CN111638766A - Computer with heat dissipation and dust removal functions - Google Patents

Computer with heat dissipation and dust removal functions Download PDF

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Publication number
CN111638766A
CN111638766A CN202010454597.2A CN202010454597A CN111638766A CN 111638766 A CN111638766 A CN 111638766A CN 202010454597 A CN202010454597 A CN 202010454597A CN 111638766 A CN111638766 A CN 111638766A
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China
Prior art keywords
plate
heat dissipation
computer
pipe
heat
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Withdrawn
Application number
CN202010454597.2A
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Chinese (zh)
Inventor
不公告发明人
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Shen Qilei
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Shen Qilei
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Priority to CN202010454597.2A priority Critical patent/CN111638766A/en
Publication of CN111638766A publication Critical patent/CN111638766A/en
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/28Plant or installations without electricity supply, e.g. using electrets
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a computer with heat dissipation and dust removal functions, which belongs to the technical field of computers, and comprises a case and a cooling box for heat dissipation, wherein the cooling box is fixedly connected to the inner wall of the bottom of the case, and the computer also comprises: the temperature guide plate is fixedly connected to the inner wall of the case; the first pressurizer is arranged on the inner wall of the bottom of the cooling box, the output end of the first pressurizer is connected with a first temperature conduction pipe, and one end, far away from the first pressurizer, of the first temperature conduction pipe is communicated with the cooling box; the rotating impeller is arranged in the first heat conduction pipe; the rotating shaft is fixedly connected to the rotating impeller; according to the invention, through the mutual matching of the first heat conduction pipe and the second heat conduction pipe, the heat dissipation efficiency is greatly improved, the rotating impeller is driven to rotate by utilizing the flow of the cooling liquid, so that the sliding head and the friction block are mutually rubbed to generate static electricity, the purpose of automatically adsorbing dust is achieved, and the use experience is greatly improved.

Description

Computer with heat dissipation and dust removal functions
Technical Field
The invention relates to the technical field of computers, in particular to a computer with heat dissipation and dust removal functions.
Background
The computer components are largely integrated circuits, as is known, most of heat which causes high temperature is not from the outside of the computer but from the inside of the computer or the inside of the integrated circuit, most of radiators absorb the heat by contacting with the surfaces of heating components, then the heat is transferred to a remote place by various methods, such as air in a case, and then the case transfers the hot air to the outside of the case to complete the heat dissipation of the computer, the high temperature not only causes unstable system operation and shortened service life, but also possibly burns some components, the radiator absorbs the heat and then radiates the heat to the inside or outside of the case, so as to ensure the normal temperature of the computer components, the air-cooled heat dissipation is the most common, and the radiator is very simple, namely, the heat absorbed by the radiator is taken away by a fan, so that the computer component has the advantages of relatively low price, simple installation and the like, but the dependence on the environment is higher, for example, the heat radiation performance is greatly influenced when the temperature rises and the frequency exceeds, the heat radiation efficiency is low, and when the computer is used for a long time, a lot of dust can be accumulated, the heat radiation effect is reduced, so that people need to regularly remove dust for calculation, and the existing computer has no automatic dust removal function, thereby greatly influencing the use experience.
Disclosure of Invention
The invention aims to solve the problems of low heat dissipation efficiency, no automatic dust removal function and the like in the prior art, and provides a computer with the heat dissipation and dust removal functions.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a computer with heat dissipation dust removal function, includes quick-witted case and is used for the cooling tank of heat dissipation usefulness, cooling tank fixed connection still includes at quick-witted bottom of the case inner wall:
the temperature guide plate is fixedly connected to the inner wall of the case;
the first pressurizer is arranged on the inner wall of the bottom of the cooling box, the output end of the first pressurizer is connected with a first temperature conduction pipe, and one end, far away from the first pressurizer, of the first temperature conduction pipe is communicated with the cooling box;
the rotating impeller is arranged in the first heat conduction pipe;
the rotating shaft is fixedly connected to the rotating impeller;
the rotating disc is fixedly connected to the rotating shaft;
the sliding head is connected to the rotating disc in a sliding mode;
the circular plate is arranged on the heat conducting plate;
the hollow cylinder is arranged on the circular plate and is matched with the rotating disc;
the friction block is fixedly connected to the hollow cylinder and is abutted against the sliding head;
the filter box is arranged on the heat conducting plate;
the second fan is arranged in the case;
the second fan is positioned below the first heat conduction pipe, and the first heat conduction pipes above the second fan are distributed in a U-shaped matrix;
the two circular plates are connected with a second hollow pipe between the two circular plates, the two circular plates are also respectively connected with a first hollow pipe and a third hollow pipe, the first hollow pipe is communicated with the first temperature conduction pipe, and the third hollow pipe is communicated with the filter box;
a fourth hollow pipe is connected between the filter box and the first heat conduction pipe;
the sliding head, the hollow cylinder and the friction block are all made of plastic materials.
Preferably, the heat conducting plate is provided with an integrated circuit board, and the bottom of the heat conducting plate is respectively provided with a radiating fin and a temperature sensor.
Preferably, the inner wall of the bottom of the cooling box is provided with a second pressurizer, the output end of the second pressurizer is connected with a second temperature guide pipe, the second temperature guide pipe is communicated with the cooling box, the second temperature guide pipe penetrates through the temperature guide plate, and a first fan is arranged between the temperature guide plate and the cooling box.
Preferably, the temperature guide plate is fixedly connected with a first support rod, the circular plate is fixedly connected with the first support rod, the bottom of the hollow cylinder is fixedly connected with a support plate, and a first spring is arranged between the support plate and the first support rod.
Preferably, the side wall of the supporting plate is rotatably connected with a rotating plate, the rotating plate is provided with a sealing gasket, the side wall of the supporting plate is slidably connected with a sliding plate, and the bottom of the sliding plate is provided with a buoyancy ball.
Preferably, a flow valve is arranged on the first hollow pipe, a filter screen is arranged on the inner wall of the filter box, a one-way valve is arranged in the fourth hollow pipe, and a second spring is arranged between the rotating disc and the sliding head.
Preferably, the side wall of the case is provided with a sliding groove, a second supporting rod is connected in the sliding groove in a sliding mode, the second fan is fixedly connected to the second supporting rod, and the second supporting rod and the side wall of the case are provided with threaded holes.
Preferably, the method further comprises the following steps:
the feeding hole is fixed on the side wall of the case and communicated with the cooling case;
the rotating door is rotatably connected to the top of the case;
the first breathable net is arranged on the rotating door;
the roller is fixed at the bottom of the case;
and the second breathable net is arranged on the side wall of the case.
Compared with the prior art, the invention provides a computer with heat dissipation and dust removal functions, which has the following beneficial effects:
1. when the computer with the heat dissipation and dust removal functions is used, when an integrated circuit board generates heat, a first pressurizer and a second fan are started, the first pressurizer sends cooling liquid into a first temperature guide pipe, the cooling liquid reduces the temperature of ambient air through the first temperature guide pipe, and air with the reduced temperature is blown to the integrated circuit board through a second fan, so that the purpose of reducing the temperature is achieved, when the temperature is reduced, the cooling liquid drives a rotating impeller to rotate, the rotating impeller drives a rotating disc to rotate through a rotating shaft, the rotating disc drives a sliding head to rotate, the sliding head and a friction block rub against each other to generate static electricity, an adsorption effect is formed on dust, the dust is automatically stuck on a hollow cylinder, the sliding head and the friction block rub against each other at the same time, the hollow cylinder can continuously and slightly shake under the action of a first spring, the dust falls in a circular plate under the action of shaking, and starting the flow valve, enabling the cooling liquid to enter the circular plate through the first hollow pipe, finally bringing dust into the filter box, filtering through the filter screen, enabling the cooling liquid to flow back to the first temperature conduction pipe, and collecting the dust in the filter box.
2. This computer with heat dissipation dust removal function, if too much causes the coolant liquid circulation not smooth in the dust in the circular slab, when producing the gathering, the sliding plate can be in the effect of buoyancy ball rebound, and the sliding plate drives the rotor plate and rotates, and the rotor plate pastes with the circular slab top, reaches sealed effect, prevents that the coolant liquid from spilling over, causes the computer to damage.
3. This computer with heat dissipation dust removal function, the bottom of leading the warm board is equipped with temperature-sensing ware, when temperature-sensing ware sensed the temperature and exceeded safe temperature, starts second presser and first fan, and the second presser sends the coolant liquid into the second and leads in the warm pipe, then leads the warm board through, will lead partly heat of warm board and take away, and meanwhile, first fan increase air flow velocity cooperates the fin, has further improved fan thermal efficiency.
The device has the advantages that the heat dissipation efficiency is greatly improved through the mutual matching of the first heat conduction pipe and the second heat conduction pipe, the rotating impeller is driven to rotate by the flowing of the cooling liquid, the sliding head and the friction block rub against each other to generate static electricity, the purpose of automatically adsorbing dust is achieved, and the use experience is greatly improved.
Drawings
FIG. 1 is a schematic structural diagram of a computer with heat dissipation and dust removal functions according to the present invention;
FIG. 2 is an enlarged view of part A of a computer 1 with heat dissipation and dust removal functions according to the present invention;
FIG. 3 is an enlarged view of a portion B of a computer 1 with heat dissipation and dust removal functions according to the present invention;
FIG. 4 is a side view of a computer rotary disk with heat dissipation and dust removal functions according to the present invention;
FIG. 5 is a top view of a second fan with heat dissipation and dust removal functions of a computer according to the present invention;
FIG. 6 is a top view of a first thermal conductive tube with heat dissipation and dust removal functions for a computer according to the present invention;
FIG. 7 is a front view of a computer case with heat dissipation and dust removal functions according to the present invention;
fig. 8 is a front view of a rotating impeller of a computer with heat dissipation and dust removal functions according to the present invention.
In the figure: 1. a chassis; 2. a cooling tank; 201. a first pressurizer; 202. a first heat transfer tube; 3. a second pressurizer; 301. a second thermal conduction tube; 4. a feed inlet; 5. a heat conducting plate; 501. a heat sink; 502. an integrated circuit board; 6. a first fan; 7. a first hollow tube; 701. a flow valve; 702. a second hollow tube; 703. a third hollow tube; 8. a first support bar; 801. a circular plate; 9. a support plate; 901. a rotating plate; 902. a sealing gasket; 10. a sliding plate; 1001. a buoyant ball; 11. a first spring; 12. rotating the impeller; 1201. a rotating shaft; 13. rotating the disc; 1301. a sliding head; 1302. a second spring; 14. a hollow cylinder; 1401. a friction block; 15. a filter box; 1501. a filter screen; 16. a fourth hollow tube; 1601. a one-way valve; 17. a second support bar; 1701. a sliding groove; 1702. a threaded hole; 18. a second fan; 19. a rotating door; 1901. a first breathable web; 20. a roller; 21. a second breathable web; 22. a temperature sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-8, a computer with heat dissipation and dust removal functions comprises a case 1 and a cooling box 2 for heat dissipation, wherein the cooling box 2 is fixedly connected to the inner wall of the bottom of the case 1, and further comprises:
the temperature guide plate 5 is fixedly connected to the inner wall of the case 1;
the first pressurizer 201 is arranged on the inner wall of the bottom of the cooling box 2, the output end of the first pressurizer 201 is connected with a first temperature conducting pipe 202, and one end, far away from the first pressurizer 201, of the first temperature conducting pipe 202 is communicated with the cooling box 2;
the rotating impeller 12 is arranged in the first heat conduction pipe 202;
a rotating shaft 1201 fixedly connected to the rotating impeller 12;
a rotating disc 13 fixedly connected to the rotating shaft 1201;
a slider 1301 slidably coupled to the rotary plate 13;
a circular plate 801 provided on the heat conducting plate 5;
a hollow cylinder 14 provided on the circular plate 801 to be engaged with the rotating disk 13;
a friction block 1401 fixedly connected to the hollow cylinder 14 and abutting against the slider 1301;
the filter box 15 is arranged on the temperature guide plate 5;
a second fan 18 provided in the cabinet 1;
the second fan 18 is located below the first thermal conductive pipe 202, and the first thermal conductive pipes 202 above the second fan 18 are distributed in a U-shaped matrix.
The two circular plates 801 are connected with a second hollow pipe 702 between the two circular plates 801, the two circular plates 801 are also respectively connected with a first hollow pipe 7 and a third hollow pipe 703, the first hollow pipe 7 is communicated with the first temperature conduction pipe 202, and the third hollow pipe 703 is communicated with the filter box 15.
A fourth hollow pipe 16 is connected between the filter box 15 and the first heat conducting pipe 202.
The sliding head 1301, the hollow cylinder 14 and the friction block 1401 are all made of plastic.
The heat conducting plate 5 is provided with an integrated circuit board 502, and the bottom of the heat conducting plate 5 is provided with a heat sink 501 and a temperature sensor 22.
The inner wall of the bottom of the cooling box 2 is provided with a second pressurizer 3, the output end of the second pressurizer 3 is connected with a second temperature guide pipe 301, the second temperature guide pipe 301 is communicated with the cooling box 2, the second temperature guide pipe 301 penetrates through a temperature guide plate 5, and a first fan 6 is arranged between the temperature guide plate 5 and the cooling box 2.
The temperature guide plate 5 is fixedly connected with a first supporting rod 8, the circular plate 801 is fixedly connected with the first supporting rod 8, the bottom of the hollow cylinder 14 is fixedly connected with a supporting plate 9, and a first spring 11 is arranged between the supporting plate 9 and the first supporting rod 8.
The side wall of the supporting plate 9 is rotatably connected with a rotating plate 901, the rotating plate 901 is provided with a sealing gasket 902, the side wall of the supporting plate 9 is slidably connected with a sliding plate 10, and the bottom of the sliding plate 10 is provided with a buoyancy ball 1001.
The flow valve 701 is arranged on the first hollow pipe 7, the filter screen 1501 is arranged on the inner wall of the filter box 15, the one-way valve 1601 is arranged in the fourth hollow pipe 16, and the second spring 1302 is arranged between the rotating disc 13 and the sliding head 1301.
The lateral wall of the case 1 is provided with a sliding groove 1701, a second support rod 17 is slidably connected in the sliding groove 1701, a second fan 18 is fixedly connected to the second support rod 17, and the second support rod 17 and the lateral wall of the case 1 are both provided with threaded holes 1702.
Further comprising:
the feeding port 4 is fixed on the side wall of the case 1 and communicated with the cooling box 2;
the rotating door 19 is rotatably connected to the top of the case 1;
a first breathable net 1901 arranged on the revolving door 19;
the roller 20 is fixed at the bottom of the case 1;
and the second breathable net 21 is arranged on the side wall of the case 1.
In the invention, when the integrated circuit board 502 generates heat, the first pressurizer 201 and the second fan 18 are started, the first pressurizer 201 sends cooling liquid into the first heat conducting pipe 202, the cooling liquid reduces the temperature of the surrounding air through the first heat conducting pipe 202, the air with the reduced temperature is blown to the integrated circuit board 502 through the second fan 18, thereby achieving the purpose of reducing the temperature, at the same time of reducing the temperature, the cooling liquid drives the rotating impeller 12 to rotate, the rotating impeller 12 drives the rotating disk 13 to rotate through the rotating shaft 1201, the rotating disk 13 drives the sliding head 1301 to rotate, the sliding head 1301 and the friction block 1401 rub against each other to generate static electricity, an adsorption effect is formed on dust, the dust is automatically adhered to the hollow cylinder 14, meanwhile, the sliding head 1301 and the friction block 1401 rub against each other, under the action of the first spring 11, the hollow cylinder 14 can continuously and slightly shake, the dust under the shaking action, when the coolant falls into the circular plate 801, the flow valve 701 is started, the coolant enters the circular plate 801 through the first hollow pipe 7, finally dust is brought into the filter box 15, the coolant flows back to the first temperature conduction pipe 202 after being filtered by the filter screen 1501, and the dust is collected in the filter box 15.
If too much dust in the circular plate 801 causes unsmooth circulation of the cooling liquid and accumulation, the sliding plate 10 moves upwards under the action of the buoyancy ball 1001, the sliding plate 10 drives the rotating plate 901 to rotate, and the rotating plate 901 is attached to the top of the circular plate 801 to achieve the sealing effect, so that the cooling liquid is prevented from overflowing and causing damage to the computer.
The bottom of leading warm board 5 is equipped with temperature-sensing ware 22, and when temperature-sensing ware 22 sensed the temperature and exceeded the safe temperature, start second presser 3 and first fan 6, during second presser 3 sent the coolant liquid into second leading warm pipe 301, then through leading warm board 5, will lead the partial heat of warm board 5 and take away, and meanwhile, first fan 6 increases the air flow velocity, cooperates fin 501, has further improved fan thermal efficiency.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (8)

1. The utility model provides a computer with heat dissipation dust removal function, includes quick-witted case (1) and is used for cooling tank (2) of heat dissipation usefulness, cooling tank (2) fixed connection is at quick-witted case (1) bottom inner wall, its characterized in that still includes:
the temperature guide plate (5) is fixedly connected to the inner wall of the case (1);
the first pressurizer (201) is arranged on the inner wall of the bottom of the cooling box (2), the output end of the first pressurizer (201) is connected with a first temperature conducting pipe (202), and one end, far away from the first pressurizer (201), of the first temperature conducting pipe (202) is communicated with the cooling box (2);
the rotating impeller (12) is arranged in the first heat conduction pipe (202);
a rotating shaft (1201) fixedly connected to the rotating impeller (12);
a rotating disc (13) fixedly connected to the rotating shaft (1201);
a sliding head (1301) which is connected to the rotating disc (13) in a sliding manner;
a circular plate (801) provided on the heat conducting plate (5);
a hollow cylinder (14) provided on the circular plate (801) to be engaged with the rotating disk (13);
a friction block (1401) fixedly connected to the hollow cylinder (14) and abutting against the sliding head (1301);
the filter box (15) is arranged on the heat conducting plate (5);
a second fan (18) disposed in the cabinet (1);
the second fan (18) is positioned below the first heat conduction pipe (202), and the first heat conduction pipes (202) above the second fan (18) are distributed in a U-shaped matrix;
the number of the circular plates (801) is two, a second hollow pipe (702) is connected between the two circular plates (801), a first hollow pipe (7) and a third hollow pipe (703) are respectively connected to the two circular plates (801), the first hollow pipe (7) is communicated with the first temperature conduction pipe (202), and the third hollow pipe (703) is communicated with the filter box (15); a fourth hollow pipe (16) is connected between the filter box (15) and the first heat conduction pipe (202);
the sliding head (1301), the hollow cylinder (14) and the friction block (1401) are all made of plastic materials.
2. The computer with the functions of heat dissipation and dust removal as claimed in claim 1, wherein an integrated circuit board (502) is disposed on the heat conducting plate (5), and a heat sink (501) and a temperature sensor (22) are respectively disposed at the bottom of the heat conducting plate (5).
3. The computer with the heat dissipation and dust removal functions as claimed in claim 2, wherein a second pressurizer (3) is arranged on the inner wall of the bottom of the cooling box (2), a second heat conduction pipe (301) is connected to the output end of the second pressurizer (3), the second heat conduction pipe (301) is communicated with the cooling box (2), the second heat conduction pipe (301) penetrates through the heat conduction plate (5), and a first fan (6) is arranged between the heat conduction plate (5) and the cooling box (2).
4. The computer with the heat dissipation and dust removal functions as claimed in claim 3, wherein a first supporting rod (8) is fixedly connected to the temperature guide plate (5), the circular plate (801) is fixedly connected to the first supporting rod (8), a supporting plate (9) is fixedly connected to the bottom of the hollow cylinder (14), and a first spring (11) is arranged between the supporting plate (9) and the first supporting rod (8).
5. The computer with the heat dissipation and dust removal functions as claimed in claim 4, wherein a rotating plate (901) is rotatably connected to the side wall of the supporting plate (9), a sealing gasket (902) is arranged on the rotating plate (901), a sliding plate (10) is slidably connected to the side wall of the supporting plate (9), and a buoyancy ball (1001) is arranged at the bottom of the sliding plate (10).
6. The computer with the heat dissipation and dust removal functions as claimed in claim 1, wherein a flow valve (701) is arranged on the first hollow pipe (7), a filter screen (1501) is arranged on the inner wall of the filter box (15), a one-way valve (1601) is arranged in the fourth hollow pipe (16), and a second spring (1302) is arranged between the rotating disc (13) and the sliding head (1301).
7. The computer with the heat dissipation and dust removal functions as claimed in claim 1, wherein a sliding groove (1701) is formed in a side wall of the case (1), a second support rod (17) is slidably connected in the sliding groove (1701), the second fan (18) is fixedly connected to the second support rod (17), and threaded holes (1702) are formed in the second support rod (17) and the side wall of the case (1).
8. The computer with the heat dissipation and dust removal function according to claim 1, further comprising:
the feeding hole (4) is fixed on the side wall of the case (1) and communicated with the cooling box (2);
the rotating door (19) is rotatably connected to the top of the case (1);
a first breathable net (1901) arranged on the rotating door (19);
the roller (20) is fixed at the bottom of the case (1);
and the second breathable net (21) is arranged on the side wall of the case (1).
CN202010454597.2A 2020-05-26 2020-05-26 Computer with heat dissipation and dust removal functions Withdrawn CN111638766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010454597.2A CN111638766A (en) 2020-05-26 2020-05-26 Computer with heat dissipation and dust removal functions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010454597.2A CN111638766A (en) 2020-05-26 2020-05-26 Computer with heat dissipation and dust removal functions

Publications (1)

Publication Number Publication Date
CN111638766A true CN111638766A (en) 2020-09-08

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ID=72329315

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Application Number Title Priority Date Filing Date
CN202010454597.2A Withdrawn CN111638766A (en) 2020-05-26 2020-05-26 Computer with heat dissipation and dust removal functions

Country Status (1)

Country Link
CN (1) CN111638766A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112527070A (en) * 2020-12-30 2021-03-19 石家庄抚集贸易有限公司 Computer case for ensuring working environment by using static electricity
CN112614385A (en) * 2020-12-11 2021-04-06 钟向阳 Remote teaching device based on cloud calculates
CN113022120A (en) * 2021-03-03 2021-06-25 绍兴寿春针纺织有限公司 PUR hot melt adhesive gilding press
CN113296587A (en) * 2021-06-22 2021-08-24 中关控股(杭州)有限公司 Big data server
CN113923535A (en) * 2021-09-17 2022-01-11 善悦(武汉)高新技术有限公司 5G wireless radio frequency unit shared by star link connection modes

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112614385A (en) * 2020-12-11 2021-04-06 钟向阳 Remote teaching device based on cloud calculates
CN112614385B (en) * 2020-12-11 2022-09-06 株洲亚文科技有限责任公司 Remote teaching device based on cloud calculates
CN112527070A (en) * 2020-12-30 2021-03-19 石家庄抚集贸易有限公司 Computer case for ensuring working environment by using static electricity
CN113022120A (en) * 2021-03-03 2021-06-25 绍兴寿春针纺织有限公司 PUR hot melt adhesive gilding press
CN113296587A (en) * 2021-06-22 2021-08-24 中关控股(杭州)有限公司 Big data server
CN113923535A (en) * 2021-09-17 2022-01-11 善悦(武汉)高新技术有限公司 5G wireless radio frequency unit shared by star link connection modes

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Application publication date: 20200908