CN220191153U - Multi-layer tool fixture for circuit board surface metallization process - Google Patents
Multi-layer tool fixture for circuit board surface metallization process Download PDFInfo
- Publication number
- CN220191153U CN220191153U CN202321637959.7U CN202321637959U CN220191153U CN 220191153 U CN220191153 U CN 220191153U CN 202321637959 U CN202321637959 U CN 202321637959U CN 220191153 U CN220191153 U CN 220191153U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board surface
- pressing rod
- surface metallization
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001465 metallisation Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000008569 process Effects 0.000 title claims abstract description 15
- 230000006835 compression Effects 0.000 claims abstract description 45
- 238000007906 compression Methods 0.000 claims abstract description 45
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 239000000725 suspension Substances 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of tooling jigs, in particular to a multi-layer tooling jig for a circuit board surface metallization process, which comprises a frame, a hanging mechanism, a second compression bar and a buckle, wherein the frame comprises a connecting rod and a first compression bar which are fixedly connected in a rectangular shape; the suspension mechanism is fixedly connected with the frame and is positioned above the frame; the second pressure lever is rotationally connected with the first pressure lever. According to the utility model, the first pressure bar and the second pressure bar which are connected in a rotating way and the buckle used for clamping the first pressure bar and the second pressure bar are arranged, so that a circuit board placed between the first pressure bar and the second pressure bar is clamped stably and is not easy to fall off.
Description
Technical Field
The utility model relates to the technical field of tooling jigs, in particular to a multi-layer tooling jig for a circuit board surface metallization process.
Background
The ceramic circuit board is a ceramic circuit board which utilizes heat conduction ceramic powder and an organic adhesive, has good high-frequency performance and electrical performance, has high heat conductivity, high chemical stability and high thermal stability, is electroplated on ceramic metallization, thickened ceramic copper, is filled in a through hole, is manufactured by a fine circuit and the like, and needs to be fixed by a tool fixture so as to facilitate the processing operation of workers.
Disclosure of Invention
The present utility model is directed to a multi-layer tooling fixture for a circuit board surface metallization process, which at least solves one of the problems set forth in the background art.
The technical scheme of the utility model is as follows:
a multilayer formula frock tool for circuit board surface metallization technology includes:
the rack comprises a connecting rod and a first compression bar which are fixedly connected in a rectangular shape;
the suspension mechanism is fixedly connected with the frame and is positioned above the frame;
the first pressing rod and the second pressing rod are respectively provided with a plurality of metal strips, and the metal strips are also attached when the first pressing rod and the second pressing rod rotate to be attached;
the buckle is rotationally connected with the first pressure bar, and when the first pressure bar and the second pressure bar rotate to be mutually attached, the buckle is used for buckling the first pressure bar and the second pressure bar together.
Further, a pressing plate is fixedly connected to the second pressing rod.
Further, a plurality of round holes are uniformly formed in the pressing plate.
Further, grooves are formed in the surfaces, opposite to the first compression bar, of the second compression bar, tilted elastic metal pressing sheets are arranged in the grooves, and the tilted elastic metal pressing sheets are higher than the depth of the grooves.
Further, the buckle is integrally formed with a handle.
Further, one end of the suspension mechanism, which is far away from the rack, is integrally formed with a hook, and a screw with a handle is arranged on the hook.
Further, the connecting rod is connected with the first compression bar through a screw.
Further, oval long strip threaded holes are formed in two ends of the connecting rod.
The utility model provides a multilayer tooling jig for a circuit board surface metallization process through improvement, and compared with the prior art, the multilayer tooling jig has at least one of the following improvements and advantages:
according to the utility model, the first pressure bar and the second pressure bar which are connected in a rotating way and the buckle used for clamping the first pressure bar and the second pressure bar are arranged, so that a circuit board placed between the first pressure bar and the second pressure bar is clamped stably and is not easy to fall off. The surface of the first compression bar and the second compression bar, which are contacted, are provided with the elliptical grooves, and the elastic metal pressing sheets are arranged in the elliptical grooves, so that the circuit board can be further fixed by the elastic metal pressing sheets, and can be firmly clamped and cannot fall off in moving or subsequent procedures.
Drawings
The utility model is further explained below with reference to the drawings and examples:
FIG. 1 is a schematic diagram of a multi-layer tooling fixture of the present utility model when closed;
FIG. 2 is a schematic diagram of a multi-layer tooling fixture according to the present utility model when opened;
FIG. 3 is a schematic view of a multi-layer tooling fixture according to another embodiment of the present utility model;
fig. 4 is a partial enlarged view at a in fig. 3.
Reference numerals illustrate:
2. a suspension mechanism; 3. a second compression bar; 4. a buckle; 11. a connecting rod; 12. a first compression bar; 31. a metal strip; 32. a pressing plate; 321. a round hole; 33. a groove; 34. an elastic metal tabletting; 41. a handle; 21. a hook; 22. screw with handle.
Detailed Description
The following detailed description of the present utility model clearly and fully describes the technical solutions of the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
Furthermore, the terms "first," "second," "third," and the like in the description of the present specification and in the appended claims, are used for distinguishing between descriptions and not necessarily for indicating or implying a relative importance.
The utility model provides a multilayer tooling jig for a circuit board surface metallization process by improving the technical scheme that:
a multi-layer tool fixture for a circuit board surface metallization process comprises a frame, a hanging mechanism 2, a second pressing rod 3 and a buckle 4.
As shown in fig. 1, the frame includes a connecting rod 11 and a first compression bar 12 fixedly connected in a rectangular shape. The two first compression bars 12 are arranged in parallel, the two connecting rods 11 are respectively arranged at two ends of the first compression bars 12, and the connecting rods 11 are connected with the first compression bars 12 through screws. The two ends of the connecting rod 11 are provided with oval strip threaded holes, and the oval strip threaded holes are used for adjusting the distance between the two first compression bars 12 so as to adapt to circuit boards with different widths.
The hanging mechanism 2 is fixedly connected with the frame, and the hanging mechanism 2 is positioned above the frame. One end of the hanging mechanism 2 far away from the rack is integrally formed with a hook 21, the hook 21 is provided with a screw 22 with a handle, the hook 21 is used for hanging the tool fixture, the screw is used for fixing the hanging mechanism 2 with a hanging rod and the like, and the handle is convenient for turning the screw.
As shown in fig. 2 and 3, the second pressing rod 3 is rotatably connected with the first pressing rod 12, and two second pressing rods 3 are correspondingly arranged, and the second pressing rod 3 is rotatably connected with the first pressing rod 12 through a hinge. The circuit board is placed between the first 12 and second 3 compression bars. When the first compression bar 12 and the second compression bar 3 relatively rotate until the first compression bar 12 and the second compression bar 3 are located on the same plane, namely the first compression bar 12 and the second compression bar 3 are in an open state, at this time, the circuit board is placed on the first compression bar 12, then the second compression bar 3 rotates around the rotation axis until the second compression bar 3 is attached to the surface of the first compression bar 12, and the first compression bar 12 and the second compression bar 3 overlap, namely the first compression bar 12 and the second compression bar 3 are in a closed state, at this time, the first compression bar 12 and the second compression bar 3 compress the circuit board. The first compression bar 12 and the second compression bar 3 are respectively provided with a plurality of metal strips 31, and the metal strips 31 are also attached when the first compression bar 12 and the second compression bar 3 rotate to be attached. The metal strip 31 is used for subsequent operations such as ceramic metallization, ceramic thickening copper electroplating and the like of the circuit board.
As shown in fig. 1, the buckle 4 is rotatably connected with the first compression bar 12, and when the first compression bar 12 and the second compression bar 3 are in a closed state, the buckle 4 is rotated to buckle the first compression bar 12 and the second compression bar 3 together. The buckle 4 is used for buckling the first pressing rod 12, the circuit board and the second pressing rod 3 together, and the circuit board can be stably clamped between the first pressing rod 12 and the second pressing rod 3. The buckle 4 is integrally formed with a handle 41, and the handle 41 is convenient for rotating the buckle 4.
As shown in fig. 2, the second pressing rod 3 is fixedly connected with a pressing plate 32, and a plurality of circular holes 321 are uniformly formed in the pressing plate 32. The two first press rods 12 of the tooling fixture are respectively used for fixing different circuit boards, namely, only one side of the circuit board is fixed between the first press rod 12 and the second press rod 3, and the press plate 32 is used for preventing the other side of the circuit board from tilting when only one side of the circuit board is fixedly connected. The circular hole 321 is used for allowing the plating solution to penetrate therethrough and contact with the circuit board without obstruction.
As shown in fig. 4, the surfaces of the second compression bar 3 opposite to the first compression bar 12 are provided with grooves 33, the grooves 33 are internally provided with tilted elastic metal pressing pieces 34, and the tilted elastic metal pressing pieces 34 are higher than the depth of the grooves 33. The oval groove is used for accommodating the elastic metal pressing sheet 34, so that a gap is avoided between the first pressing rod 12 and the second pressing rod 3 due to the thickness of the elastic metal pressing sheet 34, the fixation of a circuit board is affected, the elastic metal pressing sheet 34 is elastic, the gap is not generated between the first pressing rod 12 and the second pressing rod 3, and when the first pressing rod 12 and the second pressing rod 3 are in a closed state, the elastic metal pressing sheet 34 has extrusion force on the upper surface and the lower surface of the circuit board, and the circuit board is further fixed.
Claims (8)
1. A multilayer formula frock tool for circuit board surface metallization technology, its characterized in that includes:
the rack comprises a connecting rod (11) and a first compression bar (12) which are fixedly connected in a rectangular shape;
the suspension mechanism (2), the suspension mechanism (2) is fixedly connected with the frame, and the suspension mechanism (2) is positioned above the frame;
the second pressing rod (3), the second pressing rod (3) is rotationally connected with the first pressing rod (12), a plurality of metal strips (31) are arranged on the first pressing rod (12) and the second pressing rod (3), and when the first pressing rod (12) and the second pressing rod (3) rotate to be mutually attached, the metal strips (31) on the first pressing rod (12) and the second pressing rod (3) are respectively attached;
the buckle (4), buckle (4) with first depression bar (12) rotate and be connected, when first depression bar (12) rotate to the looks when laminating with second depression bar (3), buckle (4) will first depression bar (12) are in the same place with second depression bar (3).
2. The multi-layer tooling jig for the circuit board surface metallization process according to claim 1, wherein the second pressing rod (3) is fixedly connected with a pressing plate (32).
3. The multi-layer tooling jig for the circuit board surface metallization process according to claim 2, wherein a plurality of circular holes (321) are uniformly formed on the pressing plate (32).
4. A multi-layer tooling jig for a circuit board surface metallization process according to claim 3, wherein the surfaces of the second press rod (3) opposite to the first press rod (12) are provided with grooves (33), the grooves (33) are internally provided with tilted elastic metal press sheets (34), and the tilted elastic metal press sheets (34) are higher than the depth of the grooves (33).
5. The multi-layer tooling jig for the circuit board surface metallization process according to claim 4, wherein the buckle (4) is provided with an integrally formed handle (41).
6. The multi-layer tooling jig for the circuit board surface metallization process according to claim 5, wherein a hook (21) is integrally formed at one end of the suspension mechanism (2) far away from the frame, and a screw (22) with a handle is arranged on the hook (21).
7. The multi-layer tooling jig for the circuit board surface metallization process according to any one of claims 1-6, wherein the connecting rod (11) is connected with the first compression rod (12) by a screw.
8. The multi-layer tooling jig for the circuit board surface metallization process according to claim 7, wherein oval long strip threaded holes are formed at two ends of the connecting rod (11).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321637959.7U CN220191153U (en) | 2023-06-27 | 2023-06-27 | Multi-layer tool fixture for circuit board surface metallization process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321637959.7U CN220191153U (en) | 2023-06-27 | 2023-06-27 | Multi-layer tool fixture for circuit board surface metallization process |
Publications (1)
Publication Number | Publication Date |
---|---|
CN220191153U true CN220191153U (en) | 2023-12-15 |
Family
ID=89105597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321637959.7U Active CN220191153U (en) | 2023-06-27 | 2023-06-27 | Multi-layer tool fixture for circuit board surface metallization process |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN220191153U (en) |
-
2023
- 2023-06-27 CN CN202321637959.7U patent/CN220191153U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN211420353U (en) | Copper plating device for circuit board printing | |
CN220191153U (en) | Multi-layer tool fixture for circuit board surface metallization process | |
CN103757685A (en) | Ceramic circuit board clamp used for electroplating | |
CN202730284U (en) | Printed circuit board hanger for electroplating | |
CN209402853U (en) | A kind of fixed device of wiring board finishing | |
CN209428627U (en) | Electroplating clamp | |
CN214025435U (en) | Mechanical spindle dismounting platform | |
CN112410741B (en) | Mask clamp based on hard alloy blade coating | |
CN212086731U (en) | Positioning equipment for mounting special substrate | |
CN211126091U (en) | Fast-assembling binding post of track traffic | |
CN211152353U (en) | Frame for gold plating of thin printed circuit board | |
CN211708361U (en) | Gold wire bonding tool | |
CN220224016U (en) | Tool jig for surface metallization of ceramic wafer | |
CN216992244U (en) | Auxiliary mechanism for drilling of PCB | |
CN218192624U (en) | Position-adjustable tool apron for hardware stamping | |
CN204039538U (en) | The composite electroplated hanger of a kind of flex circuit application | |
CN208033383U (en) | Aluminum substrate die cut process equipment | |
CN218445572U (en) | Screening and testing clamp for combined tantalum electrolytic capacitor | |
CN208279710U (en) | circuit board electroplating hanger | |
CN216919456U (en) | Accompanying plating plate for improving electroplating uniformity | |
CN221837123U (en) | Anodic oxidation hanger | |
CN216600212U (en) | Small-aperture high-precision circuit board | |
CN216801219U (en) | Automatic folding mechanism for aluminum substrate | |
CN213187082U (en) | SMT paster presss from both sides limit device | |
CN212910252U (en) | SMT electric fitting microwave tool |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |