CN220197301U

CN220197301U - Chemical mechanical polishing assembly and assembly for electrical connection to a volume having a fluid

Info

Publication number: CN220197301U
Application number: CN202223142179.3U
Authority: CN
Inventors: 乍得·波拉德; 张守成; 吴昊晟
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2022-05-27
Filing date: 2022-11-25
Publication date: 2023-12-19
Anticipated expiration: 2032-11-25
Also published as: US20230381922A1; TW202346032A; US20230387625A1; WO2023229661A1; CN117124229A

Abstract

The present disclosure provides a chemical mechanical polishing assembly and an assembly for electrical connection to a volume having a fluid. A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit for delivering fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen that supports a polishing pad, a carrier head that supports a substrate and brings the substrate into contact with the polishing pad, and a motor that causes relative movement between the platen and the carrier head. The fluid delivery catheter includes: a conductive wire extending through an interior of the conduit to flow an electrostatic discharge to ground; and a wire extraction fitting covering and sealing the location of the conductive wire through the wall of the fluid delivery conduit.

Description

Chemical mechanical polishing assembly and assembly for electrical connection to a volume having a fluid

Technical Field

The present disclosure relates to Chemical Mechanical Polishing (CMP), and more particularly to fluid delivery in CMP, a chemical mechanical polishing assembly, and an assembly for electrical connection to a volume having a fluid.

Background

Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductive, or insulative layers on a semiconductor wafer. Various fabrication processes require planarization of layers on a substrate. For example, one fabrication step involves depositing a filler layer over a non-planar surface and planarizing the filler layer. For some applications, the filler layer is planarized until the top surface of the patterned layer is exposed, or until a predetermined thickness of material remains on the underlying layer.

Chemical Mechanical Polishing (CMP) is a well-known planarization method. This planarization method typically requires the substrate to be mounted on a carrier head. The exposed surface of the substrate is typically placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to urge the substrate against the polishing pad. A polishing slurry having abrasive particles can typically be supplied to the surface of the polishing pad. A cleaning fluid (e.g., deionized water) can be sprayed onto the polishing pad to remove debris from the polishing process.

Disclosure of Invention

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit for delivering fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen supporting a polishing pad, a carrier head supporting a substrate and contacting the substrate with the polishing pad, and a motor that causes relative movement between the platen and the carrier head. The fluid delivery catheter includes: a conductive wire extending through an interior of the conduit to flow an electrostatic discharge to ground; and a wire extraction fitting covering and sealing the location of the conductive wire through the wall of the fluid delivery conduit.

Particular implementations may include one or more of the following features. The conductive lines may be made of noble metals. The fluid delivery conduit may be a flexible tube. The conductive lugs (lug) may be screwed into the threaded portion of the passageway. The plastic body may be screwed into a threaded opening in the fluid delivery conduit. The fluid source includes a steam generating boiler. The fluid source includes a reservoir to hold a polishing fluid, the system includes a dispenser to deliver the polishing fluid to the polishing pad, and the fluid delivery conduit couples the reservoir to the dispenser. The fluid source includes a cleaning fluid source, the system includes a dispenser that delivers cleaning fluid to the polishing pad, conditioner head, or carrier head, and the fluid delivery conduit couples the fluid source to the dispenser. The fluid source includes a temperature control fluid source, the system includes a dispenser that delivers a temperature control fluid to the polishing pad, and the fluid delivery conduit couples the fluid source to the dispenser. The fluid source includes a pressure line, wherein the carrier head includes one or more pressurizable chambers, and the fluid delivery conduit couples the pressure line to the carrier head. The fluid source includes a pressure line, wherein the regulator head includes one or more pressurizable chambers, and the fluid delivery conduit couples the pressure line to the regulator head. The fluid delivery conduit includes an inlet and an outlet for the fluid, and the conductive wire extends along at least 75% of a distance from the inlet to the outlet. The ground pick-up fitting covers and seals the location where the conductive wire passes through the wall of the fluid delivery conduit. The ground pick-up fitting includes a plastic body having a passageway therethrough, wherein the conductive wire is inserted into one end of the passageway and a conductive lug is inserted into the opposite end of the passageway and contacts the conductive wire.

In another aspect, a method of manufacturing a fluid conduit includes: placing a conductive wire through a tube, wherein the tube is configured to flow a fluid into a chemical mechanical polishing assembly; and coupling the conductive line to a ground source to form an electrostatic discharge protection component to conduct electrostatic charges.

Particular implementations may include one or more of the following features. The electrostatic discharge protection component may be mounted on the chemical mechanical polishing component. The tube may fluidly couple the tube to a fluid source to flow fluid from the fluid source to the chemical mechanical polishing assembly. The conductive lines may be coupled to a common ground source.

In another aspect, an assembly for electrically connecting to a volume having a fluid includes a wall forming a boundary of the volume to contain the fluid, a conductive wire extending through the volume, and an extraction fitting providing a sealed electrical connection through the wall. The extraction fitting includes an annular plastic body having a passageway therethrough. The plastic body has a threaded outer surface threaded into a threaded bore in the wall, the conductive wire is inserted into one end of the passageway, and the conductive lugs are inserted into the opposite end of the passageway and contact the conductive wire. The conductive lugs have threaded outer surfaces that screw into threaded portions at opposite ends of the passageway.

Particular implementations may include one or more of the following features. A sealant may be placed between the threaded outer surface of the plastic body and the threaded hole in the wall. A sealant may be placed between the threaded outer surface of the lug body and the threaded portion of the passageway. In either case, the sealant may be a Polytetrafluoroethylene (PTFE) tape. The plastic body may be Polytetrafluoroethylene (PTFE). The wall may be plastic. The fluid may be steam. The conductive lines may be made of noble metals. The plastic body is tapered such that the one end of the passageway is compressed to form a seal between the conductive wire and an inner surface of the passageway. The passageway includes a lower portion extending from the one end and an upper portion extending from the opposite end, and the upper portion is narrower than the lower portion. The conductive wire is compressed between the bottom of the ledge and the bottom of the upper portion of the via. The wall forms a conduit for flowing the fluid to a semiconductor processing system or the wall forms a processing chamber of a semiconductor processing system. The semiconductor processing system includes a deposition system, an etching system, or a thermal processing system. The conductive line is coupled to an antenna or sensor inside the processing chamber. The assembly comprises: monitoring a system or controller; and a second electrically conductive wire connecting the monitoring system or the controller to the electrically conductive lugs. The assembly includes a second conductive wire connecting the conductive lugs to electrical ground.

Possible advantages may include, but are not limited to, one or more of the following.

The risk of electrostatic discharge from the fluid delivery line and thus damage to the fluid delivery line or other components in the chemical mechanical polishing system may be reduced. The components of the grounding mechanism can be manufactured easily and at low cost. When the fluid interacts with the precious metal, the fluid flowing through the tube does not have an additional risk of contamination. Additionally, the systems and methods disclosed herein are high temperature safe and compatible with semiconductor cleaning chambers.

The details of one or more implementations are set forth in the accompanying drawings and the description below. Other aspects, features, and advantages will be apparent from the description and drawings, and from the claims.

Drawings

Fig. 1 shows a schematic cross-sectional view of an example of a polishing station of a polishing apparatus.

Fig. 2 is a schematic top view of an example polishing station of a chemical mechanical polishing apparatus.

Fig. 3A is a schematic diagram of a fluid delivery line with conductive lines in a chemical mechanical polishing system.

Fig. 3B is a schematic cross-sectional view of the fluid delivery line of fig. 3A.

Fig. 3C is a schematic cross-sectional view of the ground extraction fitting assembly.

Fig. 4 is a schematic cross-sectional view of a ground pick-up fitting assembly attached to a pipe.

Fig. 5 is a schematic cross-sectional view of an electrical connection extraction fitting assembly attached to a conduit for a semiconductor processing system.

Fig. 6 is a schematic cross-sectional view of an electrical connection extraction fitting assembly attached to a process chamber of a semiconductor processing system.

Like reference symbols in the various drawings indicate like elements.

Detailed Description

A chemical mechanical polishing system includes a substantial amount of fluid delivery lines to deliver a substantial amount of fluid, such as deionized water, steam, nitrogen. For example, a typical system may include a fluid delivery line to deliver slurry to the polishing pad, to deliver cleaning fluid to the polishing pad to remove polishing debris, to deliver heating or cooling fluid to the polishing pad to control the temperature of the polishing process, to deliver pressurized gas for pneumatic control of pressure in the carrier head, and so forth. Static electricity accumulation in these fluid transfer lines may be caused, for example, by triboelectrification or static electricity induction. If the static electricity build-up becomes too large, it may cause static electricity discharge, damaging the components and tubing along the fluid delivery line. In particular, static electricity is particularly prone to occur in fluid lines that carry hot gases (e.g., steam). The combination of steam and temperature can cause triboelectrification that is not observed in conventional systems that do not use steam.

The traditional approach for static dissipative (electrostatic dissipative, ESD) tubes is to place a conductive layer, such as carbon, inside the tube. However, particles of the material coated on the inside of the tube may be fluid-fed to the polishing system, thereby causing contamination and defects of the substrate. Furthermore, the polishing environment may be wet and wet with the splattered slurry, so that the conductive layer on the outside of the tube may experience oxidation or environmental wear.

Other commercially available options for grounding technology, such as tubes impregnated with integral carbon on the inside and outside of the tube, cannot fully dissipate ESD charge from the polymer fluid lines. In addition, these methods tend to leak at the pipe ends. These problems are exacerbated at high temperatures, which is an unpredictable problem in chemical mechanical polishing systems, as temperature regulation becomes more important to control the process.

Wires formed of conductive noble metal and extending through the interior of the tube can ameliorate these problems. Noble metals, such as platinum or gold, do not interact with steam even at high temperatures. Thus, the placement of noble metal wires inside the tube is less likely to result in particles and also less likely to result in defects in the integrated circuit product. The ground pick-up fitting assembly may be designed to maintain a hermetically sealed tube path while also properly introducing a ground path for the internal precious metal lead. The noble metal lead may be coupled to a ground source such that electrical charge generated by friction between the fluid flow and the surrounding polymeric tubing can be dissipated.

Fig. 1 and 2 illustrate an example of a polishing system 20 of a chemical mechanical polishing system. The polishing system 20 includes a rotatable disk platen 24, and a polishing pad 30 is disposed on the rotatable disk platen 24. The platen 24 is operable to rotate about an axis 23 (see arrow a in fig. 2). For example, the motor 22 may rotate the drive shaft 26 to rotate the platen 24. The polishing pad 30 may be a two-layer polishing pad having an outer polishing layer 34 and a softer backing layer 32.

The polishing system 20 can include a supply port 40 (e.g., at one end of a slurry dispense arm 43) to dispense a polishing liquid 42, such as an abrasive slurry, onto the polishing pad 30. The polishing liquid 42 may be delivered from a reservoir 44 (see fig. 2) through a fluid delivery line 46, such as by a pump.

The polishing system 20 can include a pad conditioner 90 (see fig. 2) having a conditioner disk 92 to maintain the surface roughness of the polishing pad 30. Regulator disc 92 may be positioned in regulator head 93 at one end of arm 94. May be accomplished, for example, by a pressurized gas (e.g., N ₂ ) To pneumatically control the pressing down of the conditioner disk 92 against the polishing pad 30.

The carrier head 50 is operable to hold the substrate 10 on the polishing pad 30. The carrier head 50 may also include a retaining ring 56 to maintain the lateral position of the substrate 10 under the carrier head. The carrier head 50 is suspended from a support structure 60 (e.g., a turntable or track) and is connected by a drive shaft 62 to a carrier head rotation motor 64 such that the carrier head is rotatable about the central axis 51. Optionally, the carrier head 50 may oscillate laterally, for example on a slider on a turntable, by movement along a track or by rotational oscillation of the turntable itself.

Carrier head 50 may include a flexible membrane 54 and a plurality of pressurizable chambers 52a-52c, the flexible membraneThe sheet 54 has a substrate mounting surface to contact the backside of the substrate 10 and the plurality of pressurizable chambers 52a-52c apply different pressures to different areas (e.g., different radial areas) on the substrate 10. The pressure of chambers 52a-52c may be controlled by pressure regulators 58a-58 c. The pressure regulators 58a-58c may be coupled by a pneumatic line 59, the pneumatic line 59 passing through a rotary joint and a drive shaft 62 and pressurizing gas (e.g., N ₂ ) To the respective chambers 52a-52c.

In operation, the platen rotates about its central axis 25 and the carrier head rotates about its central axis 51 (see arrow B in fig. 2) and translates laterally across the top surface of the polishing pad 30 (see arrow C in fig. 2).

As the carrier head 50 and conditioner head 92 sweep across the polishing pad 30, any exposed surfaces tend to become covered with slurry. For example, the slurry may adhere to the outer or inner diameter surface of the retaining ring 56. In general, for any surface that is not maintained in a wet state, the slurry will tend to coagulate and/or dry, resulting in corrosion of the part and particles and defects on the substrate. One solution is to jet clean the components (e.g., carrier head 50 and regulator head 92) with water or steam, for example. A carrier head cleaner (e.g., a vapor treatment assembly) for the carrier head may be part of a load cup (load cup) in the polishing system. Similarly, a conditioner head cleaner (e.g., a steam treatment assembly) for the conditioner head may be part of the conditioner head cleaning cup. In either case, a tube is required to deliver cleaning fluid (such as liquid water or steam) to the cleaner.

In some embodiments, the polishing system 20 includes a temperature sensor 80 to monitor the temperature of the polishing station or/and components of the polishing station or components in the polishing station, such as the temperature of the polishing pad 30 and/or the polishing liquid 38 on the polishing pad. For example, the temperature sensor 80 may be an Infrared (IR) sensor, such as an IR camera. Alternatively or additionally, the temperature sensor may be a contact sensor instead of a non-contact sensor. For example, the temperature sensor 80 may be a thermocouple or an IR thermometer positioned on or within the platen 24. In addition, the temperature sensor 80 may be in direct contact with the polishing pad.

The polishing system 20 can also include a temperature control system 100 to control the temperature of the polishing pad 30 and/or the polishing liquid 38 on the polishing pad. The temperature control system 100 may include a cooling system 102 and/or a heating system 104. At least one, and in some implementations both, of the cooling system 102 and the heating system 104 are configured to deliver a temperature-controlled medium (e.g., a liquid, vapor, or spray) onto the polishing surface 36 of the polishing pad 30 (or onto a polishing liquid already present on the polishing pad).

As shown in fig. 1, the example temperature control system 100 includes one or more arms 110 extending over the platen 22 and the polishing pad 30. A plurality of nozzles 120 are suspended from or formed in each arm 110, and each nozzle 120 is configured to deliver a temperature control fluid onto the polishing pad 30, such as spraying the fluid onto the polishing pad.

For operation as a cooling system, the temperature control fluid is a coolant. The coolant may be a gas (e.g., air) or a liquid (e.g., water). The cooling fluid may be at room temperature or cooled to below room temperature (e.g., at 5-15 ℃). The cooling fluid used in cooling system 102 may include, for example, chilled water, liquid nitrogen, or a gas formed from liquid nitrogen and/or dry ice. In some embodiments, droplets of a liquid (e.g., water, ethanol, or isopropanol) may be added to the gas stream. In some implementations, the cooling system uses a spray of air and a liquid, such as an atomized spray of a liquid (e.g., water). In particular, the cooling system may have a nozzle that produces an atomized spray of water cooled below room temperature.

As shown in fig. 2, the cooling system 102 may include a source 130 of liquid coolant medium and/or a source 132 of gaseous coolant medium. Liquid from source 130 and gas from source 132 may be delivered to arm 110 and to the interior of the arm through tubing 134, 136 before being directed through nozzle 120, for example, to form spray 122. When the coolant is dispensed, the coolant may be below room temperature, for example from-100 to 20 ℃, for example below 0 ℃.

Gas, such as compressed gas, from a gas source 132 can be coupled to a vortex tube 133 that can separate the compressed gas into a cold stream and a hot stream and direct the cold stream from the nozzle 120 onto the polishing pad 30. In some embodiments, the nozzle 120 is the lower end of a vortex tube that directs a cold flow of compressed gas onto the polishing pad 30.

For operation as a heating system, the temperature control fluid is a heating fluid. The heating fluid may be a gas (e.g., steam or heated air) or a liquid (e.g., heated water) or a combination of gas and liquid. The heating fluid is above room temperature, for example at 40-120 ℃, for example at 90-110 ℃. The fluid may be water, such as substantially pure deionized water, or water including additives or chemicals. In some embodiments, the heating system uses a vapor spray or a combination of vapor and liquid water. The steam may include additives or chemicals.

As shown in fig. 2, the heating system 104 may include a source 140 of heating liquid (e.g., hot water) and/or a source 142 of heating gas (e.g., steam). For example, source 142 may be a boiler. Liquid from source 140 and gas from source 142 may be delivered to arm 110 and to the interior of the arm through tubing 144, 146 before being directed through nozzle 120 to form spray 122.

Along the direction of rotation of platen 24, arm 110b of heating system 104 may be positioned between arm 110a of cooling system 102 and carrier head 70. Along the direction of rotation of the platen 24, the arm 110b of the heating system 104 may be positioned between the arm 110a of the cooling system 102 and the slurry dispenser arm 43. For example, the arm 110a of the cooling system 102, the arm 110b of the heating system 104, the slurry dispenser arm 43, and the carrier head 70 may be positioned in this order along the direction of rotation of the platen 24.

Instead of separate arms, the temperature control system 100 may include a single arm to dispense both coolant and heating fluid.

Alternatively or additionally, the temperature control system 100 may use other techniques to control the temperature of the polishing process. For example, a heating or cooling fluid (e.g., steam or cold water) may be injected into the polishing liquid 42 (e.g., slurry) to raise or lower the temperature of the polishing liquid 42 before the polishing liquid 42 is dispensed. As another example, a resistive heater may be supported in the platen 22 to heat the polishing pad 30 and/or in the carrier head 50 to heat the substrate 10.

Adjusting the temperature of the slurry and the polishing pad during polishing of the layer allows for increased interaction between charged abrasives such as cerium oxide. By using temperature control, the material removal rate can be advantageously increased by modulating the physical parameters of the polishing pad and altering the chemical interaction characteristics between the charged cerium oxide and the filler layer.

In some embodiments, the controller 90 receives signals from the temperature sensor 80 and executes a closed loop control algorithm to control the temperature control system 100, such as the relative flow rates, mixing ratios, pressures, or temperatures of the coolant or heating fluid, in order to maintain the polishing process at a desired temperature.

In some embodiments, the in-situ monitoring system measures the polishing rate of the substrate and the controller 90 executes a closed-loop control algorithm to control the temperature control system, such as the relative flow rates or temperatures of the coolant or heating fluid, in order to maintain the polishing rate at a desired rate.

The polishing system 20 also may include a high pressure rinse system 106. The high pressure flushing system 106 includes a plurality of nozzles 150, e.g., three to twenty nozzles, that direct a cleaning fluid (e.g., water) to the polishing pad 30 at a high intensity to flush the pad 30 and remove used slurry, polishing debris, etc. Cleaning fluid may flow from a source 156 of cleaning fluid (e.g., a reservoir of deionized water) through tubing 152 to nozzle 150.

One example rinse system 106 includes an arm 110c that extends over the platen 24 and the polishing pad 30. Along the direction of rotation of the platen 24, the arm 110c of the rinse system 106 may be located between the arm 110a of the cooling system 102 and the arm 110b of the heating system 104.

In some embodiments, the polishing system 20 includes a scraper or body 170 to uniformly distribute the polishing liquid 42 across the polishing pad 30. Along the direction of rotation of the platen 24, a scraper 170 may be located between the slurry dispenser 40 and the carrier head 70.

Although fig. 2 shows separate arms for each subsystem (e.g., heating system 104, cooling system 102, and flushing system 106), the various subsystems may be included in a single assembly supported by a common arm. Various fluid delivery components (e.g., tubing, passages, etc.) may extend inside each body.

Fig. 3A and 3B illustrate a fluid delivery line 300 that may be suitable for use in a chemical mechanical polishing system (e.g., polishing system 20). The fluid delivery line 300 may be used as a fluid delivery line 44 for polishing liquid, a pneumatic line 59 for carrier head, a fluid delivery line 96 for conditioner head, a tube 134 or 136 for cooling system, a tube 144 or 146 for heating system, a tube 152 for high pressure flushing system, a tube for delivering pneumatic and/or cleaning fluid (e.g., liquid water or steam) to the load cup and/or conditioner cleaner cup.

The fluid delivery line 300 may be particularly suitable for delivering hot gases (e.g., steam) because the combination of steam and high temperature may result in an accumulation of electrostatic charges that may not occur in room temperature gases or liquids. For example, the fluid delivery line 300 may be used as a tube 146 to deliver hot gas (e.g., steam) from a source 142 (e.g., a boiler), or as a tube to deliver steam for cleaning a carrier head and/or a conditioner head in a load cup and/or a conditioner cleaner cup.

The fluid delivery line 300 includes a polymer tube 310, which may be a material that is electrically insulating and resistant to temperatures up to 100 ℃ and inert to the fluid passing through the fluid delivery line 300 and inert to the polishing process. For example, the polymer tube may be Perfluoroalkoxyalkane (PFA). The polymeric tube 310 has an interior passage 312 through which fluid flows 312. The polymer tube 310 may have an inlet 314 and an outlet 316 through which fluid will flow through the inlet 314 and outlet 316. The fluid delivery line 300 may be formed from multiple pieces, such as by screwing one piece having a threaded outer surface into another piece having a threaded inner surface. Polytetrafluoroethylene (PTFE) (e.g., teflon) may be provided ^TM ) The tape or sealing compound provides additional sealing between the various pieces. Further, while fig. 3A shows the fluid delivery line 300 as being linear, the fluid delivery line may have one or more bends or curves.

The conductive wire 340 extends through the internal passage 312 of the polymeric tube 310. This conductive line 340 may be connected to a common ground. For example, the conductive wire 340 may be connected to the ground wire 342 through a fluid-tight ground extraction fitting assembly 350. The conductive line 340 may be a noble metal such as gold and platinum. Noble metals, such as platinum or gold, do not interact with steam even at high temperatures, so the risk of particles and corresponding defects is low. Within tube 310, the conductive wire is "bare", i.e., uncoated or covered with an insulating sheath, such that electrostatic charges may be drained away by wire 340. Instead, the ground wire 342 may be nearly any wire, such as copper wire with an insulating sheath (e.g., a plastic sheath), that is stripped at the connection to the ground pick-up fitting assembly 350.

The conductive wire 340 need not extend through the fluid inlet and outlet of the tube, but can extend along at least a majority (e.g., at least 50%, such as at least 75%, such as at least 90%) of the distance between the inlet and outlet. Thus, the ground extraction fitting assembly 342 should be located near, for example, the last 10% (e.g., the last 5%) of the distance between the inlet and the outlet. This may prevent electrostatic discharge along a substantial portion of the fluid path.

Fig. 3A shows a fluid delivery line 300 having two ground pick-up fitting assemblies 350 and a conductive wire 340 extending between and connected to the two ground pick-up fitting assemblies 350. However, this is not necessary. In some implementations, the fluid delivery line 300 may have a single ground pick-up fitting assembly 350, and one end of the conductive wire 340 may be attached to the ground pick-up fitting assembly 350 while the other end of the conductive wire is "loosely" hung in the fluid delivery line 300. In some embodiments, the fluid delivery line 300 may have a single ground pick-up fitting assembly 350, and the conductive wire 340 forms a loop within the fluid delivery line 300 with both ends attached to the same ground pick-up fitting assembly 350. The loop in the wire 340 may extend through a loop in the fluid delivery line itself.

In some implementations, the ground pick-up fitting assembly 350 may include a valve having an adjustable inner diameter. The conductive wire may be fed through an opening through the valve, and then the valve may be tightened, for example by rotating from the outside of the tube, such that the inner surface clamps and seals the conductive wire. The valve may be formed of a plastic (e.g., PFA or Polytetrafluoroethylene (PTFE)) that is non-reactive with steam and capable of withstanding high temperatures.

In some embodiments, the ground pick-up fitting assembly 350 is simply provided by a fine bore through the tubing. In some implementations, the size of the hole is just sufficient to pass one or both wires, and the insertion of the wire(s) effectively plugs the hole. If necessary, a sealant may be applied to the wire where it exits the hole and then cured to reduce the likelihood of leakage. One end of the wire may be tapered to aid in inserting and guiding the wire through the hole.

In some embodiments, extraction fitting assembly 350 includes a conductive grounding lug (lug) that provides an electrical connection to wire 340.

Fig. 3C and 4 illustrate a mechanism for connecting an external ground lead 342 to a conductive wire 340 inside the fluid delivery line 300. The ground pick-up fitting assembly 350 includes a fitting 352, the fitting 352 being an annular body having a passageway 354 therethrough. In some implementations, the passageway 354 has a narrow portion 354a and a wider portion 354b. The inner surface of the wide portion 354b of the passageway 354 may be threaded.

Fitting 352 may be a plastic material that does not corrode or dissolve upon exposure to fluid (e.g., steam) in fluid delivery line 310. For example, fitting 352 may be Polytetrafluoroethylene (PTFE) (e.g., teflon @ ^TM ). The bottom portion 358 of the outer surface of fitting 352 is threaded and is screwed into a corresponding threaded receiving bore in tube 310 to form a seal between tube 310 and fitting 352. An additional seal between fitting 352 and tube 310 may provide Polytetrafluoroethylene (PTFE) (e.g., teflon) between the threads ^TM ) Tape or sealing compound.

The conductive wire 340 extends through the lower portion 354a of the passageway 354 to contact the conductive tab 360 inserted into the upper portion 354b of the passageway 354. In some embodiments, fitting 352 is a cone, the lower end of which is the narrower side of the cone. In this case, as fitting 352 is screwed into tube 310, passageway 354 is clamped inward (at 355) so that the plastic of fitting 352 securely contacts and seals around conductive wire 340. This may form a primary seal to prevent fluid in the fluid delivery line 300 from escaping through the passageway 354.

The lugs 360 may have threaded outer surfaces 362 with the threaded outer surfaces 362 threaded into corresponding threaded regions 354c of the upper portion 354b of the passageway to form a seal between the lugs 360 and the fitting 352. This may provide a secondary seal that prevents fluid from escaping through the passageway 354. An additional seal between fitting 352 and tube 310 may provide Polytetrafluoroethylene (PTFE) (e.g., teflon) between the threads ^TM ) Tape or sealing compound.

Two lug nuts 356 may be threaded onto lugs 360 and external ground wire 342 may be wrapped around the shaft of lugs 360 and captured and compressed between two lug nuts 356.

One technique for assembling fluid delivery line 300 with conductive line 340 is as follows. Initially, the conductive wire is inserted through the tube 310. This may be performed prior to attaching the inlet, outlet and extraction fitment assembly. For example, the conductive wire may be secured to a catheter having an outer diameter slightly smaller than the inner diameter of the internal passage 312. Such a catheter may be used to guide a conductive wire through the tube 310, for example around a bend or curve in the tube 310.

A portion of the conductive wire 340 extending through each end of the tube may then be inserted into a passageway 354 in the fitting 352. The width of the narrow portion 354a may be just sufficient to allow one or two wires to pass through, for example, wires disposed in the narrow portion 354a in contact with the sidewalls of the narrow portion 354a of the via 354. The conductive wire 340 may be inserted through the passageway 354 until the wire extends into the wider portion 354b of the passageway 354. Optionally, if conductive line 340 extends beyond top surface 357 of fitting 352, line 350 may be trimmed so that it does not extend substantially beyond top surface 357, for example, not more than 1mm.

Conductive lugs 360 are then inserted into the wide portions 354b of the vias 354. In particular, the conductive lugs 360 may have threaded shafts 362 with the threaded shafts 362 screwed into the threaded wide portions 354b of the passages such that the lugs 360 securely contact and electrically connect with the conductive wires 340. One end of the wire 340 may be compressed (at 344) between the bottom of the tab 360 and the bottom of the wider portion 354b of the channel 354 to provide an electrical connection.

Finally, the fitting 350 may be attached either directly to the tube 312 or to the inlet 314 or outlet 316. In particular, the bottom portion 358 of the outer surface of the fitting 350 may be threaded and may be screwed into a corresponding threaded receiving hole in the tube 312, the inlet 314 or the outlet 316 b.

The assembly process may include rotating the fluid delivery line 300 in advance to prevent caking, overcoming a 90 ° turn, cutting the wire flush, locking the nut to push on the wire, and taping the locking nut with Teflon tape to secure it.

In some embodiments, the PFA tubing may be 1/8 inch thick and up to 7 feet long.

Such a fluid delivery line may provide a ground path for accumulated charge and thereby reduce the risk of component damage while still remaining compatible with the polishing process.

While the above description focuses on a fluid delivery line for a chemical mechanical polishing system, as shown in fig. 5 and 6, the ground extraction fitting assembly 350 may be suitable for other uses as a general conductive circuit extraction fitting assembly when a sealed conductive connection is desired between an interior volume 502 of a processing system (e.g., semiconductor processing system 500) and an external environment 504, particularly where the interior volume 502 contains steam. The semiconductor processing system typically includes a chamber 510 and a support 512 (e.g., a pedestal, edge support ring, or lift pins) to hold the substrate 10 within the chamber 510, and includes a gas source 514 (e.g., a steam or heated water generating boiler) or facility gas lines. Examples of processing systems include vapor processing, but also include rapid thermal processing, etching, and deposition systems in which vapor is required for temperature control of a component or as a process gas.

As shown in fig. 5, the connection may be through a wall of a line 520, the line 520 delivering fluid (e.g., steam) from the source 514 to another component of the processing system, e.g., for injection into the processing chamber 512 or to provide temperature control for one component (e.g., wall, support pedestal, etc.) in the processing system 500. Alternatively, as shown in fig. 6, the connection may be through a wall of the process chamber 510 directly into the interior volume of the chamber 502. In either case, the wire 340' may be used for ground, but may also be used for other electrical purposes, such as delivering DC or AC current from the voltage source 530 to the antenna 540, the sensor 542, or other components in the interior volume 502, or delivering a signal (e.g., DC or AC current) from the antenna 540, the sensor 542, or other components in the interior volume 502 to the external detection system or controller 533.

Various embodiments of the present utility model have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the utility model. Accordingly, other embodiments are within the scope of the following claims.

Claims

1. A chemical mechanical polishing assembly comprising:

a chemical mechanical polishing system, the chemical mechanical polishing system comprising: a platen supporting a polishing pad, a carrier head supporting a substrate and bringing the substrate into contact with the polishing pad, and a motor causing relative movement between the platen and the carrier head;

a fluid source; and

a fluid delivery conduit for delivering fluid from the fluid source into the chemical mechanical polishing system, the fluid delivery conduit comprising:

a conductive wire extending through an interior of the conduit to flow an electrostatic discharge to ground; and

a ground extraction fitting providing a sealed electrical connection between the conductive wire and the ground through a wall of the fluid delivery conduit.

2. The assembly of claim 1, wherein the fluid source comprises a steam generating boiler.

3. The assembly of claim 1, wherein the fluid source comprises a reservoir to contain a polishing fluid, the system comprises a dispenser to deliver the polishing fluid to the polishing pad, and the fluid delivery conduit couples the reservoir to the dispenser.

4. The assembly of claim 1, wherein the fluid source comprises a cleaning fluid source, the system comprises a dispenser that delivers cleaning fluid to the polishing pad, conditioner head, or carrier head, and the fluid delivery conduit couples the fluid source to the dispenser.

5. The assembly of claim 1, wherein the fluid source comprises a temperature control fluid source, the system comprises a dispenser that delivers a temperature control fluid to the polishing pad, and the fluid delivery conduit couples the fluid source to the dispenser.

6. The assembly of claim 1, wherein the fluid source comprises a pressure line, wherein the carrier head comprises one or more pressurizable chambers, and the fluid delivery conduit couples the pressure line to the carrier head.

7. The assembly of claim 4, wherein the fluid source comprises a pressure line, wherein the regulator head comprises one or more pressurizable chambers, and the fluid delivery conduit couples the pressure line to the regulator head.

8. The assembly of claim 1, wherein the fluid delivery conduit comprises an inlet and an outlet for the fluid, and the conductive wire extends along at least 75% of a distance from the inlet to the outlet.

9. The assembly of claim 1, wherein the ground pick-up fitting covers and seals the location of the conductive wire through the wall of the fluid delivery conduit.

10. The assembly of claim 9, wherein the ground extraction fitting comprises a plastic body having a passageway therethrough, wherein the conductive wire is inserted into one end of the passageway and a conductive lug is inserted into an opposite end of the passageway and contacts the conductive wire.

11. An assembly for electrical connection to a volume having a fluid, comprising:

a wall forming a boundary of the volume to contain the fluid;

a conductive wire extending through the volume;

an extraction fitting providing a sealed electrical connection through a wall, wherein the extraction fitting comprises an annular plastic body having a passageway therethrough, the plastic body having a threaded outer surface threaded into a threaded bore in the wall, the conductive wire being inserted into one end of the passageway, and a conductive lug being inserted into an opposite end of the passageway and contacting the conductive wire, and the conductive lug having a threaded outer surface threaded into a threaded portion at the opposite end of the passageway.

12. The assembly of claim 11, wherein the plastic body is tapered such that the one end of the passageway is compressed to form a seal between the conductive wire and an inner surface of the passageway.

13. The assembly of claim 11, wherein the passageway includes a lower portion extending from the one end and an upper portion extending from the opposite end, and wherein the upper portion is narrower than the lower portion.

14. The assembly of claim 13, wherein the conductive wire is compressed between a bottom of the ledge and a bottom of the upper portion of the via.

15. The assembly of claim 11, wherein the wall forms a conduit for flowing the fluid to a semiconductor processing system or the wall forms a processing chamber of a semiconductor processing system.

16. The assembly of claim 15, wherein the semiconductor processing system comprises a deposition system, an etching system, or a thermal processing system.

17. The assembly of claim 15, wherein the conductive wire is coupled to an antenna or sensor inside the processing chamber.

18. The assembly of claim 11, wherein the assembly comprises: monitoring a system or controller; and a second electrically conductive wire connecting the monitoring system or the controller to the electrically conductive lugs.

19. The assembly of claim 11, comprising a second conductive wire connecting the conductive lug to electrical ground.