CN220188876U - Audio processor with good heat dissipation performance - Google Patents
Audio processor with good heat dissipation performance Download PDFInfo
- Publication number
- CN220188876U CN220188876U CN202320685513.5U CN202320685513U CN220188876U CN 220188876 U CN220188876 U CN 220188876U CN 202320685513 U CN202320685513 U CN 202320685513U CN 220188876 U CN220188876 U CN 220188876U
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- Prior art keywords
- processor
- shell
- supporting
- audio processor
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 230000000712 assembly Effects 0.000 claims abstract description 8
- 238000000429 assembly Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920000297 Rayon Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 8
- 230000004888 barrier function Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an audio processor with good heat dissipation performance, relates to the technical field of audio processors, and aims to solve the problems that the existing audio processor dissipates heat by arranging a fan structure at the bottom, dust is easy to accumulate due to the fact that the fan is arranged at the bottom for a long time, dust can be blown into the audio processor while the heat is dissipated, and internal elements of the audio processor are polluted. The device comprises a processor shell, wherein four supporting loop bars are arranged at the bottom of the processor shell, mounting assemblies are arranged on the outer walls of two sides of the processor shell, and the mounting assemblies and the processor shell are integrally formed; further comprises: the top groove is arranged at the top position of the processor shell, the top groove and the processor shell are integrally formed, a top sealing plate is arranged in the top groove, four connecting rods are arranged at the upper end of the top sealing plate, and the connecting rods and the top sealing plate are integrally formed; and a temperature sensor provided on a front end surface of the processor housing.
Description
Technical Field
The utility model relates to the technical field of audio processors, in particular to an audio processor with good heat dissipation performance.
Background
The audio processor is also called a digital processor, is used for processing digital signals, and the internal structure of the audio processor is generally composed of an input part and an output part. The functions inside the audio processor are more complete, some audio processor are provided with processing modules capable of being dragged and programmed, the audio processor can be freely built by a user, and the audio processor needs to perform heat dissipation treatment in the using process.
For example, bulletin numbers: CN215815173U (named a digital audio processor with good heat dissipation performance), which comprises a body, gas outlet, air inlet and motor fan, the gas outlet has been seted up in the outside of body, the air inlet has been seted up to the bottom of body, the outside fixed mounting of air inlet has the rectangle frame, the inside fixed mounting of rectangle frame has motor fan, the supporting shoe is equipped with admittedly to the bottom of body, the bottom of supporting shoe is provided with adjusting structure, the rectangle frame passes through bolt and body fixed connection, and the quantity of bolt is four altogether, the locating rack has been equipped with admittedly in the outside of rectangle frame, the inside sliding connection of locating rack has the holding frame, the filter plate has been placed to the inside of holding frame, the intercommunication groove has been seted up on the surface of locating rack, the inside of intercommunication groove has been fixed with the shell fragment, the recess has been seted up on the surface of holding frame, one side of holding frame has the handle fixedly, the surface of handle has the rubber sleeve, adjusting structure include double-screw bolt, circle piece and silica gel pad, the screw hole is equipped with the double-screw bolt to the inside cover of screw bolt, bottom fixed mounting has the round piece, the round groove has been seted up to the round groove inside the round groove.
Above-mentioned audio processor dispels the heat through setting up fan structure in the bottom, but the fan setting has been for a long time in the bottom and has appeared the deposition easily, can blow in the inside of audio processor with the dust when dispelling the heat, causes the problem that audio processor inner element was polluted, accomplishes and provides an audio processor that heat dispersion is good.
Disclosure of Invention
The utility model aims to provide an audio processor with good heat dissipation performance, so as to solve the problem that the existing audio processor provided in the background art dissipates heat by arranging a fan structure at the bottom, but dust is easy to be accumulated when the fan is arranged at the bottom for a long time, dust can be blown into the audio processor while the heat is dissipated, and the internal elements of the audio processor are polluted.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the audio processor with good heat dissipation performance comprises a processor shell, wherein four supporting loop bars are arranged at the bottom of the processor shell, mounting assemblies are arranged on the outer walls of two sides of the processor shell, and the mounting assemblies and the processor shell are integrally formed;
further comprises:
the top groove is arranged at the top position of the processor shell, the top groove and the processor shell are integrally formed, a top sealing plate is arranged in the top groove, four connecting rods are arranged at the upper end of the top sealing plate, and the connecting rods and the top sealing plate are integrally formed;
the temperature sensor is arranged on the front end face of the processor shell, and the sensing end of the temperature sensor is positioned in the processor shell;
the fan frame is arranged at the upper end positions of the four connecting rods, the fan frame and the four connecting rods are integrally formed, and a cooling fan is arranged in the fan frame;
the device comprises a processor shell, an element mounting seat, a supporting inner rod and a supporting outer rod, wherein the element mounting seat is arranged in the processor shell, the supporting inner rod is arranged at the connecting position of the element mounting seat and the inner wall of the processor shell, and two ends of the supporting inner rod are respectively connected with the element mounting seat and the processor shell in a welding mode.
Preferably, a driving motor is arranged at the top of the fan frame, the cooling fan is arranged on an output shaft of the driving motor, an isolation barrier net is arranged below the cooling fan, and the isolation barrier net is fixedly arranged at the bottom of the fan frame through screws.
Preferably, the inside of top shrouding and the bottom central point of treater shell are put and all are provided with the water conservancy diversion gas pocket, and water conservancy diversion gas pocket and top shrouding and treater shell integrated into one piece set up.
Preferably, the inside of supporting the loop bar is provided with the screw thread guide arm, and the upper end of screw thread guide arm is provided with the connecting seat, and connecting seat and screw thread guide arm integrated into one piece set up, and connecting seat and the bottom viscose fixed connection of treater shell.
Preferably, the support sleeve rod is internally provided with a sleeve screw groove, and the support sleeve rod is movably connected with the threaded guide rod in a sleeve manner through the sleeve screw groove.
Preferably, the bottom of the supporting loop bar is provided with a contact support leg, and the contact support leg and the supporting loop bar are integrally formed.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the plate inside the original top groove of the processor shell is detached, the top sealing plate is replaced, then the driving motor is powered on, the cooling fan inside the fan frame is started to cool the audio processor, air flow enters through the flow guide air holes at the top and is finally discharged from the flow guide air holes at the bottom, the hot air is brought out by the circulation of the air flow, the purpose of cooling the audio processor is achieved, accumulated dust is blown out from top to bottom while cooling, the effect of cooling and ash removal synchronization is achieved, the problem that the existing audio processor is easy to accumulate dust due to the fact that the fan is arranged at the bottom for a long time is solved, dust is blown into the audio processor while cooling, and the internal elements of the audio processor are polluted is solved.
2. The sensing end of the temperature sensor is positioned in the processor shell, the internal temperature of the audio processor is monitored in real time, the numerical value of the temperature is displayed on the display screen of the temperature sensor, and a worker judges whether heat dissipation treatment is needed according to the displayed numerical value of the temperature, so that the aim of timely heat dissipation is fulfilled.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an audio processor with good heat dissipation performance;
FIG. 2 is a schematic view of the internal structure of a processor housing according to the present utility model;
FIG. 3 is a schematic view of the internal structure of the fan frame according to the present utility model;
FIG. 4 is a schematic view of the connection structure of the support loop bar and the threaded guide bar of the present utility model;
in the figure: 1. a processor housing; 2. a temperature sensor; 3. a mounting assembly; 4. a fan frame; 5. a top sealing plate; 6. a diversion air hole; 7. a drive motor; 8. a connecting rod; 9. a support loop bar; 10. a top groove; 11. a component mounting base; 12. supporting the inner rod; 13. an isolation barrier; 14. a heat radiation fan; 15. a connecting seat; 16. a threaded guide rod; 17. sleeving the screw groove; 18. contact legs.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: the audio processor with good heat dissipation performance comprises a processor shell 1, wherein four supporting loop bars 9 are arranged at the bottom of the processor shell 1, mounting assemblies 3 are arranged on the outer walls of two sides of the processor shell 1, and the mounting assemblies 3 and the processor shell 1 are integrally formed;
further comprises:
the top end groove 10 is arranged at the top position of the processor shell 1, the top end groove 10 and the processor shell 1 are integrally formed, a top sealing plate 5 is arranged in the top end groove 10, four connecting rods 8 are arranged at the upper end of the top sealing plate 5, and the connecting rods 8 and the top sealing plate 5 are integrally formed;
a temperature sensor 2 provided on the front end surface of the processor housing 1, the sensing end of the temperature sensor 2 being located inside the processor housing 1;
the fan frame 4 is arranged at the upper end positions of the four connecting rods 8, the fan frame 4 and the four connecting rods 8 are integrally formed, and a cooling fan 14 is arranged in the fan frame 4;
the component mounting seat 11 is arranged in the processor shell 1, the connection position of the component mounting seat 11 and the inner wall of the processor shell 1 is provided with the supporting inner rod 12, and two ends of the supporting inner rod 12 are respectively welded and connected with the component mounting seat 11 and the processor shell 1.
When the device is used, the plate inside the original top groove of the processor shell is detached, the top sealing plate is replaced and reinstalled, then the driving motor is powered on, the cooling fan inside the fan frame is started to cool the audio processor, air flow enters through the flow guide air holes at the top and is finally discharged from the flow guide air holes at the bottom, hot air is taken out through the flow of the air flow, the purpose of cooling the audio processor is achieved, accumulated ash is blown out from top to bottom while cooling, and the effect of cooling and ash removal synchronization is achieved.
Referring to fig. 1 and 3, a driving motor 7 is disposed at the top of the fan frame 4, a cooling fan 14 is mounted on an output shaft of the driving motor 7, an isolation barrier net 13 is mounted below the cooling fan 14, the isolation barrier net 13 is fixedly mounted with the bottom of the fan frame 4 through screws, and the driving motor 7 disposed at the top of the fan frame 4 plays a role in driving the cooling fan 14 to rotate.
Referring to fig. 2, the top sealing plate 5 and the bottom center of the processor housing 1 are provided with air guide holes 6, the top sealing plate 5 and the processor housing 1 are integrally formed, and the air guide holes 6 in the top sealing plate 5 and the bottom center of the processor housing 1 play a role in guiding air.
Referring to fig. 4, a threaded guide rod 16 is disposed in the support loop bar 9, a connection seat 15 is disposed at an upper end of the threaded guide rod 16, the connection seat 15 and the threaded guide rod 16 are integrally formed, the connection seat 15 is fixedly connected with the bottom adhesive of the processor housing 1, and the threaded guide rod 16 disposed in the support loop bar 9 plays a role in facilitating the sleeving and moving of the support loop bar 9.
Referring to fig. 4, a socket groove 17 is formed in the support sleeve rod 9, the support sleeve rod 9 is movably connected with the screw guide rod 16 in a socket manner through the socket groove 17, and the socket groove 17 formed in the support sleeve rod 9 plays a role in movably connecting with the screw guide rod 16.
Referring to fig. 4, a contact leg 18 is provided at the bottom of the support loop bar 9, the contact leg 18 and the support loop bar 9 are integrally formed, and the contact leg 18 provided at the bottom of the support loop bar 9 plays a role of contact support.
Working principle: when in use, the sensing end of the temperature sensor 2 is positioned in the processor shell 1, the internal temperature of the audio processor is monitored in real time, the numerical value of the temperature is displayed on the display screen of the temperature sensor 2, and the model of the temperature sensor 2 is as follows: HF3223, the staff judges whether need carry out the heat dissipation according to the temperature numerical value that shows, when carrying out the heat dissipation, pull down the inside plate of the original top tank 10 of processor shell 1, top shrouding 5 reinstallate, then put through the power with driving motor 7, open the inside radiator fan 14 of fan frame 4 and dispel the heat to audio processor, the air current gets into through the water conservancy diversion gas pocket 6 at top, finally follow the water conservancy diversion gas pocket 6 of bottom and discharge, the circulation of air current brings out the hot air, reach the radiating purpose to audio processor, top-down blows off the deposition when dispelling the heat, realize the synchronous effect of heat dissipation deashing, accomplish the use work of audio processor that the heat dispersion is good.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The audio processor with good heat dissipation performance comprises a processor shell (1), wherein four supporting loop bars (9) are arranged at the bottom of the processor shell (1), mounting assemblies (3) are arranged on the outer walls of two sides of the processor shell (1), and the mounting assemblies (3) and the processor shell (1) are integrally formed;
the method is characterized in that: further comprises:
the top groove (10) is formed in the top position of the processor shell (1), the top groove (10) and the processor shell (1) are integrally formed, a top sealing plate (5) is arranged in the top groove (10), four connecting rods (8) are arranged at the upper end of the top sealing plate (5), and the connecting rods (8) and the top sealing plate (5) are integrally formed;
a temperature sensor (2) arranged on the front end surface of the processor housing (1), wherein the sensing end of the temperature sensor (2) is positioned inside the processor housing (1);
the fan frame (4) is arranged at the upper end positions of the four connecting rods (8), the fan frame (4) and the four connecting rods (8) are integrally formed, and a cooling fan (14) is arranged in the fan frame (4);
the device comprises a processor shell (1), an element mounting seat (11), a supporting inner rod (12) and a supporting outer rod (12), wherein the element mounting seat (11) is arranged in the processor shell (1), and the connecting position of the element mounting seat (11) and the inner wall of the processor shell (1) is provided with the supporting inner rod (12), and two ends of the supporting inner rod (12) are respectively welded and connected with the element mounting seat (11) and the processor shell (1).
2. An audio processor with good heat dissipation performance as defined in claim 1, wherein: the top of fan frame (4) is provided with driving motor (7), and radiator fan (14) are installed on the output shaft of driving motor (7), keep off net (13) is installed to the below of radiator fan (14), keeps off net (13) and the bottom of fan frame (4) through screw fixed mounting.
3. An audio processor with good heat dissipation performance as defined in claim 1, wherein: the inside of top sealing plate (5) and the bottom central position of treater shell (1) are provided with water conservancy diversion gas pocket (6), and water conservancy diversion gas pocket (6) and top sealing plate (5) and treater shell (1) integrated into one piece set up.
4. An audio processor with good heat dissipation performance as defined in claim 1, wherein: the inside of supporting sleeve pole (9) is provided with screw thread guide arm (16), and the upper end of screw thread guide arm (16) is provided with connecting seat (15), and connecting seat (15) and screw thread guide arm (16) integrated into one piece set up, and bottom viscose fixed connection of connecting seat (15) and treater shell (1).
5. The audio processor with good heat dissipation performance according to claim 4, wherein: the inside of supporting sleeve rod (9) is provided with cup joint helicoidal groove (17), and supporting sleeve rod (9) cup joints swing joint through inside cup joint helicoidal groove (17) and screw thread guide arm (16).
6. An audio processor with good heat dissipation performance as defined in claim 1, wherein: the bottom of the supporting loop bar (9) is provided with a contact supporting foot (18), and the contact supporting foot (18) and the supporting loop bar (9) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320685513.5U CN220188876U (en) | 2023-03-31 | 2023-03-31 | Audio processor with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320685513.5U CN220188876U (en) | 2023-03-31 | 2023-03-31 | Audio processor with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220188876U true CN220188876U (en) | 2023-12-15 |
Family
ID=89112542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320685513.5U Active CN220188876U (en) | 2023-03-31 | 2023-03-31 | Audio processor with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220188876U (en) |
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2023
- 2023-03-31 CN CN202320685513.5U patent/CN220188876U/en active Active
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