support frame in a lap joint manner through the gaskets, and the levelness of the lower pressing block can be adjusted before die assembly, so that the smooth fit between the lower pressing block and a piece to be pressed is ensured during die assembly;
along with the downward movement of the support frame, the lower pressing block is pressed to the workpiece to be pressed, the lower pressing block continuously moves downward after contacting with the workpiece to be pressed, the workpiece to be pressed gives the upward reaction force to the lower pressing block, under the reaction force, the 2 second convex strips on the mounting plate are separated from the first convex strips on the support frame upward, so that a gap is formed between the second convex strips and the first convex strips, the spring continuously applies downward pressure to the 2 second convex strips on the mounting plate as mold closing pressure, at the moment, the lower pressing block arranged on the mounting plate is in a floating state, the conversion from the lower pressing block to the workpiece to be pressed is realized, and tiny deviation on a horizontal plane is absorbed and balanced through the spring, so that the tight and smooth lamination between the lower pressing block and the workpiece to be pressed is realized.
When the die assembly pressing assembly for chip testing is adopted, the distance between the pressing block and the workpiece to be pressed and the parallelism of the pressing block before die assembly can be pre-adjusted by increasing and reducing the thickness of the gasket or changing the thickness of the gasket, the horizontal plane reference of the pressing block can be converted to the workpiece to be pressed after the pressing block and the workpiece to be pressed are clamped, and the tiny offset is absorbed through the spring while the die assembly pressure is continuously provided, so that the smooth lamination between the pressing block and the workpiece to be pressed is ensured, and the consistency of the contact resistance of each test probe and the corresponding test area on the chip is further ensured, and the consistency of test data is improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (7)
1. A die-hold-down assembly for chip testing, comprising: support frame (1) that can remove in vertical direction and install lower briquetting (3) on support frame (1), be provided with under briquetting (3) and wait to pressfitting piece (4), its characterized in that: the lower pressing block (3) is connected with the supporting frame (1) through a mounting plate (5), a strip-shaped through hole (6) is formed in the upper surface of the supporting frame (1), a first raised strip (71) is respectively arranged at the lower parts of two opposite inner walls of the strip-shaped through hole (6), a second raised strip (72) which correspondingly extends to the position right above the first raised strip (71) is respectively arranged at the upper parts of two opposite side surfaces of the mounting plate (5), a strip-shaped block (8) is respectively arranged above the 2 second raised strips (72), one side of the strip-shaped block (8) is fixedly connected with the upper surface of the supporting frame (1), and the other side of the strip-shaped block (8) extends to the position right above the second raised strip (72) and is connected with the second raised strip (72) through at least two springs (9);
the gasket (12) is arranged below each second raised line (72), a plurality of screws (13) which are arranged along the length direction of the second raised line (72) at intervals sequentially penetrate through the second raised line (72) and the gasket (12), the gasket (12) is detachably arranged on the lower surface of the second raised line (72), when the lower pressing block (3) is arranged at intervals with the to-be-pressed piece (4), the lower surface of the gasket (12) is connected with the upper surface of the first raised line (71) in a lap joint mode, and when the lower surface of the lower pressing block (3) is tightly attached to the upper surface of the to-be-pressed piece (4), a gap (10) is formed between the lower surface of the gasket (12) and the upper surface of the first raised line (71).
2. The die-closing hold-down assembly for chip testing as defined in claim 1, wherein: the upper end surface of the screw (13) is lower than the upper surface of the second raised strip (72).
3. The die-closing hold-down assembly for chip testing as defined in claim 1, wherein: the gasket (12) is a strip gasket.
4. The die-closing hold-down assembly for chip testing as defined in claim 1, wherein: each second raised strip (72) is connected with the strip-shaped block (8) through 4-8 springs (9) which are arranged at equal intervals along the length direction of the strip-shaped block.
5. The die spotting hold-down assembly of claim 1 or 2, wherein: the upper surface of the second raised strip (72) and/or the lower surface of the strip-shaped block (8) are provided with mounting grooves (11) for embedding the end parts of the springs (9).
6. The die-closing hold-down assembly for chip testing as defined in claim 1, wherein: the lower pressing block (3) is connected with the piece to be pressed (4) in a matched mode through at least two groups of pins and pin holes.
7. The die-closing hold-down assembly for chip testing as defined in claim 1, wherein: the lower pressing block (3) is fixedly arranged on the lower surface of the mounting plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321421413.8U CN220207672U (en) | 2023-06-06 | 2023-06-06 | Die assembly pressing component for chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321421413.8U CN220207672U (en) | 2023-06-06 | 2023-06-06 | Die assembly pressing component for chip test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220207672U true CN220207672U (en) | 2023-12-19 |
Family
ID=89148899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321421413.8U Active CN220207672U (en) | 2023-06-06 | 2023-06-06 | Die assembly pressing component for chip test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220207672U (en) |
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2023
- 2023-06-06 CN CN202321421413.8U patent/CN220207672U/en active Active
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